CN1193762A - 计算机特殊器件的液体冷却装置 - Google Patents

计算机特殊器件的液体冷却装置 Download PDF

Info

Publication number
CN1193762A
CN1193762A CN97107266A CN97107266A CN1193762A CN 1193762 A CN1193762 A CN 1193762A CN 97107266 A CN97107266 A CN 97107266A CN 97107266 A CN97107266 A CN 97107266A CN 1193762 A CN1193762 A CN 1193762A
Authority
CN
China
Prior art keywords
heat
hard disk
disk drive
heat transfer
transfer plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN97107266A
Other languages
English (en)
Chinese (zh)
Inventor
D·N·多纳霍
M·T·吉尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compaq Computer Corp
Original Assignee
Compaq Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compaq Computer Corp filed Critical Compaq Computer Corp
Publication of CN1193762A publication Critical patent/CN1193762A/zh
Pending legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN97107266A 1996-12-31 1997-12-31 计算机特殊器件的液体冷却装置 Pending CN1193762A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77514396A 1996-12-31 1996-12-31
US775,143 1996-12-31

Publications (1)

Publication Number Publication Date
CN1193762A true CN1193762A (zh) 1998-09-23

Family

ID=25103453

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97107266A Pending CN1193762A (zh) 1996-12-31 1997-12-31 计算机特殊器件的液体冷却装置

Country Status (3)

Country Link
JP (1) JPH10213370A (enExample)
CN (1) CN1193762A (enExample)
TW (1) TW422946B (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658744B (zh) * 2004-02-16 2010-07-21 株式会社日立制作所 液冷系统和电子装置
CN101115373B (zh) * 2006-07-25 2010-08-11 富士通株式会社 包括液体冷却单元的电子设备
CN101471308B (zh) * 2007-12-26 2011-03-23 中强光电股份有限公司 散热模块
CN102089726A (zh) * 2008-04-17 2011-06-08 泰拉丁公司 在存储装置测试系统中的温度控制
CN105698460A (zh) * 2014-11-28 2016-06-22 青岛海尔智能技术研发有限公司 冰箱及应用于冰箱的冷量补偿方法
CN106165556A (zh) * 2014-04-11 2016-11-23 慧与发展有限责任合伙企业 液体冷却剂供应
CN109491463A (zh) * 2018-11-01 2019-03-19 合肥享淘科技有限公司 一种新型计算机硬盘固定装置
CN111725655A (zh) * 2019-03-22 2020-09-29 泰连公司 用于电连接器的端子热交换器
CN114741257A (zh) * 2022-03-29 2022-07-12 国网浙江省电力有限公司电力科学研究院 一种图像分析服务器硬件运行状态监测装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132680B2 (ja) * 1999-02-26 2008-08-13 日本サーモスタット株式会社 電子機器の冷却装置
EP1207446A4 (en) 1999-06-02 2002-08-28 Guangji Dong A COMPUTER HEAT RADIATION SYSTEM
JP2002189535A (ja) 2000-12-20 2002-07-05 Hitachi Ltd 液冷システムおよびこれを用いたパーソナルコンピュータ
TWI234063B (en) 2002-05-15 2005-06-11 Matsushita Electric Industrial Co Ltd Cooling apparatus for electronic equipment
JP3757200B2 (ja) 2002-09-25 2006-03-22 株式会社日立製作所 冷却機構を備えた電子機器
KR100498276B1 (ko) * 2002-11-19 2005-06-29 월드이노텍(주) 냉각 장치
CN1759643B (zh) 2003-03-12 2011-06-08 富士通株式会社 电子设备的冷却结构
JP2005158101A (ja) * 2003-11-21 2005-06-16 Hitachi Ltd ディスクアレイ装置
JP4272503B2 (ja) 2003-12-17 2009-06-03 株式会社日立製作所 液冷システム
JP2006057920A (ja) 2004-08-20 2006-03-02 Hitachi Ltd 電子機器の液冷システム、及び、これを用いた電子機器
JP2006065940A (ja) * 2004-08-26 2006-03-09 Ricoh Co Ltd 電装冷却装置、画像形成装置
JP4214106B2 (ja) 2004-11-17 2009-01-28 富士通株式会社 電子装置の冷却装置
JP4637734B2 (ja) 2005-11-30 2011-02-23 富士通株式会社 電子装置の冷却装置
US20070153414A1 (en) * 2005-12-30 2007-07-05 Michael Sullivan External cover for controlling the temperature of an internal thermal zone of a hard disk drive
JP4685692B2 (ja) * 2006-04-14 2011-05-18 株式会社日立製作所 電子機器
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
US9074825B2 (en) 2007-09-28 2015-07-07 Panasonic Intellectual Property Management Co., Ltd. Heatsink apparatus and electronic device having the same
CN101983364B (zh) * 2008-01-31 2013-01-16 惠普开发有限公司 模块化数据处理部件和系统
JP2015082950A (ja) * 2013-10-24 2015-04-27 トヨタ自動車株式会社 冷却器及び電力変換装置
US11832423B2 (en) * 2021-03-23 2023-11-28 Baidu Usa Llc Liquid cooling unit for peripheral devices
CN115951768A (zh) * 2023-02-21 2023-04-11 西安翎飞鸾信息科技有限公司 一种计算机水冷散热装置
WO2025178114A1 (ja) * 2024-02-22 2025-08-28 ニデック株式会社 冷媒循環装置
KR102772293B1 (ko) * 2024-03-18 2025-02-26 명화지리정보(주) 영상이미지의 특정값을 추출하는 영상처리시스템

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1658744B (zh) * 2004-02-16 2010-07-21 株式会社日立制作所 液冷系统和电子装置
CN101115373B (zh) * 2006-07-25 2010-08-11 富士通株式会社 包括液体冷却单元的电子设备
CN101471308B (zh) * 2007-12-26 2011-03-23 中强光电股份有限公司 散热模块
CN102089726A (zh) * 2008-04-17 2011-06-08 泰拉丁公司 在存储装置测试系统中的温度控制
CN102089726B (zh) * 2008-04-17 2014-05-21 泰拉丁公司 在存储装置测试系统中的温度控制
CN106165556A (zh) * 2014-04-11 2016-11-23 慧与发展有限责任合伙企业 液体冷却剂供应
CN105698460A (zh) * 2014-11-28 2016-06-22 青岛海尔智能技术研发有限公司 冰箱及应用于冰箱的冷量补偿方法
CN105698460B (zh) * 2014-11-28 2019-11-05 青岛海尔智能技术研发有限公司 冰箱及应用于冰箱的冷量补偿方法
CN109491463A (zh) * 2018-11-01 2019-03-19 合肥享淘科技有限公司 一种新型计算机硬盘固定装置
CN111725655A (zh) * 2019-03-22 2020-09-29 泰连公司 用于电连接器的端子热交换器
CN114741257A (zh) * 2022-03-29 2022-07-12 国网浙江省电力有限公司电力科学研究院 一种图像分析服务器硬件运行状态监测装置

Also Published As

Publication number Publication date
TW422946B (en) 2001-02-21
JPH10213370A (ja) 1998-08-11

Similar Documents

Publication Publication Date Title
CN1193762A (zh) 计算机特殊器件的液体冷却装置
US6333849B1 (en) Apparatus for liquid cooling of specific computer components
US8929080B2 (en) Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US8422218B2 (en) Liquid cooled condensers for loop heat pipe like enclosure cooling
US8000103B2 (en) Cooling system for contact cooled electronic modules
US8619425B2 (en) Multi-fluid, two-phase immersion-cooling of electronic component(s)
US8713957B2 (en) Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)
US20180160566A1 (en) Liquid cooling system for server
US7411785B2 (en) Heat-spreading devices for cooling computer systems and associated methods of use
US8599557B2 (en) Printed circuit board cooling assembly
WO2020028181A1 (en) Modular computer cooling system
US8953317B2 (en) Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)
US10123464B2 (en) Heat dissipating system
US20070201204A1 (en) Liquid cooling loops for server applications
EP3531812A1 (en) Cooling system for a server
US10705578B2 (en) Heat removal from memory modules
US20090262495A1 (en) High efficiency heat removal system for rack mounted computer equipment
US20110209855A1 (en) Cooling system for computer components
US20070034359A1 (en) Integrated liquid cooling system for electronic components
US20150047809A1 (en) Fabricating thermal transfer structure(s) and attachment mechanism(s) for cooling electronics card(s)
KR20210110165A (ko) 방열장치
JP2003511648A (ja) 電子ヒートポンプ用の熱交換器
US7360583B2 (en) Integrated liquid cooling system for electronic components
EP0709885A2 (en) Circuit pack with integrated closed-loop cooling system
CN118870714A (zh) 液冷散热装置、电路板组件及电子设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication