JPWO2023189256A1 - - Google Patents

Info

Publication number
JPWO2023189256A1
JPWO2023189256A1 JP2024511583A JP2024511583A JPWO2023189256A1 JP WO2023189256 A1 JPWO2023189256 A1 JP WO2023189256A1 JP 2024511583 A JP2024511583 A JP 2024511583A JP 2024511583 A JP2024511583 A JP 2024511583A JP WO2023189256 A1 JPWO2023189256 A1 JP WO2023189256A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511583A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189256A1 publication Critical patent/JPWO2023189256A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2024511583A 2022-03-29 2023-03-06 Pending JPWO2023189256A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022053996 2022-03-29
PCT/JP2023/008423 WO2023189256A1 (ja) 2022-03-29 2023-03-06 導電性フィルム及び表示装置

Publications (1)

Publication Number Publication Date
JPWO2023189256A1 true JPWO2023189256A1 (https=) 2023-10-05

Family

ID=88201275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511583A Pending JPWO2023189256A1 (https=) 2022-03-29 2023-03-06

Country Status (4)

Country Link
US (1) US20250014775A1 (https=)
JP (1) JPWO2023189256A1 (https=)
CN (1) CN118946455A (https=)
WO (1) WO2023189256A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332534B2 (ja) * 1993-12-02 2002-10-07 大日本印刷株式会社 透明機能性フィルムの製造方法
JPH11163018A (ja) * 1997-11-28 1999-06-18 Toshiba Corp 半導体装置の製造方法、多層配線基板及びその製造方法
JP4166686B2 (ja) * 2003-12-26 2008-10-15 株式会社東芝 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
JP5842821B2 (ja) * 2010-11-05 2016-01-13 旭硝子株式会社 積層体、支持板付き表示装置用パネル、表示装置用パネル、および表示装置
JP7375294B2 (ja) * 2017-07-28 2023-11-08 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法

Also Published As

Publication number Publication date
US20250014775A1 (en) 2025-01-09
CN118946455A (zh) 2024-11-12
WO2023189256A1 (ja) 2023-10-05

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