CN1200319C - 使用空气影像仿真器来评估掩模影像的方法 - Google Patents
使用空气影像仿真器来评估掩模影像的方法 Download PDFInfo
- Publication number
- CN1200319C CN1200319C CNB018057314A CN01805731A CN1200319C CN 1200319 C CN1200319 C CN 1200319C CN B018057314 A CNB018057314 A CN B018057314A CN 01805731 A CN01805731 A CN 01805731A CN 1200319 C CN1200319 C CN 1200319C
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- Prior art keywords
- emulation
- wafer
- mask
- wafer architecture
- architecture
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/515,348 US7120285B1 (en) | 2000-02-29 | 2000-02-29 | Method for evaluation of reticle image using aerial image simulator |
US09/515,348 | 2000-02-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1406347A CN1406347A (zh) | 2003-03-26 |
CN1200319C true CN1200319C (zh) | 2005-05-04 |
Family
ID=24050973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018057314A Expired - Lifetime CN1200319C (zh) | 2000-02-29 | 2001-02-21 | 使用空气影像仿真器来评估掩模影像的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7120285B1 (zh) |
EP (1) | EP1269264B1 (zh) |
JP (1) | JP4599020B2 (zh) |
KR (1) | KR100734533B1 (zh) |
CN (1) | CN1200319C (zh) |
DE (1) | DE60144274D1 (zh) |
TW (1) | TWI222667B (zh) |
WO (1) | WO2001065317A2 (zh) |
Families Citing this family (65)
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US7289230B2 (en) | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
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DE10332059A1 (de) * | 2003-07-11 | 2005-01-27 | Carl Zeiss Sms Gmbh | Verfahren zur Analyse von Objekten in der Mikrolithographie |
CN1910516B (zh) * | 2004-01-29 | 2011-01-12 | 克拉-坦科技术股份有限公司 | 用于检测标线设计数据中的缺陷的计算机实现方法 |
US7313781B2 (en) * | 2004-05-28 | 2007-12-25 | Kabushiki Kaisha Toshiba | Image data correction method, lithography simulation method, image data correction system, program, mask and method of manufacturing a semiconductor device |
JP4904034B2 (ja) | 2004-09-14 | 2012-03-28 | ケーエルエー−テンカー コーポレイション | レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体 |
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JP4769025B2 (ja) * | 2005-06-15 | 2011-09-07 | 株式会社日立ハイテクノロジーズ | 走査型電子顕微鏡用撮像レシピ作成装置及びその方法並びに半導体パターンの形状評価装置 |
DE102005028212B3 (de) * | 2005-06-17 | 2007-03-15 | Infineon Technologies Ag | Verfahren zur Simulation einer optischen Projektion |
US7769225B2 (en) | 2005-08-02 | 2010-08-03 | Kla-Tencor Technologies Corp. | Methods and systems for detecting defects in a reticle design pattern |
DE102005048376A1 (de) * | 2005-10-10 | 2007-04-12 | Carl Zeiss Sms Gmbh | Simulationsverfahren und Simulationssystem |
KR100698074B1 (ko) * | 2005-10-31 | 2007-03-23 | 동부일렉트로닉스 주식회사 | 근접 효과 보정용 모델의 제조방법 |
US8041103B2 (en) | 2005-11-18 | 2011-10-18 | Kla-Tencor Technologies Corp. | Methods and systems for determining a position of inspection data in design data space |
US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
EP1955225A4 (en) * | 2005-11-18 | 2009-11-04 | Kla Tencor Tech Corp | METHOD AND SYSTEMS FOR USE OF DESIGN DATA IN COMBINATION WITH TEST DATA |
US7676077B2 (en) | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
JP4709639B2 (ja) * | 2005-12-12 | 2011-06-22 | 株式会社東芝 | マスクパターン評価方法及び評価装置 |
CN101410690B (zh) | 2006-02-21 | 2011-11-23 | 赛博光学半导体公司 | 半导体加工工具中的电容性距离感测 |
US7893697B2 (en) | 2006-02-21 | 2011-02-22 | Cyberoptics Semiconductor, Inc. | Capacitive distance sensing in semiconductor processing tools |
US7586607B2 (en) * | 2006-04-21 | 2009-09-08 | Rudolph Technologies, Inc. | Polarization imaging |
GB2455006A (en) | 2006-09-29 | 2009-05-27 | Cyberoptics Semiconductor Inc | Substrate-like particle sensor |
JP5427609B2 (ja) | 2006-12-19 | 2014-02-26 | ケーエルエー−テンカー・コーポレーション | 検査レシピ作成システムおよびその方法 |
US8194968B2 (en) | 2007-01-05 | 2012-06-05 | Kla-Tencor Corp. | Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions |
US9047532B2 (en) * | 2007-01-25 | 2015-06-02 | Applied Materials Israel, Ltd. | System, method and computer program product for evaluating an actual structural element of an electrical circuit |
US7778793B2 (en) | 2007-03-12 | 2010-08-17 | Cyberoptics Semiconductor, Inc. | Wireless sensor for semiconductor processing systems |
US7962863B2 (en) | 2007-05-07 | 2011-06-14 | Kla-Tencor Corp. | Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer |
US7738093B2 (en) | 2007-05-07 | 2010-06-15 | Kla-Tencor Corp. | Methods for detecting and classifying defects on a reticle |
US8213704B2 (en) | 2007-05-09 | 2012-07-03 | Kla-Tencor Corp. | Methods and systems for detecting defects in a reticle design pattern |
KR100881194B1 (ko) * | 2007-05-16 | 2009-02-05 | 삼성전자주식회사 | 공간 영상 검사 장비를 이용한 마스크 측정 방법 |
KR100884985B1 (ko) * | 2007-07-19 | 2009-02-23 | 주식회사 동부하이텍 | 광학적 근접보정 모델 조절 시스템 및 데이터 처리 방법 |
US7796804B2 (en) | 2007-07-20 | 2010-09-14 | Kla-Tencor Corp. | Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer |
US7711514B2 (en) | 2007-08-10 | 2010-05-04 | Kla-Tencor Technologies Corp. | Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan |
KR101448971B1 (ko) | 2007-08-20 | 2014-10-13 | 케이엘에이-텐코어 코오포레이션 | 실제 결함들이 잠재적으로 조직적인 결함들인지 또는 잠재적으로 랜덤인 결함들인지를 결정하기 위한 컴퓨터-구현 방법들 |
JP2009092954A (ja) * | 2007-10-09 | 2009-04-30 | Toshiba Corp | パターン評価方法 |
JP4856047B2 (ja) * | 2007-11-12 | 2012-01-18 | 株式会社東芝 | マスクパターン寸法検査方法およびマスクパターン寸法検査装置 |
CN101482697B (zh) * | 2008-01-07 | 2010-12-22 | 中芯国际集成电路制造(上海)有限公司 | 一种减小opc模型残余误差的方法 |
US8139844B2 (en) | 2008-04-14 | 2012-03-20 | Kla-Tencor Corp. | Methods and systems for determining a defect criticality index for defects on wafers |
DE102008019341B4 (de) * | 2008-04-15 | 2020-09-24 | Carl Zeiss Smt Gmbh | Verfahren zur Analyse von Masken für die Photolithographie |
WO2010014609A2 (en) | 2008-07-28 | 2010-02-04 | Kla-Tencor Corporation | Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer |
US8775101B2 (en) | 2009-02-13 | 2014-07-08 | Kla-Tencor Corp. | Detecting defects on a wafer |
US8204297B1 (en) | 2009-02-27 | 2012-06-19 | Kla-Tencor Corp. | Methods and systems for classifying defects detected on a reticle |
US8112241B2 (en) | 2009-03-13 | 2012-02-07 | Kla-Tencor Corp. | Methods and systems for generating an inspection process for a wafer |
JP4942800B2 (ja) * | 2009-08-18 | 2012-05-30 | 株式会社ニューフレアテクノロジー | 検査装置 |
JP4918598B2 (ja) * | 2010-01-18 | 2012-04-18 | 株式会社ニューフレアテクノロジー | 検査装置および検査方法 |
US8477299B2 (en) * | 2010-04-01 | 2013-07-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for monitoring mask process impact on lithography performance |
US8781781B2 (en) | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
US8818072B2 (en) * | 2010-08-25 | 2014-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Rendered database image-to-inspection image optimization for inspection |
US8539392B2 (en) | 2011-02-24 | 2013-09-17 | National Taiwan University | Method for compensating proximity effects of particle beam lithography processes |
US9170211B2 (en) | 2011-03-25 | 2015-10-27 | Kla-Tencor Corp. | Design-based inspection using repeating structures |
US9087367B2 (en) | 2011-09-13 | 2015-07-21 | Kla-Tencor Corp. | Determining design coordinates for wafer defects |
US8831334B2 (en) | 2012-01-20 | 2014-09-09 | Kla-Tencor Corp. | Segmentation for wafer inspection |
US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
US9189844B2 (en) | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
US9053527B2 (en) | 2013-01-02 | 2015-06-09 | Kla-Tencor Corp. | Detecting defects on a wafer |
US9134254B2 (en) | 2013-01-07 | 2015-09-15 | Kla-Tencor Corp. | Determining a position of inspection system output in design data space |
US9311698B2 (en) | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
KR102019534B1 (ko) | 2013-02-01 | 2019-09-09 | 케이엘에이 코포레이션 | 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출 |
US9299135B2 (en) * | 2013-03-12 | 2016-03-29 | Applied Materials Israel, Ltd. | Detection of weak points of a mask |
US9865512B2 (en) | 2013-04-08 | 2018-01-09 | Kla-Tencor Corp. | Dynamic design attributes for wafer inspection |
US9310320B2 (en) | 2013-04-15 | 2016-04-12 | Kla-Tencor Corp. | Based sampling and binning for yield critical defects |
KR102085522B1 (ko) | 2013-11-14 | 2020-03-06 | 삼성전자 주식회사 | 패턴의 결함 탐지 방법 |
CN104198509B (zh) * | 2014-09-01 | 2017-01-11 | 上海华力微电子有限公司 | 一种光罩图形缺陷检测系统及方法 |
US11263737B2 (en) * | 2019-01-10 | 2022-03-01 | Lam Research Corporation | Defect classification and source analysis for semiconductor equipment |
US11061318B2 (en) * | 2019-02-28 | 2021-07-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography model calibration |
CN111929980B (zh) * | 2020-08-28 | 2024-05-17 | 上海华力微电子有限公司 | 增强二维图形opc模型精度的方法 |
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-
2000
- 2000-02-29 US US09/515,348 patent/US7120285B1/en not_active Expired - Lifetime
-
2001
- 2001-02-21 DE DE60144274T patent/DE60144274D1/de not_active Expired - Lifetime
- 2001-02-21 CN CNB018057314A patent/CN1200319C/zh not_active Expired - Lifetime
- 2001-02-21 KR KR1020027011374A patent/KR100734533B1/ko not_active IP Right Cessation
- 2001-02-21 WO PCT/US2001/005761 patent/WO2001065317A2/en active Application Filing
- 2001-02-21 JP JP2001563956A patent/JP4599020B2/ja not_active Expired - Fee Related
- 2001-02-21 EP EP01911115A patent/EP1269264B1/en not_active Expired - Lifetime
- 2001-02-27 TW TW090104477A patent/TWI222667B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1269264A2 (en) | 2003-01-02 |
JP2003525529A (ja) | 2003-08-26 |
US7120285B1 (en) | 2006-10-10 |
EP1269264B1 (en) | 2011-03-23 |
KR20020079975A (ko) | 2002-10-21 |
WO2001065317A3 (en) | 2002-03-28 |
KR100734533B1 (ko) | 2007-07-04 |
TWI222667B (en) | 2004-10-21 |
WO2001065317A2 (en) | 2001-09-07 |
DE60144274D1 (de) | 2011-05-05 |
CN1406347A (zh) | 2003-03-26 |
JP4599020B2 (ja) | 2010-12-15 |
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