CN117581343A - 焊料凸块形成方法 - Google Patents

焊料凸块形成方法 Download PDF

Info

Publication number
CN117581343A
CN117581343A CN202280045863.3A CN202280045863A CN117581343A CN 117581343 A CN117581343 A CN 117581343A CN 202280045863 A CN202280045863 A CN 202280045863A CN 117581343 A CN117581343 A CN 117581343A
Authority
CN
China
Prior art keywords
solder
electrode
solder particles
solder bump
bump forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280045863.3A
Other languages
English (en)
Chinese (zh)
Inventor
森谷敏光
赤井邦彦
宫地胜将
欠畑纯一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN117581343A publication Critical patent/CN117581343A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
CN202280045863.3A 2021-06-30 2022-06-29 焊料凸块形成方法 Pending CN117581343A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-108623 2021-06-30
JP2021108623 2021-06-30
PCT/JP2022/026029 WO2023277083A1 (ja) 2021-06-30 2022-06-29 はんだバンプ形成方法

Publications (1)

Publication Number Publication Date
CN117581343A true CN117581343A (zh) 2024-02-20

Family

ID=84691847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280045863.3A Pending CN117581343A (zh) 2021-06-30 2022-06-29 焊料凸块形成方法

Country Status (5)

Country Link
JP (1) JP7831484B2 (https=)
KR (1) KR20240027705A (https=)
CN (1) CN117581343A (https=)
TW (1) TW202320599A (https=)
WO (1) WO2023277083A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139427A (ja) * 1994-11-04 1996-05-31 Mitsubishi Electric Corp 球状電極の形成方法
JPH09246324A (ja) * 1996-03-08 1997-09-19 Hitachi Ltd 電子部品及びそのバンプ形成方法
JP2006216702A (ja) * 2005-02-02 2006-08-17 Tdk Corp 半田ボールの転写方法及び転写装置
JP5889160B2 (ja) * 2012-10-17 2016-03-22 三菱電機株式会社 電子機器の製造方法
JP6428407B2 (ja) * 2015-03-18 2018-11-28 三菱マテリアル株式会社 ハンダ粉末の製造方法及びこの粉末を用いたハンダ用ペーストの製造方法
JP2017157626A (ja) 2016-02-29 2017-09-07 三菱マテリアル株式会社 はんだバンプの形成方法
JP2018206953A (ja) * 2017-06-05 2018-12-27 三菱マテリアル株式会社 はんだバンプ形成方法及びはんだペースト

Also Published As

Publication number Publication date
JPWO2023277083A1 (https=) 2023-01-05
WO2023277083A1 (ja) 2023-01-05
JP7831484B2 (ja) 2026-03-17
KR20240027705A (ko) 2024-03-04
TW202320599A (zh) 2023-05-16

Similar Documents

Publication Publication Date Title
US6221691B1 (en) Method and system for attaching semiconductor dice to substrates
US5714252A (en) Deformable substrate assembly for adhesively bonded electronic device
JP7697292B2 (ja) はんだバンプ形成装置
US7820479B2 (en) Conductive ball mounting method
JP4123998B2 (ja) 電子回路装置およびその製造方法
US20090301771A1 (en) Conductive bump, method for forming the same, and electronic component mounting structure using the same
CN115053330A (zh) 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
CN101410976B (zh) 带有电气部件的基板的制造方法
JPH08340001A (ja) はんだバンプ形成方法及び装置
CN117581343A (zh) 焊料凸块形成方法
JP7831485B2 (ja) はんだバンプ形成用部材
US20110134618A1 (en) Connection structure for chip-on-glass driver ic and connection method therefor
Joo et al. Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
KR20240032918A (ko) 접속 구조체의 제조 방법
US20130220688A1 (en) Mounting structure and mounting method
JP2023046305A (ja) 接続構造体の製造方法
US5899376A (en) Transfer of flux onto electrodes and production of bumps on electrodes
JPH0957432A (ja) 半田供給用キャリア
JPH10112474A (ja) 半導体装置、半導体装置の製造方法、接点の形成方法、および電子装置の製造方法
JP2003204142A (ja) 電子部品実装方法及び電子部品実装装置
JP2005101506A (ja) 電子部品実装体の製造方法、電気光学装置の製造方法、電子部品実装体、電気光学装置
JP2001024400A (ja) 電子部品の実装方法及びその装置
CN117099190A (zh) 带焊料凸块的部件的制造方法、带焊料凸块的部件及焊料凸块形成用部件
JP2005347673A (ja) 導電性ボールの搭載方法および搭載装置
Chen et al. High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination