CN1186967C - 电激发光面板的制造方法 - Google Patents

电激发光面板的制造方法 Download PDF

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Publication number
CN1186967C
CN1186967C CNB021432651A CN02143265A CN1186967C CN 1186967 C CN1186967 C CN 1186967C CN B021432651 A CNB021432651 A CN B021432651A CN 02143265 A CN02143265 A CN 02143265A CN 1186967 C CN1186967 C CN 1186967C
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CN
China
Prior art keywords
substrate
sealing material
panel
aforementioned
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB021432651A
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English (en)
Chinese (zh)
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CN1411323A (zh
Inventor
松冈英树
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN1411323A publication Critical patent/CN1411323A/zh
Application granted granted Critical
Publication of CN1186967C publication Critical patent/CN1186967C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/872—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CNB021432651A 2001-09-28 2002-09-25 电激发光面板的制造方法 Expired - Lifetime CN1186967C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001303819 2001-09-28
JP2001303819 2001-09-28

Publications (2)

Publication Number Publication Date
CN1411323A CN1411323A (zh) 2003-04-16
CN1186967C true CN1186967C (zh) 2005-01-26

Family

ID=19123846

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021432651A Expired - Lifetime CN1186967C (zh) 2001-09-28 2002-09-25 电激发光面板的制造方法

Country Status (4)

Country Link
US (1) US7097527B2 (enExample)
KR (1) KR100513613B1 (enExample)
CN (1) CN1186967C (enExample)
TW (1) TWI299632B (enExample)

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US6909114B1 (en) * 1998-11-17 2005-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having LDD regions
JP3705190B2 (ja) * 2001-10-03 2005-10-12 ソニー株式会社 表示装置の製造方法
JP3650101B2 (ja) * 2003-02-04 2005-05-18 三洋電機株式会社 有機エレクトロルミネッセンス装置およびその製造方法
KR100556086B1 (ko) 2003-11-15 2006-03-07 한국전자통신연구원 엔캡슐레이션된 유기 발광 디스플레이 판넬 및 그의 제작방법
US7792489B2 (en) 2003-12-26 2010-09-07 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic appliance, and method for manufacturing light emitting device
US7279063B2 (en) * 2004-01-16 2007-10-09 Eastman Kodak Company Method of making an OLED display device with enhanced optical and mechanical properties
US7211881B2 (en) * 2004-03-24 2007-05-01 Hewlett-Packard Development Company, L.P. Structure for containing desiccant
DE102004024676A1 (de) * 2004-05-18 2005-12-15 Süd-Chemie AG Filmförmige sorbenshaltige Zusammensetzungen
KR100637193B1 (ko) * 2004-11-25 2006-10-23 삼성에스디아이 주식회사 전계 발광 디스플레이 장치 및 이의 제조 방법
GB0505680D0 (en) * 2005-03-22 2005-04-27 Cambridge Display Tech Ltd Apparatus and method for increased device lifetime in an organic electro-luminescent device
US7452258B1 (en) * 2005-08-30 2008-11-18 Rockwell Collins, Inc. Method of sealing OLED cover with liquid adhesive
US8603288B2 (en) * 2008-01-18 2013-12-10 Rockwell Collins, Inc. Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
KR100893864B1 (ko) * 2007-11-07 2009-04-20 엘지전자 주식회사 유기 전계 발광 소자 및 그 제조방법
KR100977704B1 (ko) * 2007-12-21 2010-08-24 주성엔지니어링(주) 표시소자 및 그 제조방법
KR101625880B1 (ko) 2008-01-18 2016-05-31 로크웰 콜린스 인코포레이티드 기판 적층 시스템 및 방법
US8362698B2 (en) * 2008-02-26 2013-01-29 Tohoku Pioneer Corporation Organic EL panel and its manufacturing method
JP5111201B2 (ja) 2008-03-31 2013-01-09 株式会社ジャパンディスプレイイースト 有機ｅｌ表示装置
DE102008032126B4 (de) * 2008-07-08 2017-02-09 Osram Oled Gmbh Organisches, optoelektronisches Bauteil und Verfahren zur Herstellung eines organischen, optoelektronischen Bauteils
JP2010102994A (ja) * 2008-10-24 2010-05-06 Hitachi Displays Ltd 有機エレクトロルミネッセンス装置
KR100995066B1 (ko) * 2009-01-07 2010-11-18 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
CN201498735U (zh) * 2009-08-04 2010-06-02 富士康(昆山)电脑接插件有限公司 线缆组件
JP5656393B2 (ja) * 2009-12-01 2015-01-21 キヤノン株式会社 モジュール
US8411235B1 (en) 2010-03-16 2013-04-02 Rockwell Collins, Inc. Displays for three-dimensional imaging
JP6124577B2 (ja) * 2012-12-12 2017-05-10 株式会社半導体エネルギー研究所 発光装置およびその作製方法
KR102071007B1 (ko) * 2013-02-13 2020-01-30 삼성디스플레이 주식회사 유기 발광 표시 장치
CN103500799B (zh) * 2013-09-24 2015-10-14 京东方科技集团股份有限公司 一种oled器件的封装结构和封装方法
US9981460B1 (en) 2014-05-06 2018-05-29 Rockwell Collins, Inc. Systems and methods for substrate lamination
CN112930106B (zh) * 2021-01-22 2022-11-22 杭州唯灵医疗科技有限公司 一种柔性电子设备及柔性电子设备的组装方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2049274B (en) 1979-03-16 1983-04-27 Sharp Kk Moisture absorptive arrangement for a glass sealed thinfilm electroluminescent display panel
JPS576883A (en) 1980-06-13 1982-01-13 Sharp Kk Thin film el panel
JP2836497B2 (ja) * 1994-09-06 1998-12-14 株式会社デンソー 透明薄膜エレクトロルミネッセンス表示器
JPH11162635A (ja) * 1997-11-28 1999-06-18 Nippon Seiki Co Ltd 薄膜電界発光素子
JP2845239B1 (ja) * 1997-12-17 1999-01-13 日本電気株式会社 有機薄膜ｅｌデバイスおよびその製造方法
JP2000206894A (ja) 1998-11-10 2000-07-28 Toshiba Corp 平面表示装置
US6624570B1 (en) * 1999-09-29 2003-09-23 Sanyo Electric Co., Ltd. Electroluminescent display device and method for its fabrication
JP4776769B2 (ja) 1999-11-09 2011-09-21 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2003017259A (ja) * 2001-06-29 2003-01-17 Sanyo Electric Co Ltd エレクトロルミネッセンス表示パネルの製造方法
KR20030024996A (ko) * 2001-09-19 2003-03-28 엘지전자 주식회사 유기전계발광소자 및 그의 제조방법
KR100477745B1 (ko) * 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널

Also Published As

Publication number Publication date
US20030067268A1 (en) 2003-04-10
TWI299632B (enExample) 2008-08-01
KR100513613B1 (ko) 2005-09-09
US7097527B2 (en) 2006-08-29
KR20030027796A (ko) 2003-04-07
CN1411323A (zh) 2003-04-16

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Granted publication date: 20050126