JP7609301B2 - 保護シート、電子デバイスパッケージ及びその製造方法 - Google Patents

保護シート、電子デバイスパッケージ及びその製造方法 Download PDF

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Publication number
JP7609301B2
JP7609301B2 JP2023563644A JP2023563644A JP7609301B2 JP 7609301 B2 JP7609301 B2 JP 7609301B2 JP 2023563644 A JP2023563644 A JP 2023563644A JP 2023563644 A JP2023563644 A JP 2023563644A JP 7609301 B2 JP7609301 B2 JP 7609301B2
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Japan
Prior art keywords
protective layer
protective
protective sheet
layer
electronic device
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Active
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JP2023563644A
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English (en)
Japanese (ja)
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JPWO2023095697A5 (enExample
JPWO2023095697A1 (enExample
Inventor
玲季 松尾
和規 松戸
大将 岸
光晴 日野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Artience Co Ltd
Original Assignee
Artience Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Artience Co Ltd filed Critical Artience Co Ltd
Publication of JPWO2023095697A1 publication Critical patent/JPWO2023095697A1/ja
Publication of JPWO2023095697A5 publication Critical patent/JPWO2023095697A5/ja
Priority to JP2024220911A priority Critical patent/JP2025041717A/ja
Application granted granted Critical
Publication of JP7609301B2 publication Critical patent/JP7609301B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023563644A 2021-11-29 2022-11-16 保護シート、電子デバイスパッケージ及びその製造方法 Active JP7609301B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024220911A JP2025041717A (ja) 2021-11-29 2024-12-17 保護シート、電子デバイスパッケージ及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021193194 2021-11-29
JP2021193194 2021-11-29
PCT/JP2022/042570 WO2023095697A1 (ja) 2021-11-29 2022-11-16 保護シート、電子デバイスパッケージ及びその製造方法

Related Child Applications (1)

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JP2024220911A Division JP2025041717A (ja) 2021-11-29 2024-12-17 保護シート、電子デバイスパッケージ及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2023095697A1 JPWO2023095697A1 (enExample) 2023-06-01
JPWO2023095697A5 JPWO2023095697A5 (enExample) 2024-08-09
JP7609301B2 true JP7609301B2 (ja) 2025-01-07

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JP2023563644A Active JP7609301B2 (ja) 2021-11-29 2022-11-16 保護シート、電子デバイスパッケージ及びその製造方法
JP2024220911A Pending JP2025041717A (ja) 2021-11-29 2024-12-17 保護シート、電子デバイスパッケージ及びその製造方法

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JP2024220911A Pending JP2025041717A (ja) 2021-11-29 2024-12-17 保護シート、電子デバイスパッケージ及びその製造方法

Country Status (4)

Country Link
JP (2) JP7609301B2 (enExample)
KR (1) KR20240113761A (enExample)
CN (1) CN118266274A (enExample)
WO (1) WO2023095697A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062977A1 (ja) * 2023-09-21 2025-03-27 日本発條株式会社 積層体製造用器具、及び積層体の製造方法
JP7460013B1 (ja) * 2023-11-30 2024-04-02 ａｒｔｉｅｎｃｅ株式会社 電子部品搭載基板及び電子機器
JP7783968B1 (ja) * 2024-12-18 2025-12-10 ａｒｔｉｅｎｃｅ株式会社 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059743A (ja) 2010-09-06 2012-03-22 Nitto Denko Corp 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP2013136821A (ja) 2011-12-28 2013-07-11 Nitto Denko Corp 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法
WO2015083491A1 (ja) 2013-12-03 2015-06-11 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
WO2017010228A1 (ja) 2015-07-13 2017-01-19 株式会社村田製作所 樹脂基板、部品搭載樹脂基板およびその製造方法
JP2020069720A (ja) 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
WO2020184545A1 (ja) 2019-03-11 2020-09-17 積水化学工業株式会社 コーティング剤、および該コーティング剤を用いたモジュールの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445968B2 (en) 2005-12-16 2008-11-04 Sige Semiconductor (U.S.), Corp. Methods for integrated circuit module packaging and integrated circuit module packages

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059743A (ja) 2010-09-06 2012-03-22 Nitto Denko Corp 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP2013136821A (ja) 2011-12-28 2013-07-11 Nitto Denko Corp 電子部品用樹脂シート、電子部品用樹脂シートの製造方法、及び、半導体装置の製造方法
WO2015083491A1 (ja) 2013-12-03 2015-06-11 東洋インキＳｃホールディングス株式会社 電子素子およびシート材
WO2017010228A1 (ja) 2015-07-13 2017-01-19 株式会社村田製作所 樹脂基板、部品搭載樹脂基板およびその製造方法
JP2020069720A (ja) 2018-10-31 2020-05-07 京セラ株式会社 封止用シート及びそれを用いた電子部品の製造方法
WO2020184545A1 (ja) 2019-03-11 2020-09-17 積水化学工業株式会社 コーティング剤、および該コーティング剤を用いたモジュールの製造方法

Also Published As

Publication number Publication date
KR20240113761A (ko) 2024-07-23
CN118266274A (zh) 2024-06-28
TW202322301A (zh) 2023-06-01
JP2025041717A (ja) 2025-03-26
WO2023095697A1 (ja) 2023-06-01
JPWO2023095697A1 (enExample) 2023-06-01

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