DE112023000409T5 - Kühler und halbleitervorrichtung - Google Patents

Kühler und halbleitervorrichtung Download PDF

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Publication number
DE112023000409T5
DE112023000409T5 DE112023000409.9T DE112023000409T DE112023000409T5 DE 112023000409 T5 DE112023000409 T5 DE 112023000409T5 DE 112023000409 T DE112023000409 T DE 112023000409T DE 112023000409 T5 DE112023000409 T5 DE 112023000409T5
Authority
DE
Germany
Prior art keywords
region
flow rate
rate adjusting
flow path
cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023000409.9T
Other languages
German (de)
English (en)
Inventor
Daiki Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE112023000409T5 publication Critical patent/DE112023000409T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
    • F28F3/044—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being pontual, e.g. dimples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112023000409.9T 2022-08-08 2023-07-04 Kühler und halbleitervorrichtung Pending DE112023000409T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022126059 2022-08-08
JP2022-126059 2022-08-08
PCT/JP2023/024795 WO2024034291A1 (ja) 2022-08-08 2023-07-04 冷却器及び半導体装置

Publications (1)

Publication Number Publication Date
DE112023000409T5 true DE112023000409T5 (de) 2024-10-10

Family

ID=89851371

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023000409.9T Pending DE112023000409T5 (de) 2022-08-08 2023-07-04 Kühler und halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20240379499A1 (https=)
JP (1) JPWO2024034291A1 (https=)
CN (1) CN118541794A (https=)
DE (1) DE112023000409T5 (https=)
WO (1) WO2024034291A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179771A (ja) 2004-12-24 2006-07-06 Mitsubishi Electric Corp 電気デバイス及び冷却ジャケット
JP2012069892A (ja) 2010-09-27 2012-04-05 Denso Corp 半導体冷却器
JP2012146759A (ja) 2011-01-10 2012-08-02 Toyota Motor Corp 冷却器及びそれを用いた電力変換装置
WO2013054615A1 (ja) 2011-10-12 2013-04-18 富士電機株式会社 半導体モジュール用冷却器及び半導体モジュール
WO2015079643A1 (ja) 2013-11-28 2015-06-04 富士電機株式会社 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両
JP2015153799A (ja) 2014-02-12 2015-08-24 三菱電機株式会社 液冷式冷却器
WO2017090106A1 (ja) 2015-11-25 2017-06-01 三菱電機株式会社 半導体装置、インバータ装置及び自動車
JP2019071330A (ja) 2017-10-06 2019-05-09 富士電機株式会社 冷却器
WO2019211889A1 (ja) 2018-05-01 2019-11-07 三菱電機株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4269060B2 (ja) * 2006-02-22 2009-05-27 国立大学法人九州大学 除熱方法及び除熱装置
JP4986064B2 (ja) * 2008-02-27 2012-07-25 アイシン・エィ・ダブリュ株式会社 発熱体冷却装置
JP2010140964A (ja) * 2008-12-09 2010-06-24 Toyota Motor Corp 半導体素子用冷却器
JP6124742B2 (ja) * 2013-09-05 2017-05-10 三菱電機株式会社 半導体装置
WO2015177909A1 (ja) * 2014-05-22 2015-11-26 三菱電機株式会社 液冷ヒートシンク
JP6316096B2 (ja) * 2014-05-28 2018-04-25 昭和電工株式会社 液冷式冷却装置
JP7124425B2 (ja) * 2018-05-02 2022-08-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP7229195B2 (ja) * 2020-03-10 2023-02-27 三菱電機株式会社 発熱素子冷却装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179771A (ja) 2004-12-24 2006-07-06 Mitsubishi Electric Corp 電気デバイス及び冷却ジャケット
JP2012069892A (ja) 2010-09-27 2012-04-05 Denso Corp 半導体冷却器
JP2012146759A (ja) 2011-01-10 2012-08-02 Toyota Motor Corp 冷却器及びそれを用いた電力変換装置
WO2013054615A1 (ja) 2011-10-12 2013-04-18 富士電機株式会社 半導体モジュール用冷却器及び半導体モジュール
WO2015079643A1 (ja) 2013-11-28 2015-06-04 富士電機株式会社 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両
JP2015153799A (ja) 2014-02-12 2015-08-24 三菱電機株式会社 液冷式冷却器
WO2017090106A1 (ja) 2015-11-25 2017-06-01 三菱電機株式会社 半導体装置、インバータ装置及び自動車
JP2019071330A (ja) 2017-10-06 2019-05-09 富士電機株式会社 冷却器
WO2019211889A1 (ja) 2018-05-01 2019-11-07 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN118541794A (zh) 2024-08-23
US20240379499A1 (en) 2024-11-14
JPWO2024034291A1 (https=) 2024-02-15
WO2024034291A1 (ja) 2024-02-15

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