CN118843933A - 半导体模块、半导体装置以及车辆 - Google Patents

半导体模块、半导体装置以及车辆 Download PDF

Info

Publication number
CN118843933A
CN118843933A CN202380024528.XA CN202380024528A CN118843933A CN 118843933 A CN118843933 A CN 118843933A CN 202380024528 A CN202380024528 A CN 202380024528A CN 118843933 A CN118843933 A CN 118843933A
Authority
CN
China
Prior art keywords
partition
sealing material
semiconductor module
circuit board
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380024528.XA
Other languages
English (en)
Chinese (zh)
Inventor
伊藤太一
小平悦宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN118843933A publication Critical patent/CN118843933A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0073—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having specific features for mounting the housing on an external structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380024528.XA 2022-09-16 2023-08-02 半导体模块、半导体装置以及车辆 Pending CN118843933A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022148608 2022-09-16
JP2022-148608 2022-09-16
PCT/JP2023/028240 WO2024057752A1 (ja) 2022-09-16 2023-08-02 半導体モジュール、半導体装置、及び車両

Publications (1)

Publication Number Publication Date
CN118843933A true CN118843933A (zh) 2024-10-25

Family

ID=90274689

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380024528.XA Pending CN118843933A (zh) 2022-09-16 2023-08-02 半导体模块、半导体装置以及车辆

Country Status (5)

Country Link
US (1) US20240431041A1 (https=)
JP (1) JP7761159B2 (https=)
CN (1) CN118843933A (https=)
DE (1) DE112023000516T5 (https=)
WO (1) WO2024057752A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6261349A (ja) * 1985-09-11 1987-03-18 Mitsubishi Electric Corp 半導体装置
JPH07335800A (ja) 1994-06-08 1995-12-22 Fuji Electric Co Ltd 半導体装置
JP3831577B2 (ja) * 2000-06-01 2006-10-11 アイシン・エィ・ダブリュ株式会社 電子部品ユニット
JP2006121861A (ja) 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
CN101273673B (zh) 2005-08-30 2010-12-08 松下电器产业株式会社 基板结构及电子设备
JP2011023458A (ja) * 2009-07-14 2011-02-03 Toshiba Corp 半導体装置およびその製造方法
JP5831626B2 (ja) * 2012-03-28 2015-12-09 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP5897516B2 (ja) * 2013-08-21 2016-03-30 株式会社三社電機製作所 半導体装置
JP6193507B2 (ja) * 2014-09-30 2017-09-06 株式会社三社電機製作所 半導体モジュール
DE112017007415B4 (de) 2017-04-06 2023-01-12 Mitsubishi Electric Corporation Halbleiterbauelement, Verfahren zur Herstellung desselben und Leistungswandlervorrichtung
JP7247791B2 (ja) * 2019-07-03 2023-03-29 住友電気工業株式会社 半導体装置
JP7613196B2 (ja) 2021-03-24 2025-01-15 富士フイルムビジネスイノベーション株式会社 情報処理装置及びプログラム

Also Published As

Publication number Publication date
JP7761159B2 (ja) 2025-10-28
US20240431041A1 (en) 2024-12-26
JPWO2024057752A1 (https=) 2024-03-21
WO2024057752A1 (ja) 2024-03-21
DE112023000516T5 (de) 2024-12-12

Similar Documents

Publication Publication Date Title
CN103400832B (zh) 功率半导体装置
JP6237912B2 (ja) パワー半導体モジュール
JP4455488B2 (ja) 半導体装置
US5920119A (en) Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability
JP7567891B2 (ja) 半導体モジュール
US11450647B2 (en) Semiconductor module and semiconductor device including the same
CN105378922B (zh) 功率模块
US11232994B2 (en) Power semiconductor device having a distance regulation portion and power conversion apparatus including the same
CN113113400A (zh) 半导体电路和半导体电路的制造方法
US12456695B2 (en) Semiconductor apparatus and manufacturing method for semiconductor apparatus
US20220165712A1 (en) Power module
CN118843933A (zh) 半导体模块、半导体装置以及车辆
US20230223314A1 (en) Semiconductor apparatus and vehicle
JP2024011697A (ja) 半導体装置
JP7577953B2 (ja) 半導体装置及び半導体装置の製造方法
JP2023134143A (ja) 半導体モジュール、半導体装置、及び車両
JP7433562B1 (ja) 半導体装置
JP2004063682A (ja) 半導体装置
US20240297100A1 (en) Semiconductor module, semiconductor device, and vehicle
US20240178081A1 (en) Semiconductor module, semiconductor device, and method for manufacturing semiconductor device
US20240355713A1 (en) Semiconductor device
JP2024061189A (ja) 半導体モジュール、半導体装置、及び車両
CN118974916A (zh) 半导体模块、半导体装置以及车辆
US20230317534A1 (en) Semiconductor device and method of producing semiconductor device
JP2025078395A (ja) 半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination