CN118541794A - 冷却器以及半导体装置 - Google Patents

冷却器以及半导体装置 Download PDF

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Publication number
CN118541794A
CN118541794A CN202380018604.6A CN202380018604A CN118541794A CN 118541794 A CN118541794 A CN 118541794A CN 202380018604 A CN202380018604 A CN 202380018604A CN 118541794 A CN118541794 A CN 118541794A
Authority
CN
China
Prior art keywords
region
flow path
cooler
flow
slit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380018604.6A
Other languages
English (en)
Chinese (zh)
Inventor
佐野大贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN118541794A publication Critical patent/CN118541794A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380018604.6A 2022-08-08 2023-07-04 冷却器以及半导体装置 Pending CN118541794A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022126059 2022-08-08
JP2022-126059 2022-08-08
PCT/JP2023/024795 WO2024034291A1 (ja) 2022-08-08 2023-07-04 冷却器及び半導体装置

Publications (1)

Publication Number Publication Date
CN118541794A true CN118541794A (zh) 2024-08-23

Family

ID=89851371

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380018604.6A Pending CN118541794A (zh) 2022-08-08 2023-07-04 冷却器以及半导体装置

Country Status (5)

Country Link
US (1) US20240379499A1 (https=)
JP (1) JPWO2024034291A1 (https=)
CN (1) CN118541794A (https=)
DE (1) DE112023000409T5 (https=)
WO (1) WO2024034291A1 (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179771A (ja) * 2004-12-24 2006-07-06 Mitsubishi Electric Corp 電気デバイス及び冷却ジャケット
JP4269060B2 (ja) * 2006-02-22 2009-05-27 国立大学法人九州大学 除熱方法及び除熱装置
JP4986064B2 (ja) * 2008-02-27 2012-07-25 アイシン・エィ・ダブリュ株式会社 発熱体冷却装置
JP2010140964A (ja) * 2008-12-09 2010-06-24 Toyota Motor Corp 半導体素子用冷却器
JP2012069892A (ja) * 2010-09-27 2012-04-05 Denso Corp 半導体冷却器
JP5655575B2 (ja) 2011-01-10 2015-01-21 トヨタ自動車株式会社 冷却器及びそれを用いた電力変換装置
WO2013054615A1 (ja) 2011-10-12 2013-04-18 富士電機株式会社 半導体モジュール用冷却器及び半導体モジュール
JP6124742B2 (ja) * 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
US10214109B2 (en) * 2013-11-28 2019-02-26 Fuji Electric Co., Ltd. Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle
JP5769834B2 (ja) 2014-02-12 2015-08-26 三菱電機株式会社 液冷式冷却器
WO2015177909A1 (ja) * 2014-05-22 2015-11-26 三菱電機株式会社 液冷ヒートシンク
JP6316096B2 (ja) * 2014-05-28 2018-04-25 昭和電工株式会社 液冷式冷却装置
JP6463505B2 (ja) 2015-11-25 2019-02-06 三菱電機株式会社 半導体装置、インバータ装置及び自動車
JP7039917B2 (ja) 2017-10-06 2022-03-23 富士電機株式会社 冷却器
US11502023B2 (en) * 2018-05-01 2022-11-15 Mitsubishi Electric Corporation Semiconductor device with partition for refrigerant cooling
JP7124425B2 (ja) * 2018-05-02 2022-08-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7229195B2 (ja) * 2020-03-10 2023-02-27 三菱電機株式会社 発熱素子冷却装置

Also Published As

Publication number Publication date
DE112023000409T5 (de) 2024-10-10
US20240379499A1 (en) 2024-11-14
JPWO2024034291A1 (https=) 2024-02-15
WO2024034291A1 (ja) 2024-02-15

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