JPH10213370A - 電子装置用の液体冷却装置 - Google Patents
電子装置用の液体冷却装置Info
- Publication number
- JPH10213370A JPH10213370A JP10000293A JP29398A JPH10213370A JP H10213370 A JPH10213370 A JP H10213370A JP 10000293 A JP10000293 A JP 10000293A JP 29398 A JP29398 A JP 29398A JP H10213370 A JPH10213370 A JP H10213370A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic device
- coolant
- heat transfer
- hard disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 47
- 238000001816 cooling Methods 0.000 title claims description 58
- 239000002826 coolant Substances 0.000 claims abstract description 60
- 238000012546 transfer Methods 0.000 claims abstract description 48
- 230000020169 heat generation Effects 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims abstract 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 239000003570 air Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000012080 ambient air Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 229910001369 Brass Inorganic materials 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101100048384 Human cytomegalovirus (strain AD169) UL61 gene Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009428 plumbing Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77514396A | 1996-12-31 | 1996-12-31 | |
| US775143 | 2010-05-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10213370A true JPH10213370A (ja) | 1998-08-11 |
| JPH10213370A5 JPH10213370A5 (enExample) | 2005-08-11 |
Family
ID=25103453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10000293A Pending JPH10213370A (ja) | 1996-12-31 | 1998-01-05 | 電子装置用の液体冷却装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH10213370A (enExample) |
| CN (1) | CN1193762A (enExample) |
| TW (1) | TW422946B (enExample) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000052401A1 (fr) * | 1999-02-26 | 2000-09-08 | Nippon Thermostat Co., Ltd. | Dispositif de refroidissement pour composants electroniques |
| WO2000075763A1 (en) * | 1999-06-02 | 2000-12-14 | Guangji Dong | A computer heat-radiation system |
| JP2002189535A (ja) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよびこれを用いたパーソナルコンピュータ |
| US6778394B2 (en) | 2002-09-25 | 2004-08-17 | Hitachi, Ltd. | Electronic device having a heat dissipation member |
| US6795312B2 (en) | 2002-05-15 | 2004-09-21 | Matsushita Electric Industrial Co., Ltd. | Cooling apparatus for electronic equipment |
| JP2005158101A (ja) * | 2003-11-21 | 2005-06-16 | Hitachi Ltd | ディスクアレイ装置 |
| KR100498276B1 (ko) * | 2002-11-19 | 2005-06-29 | 월드이노텍(주) | 냉각 장치 |
| JP2006065940A (ja) * | 2004-08-26 | 2006-03-09 | Ricoh Co Ltd | 電装冷却装置、画像形成装置 |
| US7155914B2 (en) | 2003-03-12 | 2007-01-02 | Fujitsu Limited | Cooling structure for electronic equipment |
| KR20070072397A (ko) * | 2005-12-30 | 2007-07-04 | 삼성전자주식회사 | 하드 디스크 드라이브의 내부 온도 영역의 온도를 제어하는외부 커버 |
| US7242581B2 (en) | 2004-08-20 | 2007-07-10 | Hitachi, Ltd. | Liquid cooling system and an electronic apparatus applying the same therein |
| JP2007287212A (ja) * | 2006-04-14 | 2007-11-01 | Hitachi Ltd | 電子機器 |
| WO2007137018A1 (en) * | 2006-05-16 | 2007-11-29 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US7333334B2 (en) | 2003-12-17 | 2008-02-19 | Hitachi, Ltd. | Liquid cooling system and electronic equipment using the same |
| US7337830B2 (en) | 2004-11-17 | 2008-03-04 | Fujitsu Limited | Cooling device of electronic device |
| JP2011511361A (ja) * | 2008-01-31 | 2011-04-07 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー． | モジュラデータ処理構成要素及びシステム |
| US8230901B2 (en) | 2005-11-30 | 2012-07-31 | Fujitsu Limited | Electronic device cooling apparatus |
| JP2015082950A (ja) * | 2013-10-24 | 2015-04-27 | トヨタ自動車株式会社 | 冷却器及び電力変換装置 |
| US9074825B2 (en) | 2007-09-28 | 2015-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Heatsink apparatus and electronic device having the same |
| CN115119470A (zh) * | 2021-03-23 | 2022-09-27 | 百度（美国）有限责任公司 | 用于外围装置的液体冷却单元 |
| CN115951768A (zh) * | 2023-02-21 | 2023-04-11 | 西安翎飞鸾信息科技有限公司 | 一种计算机水冷散热装置 |
| KR102772293B1 (ko) * | 2024-03-18 | 2025-02-26 | 명화지리정보(주) | 영상이미지의 특정값을 추출하는 영상처리시스템 |
| WO2025178114A1 (ja) * | 2024-02-22 | 2025-08-28 | ニデック株式会社 | 冷媒循環装置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4234621B2 (ja) * | 2004-02-16 | 2009-03-04 | 株式会社日立製作所 | 液冷システムおよび電子装置 |
| JP2008027370A (ja) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | 電子機器 |
| CN101471308B (zh) * | 2007-12-26 | 2011-03-23 | 中强光电股份有限公司 | 散热模块 |
| US7848106B2 (en) * | 2008-04-17 | 2010-12-07 | Teradyne, Inc. | Temperature control within disk drive testing systems |
| US20170017277A1 (en) * | 2014-04-11 | 2017-01-19 | Hewlett Packard Enterprise Development Lp | Liquid coolant supply |
| CN105698460B (zh) * | 2014-11-28 | 2019-11-05 | 青岛海尔智能技术研发有限公司 | 冰箱及应用于冰箱的冷量补偿方法 |
| CN109491463A (zh) * | 2018-11-01 | 2019-03-19 | 合肥享淘科技有限公司 | 一种新型计算机硬盘固定装置 |
| US10756498B1 (en) * | 2019-03-22 | 2020-08-25 | Te Connectivity Corporation | Terminal heat exchanger for an electrical connector |
| CN114741257B (zh) * | 2022-03-29 | 2025-12-02 | 国网浙江省电力有限公司电力科学研究院 | 一种图像分析服务器硬件运行状态监测装置 |
-
1997
- 1997-12-30 TW TW86119975A patent/TW422946B/zh active
- 1997-12-31 CN CN97107266A patent/CN1193762A/zh active Pending
-
1998
- 1998-01-05 JP JP10000293A patent/JPH10213370A/ja active Pending
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000052401A1 (fr) * | 1999-02-26 | 2000-09-08 | Nippon Thermostat Co., Ltd. | Dispositif de refroidissement pour composants electroniques |
| WO2000075763A1 (en) * | 1999-06-02 | 2000-12-14 | Guangji Dong | A computer heat-radiation system |
| US6747869B2 (en) | 1999-06-02 | 2004-06-08 | Guangji Dong | Microcomputer heat dissipation system |
| JP2002189535A (ja) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | 液冷システムおよびこれを用いたパーソナルコンピュータ |
| US6972954B2 (en) | 2000-12-20 | 2005-12-06 | Hitachi, Ltd. | Liquid cooling system and personal computer using the same |
| US6795312B2 (en) | 2002-05-15 | 2004-09-21 | Matsushita Electric Industrial Co., Ltd. | Cooling apparatus for electronic equipment |
| US6778394B2 (en) | 2002-09-25 | 2004-08-17 | Hitachi, Ltd. | Electronic device having a heat dissipation member |
| KR100498276B1 (ko) * | 2002-11-19 | 2005-06-29 | 월드이노텍(주) | 냉각 장치 |
| US7155914B2 (en) | 2003-03-12 | 2007-01-02 | Fujitsu Limited | Cooling structure for electronic equipment |
| JP2005158101A (ja) * | 2003-11-21 | 2005-06-16 | Hitachi Ltd | ディスクアレイ装置 |
| US7609477B2 (en) | 2003-11-21 | 2009-10-27 | Hitachi, Ltd. | Dish array apparatus with improved heat energy transfer |
| US7333334B2 (en) | 2003-12-17 | 2008-02-19 | Hitachi, Ltd. | Liquid cooling system and electronic equipment using the same |
| US7242581B2 (en) | 2004-08-20 | 2007-07-10 | Hitachi, Ltd. | Liquid cooling system and an electronic apparatus applying the same therein |
| JP2006065940A (ja) * | 2004-08-26 | 2006-03-09 | Ricoh Co Ltd | 電装冷却装置、画像形成装置 |
| US7337830B2 (en) | 2004-11-17 | 2008-03-04 | Fujitsu Limited | Cooling device of electronic device |
| US8230901B2 (en) | 2005-11-30 | 2012-07-31 | Fujitsu Limited | Electronic device cooling apparatus |
| KR20070072397A (ko) * | 2005-12-30 | 2007-07-04 | 삼성전자주식회사 | 하드 디스크 드라이브의 내부 온도 영역의 온도를 제어하는외부 커버 |
| JP2007287212A (ja) * | 2006-04-14 | 2007-11-01 | Hitachi Ltd | 電子機器 |
| WO2007137018A1 (en) * | 2006-05-16 | 2007-11-29 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US7403392B2 (en) | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US8009419B2 (en) | 2006-05-16 | 2011-08-30 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| US9074825B2 (en) | 2007-09-28 | 2015-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Heatsink apparatus and electronic device having the same |
| JP2011511361A (ja) * | 2008-01-31 | 2011-04-07 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー． | モジュラデータ処理構成要素及びシステム |
| JP2015082950A (ja) * | 2013-10-24 | 2015-04-27 | トヨタ自動車株式会社 | 冷却器及び電力変換装置 |
| CN115119470A (zh) * | 2021-03-23 | 2022-09-27 | 百度（美国）有限责任公司 | 用于外围装置的液体冷却单元 |
| CN115951768A (zh) * | 2023-02-21 | 2023-04-11 | 西安翎飞鸾信息科技有限公司 | 一种计算机水冷散热装置 |
| WO2025178114A1 (ja) * | 2024-02-22 | 2025-08-28 | ニデック株式会社 | 冷媒循環装置 |
| KR102772293B1 (ko) * | 2024-03-18 | 2025-02-26 | 명화지리정보(주) | 영상이미지의 특정값을 추출하는 영상처리시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW422946B (en) | 2001-02-21 |
| CN1193762A (zh) | 1998-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050105 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050127 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070209 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070213 |
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| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070216 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20071012 |