JP7761159B2 - 半導体モジュール、半導体装置、及び車両 - Google Patents

半導体モジュール、半導体装置、及び車両

Info

Publication number
JP7761159B2
JP7761159B2 JP2024546764A JP2024546764A JP7761159B2 JP 7761159 B2 JP7761159 B2 JP 7761159B2 JP 2024546764 A JP2024546764 A JP 2024546764A JP 2024546764 A JP2024546764 A JP 2024546764A JP 7761159 B2 JP7761159 B2 JP 7761159B2
Authority
JP
Japan
Prior art keywords
partition
case
semiconductor module
circuit board
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024546764A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024057752A1 (https=
Inventor
太一 伊藤
悦宏 小平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2024057752A1 publication Critical patent/JPWO2024057752A1/ja
Application granted granted Critical
Publication of JP7761159B2 publication Critical patent/JP7761159B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0073—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having specific features for mounting the housing on an external structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024546764A 2022-09-16 2023-08-02 半導体モジュール、半導体装置、及び車両 Active JP7761159B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022148608 2022-09-16
JP2022148608 2022-09-16
PCT/JP2023/028240 WO2024057752A1 (ja) 2022-09-16 2023-08-02 半導体モジュール、半導体装置、及び車両

Publications (2)

Publication Number Publication Date
JPWO2024057752A1 JPWO2024057752A1 (https=) 2024-03-21
JP7761159B2 true JP7761159B2 (ja) 2025-10-28

Family

ID=90274689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546764A Active JP7761159B2 (ja) 2022-09-16 2023-08-02 半導体モジュール、半導体装置、及び車両

Country Status (5)

Country Link
US (1) US20240431041A1 (https=)
JP (1) JP7761159B2 (https=)
CN (1) CN118843933A (https=)
DE (1) DE112023000516T5 (https=)
WO (1) WO2024057752A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007026499A1 (ja) 2005-08-30 2007-03-08 Matsushita Electric Industrial Co., Ltd. 基板構造および電子機器
WO2016052183A1 (ja) 2014-09-30 2016-04-07 株式会社三社電機製作所 半導体モジュール
WO2018185974A1 (ja) 2017-04-06 2018-10-11 三菱電機株式会社 半導体装置およびその製造方法、ならびに電力変換装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6261349A (ja) * 1985-09-11 1987-03-18 Mitsubishi Electric Corp 半導体装置
JPH07335800A (ja) 1994-06-08 1995-12-22 Fuji Electric Co Ltd 半導体装置
JP3831577B2 (ja) * 2000-06-01 2006-10-11 アイシン・エィ・ダブリュ株式会社 電子部品ユニット
JP2006121861A (ja) 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP2011023458A (ja) * 2009-07-14 2011-02-03 Toshiba Corp 半導体装置およびその製造方法
WO2013145619A1 (ja) * 2012-03-28 2013-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP5897516B2 (ja) * 2013-08-21 2016-03-30 株式会社三社電機製作所 半導体装置
JP7247791B2 (ja) * 2019-07-03 2023-03-29 住友電気工業株式会社 半導体装置
JP7613196B2 (ja) 2021-03-24 2025-01-15 富士フイルムビジネスイノベーション株式会社 情報処理装置及びプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007026499A1 (ja) 2005-08-30 2007-03-08 Matsushita Electric Industrial Co., Ltd. 基板構造および電子機器
WO2016052183A1 (ja) 2014-09-30 2016-04-07 株式会社三社電機製作所 半導体モジュール
WO2018185974A1 (ja) 2017-04-06 2018-10-11 三菱電機株式会社 半導体装置およびその製造方法、ならびに電力変換装置

Also Published As

Publication number Publication date
WO2024057752A1 (ja) 2024-03-21
CN118843933A (zh) 2024-10-25
JPWO2024057752A1 (https=) 2024-03-21
DE112023000516T5 (de) 2024-12-12
US20240431041A1 (en) 2024-12-26

Similar Documents

Publication Publication Date Title
US5920119A (en) Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability
CN103400832B (zh) 功率半导体装置
US8497572B2 (en) Semiconductor module and method of manufacturing the same
US9312192B2 (en) Semiconductor device
JP3910383B2 (ja) パワーモジュールおよびインバータ
JP7567891B2 (ja) 半導体モジュール
EP2833404A1 (en) Semiconductor device and method for manufacturing semiconductor device
CN105378922B (zh) 功率模块
US12456695B2 (en) Semiconductor apparatus and manufacturing method for semiconductor apparatus
JP7761159B2 (ja) 半導体モジュール、半導体装置、及び車両
US20220165712A1 (en) Power module
JP7809984B2 (ja) 半導体装置、及び車両
JP7577953B2 (ja) 半導体装置及び半導体装置の製造方法
JP7543854B2 (ja) 半導体装置及び半導体装置の製造方法
JP2023134143A (ja) 半導体モジュール、半導体装置、及び車両
JP2007043204A (ja) パワーモジュールおよびインバータ
WO2021261056A1 (ja) パワーモジュール
WO2022201426A1 (ja) 半導体装置および半導体装置の製造方法
JP7626293B2 (ja) 半導体モジュール、半導体装置、及び半導体装置の製造方法
JP2004063682A (ja) 半導体装置
JP7433562B1 (ja) 半導体装置
US20240297100A1 (en) Semiconductor module, semiconductor device, and vehicle
US11887941B2 (en) Semiconductor module with reinforced sealing resin
JP2026013852A (ja) 半導体装置および電力変換装置
JP2024061189A (ja) 半導体モジュール、半導体装置、及び車両

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250610

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250916

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250929

R150 Certificate of patent or registration of utility model

Ref document number: 7761159

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150