CN118266274A - 保护片、电子器件封装及电子器件封装的制造方法 - Google Patents

保护片、电子器件封装及电子器件封装的制造方法 Download PDF

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Publication number
CN118266274A
CN118266274A CN202280076985.9A CN202280076985A CN118266274A CN 118266274 A CN118266274 A CN 118266274A CN 202280076985 A CN202280076985 A CN 202280076985A CN 118266274 A CN118266274 A CN 118266274A
Authority
CN
China
Prior art keywords
protective layer
electronic device
protective
protective sheet
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280076985.9A
Other languages
English (en)
Chinese (zh)
Inventor
松尾玲季
松戸和规
岸大将
日野光晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aitiansi Co ltd
Toyochem Co Ltd
Original Assignee
Aitiansi Co ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aitiansi Co ltd, Toyochem Co Ltd filed Critical Aitiansi Co ltd
Publication of CN118266274A publication Critical patent/CN118266274A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN202280076985.9A 2021-11-29 2022-11-16 保护片、电子器件封装及电子器件封装的制造方法 Pending CN118266274A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193194 2021-11-29
JP2021-193194 2021-11-29
PCT/JP2022/042570 WO2023095697A1 (ja) 2021-11-29 2022-11-16 保護シート、電子デバイスパッケージ及びその製造方法

Publications (1)

Publication Number Publication Date
CN118266274A true CN118266274A (zh) 2024-06-28

Family

ID=86539662

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280076985.9A Pending CN118266274A (zh) 2021-11-29 2022-11-16 保护片、电子器件封装及电子器件封装的制造方法

Country Status (4)

Country Link
JP (2) JP7609301B2 (enExample)
KR (1) KR20240113761A (enExample)
CN (1) CN118266274A (enExample)
WO (1) WO2023095697A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062977A1 (ja) * 2023-09-21 2025-03-27 日本発條株式会社 積層体製造用器具、及び積層体の製造方法
JP7460013B1 (ja) * 2023-11-30 2024-04-02 ａｒｔｉｅｎｃｅ株式会社 電子部品搭載基板及び電子機器
JP7783968B1 (ja) * 2024-12-18 2025-12-10 ａｒｔｉｅｎｃｅ株式会社 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445968B2 (en) 2005-12-16 2008-11-04 Sige Semiconductor (U.S.), Corp. Methods for integrated circuit module packaging and integrated circuit module packages
JP5349432B2 (ja) * 2010-09-06 2013-11-20 日東電工株式会社 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP5893917B2 (ja) * 2011-12-28 2016-03-23 日東電工株式会社 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法
JP6623513B2 (ja) * 2013-12-03 2019-12-25 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
CN207638990U (zh) * 2015-07-13 2018-07-20 株式会社村田制作所 树脂基板以及搭载有部件的树脂基板
JP2020069720A (ja) * 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
JP7510405B2 (ja) * 2019-03-11 2024-07-03 積水化学工業株式会社 コーティング剤、および該コーティング剤を用いたモジュールの製造方法

Also Published As

Publication number Publication date
KR20240113761A (ko) 2024-07-23
JP7609301B2 (ja) 2025-01-07
TW202322301A (zh) 2023-06-01
JP2025041717A (ja) 2025-03-26
WO2023095697A1 (ja) 2023-06-01
JPWO2023095697A1 (enExample) 2023-06-01

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