CN120153479A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN120153479A
CN120153479A CN202380077572.7A CN202380077572A CN120153479A CN 120153479 A CN120153479 A CN 120153479A CN 202380077572 A CN202380077572 A CN 202380077572A CN 120153479 A CN120153479 A CN 120153479A
Authority
CN
China
Prior art keywords
leads
resin
resin side
semiconductor device
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380077572.7A
Other languages
English (en)
Chinese (zh)
Inventor
二井瑛典
藤井贤治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN120153479A publication Critical patent/CN120153479A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN202380077572.7A 2022-11-08 2023-10-27 半导体装置 Pending CN120153479A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022178745 2022-11-08
JP2022178744 2022-11-08
JP2022-178744 2022-11-08
JP2022-178745 2022-11-08
PCT/JP2023/038914 WO2024101190A1 (ja) 2022-11-08 2023-10-27 半導体装置

Publications (1)

Publication Number Publication Date
CN120153479A true CN120153479A (zh) 2025-06-13

Family

ID=91032884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380077572.7A Pending CN120153479A (zh) 2022-11-08 2023-10-27 半导体装置

Country Status (4)

Country Link
US (1) US20250266330A1 (https=)
JP (1) JPWO2024101190A1 (https=)
CN (1) CN120153479A (https=)
WO (1) WO2024101190A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012790A (ja) * 1996-06-24 1998-01-16 Mitsubishi Electric Corp 半導体集積回路装置
JPH11214606A (ja) * 1998-01-29 1999-08-06 Matsushita Electron Corp 樹脂封止型半導体装置及びリードフレーム
JP2003204027A (ja) * 2002-01-09 2003-07-18 Matsushita Electric Ind Co Ltd リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
JP5034670B2 (ja) * 2007-05-16 2012-09-26 株式会社デンソー モールドパッケージ
JP2017183417A (ja) * 2016-03-29 2017-10-05 ローム株式会社 半導体装置
CN109801890A (zh) * 2017-11-16 2019-05-24 南昌欧菲生物识别技术有限公司 Qfn封装结构
JP7199921B2 (ja) * 2018-11-07 2023-01-06 ローム株式会社 半導体装置
WO2020262533A1 (ja) * 2019-06-28 2020-12-30 ローム株式会社 電子装置および電子装置の実装構造

Also Published As

Publication number Publication date
US20250266330A1 (en) 2025-08-21
JPWO2024101190A1 (https=) 2024-05-16
WO2024101190A1 (ja) 2024-05-16

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