CN118975415A - 配线基板及其制造方法以及半导体装置 - Google Patents

配线基板及其制造方法以及半导体装置 Download PDF

Info

Publication number
CN118975415A
CN118975415A CN202280094498.5A CN202280094498A CN118975415A CN 118975415 A CN118975415 A CN 118975415A CN 202280094498 A CN202280094498 A CN 202280094498A CN 118975415 A CN118975415 A CN 118975415A
Authority
CN
China
Prior art keywords
wiring
electrode pad
insulating resin
layer
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280094498.5A
Other languages
English (en)
Chinese (zh)
Inventor
平野寿枝
鸟羽正也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN118975415A publication Critical patent/CN118975415A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202280094498.5A 2022-04-08 2022-04-08 配线基板及其制造方法以及半导体装置 Pending CN118975415A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017402 WO2023195174A1 (ja) 2022-04-08 2022-04-08 配線基板及びその製造方法、並びに半導体装置

Publications (1)

Publication Number Publication Date
CN118975415A true CN118975415A (zh) 2024-11-15

Family

ID=88242598

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280094498.5A Pending CN118975415A (zh) 2022-04-08 2022-04-08 配线基板及其制造方法以及半导体装置

Country Status (3)

Country Link
JP (1) JPWO2023195174A1 (https=)
CN (1) CN118975415A (https=)
WO (1) WO2023195174A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244000A (ja) * 2007-03-26 2008-10-09 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2011181629A (ja) * 2010-02-26 2011-09-15 Kyocer Slc Technologies Corp 配線基板およびその製造方法
JP2012209418A (ja) * 2011-03-30 2012-10-25 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Also Published As

Publication number Publication date
WO2023195174A1 (ja) 2023-10-12
JPWO2023195174A1 (https=) 2023-10-12

Similar Documents

Publication Publication Date Title
CN113439331A (zh) 封装用基板及其制造方法
KR20190020622A (ko) 수지 조성물
CN1317759C (zh) 印刷电路板、半导体封装、基底绝缘膜以及互连衬底的制造方法
JP6425062B2 (ja) 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
JP5028897B2 (ja) 絶縁材料、配線基板及び半導体装置
CN102316668A (zh) 带金属微细图案的基材、印刷布线板和它们的制造方法、以及半导体装置
TW201812939A (zh) 半導體裝置的製造方法
JP2020136542A (ja) プリント配線板の製造方法
CN118975415A (zh) 配线基板及其制造方法以及半导体装置
JP5682554B2 (ja) 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板
WO2018088345A1 (ja) 金属箔付き樹脂膜、構造体、配線基板の製造方法、半導体装置の製造方法
JP6439315B2 (ja) 粗化硬化体
TWI898077B (zh) 電路基板之製造方法
JP4742402B2 (ja) 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シートならびに半導体装置
JP2005277135A (ja) 半導体用接着剤組成物およびそれを用いた半導体用接着剤シート、半導体集積回路接続用基板、半導体装置
JP6217870B2 (ja) 構造体、配線基板および配線基板の製造方法
JP6756162B2 (ja) コンフォーマルマスク用絶縁層付き離型金属箔、積層板、多層配線板及び多層配線板の製造方法
JP5233066B2 (ja) 電子材料用接着剤シート
KR20240136339A (ko) 회로 기판의 제조방법 및 이에 사용하는 수지 시트
JP2019035050A (ja) 樹脂組成物
JP2017183376A (ja) フレキシブル基板、フレキシブル回路基板および支持体レスフレキシブル回路基板の製造方法
JP2005126712A (ja) 半導体素子用接着剤組成物、それを用いた接着シート及び接着テープ
JP2007116134A (ja) 半導体用テープ、半導体用接着剤付きテープ、半導体集積回路接続用基板および半導体装置
JP7809997B2 (ja) 電子部品の製造方法及び電子部品の製造に用いる積層体
JP7409558B2 (ja) 回路基板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination