CN117677684A - 可交联的甲硅烷基封端聚合物组合物和使用所述组合物接合基底的方法 - Google Patents
可交联的甲硅烷基封端聚合物组合物和使用所述组合物接合基底的方法 Download PDFInfo
- Publication number
- CN117677684A CN117677684A CN202280048196.4A CN202280048196A CN117677684A CN 117677684 A CN117677684 A CN 117677684A CN 202280048196 A CN202280048196 A CN 202280048196A CN 117677684 A CN117677684 A CN 117677684A
- Authority
- CN
- China
- Prior art keywords
- composition
- groups
- adhesive composition
- weight
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FRFR2107429 | 2021-07-08 | ||
| FR2107429A FR3125053B1 (fr) | 2021-07-08 | 2021-07-08 | COMPOSITION RETICULABLE DE POLYMERE A TERMINAISON SILYL ET procédé d’assemblage de substrats LA METTANT EN OEUVRE |
| PCT/FR2022/051354 WO2023281216A1 (fr) | 2021-07-08 | 2022-07-06 | Composition reticulable de polymere a terminaison silyl et procede d'assemblage de substrats la mettant en oeuvre |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117677684A true CN117677684A (zh) | 2024-03-08 |
Family
ID=77180267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280048196.4A Pending CN117677684A (zh) | 2021-07-08 | 2022-07-06 | 可交联的甲硅烷基封端聚合物组合物和使用所述组合物接合基底的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250188330A1 (enExample) |
| EP (1) | EP4367195B8 (enExample) |
| JP (1) | JP2024526645A (enExample) |
| CN (1) | CN117677684A (enExample) |
| FR (1) | FR3125053B1 (enExample) |
| WO (1) | WO2023281216A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3125054B1 (fr) * | 2021-07-08 | 2024-11-08 | Bostik Sa | Nouvelle composition reticulable de polymere a terminaison silyl et article auto-adhesif correspondant |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3741846A1 (de) | 1987-02-26 | 1989-01-26 | Degussa | Verfahren zum verdichten von pyrogen hergestellter kieselsaeure |
| ES2070136T3 (es) * | 1988-04-07 | 1995-06-01 | Kanegafuchi Chemical Ind | Material adhesivo sensible a la presion. |
| JP2683776B2 (ja) * | 1988-06-30 | 1997-12-03 | 東芝シリコーン株式会社 | シーリング用組成物 |
| JPH02127490A (ja) * | 1988-11-08 | 1990-05-16 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
| JP3638430B2 (ja) * | 1998-04-27 | 2005-04-13 | セメダイン株式会社 | 湿気硬化型接着剤組成物 |
| US20080125562A1 (en) | 2004-11-01 | 2008-05-29 | Kaneka Corporation | Process for Production of Polyether Polymers and Compositions Containing the Polymers |
| DE102007010544A1 (de) | 2007-03-05 | 2008-09-11 | Wacker Chemie Ag | Schichten aus heterosubstituerten Silsesquioxanen |
| FR2925517B1 (fr) | 2007-12-21 | 2010-01-08 | Bostik Sa | Adhesifs sensibles a la pression a pouvoir adhesif stable en temperature. |
| FR2954341B1 (fr) | 2009-12-21 | 2014-07-11 | Bostik Sa | Composition adhesive reticulable par chauffage |
| WO2012033030A1 (ja) * | 2010-09-09 | 2012-03-15 | 株式会社カネカ | 湿気硬化型反応性ホットメルト接着剤組成物 |
| FR2969621B1 (fr) | 2010-12-22 | 2013-01-18 | Bostik Sa | Polyurethane a blocs polyether et polyester et groupe terminal alkoxysilane |
| FR2981657B1 (fr) | 2011-10-21 | 2013-12-27 | Bostik Sa | Composition adhesive de polyurethanne pour la fabrication d'agglomeres |
| JP6013035B2 (ja) * | 2012-06-19 | 2016-10-25 | アイカ工業株式会社 | 透明性接着剤組成物 |
| US10370564B2 (en) * | 2014-06-20 | 2019-08-06 | 3M Innovative Properties Company | Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods |
| JP6967999B2 (ja) * | 2018-02-28 | 2021-11-17 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤組成物 |
| FR3090679B1 (fr) | 2018-12-20 | 2020-12-11 | Bostik | Nouvelles compositions reticulables par chauffage et articles auto-adhesifs correspondants |
| FR3125054B1 (fr) * | 2021-07-08 | 2024-11-08 | Bostik Sa | Nouvelle composition reticulable de polymere a terminaison silyl et article auto-adhesif correspondant |
-
2021
- 2021-07-08 FR FR2107429A patent/FR3125053B1/fr active Active
-
2022
- 2022-07-06 WO PCT/FR2022/051354 patent/WO2023281216A1/fr not_active Ceased
- 2022-07-06 US US18/575,027 patent/US20250188330A1/en not_active Abandoned
- 2022-07-06 EP EP22754114.1A patent/EP4367195B8/fr active Active
- 2022-07-06 JP JP2024500240A patent/JP2024526645A/ja active Pending
- 2022-07-06 CN CN202280048196.4A patent/CN117677684A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250188330A1 (en) | 2025-06-12 |
| EP4367195C0 (fr) | 2025-03-19 |
| EP4367195A1 (fr) | 2024-05-15 |
| WO2023281216A1 (fr) | 2023-01-12 |
| FR3125053A1 (fr) | 2023-01-13 |
| FR3125053B1 (fr) | 2024-11-01 |
| JP2024526645A (ja) | 2024-07-19 |
| EP4367195B1 (fr) | 2025-03-19 |
| EP4367195B8 (fr) | 2025-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Country or region after: France Address after: French pitot Applicant after: BOSTIK S.A. Address before: Cologne, France Applicant before: BOSTIK S.A. Country or region before: France |
|
| CB02 | Change of applicant information |