CN118946455A - 导电性膜及显示装置 - Google Patents

导电性膜及显示装置 Download PDF

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Publication number
CN118946455A
CN118946455A CN202380030271.9A CN202380030271A CN118946455A CN 118946455 A CN118946455 A CN 118946455A CN 202380030271 A CN202380030271 A CN 202380030271A CN 118946455 A CN118946455 A CN 118946455A
Authority
CN
China
Prior art keywords
metal
layer
resin
conductive film
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380030271.9A
Other languages
English (en)
Chinese (zh)
Inventor
新开浩
西冈圭介
小川春菜
桥本晋亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN118946455A publication Critical patent/CN118946455A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN202380030271.9A 2022-03-29 2023-03-06 导电性膜及显示装置 Pending CN118946455A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053996 2022-03-29
JP2022-053996 2022-03-29
PCT/JP2023/008423 WO2023189256A1 (ja) 2022-03-29 2023-03-06 導電性フィルム及び表示装置

Publications (1)

Publication Number Publication Date
CN118946455A true CN118946455A (zh) 2024-11-12

Family

ID=88201275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380030271.9A Pending CN118946455A (zh) 2022-03-29 2023-03-06 导电性膜及显示装置

Country Status (4)

Country Link
US (1) US20250014775A1 (https=)
JP (1) JPWO2023189256A1 (https=)
CN (1) CN118946455A (https=)
WO (1) WO2023189256A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163018A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 半導体装置の製造方法、多層配線基板及びその製造方法
CN103201104A (zh) * 2010-11-05 2013-07-10 旭硝子株式会社 层叠体、带有支撑板的显示装置用面板、显示装置用面板以及显示装置
CN109309012A (zh) * 2017-07-28 2019-02-05 Tdk株式会社 导电性基板、电子装置以及显示装置的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332534B2 (ja) * 1993-12-02 2002-10-07 大日本印刷株式会社 透明機能性フィルムの製造方法
JP4166686B2 (ja) * 2003-12-26 2008-10-15 株式会社東芝 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163018A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 半導体装置の製造方法、多層配線基板及びその製造方法
CN103201104A (zh) * 2010-11-05 2013-07-10 旭硝子株式会社 层叠体、带有支撑板的显示装置用面板、显示装置用面板以及显示装置
CN109309012A (zh) * 2017-07-28 2019-02-05 Tdk株式会社 导电性基板、电子装置以及显示装置的制造方法

Also Published As

Publication number Publication date
JPWO2023189256A1 (https=) 2023-10-05
US20250014775A1 (en) 2025-01-09
WO2023189256A1 (ja) 2023-10-05

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