CN118103474A - 热熔胶粘剂组合物 - Google Patents

热熔胶粘剂组合物 Download PDF

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Publication number
CN118103474A
CN118103474A CN202280069133.7A CN202280069133A CN118103474A CN 118103474 A CN118103474 A CN 118103474A CN 202280069133 A CN202280069133 A CN 202280069133A CN 118103474 A CN118103474 A CN 118103474A
Authority
CN
China
Prior art keywords
composition
pip36
acid
composition according
diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280069133.7A
Other languages
English (en)
Chinese (zh)
Inventor
T·普伦维尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bostik Inc
Original Assignee
Bostik Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bostik Inc filed Critical Bostik Inc
Publication of CN118103474A publication Critical patent/CN118103474A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
CN202280069133.7A 2021-10-14 2022-10-13 热熔胶粘剂组合物 Pending CN118103474A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FRFR2110897 2021-10-14
FR2110897A FR3128223B1 (fr) 2021-10-14 2021-10-14 Composition adhésive thermofusible
PCT/FR2022/051931 WO2023062325A1 (fr) 2021-10-14 2022-10-13 Composition adhésive thermofusible

Publications (1)

Publication Number Publication Date
CN118103474A true CN118103474A (zh) 2024-05-28

Family

ID=80225434

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280069133.7A Pending CN118103474A (zh) 2021-10-14 2022-10-13 热熔胶粘剂组合物

Country Status (6)

Country Link
US (1) US20240400872A1 (cg-RX-API-DMAC7.html)
EP (1) EP4416231A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024536476A (cg-RX-API-DMAC7.html)
CN (1) CN118103474A (cg-RX-API-DMAC7.html)
FR (1) FR3128223B1 (cg-RX-API-DMAC7.html)
WO (1) WO2023062325A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026109748A1 (fr) * 2024-11-22 2026-05-28 Arkema France Composition pour une structure multicouche à base de polyamide utilisable en tant que carte
FR3168791A1 (fr) * 2024-11-22 2026-05-29 Arkema France Structure multicouche à base de polyamide utilisable en tant que carte

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2776295B1 (fr) * 1998-03-18 2000-06-23 Trl Polyamide thermofusible et reticulable, l'un de ses procedes d'obtention et colle le comprenant
CA2671011A1 (en) * 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
US20100032629A1 (en) * 2008-08-07 2010-02-11 Benoit Brule Adhesive composition containing carbon nanotubes and a copolyamide
FR2934867A1 (fr) * 2008-08-08 2010-02-12 Arkema France Utilisation d'une dispersion de nanotubes de carbone dans un copolyamide comme composition adhesive conductrice
FR2938843B1 (fr) * 2008-11-27 2012-07-20 Arkema France Composition comportant un polymere thermoplastique et un graphite expanse
WO2015072428A1 (ja) * 2013-11-12 2015-05-21 Jnc株式会社 ヒートシンク
FR3023294B1 (fr) * 2014-07-01 2018-07-13 Arkema France Polyamides a base d'aminoalkyl- ou aminoaryl- piperazine pour adhesifs thermofusibles
FR3034771B1 (fr) * 2015-04-13 2019-04-19 Hutchinson Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation
CN105670550B (zh) * 2016-03-31 2017-11-14 东莞新能源科技有限公司 一种导热胶及含有该导热胶的二次电池
EP3236479A1 (en) * 2016-04-21 2017-10-25 Henkel AG & Co. KGaA An electrically conductive, hot-melt adhesive or moulding composition
US20190131207A1 (en) * 2016-05-10 2019-05-02 Republic Polytechnic A heat sink, a filler for a heat sink and methods thereof
JP6922248B2 (ja) * 2017-02-21 2021-08-18 東洋インキＳｃホールディングス株式会社 ホットメルト接着剤組成物、および積層体
FR3066196B1 (fr) * 2017-05-11 2020-05-15 Arkema France Composition a base de peba et son utilisation pour la fabrication d'un objet transparent resistant a la fatigue

Also Published As

Publication number Publication date
WO2023062325A1 (fr) 2023-04-20
EP4416231A1 (fr) 2024-08-21
FR3128223A1 (fr) 2023-04-21
FR3128223B1 (fr) 2025-01-17
JP2024536476A (ja) 2024-10-04
US20240400872A1 (en) 2024-12-05

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Country or region after: France

Address after: French pitot

Applicant after: BOSTIK, Inc.

Address before: Cologne, France

Applicant before: BOSTIK, Inc.

Country or region before: France