JPWO2023195174A1 - - Google Patents
Info
- Publication number
- JPWO2023195174A1 JPWO2023195174A1 JP2024514137A JP2024514137A JPWO2023195174A1 JP WO2023195174 A1 JPWO2023195174 A1 JP WO2023195174A1 JP 2024514137 A JP2024514137 A JP 2024514137A JP 2024514137 A JP2024514137 A JP 2024514137A JP WO2023195174 A1 JPWO2023195174 A1 JP WO2023195174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/017402 WO2023195174A1 (ja) | 2022-04-08 | 2022-04-08 | 配線基板及びその製造方法、並びに半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023195174A1 true JPWO2023195174A1 (https=) | 2023-10-12 |
| JPWO2023195174A5 JPWO2023195174A5 (https=) | 2025-04-15 |
Family
ID=88242598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024514137A Pending JPWO2023195174A1 (https=) | 2022-04-08 | 2022-04-08 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023195174A1 (https=) |
| CN (1) | CN118975415A (https=) |
| WO (1) | WO2023195174A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008244000A (ja) * | 2007-03-26 | 2008-10-09 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
| JP2011181629A (ja) * | 2010-02-26 | 2011-09-15 | Kyocer Slc Technologies Corp | 配線基板およびその製造方法 |
| JP2012209418A (ja) * | 2011-03-30 | 2012-10-25 | Kyocer Slc Technologies Corp | 配線基板およびその製造方法 |
-
2022
- 2022-04-08 JP JP2024514137A patent/JPWO2023195174A1/ja active Pending
- 2022-04-08 WO PCT/JP2022/017402 patent/WO2023195174A1/ja not_active Ceased
- 2022-04-08 CN CN202280094498.5A patent/CN118975415A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023195174A1 (ja) | 2023-10-12 |
| CN118975415A (zh) | 2024-11-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241003 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250407 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250407 |