JPWO2024101190A1 - - Google Patents
Info
- Publication number
- JPWO2024101190A1 JPWO2024101190A1 JP2024557326A JP2024557326A JPWO2024101190A1 JP WO2024101190 A1 JPWO2024101190 A1 JP WO2024101190A1 JP 2024557326 A JP2024557326 A JP 2024557326A JP 2024557326 A JP2024557326 A JP 2024557326A JP WO2024101190 A1 JPWO2024101190 A1 JP WO2024101190A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022178745 | 2022-11-08 | ||
| JP2022178744 | 2022-11-08 | ||
| PCT/JP2023/038914 WO2024101190A1 (ja) | 2022-11-08 | 2023-10-27 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024101190A1 true JPWO2024101190A1 (https=) | 2024-05-16 |
| JPWO2024101190A5 JPWO2024101190A5 (https=) | 2025-07-17 |
Family
ID=91032884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024557326A Pending JPWO2024101190A1 (https=) | 2022-11-08 | 2023-10-27 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250266330A1 (https=) |
| JP (1) | JPWO2024101190A1 (https=) |
| CN (1) | CN120153479A (https=) |
| WO (1) | WO2024101190A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012790A (ja) * | 1996-06-24 | 1998-01-16 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JPH11214606A (ja) * | 1998-01-29 | 1999-08-06 | Matsushita Electron Corp | 樹脂封止型半導体装置及びリードフレーム |
| JP2003204027A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法 |
| JP5034670B2 (ja) * | 2007-05-16 | 2012-09-26 | 株式会社デンソー | モールドパッケージ |
| JP2017183417A (ja) * | 2016-03-29 | 2017-10-05 | ローム株式会社 | 半導体装置 |
| CN109801890A (zh) * | 2017-11-16 | 2019-05-24 | 南昌欧菲生物识别技术有限公司 | Qfn封装结构 |
| JP7199921B2 (ja) * | 2018-11-07 | 2023-01-06 | ローム株式会社 | 半導体装置 |
| WO2020262533A1 (ja) * | 2019-06-28 | 2020-12-30 | ローム株式会社 | 電子装置および電子装置の実装構造 |
-
2023
- 2023-10-27 JP JP2024557326A patent/JPWO2024101190A1/ja active Pending
- 2023-10-27 CN CN202380077572.7A patent/CN120153479A/zh active Pending
- 2023-10-27 WO PCT/JP2023/038914 patent/WO2024101190A1/ja not_active Ceased
-
2025
- 2025-05-05 US US19/198,750 patent/US20250266330A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250266330A1 (en) | 2025-08-21 |
| CN120153479A (zh) | 2025-06-13 |
| WO2024101190A1 (ja) | 2024-05-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250327 |