CN117500636A - Workpiece processing device, grinding stone and workpiece processing method - Google Patents

Workpiece processing device, grinding stone and workpiece processing method Download PDF

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Publication number
CN117500636A
CN117500636A CN202280043686.5A CN202280043686A CN117500636A CN 117500636 A CN117500636 A CN 117500636A CN 202280043686 A CN202280043686 A CN 202280043686A CN 117500636 A CN117500636 A CN 117500636A
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CN
China
Prior art keywords
workpiece
grindstone
grinding
convex
support mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280043686.5A
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Chinese (zh)
Inventor
片山一郎
青木裕虎
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Individual
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Individual
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Publication of CN117500636A publication Critical patent/CN117500636A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/04Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
    • B24B53/053Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14Zonally-graded wheels; Composite wheels comprising different abrasives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

The grindstone (5) has a convex grinding portion (5 b) on the outer periphery and is rotatable and circular-plate-shaped, the cross-sectional shape of the convex grinding portion (5 b) passing through the rotation shaft (6) of the grindstone (5) is convex toward the outer periphery, and the circular-arc portions (5 e) are provided at least at both ends in the thickness direction, and in order to form the circular-plate-shaped workpiece (2) into a desired cross-sectional shape using the grindstone (5), the workpiece (2) and the grindstone (5) are arranged parallel to each other, and the grindstone (5) is moved relative to the workpiece (2) in such a manner that the contact portion of the convex grinding portion (5 b) with the workpiece (2) moves along the desired cross-sectional shape of the workpiece (2) while the grindstone (5) is rotated about the rotation shaft (3) parallel to the rotation shaft (6) of the grindstone (5). The radius of curvature of the arc-shaped part (5 e) of the grindstone (5) is at least 10 times the thickness of the workpiece (2).

Description

Workpiece processing device, grinding stone and workpiece processing method
Technical Field
The present invention relates to a workpiece processing apparatus, a grindstone, and a workpiece processing method.
Background
Conventionally, in order to chamfer an outer peripheral portion of a disk-shaped workpiece (workpiece) such as a semiconductor wafer, grinding is performed by pressing a grindstone against the outer peripheral portion of the workpiece. In order to improve the accuracy of the shape and size of the chamfer of the workpiece, there are the following methods: a groove (formed groove) having a shape and a size corresponding to the finished shape of the workpiece is formed in the outer peripheral portion of the grindstone, the outer peripheral portion of the workpiece is inserted into the groove to rotate the workpiece, and the outer peripheral portion of the workpiece is ground by the inner peripheral surface of the groove. However, this method requires replacement of the grindstone every time the shape and size of the work to be manufactured are changed, and is not suitable for small-scale production of various kinds. In addition, when chamfering is repeatedly performed, the inner peripheral surface of the groove in the outer peripheral portion of the grindstone wears or breaks to change the shape and size of the groove, so that the accuracy of chamfering of the workpiece is lowered. Therefore, after chamfering the work for a long period of time, the grindstone needs to be replaced or reshaped.
In order to replace or shape the grindstone as needed, in the methods described in patent documents 1 and 2 (japanese patent application laid-open publication No. 2005-153085 and japanese patent application laid-open publication No. 2007-165712), a main grindstone having a forming groove corresponding to the finished shape of the workpiece is prepared in advance, and an outer peripheral portion of a grindstone material is brought into contact with an inner peripheral surface of the groove of the main grindstone and ground, thereby preparing a dressing grindstone (dressing) as a profile. The grinding stone material is brought into contact with the outer peripheral portion of the dressing grinding stone to form a shaped groove similar to the main grinding stone, so that the shape of the grinding stone used for chamfering an actual workpiece can be adjusted (shaped). The dressing grind stone is made of a material (e.g., GC grind stone) harder than the grind stone for chamfering (e.g., resin bond grind stone), and the main grind stone is made of a material (e.g., metal bond grind stone) harder than the dressing grind stone. The process of shaping the grindstone using the dressing grindstone in this way is called dressing.
Patent documents 1 and 2 disclose a method of chamfering a disc-shaped grindstone disposed obliquely to the tangential direction of the outer periphery of a disc-shaped workpiece (spiral processing method) in addition to a method of chamfering a disc-shaped grindstone disposed parallel to the disc-shaped workpiece. Patent document 3 also describes a chamfering method of a spiral type. In the method described in patent document 3 (japanese patent application laid-open No. 5-152259), a grindstone disposed obliquely to the tangential direction of the outer periphery of a workpiece is formed with a concave groove in the outer periphery and has an inclined surface facing inward. The inclined surface is brought into contact with the outer peripheral portion of the workpiece to perform grinding. Patent document 4 (japanese patent application laid-open No. 2007-044817) discloses a machining method for grinding a disc-shaped grindstone disposed parallel to a disc-shaped workpiece, and then performing more precise grinding in a spiral manner by using a disc-shaped grindstone disposed obliquely to a tangential direction of an outer periphery of the disc-shaped workpiece, and a dressing grindstone and dressing method for dressing a grinding stone for precise grinding in a spiral manner.
When chamfering a workpiece using a grindstone disposed obliquely to the tangential direction of the outer periphery of the workpiece as described in patent documents 1 to 4, the surface roughness of the chamfer portion of the workpiece can be reduced by grinding the workpiece while rotating the workpiece at a low speed while maintaining the length of the contact portion where the inner peripheral surface of the groove provided in the outer periphery of the grindstone contacts the outer periphery of the workpiece. Therefore, the polishing step of the finish to be performed later is easy to carry out.
Patent document 5 (japanese patent application laid-open No. 11-207585) discloses a method of chamfering a workpiece by using a grindstone having a groove provided on an outer peripheral portion thereof, the groove having a dimension larger than the thickness of the workpiece in the thickness direction, and bringing an inner peripheral surface of the groove of the grindstone into contact with the outer peripheral portion of the workpiece. Patent document 5 also discloses a method of chamfering a part of an inclined surface of a convex portion of an outer peripheral portion of a grindstone, which is thicker than a workpiece and has no groove provided in the outer peripheral portion, while the outer peripheral portion has a convex cross-sectional shape, by abutting the inclined surface of the part of the grindstone, which constitutes the convex portion of the outer peripheral portion, against the outer peripheral portion of the workpiece.
In the method described in patent document 6 (japanese patent application laid-open No. 2000-317789), a disc-shaped grindstone is disposed so as to be orthogonal to a disc-shaped workpiece. The workpiece is rotatable about a rotation axis located at the center of its planar shape. The grindstone is rotatable about a rotation axis perpendicular to the rotation axis of the workpiece, and is movable in both a direction perpendicular to the rotation axis (a direction parallel to the disk-shaped workpiece) and a direction parallel to the rotation axis (a direction perpendicular to the disk-shaped workpiece). In a state in which the workpiece is rotated, the grindstone is brought into proximity with the workpiece while rotating, and the grindstone is moved while bringing the outer peripheral portion of the rotating grindstone into contact with the outer peripheral portion of the workpiece rotating in a direction orthogonal to the rotation direction of the grindstone, thereby chamfering the workpiece. Such a processing step is called contour line processing.
In the method described in patent document 7 (japanese patent application laid-open No. 2008-034776), a cup-shaped grindstone disposed so as to be orthogonal to a disc-shaped workpiece is used, and the cup-shaped grindstone is rotated while approaching the workpiece, as in patent document 6. The chamfering process of the workpiece is performed by moving the cup-shaped grindstone while bringing the leading end face of the cup-shape of the rotating cup-shaped grindstone into contact with the outer peripheral portion of the workpiece rotating in a direction orthogonal to the rotation direction of the cup-shaped grindstone.
Patent document 8 (japanese patent application laid-open publication No. 2014-37014) discloses a method of chamfering using two disc-shaped grindstones in the same manner as patent document 6 and a method of chamfering using two cup-shaped grindstones in the same manner as patent document 7.
In the method described in patent document 9 (japanese patent application laid-open No. 2017-154240), a large-sized cup-shaped first grindstone having a grindstone element (cup-shaped) on the inner peripheral side and a grindstone element (cup-shaped) on the outer peripheral side for grinding more precisely than grinding by the grindstone element on the inner peripheral side, and a cup-shaped second grindstone are used to machine the outer peripheral portion of the workpiece.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2005-153085
Patent document 2: japanese patent laid-open No. 2007-165712
Patent document 3: japanese patent laid-open No. 5-152259
Patent document 4: japanese patent laid-open No. 2007-044817
Patent document 5: japanese patent laid-open No. 11-207585
Patent document 6: japanese patent laid-open No. 2000-317789
Patent document 7: japanese patent laid-open No. 2008-034776
Patent document 8: japanese patent laid-open publication No. 2014-37014
Patent document 9: japanese patent application laid-open No. 2017-154240
Disclosure of Invention
Problems to be solved by the invention
As described in patent documents 1 to 4, it is not easy to precisely form a groove for chamfering a workpiece in the outer peripheral portion of a grindstone disposed obliquely to the tangential direction of the outer periphery of the workpiece. In order to form a chamfer portion of a desired shape on a workpiece, the inner peripheral surface of the groove must be in contact with the outer peripheral portion of the workpiece at an appropriate angle and an appropriate contact length. In a grindstone disposed obliquely to the tangential direction of the outer periphery of a workpiece, it is difficult to form a groove having an inner peripheral surface that is accurately in contact with the outer peripheral portion of the workpiece at an appropriate angle and an appropriate contact length. In particular, when dressing is performed by rotating a dressing grind stone using a drive unit that rotates a workpiece and a drive unit that rotates a grind stone that grinds the workpiece, it is difficult to precisely form a groove that can perform good chamfering in a state of being inclined with respect to the tangential direction of the outer periphery of the workpiece, and a method that can perform dressing more easily is sought. In addition, when the shape and size of the chamfer portion of the work to be manufactured are changed, the shape of the groove for manufacturing the main grindstone of the finishing grindstone also needs to be changed, and the work is complicated.
When machining a workpiece using a grindstone disposed obliquely to the tangential direction of the outer periphery of the workpiece, the shape and size of the inner peripheral surface of the groove cannot be easily changed, and therefore, it is difficult to perform fine correction to approach a desired machining shape. Therefore, when a wafer having an orientation flat is produced as a workpiece, grooves, which are mainly used for forming arc-shaped portions of the outer periphery of the workpiece, cannot be formed with good accuracy even using grindstones disposed obliquely to the tangential direction of the outer periphery of the workpiece. Therefore, it is necessary to form a groove for forming the orientation flat in the arc-shaped portion, and the manufacture of the grindstone becomes complicated, and the processing time becomes long by using two grooves separately.
In the method described in patent document 5, an inclined surface of a part of the inner peripheral surface of the groove of the grindstone or an inclined surface of a part of the convex portion of the outer periphery of the grindstone is brought into contact with the outer peripheral portion of the workpiece, and grinding is performed. Since the outer peripheral surface of the workpiece is ground by relatively moving the workpiece along the inclined surface of the grindstone, the shape of the outer peripheral portion of the ground workpiece is a shape corresponding to the inclined surface of the grindstone. Since the angle of the inclined surface of the outer periphery of the grindstone cannot be arbitrarily changed, it is difficult to form the chamfer of the workpiece into an arbitrary shape. In addition, in the chamfer portion of both sides of the workpiece, the straight line portion of the tip, and the curved surface portion between the straight line portion and the chamfer portion, grinding is performed while relatively reciprocating (traversing) the workpiece along the grindstone, so that the processing is complicated and the processing time is long.
In the method described in patent document 6, since the disc-shaped grindstone is disposed so as to be orthogonal to the disc-shaped workpiece, when a large-sized grindstone is used, the grindstone may interfere with a mechanism (e.g., an adsorption table or a rotating mechanism) for supporting and driving the workpiece. Therefore, in order not to hinder stable support and smooth driving of the workpiece, a small-sized grindstone is used instead of a large-sized grindstone. As a result, the machining efficiency is poor and the machining time is long. In addition, since the small-sized grindstone is in contact with the outer peripheral portion of the workpiece and is ground for a longer period of time when chamfering the same workpiece than the large-sized grindstone, the life of the grindstone is shorter. Further, the workpiece is moved along a trajectory of a desired cross-sectional shape at a contact portion with the grindstone, but the workpiece is moved after each portion of the workpiece is sufficiently ground, and therefore the workpiece needs to be rotated at a high speed in order to increase efficiency. In this way, the workpiece is rotated at a high speed and the surface roughness of the ground portion is large because the streak of the grindstone rotating in the direction orthogonal to the rotation direction of the workpiece is formed on the outer surface of the workpiece in a shape extending in the thickness direction of the workpiece. Even if a polishing step of more precise finishing is performed after this polishing step, it is difficult to polish because streaks exist along a direction orthogonal to the rotation direction of the workpiece. In particular, the inclined surface-like portion of the workpiece is difficult to polish in a precision polishing step as a subsequent step, and may remain as streaks due to insufficient polishing.
In the method described in patent document 7, the cup-shaped grindstone is complicated to manufacture, and particularly, it is difficult to finish. In addition, it is not easy to dispose and drive the cup grindstone so that the cup-shaped distal end surface is properly brought into contact with the outer peripheral portion of the workpiece, and the mechanism for supporting and driving the cup grindstone is complicated.
The method described in patent document 8 has the following problems in addition to the problems in the methods described in patent documents 6 and 7: since two grindstones are driven at the same time, the apparatus becomes complicated, and a difference in size and shape is liable to occur between the two grindstones, and it is not easy to perform chamfering stably with high accuracy.
In the method described in patent document 9, the shape of the first grindstone is very complex, and the production of the first grindstone is complicated. Further, since the work rotates around the two rotation shafts, the mechanism for supporting and driving the work is also complicated. Thus, the processing apparatus for performing the method described in patent document 9 is very complicated.
The invention aims to provide a workpiece processing device, a grinding stone and a workpiece processing method, wherein chamfering processing of a workpiece can be easily and efficiently performed with high precision, a mechanism for supporting and driving the workpiece and the grinding stone is simple, and shaping of the grinding stone can be easily performed.
Means for solving the problems
The workpiece processing apparatus according to the present invention is a workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape, the workpiece processing apparatus including a workpiece support mechanism for supporting the workpiece, a disk-shaped grindstone disposed parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone, the workpiece support mechanism rotating the workpiece, the grindstone support mechanism rotating the grindstone, a rotation axis serving as a center of rotation of the workpiece by the workpiece support mechanism and a rotation axis serving as a center of rotation of the grindstone by the grindstone support mechanism being parallel to each other, the grindstone having a convex grinding portion in an outer peripheral portion, a cross-sectional shape of a cross section of the convex grinding portion passing through the rotation axis of the grindstone being convex toward an outer peripheral side, and a grinding stone and the workpiece are relatively movable so as to approach each other or separate from each other by the grinding stone supporting mechanism or the workpiece supporting mechanism, the grinding stone supporting mechanism or the workpiece supporting mechanism relatively moves the grinding stone with respect to the workpiece under a movement condition calculated based on a radius of curvature of the arc-shaped portion of the grinding stone so that a contact portion of the convex grinding portion with the workpiece is moved along the desired cross-sectional shape of the workpiece, the convex grinding portion and a rectangular grinding portion having a linear cross-section parallel to the thickness direction of the grinding stone are arranged in the thickness direction on an outer peripheral portion of the grinding stone, the rectangular grinding section of the grindstone is a section that abuts against an outer peripheral portion of the workpiece and grinds the workpiece so as to move from a radially outer side toward an inner side of the workpiece by the grindstone, and the radius of curvature of the arcuate section of the grindstone is at least 10 times or more as large as the thickness of the workpiece so that the arcuate section of the grindstone abuts against the workpiece substantially without causing a gap between the rounded section and the chamfer of the desired cross-sectional shape of the workpiece.
In addition, another workpiece processing apparatus according to the present invention is a workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape, the workpiece processing apparatus including a workpiece support mechanism for supporting the workpiece, a disk-shaped grindstone disposed parallel to the workpiece, and grindstone support mechanisms for supporting the grindstone, the workpiece support mechanisms being configured to rotate the grindstone, rotation axes serving as centers of rotation of the workpiece by the workpiece support mechanisms and rotation axes serving as centers of rotation of the grindstone by the grindstone support mechanisms being parallel to each other, the grindstone having a convex grinding portion on an outer peripheral portion, the cross-sectional shape of the convex grinding portion in a cross section passing through the rotation axes of the grindstone being convex toward an outer peripheral side, and having shapes of arc-shaped portions at least at both ends in a thickness direction, the grindstone and the workpiece being capable of relatively moving in a manner approaching or separating each other by the grindstone support mechanisms, the grindstone support mechanisms and the grindstone support mechanisms being configured to move the grindstone support portions in a manner of approaching or separating each other with respect to each other, the grinding stone support mechanisms and the grinding stone support portions having a curvature along the desired cross-sectional shape by calculating the relative movement conditions, the workpiece processing apparatus further includes a disk-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the workpiece and used for grinding more precisely than grinding by the convex grinding portion of the grindstone, and a grooved grindstone support mechanism for supporting the grooved grindstone, the grooved grindstone support mechanism rotating the grooved grindstone, and further includes a dressing grindstone capable of being attached to the workpiece support mechanism in place of the workpiece, the dressing grindstone being configured to have an outer shape by being moved relatively to the grindstone by the grindstone support mechanism or the workpiece support mechanism in accordance with the movement condition, and the grooved grindstone being pressed against the dressing grindstone and transferring the outer shape of the dressing grindstone to form or shape the groove.
The grindstone of the present invention is included in a workpiece processing apparatus having a workpiece support mechanism for supporting a disk-shaped workpiece, the grindstone being arranged in parallel with respect to the workpiece, and a grindstone support mechanism for supporting the grindstone, the workpiece support mechanism rotating the workpiece, the grindstone support mechanism rotating the grindstone, a rotation axis serving as a center of rotation of the workpiece by the workpiece support mechanism and a rotation axis serving as a center of rotation of the grindstone by the grindstone support mechanism being parallel to each other, the grindstone having a convex grinding portion in an outer peripheral portion, a cross-sectional shape of the convex grinding portion in a cross-section of the rotation axis passing through the grindstone being convex toward an outer peripheral side, and having a shape of an arc-shaped portion at least at both ends in a thickness direction, the grindstone and the workpiece being relatively movable by the grindstone support mechanism in a manner approaching or separating from each other, the grindstone support mechanism moving the grindstone support mechanism in such a manner that the convex grinding portion is in contact with the workpiece along the shape of the workpiece, the end portion being a desired shape of the arc-shaped grinding portion being a cross-shaped portion being a straight-shaped cross-section, the end portion being a curved portion in a cross-sectional shape desired to be positioned in a cross-sectional shape between the workpiece-sectional shape and the end portion being a curved portion being curved in a desired shape of the grinding portion, the straight portion is a portion having a larger grindstone grain size than the arcuate portion, the arcuate portion being a portion used for grinding which is finer than grinding by the straight portion, and the arcuate portion having a radius of curvature which is at least 10 times or more as large as a thickness of the workpiece so that the arcuate portion is brought into contact with the workpiece substantially without causing a gap between the arcuate portion and a chamfer of the workpiece having the desired cross-sectional shape.
The present invention provides a method for machining a workpiece, which is configured to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone that has a convex grinding section on an outer peripheral portion and is rotatable and disk-shaped, wherein the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone is convex toward an outer peripheral side, and has a shape having arc-shaped sections at least at both ends in a thickness direction, the method comprising: a step of arranging the workpiece and the grindstone parallel to each other; and rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, wherein the step of relatively moving the grindstone with respect to the workpiece includes: the method includes rotating the workpiece and the grindstone, and simultaneously, curvilinearly moving the arcuate portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle from an outer peripheral end face of the workpiece toward one face in accordance with the movement condition, thereby grinding an outer peripheral portion of the one face side of the workpiece; relatively moving the grindstone along the outer peripheral end face of the workpiece from the one face side to the other face side with respect to the workpiece; and moving the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the other face while rotating the workpiece and the grindstone, thereby grinding the outer peripheral portion of the other face side of the workpiece, moving the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the one face or the other face while rotating the grindstone, stopping the relative movement of the grindstone relative to the workpiece, and moving the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the one face or the other face while rotating the grindstone and the grinding stone while performing precision grinding of the outer peripheral portion of the one face side or the other face side of the workpiece.
The present invention provides a method for machining a workpiece, which is configured to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone that has a convex grinding section on an outer peripheral portion and is rotatable and disk-shaped, wherein the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone is convex toward an outer peripheral side, and has a shape having arc-shaped sections at least at both ends in a thickness direction, the method comprising: a step of arranging the workpiece and the grindstone parallel to each other; and rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, wherein the method includes a step of alternately repeating a high-speed rotation at the same speed as the high-speed rotation of the workpiece during processing by the grindstone and a low-speed rotation at the same speed as the low-speed rotation of the workpiece during processing by the grindstone, and wherein the duration of the rotation of the workpiece during processing is shorter than the duration of the high-speed rotation and the duration of the rotation during processing by the grindstone during the preparation rotation by the high-speed rotation of the grindstone.
The present invention provides a method for machining a workpiece, which is configured to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone that has a convex grinding section on an outer peripheral portion and is rotatable and disk-shaped, wherein the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone is convex toward an outer peripheral side, and has a shape having arc-shaped sections at least at both ends in a thickness direction, the method comprising: a step of arranging the workpiece and the grindstone parallel to each other; and a step of moving the grindstone relative to the workpiece based on a movement condition calculated by a radius of curvature of the circular arc-shaped portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece while rotating the grindstone around a rotation axis parallel to the rotation axis of the grindstone, the step of forming a circular plate-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the workpiece in addition to the grindstone, the step of forming a profile of the cylindrical dressed grindstone parallel to the grindstone in addition to the grindstone, the step of forming the profile of the dressed grindstone in such a manner that an inner peripheral surface of a groove of the grooved grindstone is brought into contact with the workpiece after grinding of the workpiece by bringing the convex grinding portion into contact with the workpiece, the step of forming a profile of the dressed grindstone in such a manner that the profile of the dressed grindstone is formed in parallel to the rotation axis of the transfer pad, or the profile of the dressed grindstone is formed in such a manner that the profile of the dressed grinding portion is finer than that the grinding portion is brought into contact with the convex grinding portion by the convex grinding portion, in the step of forming the outer shape of the dressing grind stone, a movement condition under which a contact portion of the convex grinding portion of the grind stone, which is in contact with the dressing grind stone, moves along a shape corresponding to the predetermined shape of the groove is calculated in advance based on a radius of curvature of the arc-shaped portion of the grind stone, and in the step of forming the outer shape of the dressing grind stone, the dressing grind stone is moved relative to the grind stone in accordance with the movement condition.
Effects of the invention
According to the present invention, it is possible to provide a workpiece processing apparatus, a grindstone, and a workpiece processing method, which can easily perform chamfering of a workpiece with good efficiency and high accuracy, and which can easily perform shaping of the grindstone with a simple mechanism for supporting and driving the workpiece and the grindstone.
Drawings
Fig. 1 is a front view schematically showing a workpiece processing apparatus according to a first embodiment of the present invention.
Fig. 2 is a cross-sectional view showing a grindstone of the workpiece processing device shown in fig. 1.
Fig. 3A is a front view schematically showing an example of a workpiece processing method according to the first embodiment of the present invention in order.
Fig. 3B is a front view schematically showing an example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 3C is a front view schematically showing an example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 3D is a front view schematically showing an example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 4 is an enlarged view showing the process shown in fig. 3B.
Fig. 5 is an enlarged view showing a process subsequent to the process shown in fig. 4.
Fig. 6 is an enlarged view showing a process subsequent to the process shown in fig. 5.
Fig. 7 is a front view showing an example of a conventional workpiece processing method.
Fig. 8A is a front view showing an example of a workpiece processed in the first embodiment of the present invention.
Fig. 8B is a front view showing an example of a workpiece processed in the first embodiment of the present invention.
Fig. 9A is a front view schematically showing another example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 9B is a front view schematically showing another example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 9C is a front view schematically showing another example of the workpiece processing method according to the first embodiment of the present invention in order.
Fig. 10A is a cross-sectional view showing a modification of the grindstone according to the first embodiment of the present invention.
Fig. 10B is a front view schematically showing a grinding process using the grindstone shown in fig. 10A.
Fig. 11A is a cross-sectional view showing a grindstone of a workpiece processing device according to a second embodiment of the invention.
Fig. 11B is a front view schematically showing a grinding process using the grindstone shown in fig. 11A.
Fig. 11C is a front view schematically showing a grinding process using the grindstone shown in fig. 11A.
Fig. 12 is a front view schematically showing a workpiece processing apparatus according to a third embodiment of the present invention.
Fig. 13 is a front view showing a workpiece processing apparatus according to a fourth embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a front view schematically showing a workpiece processing apparatus 1 according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing the grindstone 5 of the workpiece processing device 1. The workpiece processing apparatus 1 is an apparatus for grinding a disk-shaped workpiece 2 such as a semiconductor wafer, a glass substrate, or ceramic to chamfer the outer periphery of the workpiece 2. The workpiece processing apparatus 1 is particularly suitable for chamfering a workpiece 2 of high hardness including silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), sapphire, and the like. However, the workpiece processing apparatus 1 can be used for processing other types of workpieces.
The workpiece machining device 1 includes a workpiece support mechanism 4 for supporting a disk-shaped workpiece 2 and rotating the workpiece 2 about a rotation axis 3, and a grindstone support mechanism 7 for supporting a disk-shaped grindstone 5 and rotating the grindstone 5 about a rotation axis 6. As an example, the workpiece 2 is disk-shaped having a diameter of 50 to 300mm and a thickness of 1mm or less, and the grindstone 5 is disk-shaped having a diameter of 100 to 200mm and a thickness of 20 to 60 mm. For convenience, the thickness of the workpiece 2 is illustrated thicker in the drawings. The work support mechanism 4 and the grindstone support mechanism 7 support the disc-shaped work 2 and the disc-shaped grindstone 5 in parallel with each other. The work support mechanism 4 is capable of rotating the disk-shaped work 2 about a rotation axis 3 that is positioned at the center of the planar shape of the work 2 and is perpendicular to the work 2. Similarly, the grindstone support mechanism 7 can rotate the disc-shaped grindstone 5 around the rotation shaft 6 positioned at the center of the planar shape of the grindstone 5 and orthogonal to the grindstone 5. The rotation axis 3, which is the center of rotation of the workpiece 2 by the workpiece support mechanism 4, and the rotation axis 6, which is the center of rotation of the grindstone 5 by the grindstone support mechanism 7, are parallel to each other. The grindstone 5 and the workpiece 2 can be relatively moved in a manner approaching or separating from each other by the grindstone support mechanism 7 or the workpiece support mechanism 4. As an example, the grindstone support mechanism 7 is capable of moving the grindstone 5 in a direction in which the grindstone 5 approaches the workpiece 2 and a direction in which the grindstone 5 separates from the workpiece 2 in a parallel plane (plane orthogonal to the rotation axis 3 and the rotation axis 6) to the grindstone 5 and the workpiece 2 while rotating the grindstone 5, and is capable of moving the grindstone 5 in a direction in which the grindstone 5 approaches the workpiece 2 and a direction in which the grindstone 5 separates from the workpiece 2 in a plane (plane parallel to the rotation axis 3 and the rotation axis 6) orthogonal to the grindstone 5 and the workpiece 2. Therefore, the grindstone 5 is accessible from an arbitrary direction with respect to the workpiece 2 and is separable from the workpiece 2 in an arbitrary direction at least in the plane including the rotation shafts 3, 6 by the grindstone support mechanism 7. The workpiece support mechanism 4 has a temperature adjustment mechanism 15 that generates a flow of liquid or gas for maintaining the temperature of the rotation shaft 3 of the workpiece support mechanism 4 constant. Although not described in detail, the work support mechanism 4 and the grindstone support mechanism 7 may be constituted by a known suction table, a rotary motor, a movable table, or the like.
As shown in fig. 2, the grindstone 5 of the workpiece processing apparatus 1 has a base disk portion 5a serving as a base, and a convex grinding portion 5b located on the outer peripheral portion of the base disk portion 5 a. The base circular plate portion 5a is made of an alloy such as aluminum or stainless steel, and is provided with a straight mounting hole 5c extending in the thickness direction and through which the rotation shaft 6 passes, and a recess 5d for mounting to a holding portion (for example, a flange portion) of the grindstone support mechanism 7, which is not shown. The convex grinding portion 5b located at the outer peripheral portion of the grindstone 5 is composed of a metal bond grindstone, a resin bond grindstone, or the like, and has a convex shape facing radially outward (outer peripheral side) in a cross section through the rotary shaft 6, and has a shape having arc-shaped portions 5e at least at both ends in the thickness direction. In the example shown in fig. 2, the arcuate portions 5e at both ends in the thickness direction are connected by the same arcuate portions, and the convex grinding portion 5b as a whole constitutes a semicircle. The convex grinding portion 5b does not include a portion having a concave shape facing the inner side in the radial direction.
A workpiece processing method using the workpiece processing apparatus 1 shown in fig. 1 will be described. Fig. 3A to 3D are front views schematically showing an example of the workpiece processing method in order. In fig. 3A to 3D, for easy observation, the difference between the sizes of the workpiece 2 and the grindstone 5 is illustrated so as not to be large, but in reality the grindstone 5 is much larger than the workpiece 2. First, a workpiece 2 (e.g., a semiconductor wafer) as a workpiece is mounted on a workpiece support mechanism 4, and the workpiece 2 is rotated about a rotation axis 3. The workpiece 2 rotates but does not move. The grindstone 5 attached to the grindstone support mechanism 7 is rotated about the rotation shaft 6 by the grindstone support mechanism 7, and the outer peripheral portion of the grindstone 5 is moved so as to be brought into contact with the outer peripheral portion of the workpiece 2. As an example, as shown in fig. 3A, the grindstone 5 attached to the grindstone support mechanism 7 is disposed so as to coincide with the center in the thickness direction with respect to the workpiece 2 attached to the workpiece support mechanism 4. The workpiece 2 is rotated about the rotation axis 3, and the grindstone 5 is rotated about the rotation axis 6, and the outer peripheral portion of the grindstone 5 is brought into contact with the outer peripheral portion of the workpiece 2 as shown in fig. 3B, thereby grinding.
Thereafter, the grindstone 5 is moved to the one surface side of the workpiece 2 (in the example shown in fig. 3A to 3D, above the workpiece 2), and the grindstone 5 is moved relative to the workpiece 2 while continuing to rotate the workpiece 2 and the rotation of the grindstone 5, as shown in fig. 3C, with the outer peripheral portion of the grindstone 5 being brought into contact with the outer peripheral portion of the one surface of the workpiece 2. Specifically, the grindstone 5 is gradually moved from the vicinity of the center in the thickness direction of the workpiece 2 to the radially outer side toward one surface side of the workpiece 2 and to the radially inner side. Thereby, the grindstone 5 grinds and chamfer an edge on one surface side (upper side) of the outer peripheral portion of the workpiece 2, thereby forming a chamfer portion 2a.
After chamfering of the upper edge of the outer peripheral portion of the workpiece 2 is completed, the grindstone 5 is moved (lowered) from the inner side in the radial direction of the workpiece 2 to the outer side of the outermost end portion and then to the other surface side of the workpiece 2 (in the example shown in fig. 3A to 3D, below the workpiece 2). At this time, the grindstone 5 may be lowered while being in contact with the radially outermost end of the workpiece 2, but the grindstone 5 may be lowered without being in contact with the outermost end of the workpiece 2 after being moved to a position outside the outermost end of the workpiece 2.
As shown in fig. 3D, the grindstone 5 is moved from the radially outer side to the inner side of the workpiece 2 while continuing to descend in a state in which the outer peripheral portion of the grindstone 5, which is moved to a position lower than the center in the thickness direction of the workpiece 2, is brought into contact with the outer peripheral portion of the other surface of the workpiece 2. In this way, the outer peripheral portion of the rotating grindstone 5 is brought into contact with the outer peripheral portion of the workpiece 2, and the workpiece 2 is ground, and the lower edge of the outer peripheral portion of the workpiece 2 is chamfered, thereby forming the chamfered portion 2a. Finally, the grindstone 5 moves to a position lower than the lower surface of the workpiece 2, and the grindstone 5 is not in contact with the workpiece 2, and the chamfering process of the workpiece 2 is completed. As shown in fig. 3A to 3D, the grindstone 5 reciprocates (traverses) from a position facing the center of the workpiece 2 to one surface side and the other surface side (up and down) in the thickness direction of the workpiece 2 and the grindstone 5, and chamfering of the upper edge and chamfering of the lower edge of the outer peripheral portion of the workpiece 2 are performed. Chamfering of the upper edge and chamfering of the lower edge of the outer peripheral portion of the workpiece 2 are performed by movement of the grindstone 5 in the radial direction of the workpiece 2 in the same direction (movement from the outer side toward the inner side in the radial direction of the workpiece 2). In the present embodiment, the grindstone 5 is moved back and forth and grinds only a straight portion (a portion between the chamfer portions of both surfaces) of the front end of the workpiece 2, and the chamfer portions 2a of both surfaces are formed only by the movement of the grindstone 5 in one direction from the radially outer side toward the inner side of the workpiece 2. For example, as described in patent document 5, grinding can be performed easily and efficiently in a short time in the present embodiment, as compared with a method in which grinding is performed by reciprocating (traversing) a grindstone relative to a workpiece, not only in a straight portion of a front end of the workpiece but also in curved portions between the straight portion and the chamfered portions and in the chamfered portions on both sides. Further, since the convex grinding portion 5b of the grindstone 5 according to the present embodiment is mainly a curved surface having an arc shape, calculation and design of the curved surface shape can be easily performed in accordance with the shape and size of the chamfer portion 2a to be formed. In some of the drawings, in order to easily determine a desired cross-sectional shape of the workpiece 2, the shape of the chamfer 2a in a substantially completed state may be illustrated in the middle of formation of the chamfer 2a or in a stage before formation.
The workpiece processing method will be described in more detail with reference to fig. 4 to 6. In the machining method of the present embodiment, the movement condition of the relative movement of the grindstone 5 and the workpiece 2 is calculated so that the contact portion of the convex grinding portion 5b of the grindstone 5 with the workpiece 2 moves along the desired cross-sectional shape of the workpiece 2. Since the size of the grindstone 5 of the present embodiment is known, the movement condition for moving the grindstone 5 and the workpiece 2 relative to each other is calculated based on the radius of curvature of the arcuate portions 5e of the grindstone 5 located at both ends in the thickness direction of the convex grinding portion 5 b. According to the movement condition calculated in this way, the grindstone support mechanism 7 or the work support mechanism 4 moves the grindstone 5 relative to the work 2. For example, the desired cross-sectional shape of the workpiece 2 is expressed as two-dimensional coordinates in a plane including the rotation axis 3 of the workpiece 2 and the rotation axis 6 of the grindstone 5, and the relative movement condition of the grindstone 5 and the workpiece 2 is set so that the contact portion of the grindstone 5 with the workpiece 2 passes through the point of each coordinate. As described above, in the present embodiment, the grindstone 5 and the workpiece 2 are NC-controlled (numerical control) to move relatively, and grinding of the workpiece 2 is performed.
Specifically, as shown in fig. 4, the grindstone 5 is brought into contact with the outer peripheral end face of the workpiece 2 to grind the workpiece 2, thereby reducing the diameter of the workpiece 2. Since the grindstone 5 is far larger than the workpiece 2, the portion of the convex grinding portion 5b of the grindstone 5, which is in contact with the outer peripheral end face of the workpiece, is substantially linear. Therefore, the outer peripheral portion of the workpiece 2 is ground so as to be substantially linear, and the diameter of the workpiece 2 is reduced. The workpiece 2 is ground until the diameter of the workpiece 2 becomes a desired size in a state where the center in the thickness direction (up-down direction in fig. 4) of the convex grinding portion 5b of the grindstone 5 is aligned with the center in the thickness direction of the workpiece 2. Thereafter, the grindstone 5 is moved relative to the workpiece 2 in the thickness direction, and the workpiece 2 is ground so as to form a straight line portion of a desired cross-sectional shape (indicated by a two-dot chain line) of the workpiece 2. In this way, the grindstone 5 is relatively moved in the thickness direction of the workpiece 2 to form a linear portion of a desired cross-sectional shape of the workpiece 2, and after the grindstone 5 reaches a predetermined position P1 on one surface side (for example, the upper side), the grindstone is relatively moved in a curved line from the outer side toward the inner side in the radial direction of the workpiece 2 while continuing the relative movement to the one surface side, as shown in fig. 5. By properly moving the grindstone 5 in the thickness direction and the radial direction relative to the workpiece 2 based on the movement condition calculated in advance, the grindstone 5 relatively passes through a desired curved track relative to the workpiece 2. After reaching the position P2 at which the angle α with respect to the start point P1 of the relative movement from the radially outer side toward the inner side of the workpiece 2 is a predetermined angle, the relative movement amount of the grindstone 5 and the workpiece 2 is set to be constant, and the grindstone 5 is linearly moved relative to the workpiece 2. The angle α is an angle measured from the inner peripheral side of the workpiece 2 in a plane including the rotation axis 3 of the workpiece 2 and the rotation axis 6 of the grindstone 5. The grindstone 5 is moved relatively to the outside of one surface in the thickness direction of the workpiece 2 so as not to contact the workpiece 2, and grinding of one surface of the workpiece 2 is completed. As shown in fig. 6, the other surface side of the workpiece 2 is ground by performing an operation of substantially reversing the operation of the one surface side of the workpiece 2 shown in fig. 5.
The difference between the sizes of the grindstone 5 and the workpiece 2 is substantially larger than that shown in fig. 4 to 6 (for example, the radius of curvature of the arcuate portion 5e of the grindstone 5 is several tens times the thickness of the workpiece 2), and the portion of the arcuate portion 5e of the grindstone 5 in contact with the outer peripheral surface of the workpiece 2 may be substantially linear. For example, at a point in time when the grindstone 5 moves so that the movement angle α becomes a predetermined value (see fig. 5 and 6), there is a possibility that the arc-shaped portion 5e of the grindstone 5 contacts the workpiece 2 so as to be able to grind the entire chamfer portion 2a of the workpiece 2 into a desired shape, with a gap generated between the arc-shaped portion and the desired shape (indicated by a two-dot chain line in fig. 5 and 6) of the chamfer portion 2a of the workpiece 2 being extremely small and being able to be ignored. In this case, it is also conceivable that the movement of the grindstone 5 is stopped at a point of time when the grindstone 5 is moved and the movement angle α becomes a predetermined magnitude, and the step of linearly moving the grindstone 5 relative to the workpiece 2 after that is omitted. In the case of performing more precise grinding, it is preferable to perform a step of moving the grindstone 5 linearly relative to the workpiece 2 after the grindstone 5 is moved curvilinearly until the movement angle α becomes a predetermined magnitude. However, in the case of performing relatively coarse grinding as the previous stage of precise grinding, the grinding stone 5 may be moved in a curved line until the movement angle α reaches a predetermined value, and then the step of linearly moving the grinding stone 5 relative to the workpiece 2 may be omitted, thereby simplifying the work.
In this way, in the present embodiment, by relatively moving the grindstone 5 and the workpiece 2 in accordance with the movement condition calculated in advance, the contact portion of the grindstone 5 with the workpiece 2 passes through the movement locus calculated based on the desired cross-sectional shape of the workpiece 2. As a result, the workpiece 2 can be formed into a desired cross-sectional shape. When processing different kinds of workpieces 2, the movement conditions for processing the workpieces 2 are calculated in accordance with the desired cross-sectional shape of the newly processed workpiece 2. At this time, since the movement condition is calculated based on the radius of curvature of the arcuate portion 5e of the grindstone 5, it is possible to accurately machine the workpieces 2 of various shapes using the same grindstone 5.
Effects of the present embodiment will be described. As shown in fig. 7, in the case of the conventional processing method using the grindstone 16 having the forming groove 16a, there is a high possibility that the portion P3 of the inner peripheral surface of the forming groove 16a, on which the workpiece 2 is first abutted, will be worn or damaged at a specific portion of the grindstone 16, for example. When a plurality of workpieces 2 are machined, abrasion or damage occurs in the portion P3, and the shape of the formed groove 16a is changed, so that the machining accuracy becomes low when the workpiece 2 is machined using the grindstone 16. In this case, the grinding stone 16 needs to be replaced and shaped. In contrast, in the present embodiment, since various portions of the convex grinding portion 5b of the grindstone 5 are ground in contact with the workpiece 2, only specific portions are not particularly liable to wear or damage. Therefore, the life of the grindstone 5 is relatively long.
In the conventional machining method described in patent document 6, it is difficult to use a too large (large diameter) grindstone in terms of structure, and therefore machining with a small (small diameter) grindstone is necessary. As a result, the life of the grindstone is short, and the frequency of changing and shaping the grindstone is high. However, in the present embodiment, since the possibility of the grindstone 5 and the grindstone support mechanism 7 interfering with other members, specifically, the workpiece support mechanism 4 is small, the restriction in structure is small, and the workpiece 2 can be machined using the large (large diameter) grindstone 5. Therefore, the life of the grindstone 5 is long, and the frequency of replacement and shaping of the grindstone 5 is low. In the machining method described in patent document 6, the rotation direction of the grindstone substantially coincides with the relative movement direction with respect to the workpiece (both are the thickness directions of the workpiece 2). Therefore, when large concave-convex portions are present on the outer peripheral portion of the grindstone, linear marks along the rotation direction (thickness direction of the workpiece) are easily generated on the outer peripheral surface of the workpiece due to the rotation of the grindstone. The grindstone moves relative to the workpiece in the same direction as the rotation direction, that is, in a direction substantially parallel to the linear mark while rotating, and therefore the linear mark is not erased and is easily left. The portion of the grindstone where the linear mark is generated on the outer peripheral surface of the workpiece (large concave-convex portion) is relatively moved in the thickness direction of the workpiece while maintaining the position of the workpiece in the circumferential direction unchanged. Therefore, there is a possibility that a portion of the workpiece which is not in contact with the large concave-convex portion and is not deeply ground to the same extent as the linear mark remains. As a result, even if the grindstone moves, the linear mark is not erased and is liable to remain. The workpiece rotates in a direction orthogonal to the rotation direction of the grindstone, but the length of movement in the circumferential direction due to the rotation of the workpiece is considerably longer than the length of movement of the grindstone and the workpiece relative to each other in the thickness direction of the workpiece. Since the grindstone grinds the entire periphery of the workpiece and moves relatively in the thickness direction of the workpiece, the grindstone must be moved relatively slowly in the thickness direction of the workpiece with respect to the workpiece so that the processing time of the workpiece is not too long. The width of the workpiece in the circumferential direction of the portion of the workpiece in contact with the grindstone is made narrow, and in order to prevent the grindstone from moving relatively to the workpiece in the thickness direction of the workpiece, the rotation speed (the moving speed in the circumferential direction) of the workpiece is increased to shorten the time required for grinding by the grindstone being in contact with the entire circumference of the workpiece. In this way, since the rotation speed of the workpiece is increased, even if the workpiece and the grindstone rotate in mutually orthogonal directions, the surface roughness of the workpiece after grinding is rough. In contrast, in the present embodiment, the rotation direction of the grindstone 5 is substantially orthogonal to the relative movement direction with respect to the workpiece 2. The rotation direction of the grindstone 5 is the circumferential direction of the workpiece 2, and the relative movement direction is the thickness direction of the workpiece 2. When large concave-convex portions are present on the outer peripheral portion of the grindstone 5, linear marks along the circumferential direction are generated on the outer peripheral surface of the workpiece 2 due to the rotation of the grindstone 5. The grindstone 5 is moved relative to the workpiece 2 in a direction perpendicular to the rotation direction, that is, in a direction substantially perpendicular to the linear mark while rotating, and therefore the linear mark is less likely to remain. Since the portion (large concave-convex portion) of the grindstone 5, which causes the linear mark on the outer peripheral surface of the workpiece 2, moves in the direction orthogonal to the linear mark while rotating in the circumferential direction, the large concave-convex portion is sequentially brought into contact with the substantially entire outer peripheral surface of the workpiece 2. Therefore, the substantially entire outer peripheral surface of the workpiece 2 is ground deeply by the large concave-convex portion as much as the linear mark. In this way, the direction of rotation of the grindstone 5 is substantially orthogonal to the direction of relative movement with respect to the workpiece 2, and thus the linear mark generated on the outer peripheral surface of the workpiece 2 is easily erased and smoothed. In this configuration, even if the rotation speed of the workpiece 2 is high, the rotation direction of the grindstone 5 (the circumferential direction of the workpiece 2) is orthogonal to the relative movement direction of the grindstone 5 (the thickness direction of the workpiece 2) and the relative movement distance is short, so that the machining time does not become so long even if the grindstone 5 moves relatively slowly in the thickness direction of the workpiece 2. Therefore, the relative movement speed of the grindstone 5 in the thickness direction of the workpiece 2 is made relatively slow, and the entire circumference of the workpiece 2 is sufficiently ground, so that the surface roughness of the workpiece after grinding can be made good.
In the conventional machining method described in patent document 5, since grinding is performed by relatively moving the workpiece along the outer shape of the grindstone, the shape of the machined workpiece is determined by the outer shape of the grindstone (in particular, the shape and angle of the curved or linear inclined surface of the grindstone). Therefore, in order to form a work having a different shape, the grindstone needs to be replaced. In contrast, in the present embodiment, the relative movement between the grindstone 5 and the workpiece 2 is not performed along the outer shape of the grindstone 5, and is performed under movement conditions calculated in consideration of the radius of curvature of the arcuate portion 5e of the convex grinding portion 5b of the grindstone 5. Therefore, when forming the work pieces 2 having different shapes, the grinding stone 5 does not need to be replaced, and the moving conditions may be changed. That is, the work 2 having various shapes can be formed using the same grindstone 5 without replacing the grindstone 5. The movement condition is obtained by calculation based on the radius of curvature or the like of the arcuate portion 5e of the convex grinding portion 5b of the grindstone 5, and the relative movement of the grindstone 5 and the workpiece 2 is numerically controlled based on the movement condition, so that the machining accuracy is good. As described above, according to the present embodiment, the workpiece 2 having various shapes can be formed by the same grinding stone 5, and the machining accuracy is excellent, and further, the grinding stone 5 has a long life.
According to the machining apparatus and the machining method of the present embodiment, as shown in fig. 8A, both the workpiece 2 having a so-called T shape, in which the outer peripheral portion is formed of a pair of arcuate portions and a straight portion connecting them, and the workpiece 2 having a so-called rounded shape, in which the outer peripheral portion is semicircular, as shown in fig. 8B, can be formed with high precision. In the case of the T-shaped workpiece 2 shown in fig. 8A, processing is performed under a moving condition obtained by calculation based on the respective radii of curvature R1, R2 of the pair of arcuate portions of the outer peripheral portion, the lengths X1, X2 of the inclined surface portions of the straight line connecting from the respective arcuate portions, the angles θ1, θ2 of these inclined surface portions with respect to the surface of the workpiece 2, the length X3 of the straight line portion between the pair of arcuate portions, and the radius of curvature of the arcuate portion 5e of the convex grinding portion 5b of the grindstone 5, which is not shown in fig. 8A. In the case of the round-corner-shaped workpiece 2 shown in fig. 8B, processing is performed under a movement condition obtained by calculation based on the radius R of the semicircular portion of the outer peripheral portion, the lengths X1, X2 of the inclined surface portions of the straight lines connecting from the semicircular portion to both sides, the angles θ1, θ2 of these inclined surface portions with respect to the surface of the workpiece 2, and the radius of curvature of the circular arc portion 5e of the convex grinding portion 5B of the grindstone 5, which is not shown in fig. 8B. In this way, both the T-shaped workpiece 2 shown in fig. 8A and the rounded-corner-shaped workpiece 2 shown in fig. 8B can be processed with high precision by numerical control according to a moving condition that is obtained by calculation based on the dimensions of each portion of the desired cross-sectional shape shown in the figure and the radius of curvature of the arcuate portion 5e of the convex grinding portion 5B of the grindstone 5. In the case of the round-corner-shaped workpiece 2 shown in fig. 8B, since the straight line portion does not exist at the outer peripheral end, processing for forming the straight line portion on the workpiece 2 while relatively moving the grindstone 5 in the thickness direction is not required after grinding the workpiece 2 until the diameter of the workpiece 2 becomes a desired size.
Next, another example of a workpiece processing method using the workpiece processing apparatus 1 shown in fig. 1 will be described. Fig. 9A to 9C are front views schematically showing an example of the workpiece processing method in order. In this example, with respect to the grindstone 5 attached to the grindstone support mechanism 7, the outer peripheral portion of the grindstone 5 is brought into contact with the outer peripheral portion of the workpiece 2 from one surface side in the thickness direction of the workpiece 2 (in the example shown in fig. 9A to 9C, above the workpiece 2) on the inner side in the radial direction of the workpiece 2 attached to the workpiece support mechanism 4, and grinding of the edge portion of the outer peripheral portion of the workpiece 2 is started. The grindstone support mechanism 7 moves the grindstone 5 while continuing to rotate the workpiece 2. Specifically, as shown in fig. 9A, the grindstone 5 is moved from the radially inner side toward the outer side of the workpiece 2 while facing the other surface side in the thickness direction of the workpiece 2 (downward of the workpiece 2 in the example shown in fig. 9A to 9C). By this movement, the upper edge of the outer peripheral portion of the workpiece 2 is chamfered, thereby forming a chamfered portion 2a. As shown in fig. 9B, after the grindstone 5 reaches the outermost end in the radial direction of the workpiece 2, the grindstone 5 is moved downward further than the center in the thickness direction of the workpiece 2. At this time, the grindstone 5 is brought into contact with the radially outermost end portion of the workpiece 2, and is lowered while grinding the workpiece 2.
As shown in fig. 9C, the grindstone 5, which is moved to a position lower than the center in the thickness direction of the workpiece 2, is moved from the radially outer side toward the inner side of the workpiece 2 while continuing to descend. At this time, the outer peripheral portion of the rotating grindstone 5 is brought into contact with the outer peripheral portion of the workpiece 2, the workpiece 2 is ground, and the lower edge of the outer peripheral portion of the workpiece 2 is chamfered, thereby forming a chamfered portion 2a. Finally, the grindstone 5 moves to a position lower than the lower surface of the workpiece 2, and the grindstone 5 is not in contact with the workpiece 2, and chamfering of the workpiece 2 is completed. As shown in fig. 9A to 9C, chamfering of both surfaces of the workpiece 2 can be performed by extremely simple movement of the grindstone 5 in which the grindstone 5 is moved from the radially inner side to the outer side of the workpiece 2 and then moved from the radially outer side to the inner side of the workpiece 2 after being slightly lowered. However, in chamfering the upper edge of the outer peripheral portion of the workpiece 2, the grindstone 5 may be rotated while being brought into contact with the workpiece 2, and may be moved from the radially outer side toward the inner side of the workpiece 2. In this case, both the chamfering of the upper edge and the chamfering of the lower edge of the outer peripheral portion of the workpiece 2 are performed by the movement of the grindstone 5 in the same direction (movement from the radially outer side toward the inner side).
In the examples shown in fig. 3A to 6 and the examples shown in fig. 9A to 9C, the grindstone support mechanism 7 can adjust the size of the chamfer portion 2a by adjusting the position of the grindstone 5 before the start of chamfering processing on the workpiece 2 in the radial direction, that is, the position of the grindstone 5 at the start of the contact with the workpiece 2 and the position of the grindstone 5 at the end of chamfering processing, that is, the position at which the contact of the grindstone 5 with the workpiece 2 ends. In addition, the grinding stone supporting mechanism 7 can adjust the angle, shape, and the like of the chamfer portion 2a of the workpiece 2 by adjusting the speed at which the grinding stone 5 is lowered and the speed at which the grinding stone 5 is moved in the radial direction of the workpiece 2, taking into consideration the size of the chamfer portion 2a and the speed at which the workpiece 2 is ground by the grinding stone 5 thus adjusted. Further, since the contact angle of the grindstone 5 with respect to the workpiece 2 is changed by grinding at any one of the curved portions of the outer peripheral portion of the grindstone 5, the angle, shape, and the like of the chamfer portion 2a of the workpiece 2 can be adjusted. In this way, the desired shape and size of the chamfer 2a of the workpiece 2 can be achieved mainly by controlling the movement of the grindstone 5 by the grindstone support mechanism 7. For this purpose, the grindstone support mechanism 7 drives the grindstone 5 preferably by numerical control (NC control).
The above-described structure is a structure in which the grindstone 5 is moved while being rotated by the grindstone support mechanism 7, and the workpiece 2 is rotated but not moved by the workpiece support mechanism 4, but is not limited to such a structure. That is, the grindstone support mechanism 7 may be configured to rotate only the grindstone 5 without moving the grindstone, and the workpiece support mechanism 4 may be configured to rotate the workpiece 2 and move the workpiece 2 by numerical control. In this case, the workpiece support mechanism 4 is capable of moving the workpiece 2 in both a direction in which the workpiece 2 approaches the grindstone 5 and a direction in which the workpiece 2 separates from the grindstone 5 in a plane parallel to the grindstone 5 and the workpiece 2 (in a plane orthogonal to the rotation axis 3 and the rotation axis 6), and is capable of moving the workpiece 2 in both a direction in which the workpiece 2 approaches the grindstone 5 and a direction in which the workpiece 2 separates from the grindstone 5 in a plane orthogonal to the grindstone 5 and the workpiece 2 (in a plane parallel to the rotation axis 3 and the rotation axis 6). Therefore, the workpiece 2 can be moved in an arbitrary direction with respect to the grindstone 5 and can be separated in an arbitrary direction with respect to the grindstone 5 by the grindstone support mechanism 7 at least in the plane including the rotation shafts 3, 6. In this configuration, the workpiece 2 and the grindstone 5 can be moved relatively so that the workpiece 2 and the grindstone 5 are positioned in the same positional relationship as in the respective steps shown in fig. 3A to 6 or fig. 9A to 9C, and the same processing as in the processing method shown in fig. 3A to 6 or fig. 9A to 9C can be performed.
In the present embodiment, since the grindstone 5 and the workpiece 2 are rotated not in mutually orthogonal directions but in the same or opposite directions, the rotation of the grindstone 5 and the rotation of the workpiece 2 produce a composite effect, and the rotation speed of the grindstone 5 itself does not need to be so high. Therefore, the grindstone support mechanism 7 is not a grindstone support mechanism capable of being rotated at a high speed, and simplification of the structure and cost reduction can be achieved. In addition, since grinding is performed while rotating the workpiece 2 in parallel with the grindstone 5, the surface roughness of the chamfer portion of the workpiece 2 can be reduced.
According to the present embodiment, since the grindstone 5 is arranged parallel to the workpiece 2, the grindstone 5 can be enlarged without interfering with the workpiece support mechanism 4. Thus, the outer peripheral portion of the workpiece 2 can be formed into an arbitrary cross-sectional shape using the large-sized grindstone 5 without complicating the structure of the machining apparatus 1 including the grindstone supporting mechanism 7. In addition, by using the large-sized grindstone 5, the machining time can be shortened with good machining efficiency, and the grindstone 5 can be machined over a wide range of the outer peripheral portion of the grindstone 5, so that the life of the grindstone 5 is prolonged. Further, when machining is performed using a grindstone having a groove (formed groove) formed with a shape corresponding to the shape of the work 2 in the finished state, abrasion and breakage of the inner peripheral surface (particularly, the portion of the inclined surface) of the groove that abuts against the edge of the work before chamfering easily occur, but in the present embodiment, the grindstone 5 does not have a structure in which only a specific one portion of the grindstone 5 continuously abuts against the edge of the work before chamfering, and therefore breakage of the grindstone 5 is hardly generated and the life is long.
When a work is inserted into a formed groove provided in a grindstone and machined, a chamfer of a specific shape and size can be formed, but in order to form a chamfer of a different shape and size, it is necessary to replace the grindstone with a different groove. However, according to the present embodiment, since the grinding stone 5 having the convex grinding portion 5b is moved relative to the workpiece 2 to perform chamfering, the shape and size of the formed chamfer portion 2a can be changed by changing the path of movement of the grinding stone 5 by numerical control. That is, the chamfer 2a of various shapes and sizes can be formed by a single grindstone 5.
In addition, in the case of machining by inserting a workpiece into a groove provided in a grinding stone, since machining is performed in a closed narrow space, it is not easy to supply grinding water (coolant) to a machining portion. However, in the present embodiment, the convex portion of the outer peripheral portion of the grindstone 5 is brought into contact with the workpiece 2 and is processed in an open space, so that grinding water can be easily and reliably supplied to the processing portion. This makes it possible to smoothly grind without causing clogging, excessive friction, or heat generation. In particular, a low-angle chamfer (e.g., a chamfer of 11 degrees or less) that is difficult to machine by inserting a workpiece into a groove provided in a grindstone can be easily and accurately achieved. The chamfering of the edge of the arc-shaped portion of the outer peripheral portion of the workpiece 2 and the chamfering of the edge of the orientation flat can be continuously performed by one large grindstone 5, and a plurality of grooves are not required. Therefore, the grindstone 5 can be made to have a simple structure, and the chamfer portion 2a, the groove portion, and the orientation flat portion can be formed by a series of steps, so that the processing time is short and the processing cost can be reduced.
Fig. 10A to 10B show a modification of the grindstone according to the present embodiment. As shown in fig. 10A, the grindstone 8 of this modification includes, for example, a base disk portion 8a made of metal and a convex grinding portion 8b made of a resin bond grindstone located on the outer peripheral portion thereof, and a straight mounting hole 8c and a recess 8d extending in the thickness direction and through which the rotation shaft 6 passes are provided in the base disk portion 8 a. The convex grinding portion 8b is convex toward the radial outside, and has a curved portion in at least a part of a cross section along the rotation axis, and is not provided with a concave portion toward the radial inside. The convex grinding portion 8b of the grindstone 8 of the present embodiment has a planar portion, that is, a linear portion 8f in a cross section passing through the rotary shaft 6, at a part of the outer peripheral portion, particularly at a middle portion in the thickness direction (a position between a pair of arcuate portions 8e located at both end portions in the thickness direction). In fig. 10A, the boundary between the arcuate portion 8e and the linear portion 8f is indicated by a virtual line (two-dot chain line). As shown in fig. 10B, the straight line portion 8f of the convex grinding portion 8B is mainly used when grinding the middle portion of the outer peripheral portion of the workpiece 2 in the thickness direction, that is, the portion between the chamfer portions 2a of the edges of the both ends of the workpiece 2 in the thickness direction, to reduce the diameter of the workpiece 2. According to the grindstone 8, the intermediate portion in the thickness direction of the outer peripheral portion of the workpiece 2 can be efficiently and accurately ground, and the surface roughness can be reduced. The straight line portion 8f may be a portion having a relatively large grinding stone particle size, and the arcuate portion 8e may be a portion having a relatively small grinding stone particle size and performing grinding more precisely than the grinding performed by the straight line portion 8f.
Although not shown, flanges are disposed in the mounting hole 8c and the recess 8d of the base circular plate portion 8a, and a main shaft constituting the rotary shaft 6 is inserted into the flange in the mounting hole 8c, and a fixing member such as a nut is attached to the tip of the main shaft protruding into the recess 8 d. Thereby, the grindstone 8 is fixed to the main shaft constituting the rotation shaft 6, and is rotatable together with the main shaft.
Next, a second embodiment of the present invention will be described. Fig. 11A is a cross-sectional view showing the grindstone 9 of the workpiece processing device of the present embodiment. In the present embodiment, two-stage grinding steps, that is, grinding for reducing the radius of the workpiece 2 and grinding for chamfering both surfaces of the outer peripheral portion of the workpiece 2 in order to form the workpiece 2 into a desired cross-sectional shape, are performed. Typically, the former grinding is rough grinding, and the latter grinding is precise grinding. Precision grinding is a relatively good performance compared to rough grinding, and precision grinding is a grinding that has a relatively good shape and size accuracy and a small surface roughness of the ground surface. In the grindstone 9 of the present embodiment, a convex grinding portion (precision grinding portion) 9b mainly used for grinding for forming the workpiece 2 into a desired cross-sectional shape and a cross-sectional rectangular grinding portion (rough grinding portion) 9f mainly used for grinding for reducing the radius of the workpiece 2 are provided at the outer peripheral portion of the base circular plate portion 9 a. The convex grinding portions 9b have the same configuration as the convex grinding portions 5b, 8b of the grindstones 5, 8 of the first embodiment, and have arcuate portions 9e at both ends in the thickness direction, respectively. As shown in fig. 11A to 11C, the grinding section 9f of the grindstone 9 of the present embodiment has a rectangular cross section along the rotation axis 6. That is, the surface of the rectangular-section grinding portion 9f facing the workpiece 2 is linear in a section along the rotation axis 6 parallel to the thickness direction of the grindstone 9.
In the present embodiment, the unprocessed workpiece 2 is mounted on the workpiece support mechanism 4, the workpiece 2 is rotated, and the grindstone 9 attached to the grindstone support mechanism 7 is rotated about the rotation shaft 6, and the grinding section 9f having a rectangular cross section is brought into contact with the outer peripheral portion of the workpiece 2 as shown in fig. 11B. Thus, the outer peripheral portion of the workpiece 2 is rough-ground, the outer diameter of the workpiece 2 is set to a desired size, and the intermediate portion in the thickness direction of the outer peripheral portion is smoothed mainly. Next, as shown in fig. 11C, chamfering of edges of both sides of the workpiece 2 is performed so as to form the workpiece 2 into a desired cross-sectional shape using the convex grinding portion 9b of the grindstone 9 in substantially the same manner as the processing method of the first embodiment shown in fig. 3A to 6 or fig. 9A to 9C. In the present embodiment, the convex grinding portion 9b of the grindstone 9 is used for grinding (precision grinding) more precisely than grinding for reducing the radius of the workpiece 2. In the present embodiment, the same effects as those of the first embodiment are obtained, and in the case of chamfering the portion by the two-stage grinding process, the two processes can be easily performed by only a single grindstone 9, and the manufacturing process is simple and low-cost. However, the grinding for reducing the radius of the workpiece 2 may be performed using not only the rectangular-section grinding portion 9f but also the convex-shaped grinding portion 9 b. Similarly, for grinding the edges of both sides of the workpiece 2 to form the workpiece 2 into a desired cross-sectional shape, not only the convex grinding portion 9b but also the cross-sectional rectangular grinding portion 9f are used. As an example, the rectangular cross-sectional grinding portion 9f is a portion having a larger grindstone grain size, and the convex grinding portion 9b is a portion used for precision grinding, in which the grindstone grain size is smaller than that of the rectangular cross-sectional grinding portion 9 f.
In general, when chamfering a workpiece 2 such as a semiconductor wafer, the outer peripheral surface of the workpiece 2 is ground with a grinding stone to reduce the radius, and the outer shape is adjusted while removing unnecessary portions of the workpiece 2 to a desired size and centered. Thereafter, a chamfer portion 2a is formed on the workpiece 2 by using a grindstone. In the case of performing these grinding by one convex grinding portion, the grinding (rough grinding) for reducing the radius of the workpiece 2 in the previous stage is mainly performed by bringing a portion near the center in the thickness direction of the convex grinding portion of the grindstone into contact with the workpiece. The grinding (precision grinding) for forming the chamfer portion 2a at the later stage is performed by bringing the arc-shaped portions at both ends in the thickness direction of the convex grinding portion into contact with the workpiece. In general, grinding for reducing the radius of the workpiece 2 is larger in grinding amount (grinding volume) than grinding for forming the chamfer portion 2a. Therefore, the portion near the center in the thickness direction of the convex grinding portion is worn more severely than the arc-shaped portions at both ends in the thickness direction, and the overall shape of the convex grinding portion is broken. As a result, the machining accuracy of the workpiece 2 may be lowered. In contrast, in the present embodiment, grinding for reducing the radius of the workpiece 2 is mainly performed by the cross-sectional rectangular grinding portion 9f, and grinding for forming the chamfer 2a can be performed by the convex grinding portion 9 b. That is, grinding for reducing the radius of the workpiece 2 and grinding for forming the chamfer 2a can be performed by using another portion of the grindstone 9. The shape and size of the cross-sectional rectangular grinding portion 9f and the shape and size of the convex grinding portion 9b can be independently controlled, and even if the respective amounts of wear are different, good machining can be performed by appropriately adjusting the machining conditions. The convex grinding portion 9b is used only for grinding mainly for forming the chamfer portion 2a, and only a part (a portion near the center in the thickness direction) is not significantly worn than the other part, but is worn relatively uniformly. Therefore, the shape of the convex grinding portion 9b of the grindstone does not change so much, and a reduction in the machining accuracy of the workpiece 2 can be suppressed. The grinding portion 9f having a rectangular cross section is worn out considerably, but the surface facing the workpiece 2 is straight and simple in shape parallel to the thickness direction of the grindstone 9, so that even if wear occurs, the machining accuracy is not lowered.
The mounting hole 9c of the grindstone 9 according to the present embodiment is formed in a tapered shape. In this configuration, although not shown, a tapered portion of the main shaft constituting the rotary shaft 6 is inserted into the tapered mounting hole 9c without using a flange, and a fixing member such as a nut is attached to the tip of the main shaft protruding into the recess 9d, whereby the grindstone 9 can be fixed to the main shaft constituting the rotary shaft 6 and supported so as to be rotatable together with the main shaft. That is, the grindstone 9 of the present embodiment does not require a flange, and can stably fix the grindstone 9 to the main shaft constituting the rotary shaft 6, and suppress the eccentricity of the grindstone 9 with respect to the rotary shaft 6 (main shaft).
Next, a third embodiment of the present invention will be described. Fig. 12 is a front view schematically showing the workpiece processing apparatus of the present embodiment. The workpiece processing apparatus of the present embodiment includes the same grindstone 9 as the second embodiment, and a disk-shaped grooved grindstone 12 disposed obliquely to the tangential direction of the outer periphery of the disk-shaped workpiece 2. The grooved stone 12 is supported by a grooved stone support mechanism 13 and rotates about a rotation shaft 14. The workpiece machining apparatus performs chamfering by the two-stage grinding process, and performs the previous-stage rough grinding process by performing the above-described machining method using the rectangular-section grinding portion 9f and the convex-shaped grinding portion 9b of the grindstone 9 similar to those of the second embodiment. The latter precision grinding step is performed by using the grooved grindstone 12 disposed obliquely to the tangential direction of the outer periphery of the workpiece 2. A concave groove 12a is provided in the outer peripheral portion of the grooved grindstone 12, and the outer peripheral portion of the workpiece 2 is inserted into the groove 12a, so that the inner peripheral surface of the groove 12a can be ground by abutting against the outer peripheral portion of the workpiece 2, thereby forming a chamfered portion. According to the present embodiment, the effect of the spiral processing method such as the small surface roughness is obtained, and the rough grinding by the grindstone 9 moving while rotating also achieves the effect of the spiral precise grinding by the grooved grindstone 12 which can be performed later with high efficiency in a shorter time.
The workpiece processing apparatus of the present embodiment includes a dressing stone 11 for dressing a grooved stone 12 that is rotatable about a rotation axis 3 and is attached to a workpiece support mechanism 4 in place of a workpiece 2. The dressing stone 11 is made of, for example, GC stone or the like harder than the grooved stone 12 made of a resin bond stone, and has a diameter and thickness substantially equal to those of the workpiece 2. The dressing grindstone 11 made of GC grindstone or the like is usually formed into a cross-sectional shape (a shape corresponding to the shape of the groove 12a set in advance) to be transferred to the inclined grooved grindstone 12 by processing the grindstone 9 made of metal bond grindstone in the same manner as the processing of the workpiece 2. The same method as the machining of the workpiece 2 is to calculate in advance a movement condition in which a contact portion of the convex grinding portion 9b of the grinding stone 9 with the dressing grinding stone 11 moves along a shape corresponding to the shape of the predetermined groove 12a based on the radius of curvature of the circular-arc-shaped portion 9e of the grinding stone 9, and to move the dressing grinding stone 11 relative to the grinding stone 9 in accordance with the movement condition, thereby forming the outer shape of the dressing grinding stone 11. The shape of the groove 12a set in advance is a shape suitable for forming the workpiece 2 in contact with the inner peripheral surface of the groove 12a into a desired cross-sectional shape. The dressing grind stone 11 having the cross-sectional shape is rotated about the rotation axis 3 and pressed against the outer peripheral portion of the inclined grooved grind stone 12 before the groove is formed or shaped, and the outer shape of the dressing grind stone 11 is transferred to the outer peripheral portion of the grooved grind stone 12 to form or shape the groove 12 a. In this way, the dressing of the grooved grindstone 12 can be easily performed. The dressing grindstone 11 is formed to have a shape including a slight change in the cross-sectional shape that is expected to occur during dressing of the inclined grooved grindstone 12, based on experience.
For example, the GC grinding stone Dan Jiao having a particle size of #320 is stronger than the resin bond grinding stone having a particle size of #3000, and the metal bond grinding stone having a particle size of #800 is stronger than the GC grinding stone having a particle size of # 320. Accordingly, the GC grinding stone having the particle size #320 can be formed into a desired cross-sectional shape by grinding the GC grinding stone having the particle size #800 with the metal bond grinding stone. Further, the GC grinding stone having a particle size of #320 is pressed against the inner peripheral surface of the groove provided with the resin bond grinding stone having a particle size of #3000, whereby the shape of the groove can be shaped. The grinding stones described below are basically grinding stones having the above-described particle sizes, respectively. In a conventional workpiece processing apparatus that performs rough grinding using a grinding stone composed of a metal bond grinding stone and having a molding groove and performs precision grinding using an inclined grooved grinding stone composed of a resin bond grinding stone, a dressing grinding stone composed of a GC grinding stone is brought into contact with an inner peripheral surface of the molding groove of the metal bond grinding stone to transfer the shape of the molding groove. Thereafter, a dressing stone composed of GC stone is brought into contact with the inclined resin bond stone to form or shape the groove. Precision grinding of a workpiece (wafer) is performed by using the inclined groove grinding stone groove formed of the resin bond grinding stone formed in this manner. Therefore, the workpiece can be formed only in a cross-sectional shape depending on the shape of the forming groove of the metal bond grindstone, and cannot be formed in a different cross-sectional shape.
In contrast, in the present invention, since the dressing grind stone 11 made of GC grind stone can be formed into an arbitrary cross-sectional shape by the convex grinding section 9b of the grind stone 9 made of metal bond grind stone, grooves 12a of an arbitrary cross-sectional shape can be formed in the grooved grind stone 12 dressed by the dressing grind stone 11. Thus, the work 2 having various cross-sectional shapes can be processed without changing the grindstone. Further, after the grooved grindstone 12 is trimmed, the workpiece 2 can be machined once, and the cross-sectional shape of the machined workpiece 2 can be actually measured and fed back by comparing it with the target shape. Even when the cross-sectional shape of the machined workpiece 2 is different from the target shape, the cross-sectional shape of the shaped dressing grind stone 11 is changed (corrected) by the convex grinding section 9b of the grind stone 9, and the grooved grind stone 12 is reconditioned by the dressing grind stone 11 having the changed cross-sectional shape. In this way, the cross-sectional shape of the workpiece 2 shaped by the grooved grindstone 12 can be made close to the target shape. In the above-described conventional workpiece processing apparatus, since the metal bond grindstone having the formed groove is used, even if the cross-sectional shape of the processed workpiece is different from the target shape, it is impossible to change (correct) the cross-sectional shape of the dressing grindstone 11. However, according to the method of the present invention, the accuracy of the cross-sectional shape of the processed workpiece, that is, the processing accuracy of the workpiece 2 can be remarkably improved.
Next, a fourth embodiment of the present invention will be described. Fig. 13 is a front view schematically showing the workpiece processing apparatus of the present embodiment. The workpiece processing apparatus according to the present embodiment includes the grooved grindstone 12 disposed obliquely to the tangential direction of the outer periphery of the disc-shaped workpiece 2, as in the third embodiment. The grinding stone 9 similar to the second embodiment is attached to the grinding stone supporting mechanism 7 and is rotatable about the rotation shaft 6. The workpiece 2 is mounted on the workpiece support mechanism 4 so as to be rotatable about the rotation axis 3, and is movable in both a direction approaching the grindstone 9 and a direction separating from the grindstone 9 in a plane parallel to the workpiece 2 and the grindstone 9 (in a plane orthogonal to the rotation axis 3 and the rotation axis 6), and is movable in both a direction approaching the grindstone 9 and a direction separating from the grindstone 9 in a plane orthogonal to the grindstone 9 and the workpiece 2 (in a plane parallel to the rotation axis 3 and the rotation axis 6). As shown in fig. 13, the workpiece support mechanism 4 includes an X-direction moving stage 4a, a Y-direction moving stage 4b, a Z-direction moving stage 4c, and a motor 4d. The X-direction moving stage 4a is movable in the width direction (direction orthogonal to the paper surface of fig. 13) of the grindstone 9 and the workpiece 2 in a plane parallel to the grindstone 9 and the workpiece 2. The Y-direction moving stage 4b is mounted on the X-direction moving stage 4a so as to be movable in the approaching/separating direction (left-right direction in fig. 13) of the grindstone 9 and the workpiece 2 in a plane parallel to the grindstone 9 and the workpiece 2. The Z-direction moving stage 4c is mounted on the Y-direction moving stage 4b and is movable in the height direction (up-down direction in fig. 13) in a plane orthogonal to the grindstone 9 and the workpiece 2. Although not described in detail, the X-direction moving stage 4a, the Y-direction moving stage 4b, and the Z-direction moving stage 4c have a known guide mechanism (for example, LM guide) and a known moving mechanism (for example, ball screw, nut, and rotation driving mechanism), respectively, and are movable in the respective directions described above. The motor 4d is mounted on the Z-direction moving table 4c, and is a driving mechanism that supports the workpiece 2 via the rotation shaft 3 and rotates the rotation shaft 3. The motor 4d is a heat generating member, and a temperature adjustment mechanism 15 is provided so as to cover at least one of the motor 4d and the rotation shaft 3. The temperature adjusting mechanism 15 adjusts the temperature of at least one of the motor 4d and the rotary shaft 3 by flowing a liquid or a gas into a flow path not shown.
According to this workpiece processing apparatus, the effects of the first to third embodiments can be achieved. In addition, although not shown, the dressing grind stone 11 similar to the third embodiment can be moved so as to abut against the grooved grind stone 12 while rotating, and the dressing of the grooved grind stone 12 can be performed easily and efficiently with high accuracy.
The workpiece support mechanism 4 may not always rotate the workpiece 2 at a high speed, and may not rotate the workpiece 2 at a low speed. Specifically, when grinding the workpiece 2 by the convex grinding portions 5b, 8b, 9b and the rectangular-section grinding portion 9f of the grindstones 5, 8, 9, the workpiece 2 rotates at a high speed. When grinding the workpiece 2 by using the grooved grindstone 12 disposed obliquely with respect to the tangential direction of the outer periphery of the disk-shaped workpiece 2, the workpiece 2 rotates at a low speed. In addition, the workpiece support mechanism 4 does not need to perform a rotational movement at the time of replacement of the workpiece 2. Conventionally, in the case of continuously processing a plurality of workpieces 2, the workpiece support mechanism 4 repeats a high-speed rotation of the workpiece 2 around the rotation shaft 3, a low-speed rotation of the workpiece 2, and a rotation stopped state. The workpiece support mechanism 4 generates heat to be at a high temperature during high-speed rotation of the workpiece 2, is at a lower temperature during low-speed rotation of the workpiece 2 than during high-speed rotation, and is further at a lower temperature in a state where the rotational movement is stopped. As a result of repeating such temperature changes, the workpiece support mechanism 4 deforms, in particular, the rotation shaft 3 expands and contracts. When the rotation shaft 3 to which the workpiece 2 is attached is deformed and the position of the workpiece 2 in the thickness direction is changed, even if the workpiece 2 and the grindstone are moved relatively by numerical control as described above, the machining accuracy is greatly reduced.
In the embodiments of the present invention, the temperature adjustment mechanism 15 attached to the workpiece support mechanism 4 is provided. The temperature adjustment mechanism 15 generates a flow of liquid or gas, reduces a variation in temperature of the rotation shaft 3 of the workpiece support mechanism 4, and suppresses deformation of the rotation shaft 3. In this way, when the workpiece 2 is processed, deformation due to heat of the rotating shaft 3 is suppressed, thereby preventing degradation of processing accuracy of the workpiece 2.
In order to keep the temperature of the rotation shaft 3 as constant as possible, it is preferable to continuously perform the rotation movement centering on the rotation shaft 3. For example, it is preferable that the workpiece support mechanism 4 continue the rotation movement about the rotation shaft 3 even when the workpiece 2 is replaced or replenished or when the processing of the workpiece 2 is interrupted due to a problem in the working process. In this way, by holding the workpiece support mechanism 4 in a state in which the rotation movement (referred to as an idling state or a preliminary rotation operation for convenience) about the rotation axis 3 is performed in a state in which the workpiece 2 is not mounted and the processing of the workpiece 2 is not performed, it is possible to suppress the fluctuation of the temperature to a small extent, and it is easy to stabilize the temperature in a short time. In this preliminary rotation operation, it is preferable that the high-speed rotation (rotation at the same speed as the high-speed rotation of the workpiece 2 during the machining by the grindstone) and the low-speed rotation (rotation at the same speed as the low-speed rotation of the workpiece 2 during the machining by the grindstone) be alternately repeated in order to suppress the temperature fluctuation to be small, instead of the high-speed rotation or the low-speed rotation alone, as in the actual machining of the workpiece 2. Thus, when the processing is shifted from the preliminary rotation operation to the workpiece 2, the temperature of the rotary shaft 3 can be immediately stabilized, and high-precision processing can be performed. In particular, when the ratio of the duration of high-speed rotation to the duration of low-speed rotation in the preliminary rotation operation is made to coincide with the ratio of the duration of high-speed rotation to the duration of low-speed rotation in the actual processing of the workpiece 2, temperature control based on the actual processing of the workpiece 2 is preferably performed. However, if the duration of the high-speed rotation and the duration of the low-speed rotation of the preliminary rotation operation are long, the standby time for waiting for a timing suitable for the transfer to the work 2 by ending the preliminary rotation operation (for example, a timing for switching the rotation speed of the preliminary rotation operation) becomes long when the actual work 2 starts to be processed, and there is a possibility that the work efficiency may be lowered. Then, as described above, it is preferable that the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation in the preliminary rotation operation is made to coincide with the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation in the actual processing of the workpiece 2, and the duration of the high-speed rotation and the duration of the low-speed rotation in the preliminary rotation operation are made to be shorter than the duration of the high-speed rotation and the duration of the low-speed rotation in the actual processing of the workpiece 2, respectively. This suppresses a decrease in machining accuracy by suppressing a temperature change of the rotary shaft 3 to be small by temperature management based on actual machining of the workpiece 2, and also suppresses a decrease in work efficiency by shortening a standby time when shifting from the preliminary rotation operation to machining of the workpiece 2.
In the grindstone 5, 8, 9 of the present invention, the cross-sectional shape of the convex grinding portions 5b, 8b, 9b in a cross-section through the rotation shaft 6 of the grindstone 5, 8, 9 is a shape having a pair of arcuate portions 5e, 8e, 9e located at both ends in the thickness direction. When the arcuate portions 5e and 9e located at both ends in the thickness direction are connected by the same arcuate portion, the convex grinding portions 5b and 9b have a cross-sectional shape forming a single semicircle as a whole, as shown in fig. 1 to 3D, 9A to 9C, and 11A to 13. On the other hand, as shown in fig. 10A to 10B, the convex grinding portion 8B may have a cross-sectional shape in which arc portions 8e located at both ends in the thickness direction are connected by a straight portion 8 f. In either case, the arcuate portions 5e, 8e, 9e of one end portion and the arcuate portions 5e, 8e, 9e of the other end portion in the thickness direction of the grindstones 5, 8, 9 are preferably formed separately so that the average value of the respective radii of curvature becomes a desired size. Thus, compared with the case where the entire convex grinding portions 5b, 8b, 9b are machined to have the same radius of curvature, both the one end portion and the other end portion in the thickness direction can be formed with high accuracy and good performance. It is preferable that the radii of curvature of the arcuate portions 5e, 8e, and 9e at one end and the radii of curvature of the arcuate portions 5e, 8e, and 9e at the other end in the thickness direction are made to be somewhat small in error. For example, the difference between the maximum value and the minimum value of the radius of curvature of the arcuate portions 5e, 8e, 9e at one end in the thickness direction and the difference between the maximum value and the minimum value of the radius of curvature of the arcuate portions 5e, 8e, 9e at the other end are set to fall within the allowable range, that is, not more than a predetermined value (first predetermined value) set in advance. The difference between the average value of the radii of curvature of the arcuate portions 5e, 8e, 9e at one end in the thickness direction and the average value of the radii of curvature of the arcuate portions 5e, 8e, 9e at the other end is set to be within the allowable range, that is, equal to or less than a predetermined value (second predetermined value) set in advance.
[ additional note 1]
A workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape,
the workpiece processing device is characterized in that,
the workpiece processing apparatus includes a workpiece support mechanism for supporting the workpiece, a disc-shaped grindstone disposed parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone,
the work support mechanism rotates the work, the grindstone support mechanism rotates the grindstone, a rotation axis which becomes a center of rotation of the work by the work support mechanism and a rotation axis which becomes a center of rotation of the grindstone by the grindstone support mechanism are parallel to each other,
the grinding stone has a convex grinding part on the outer periphery, the cross section of the convex grinding part in the cross section passing through the rotating shaft of the grinding stone is convex towards the outer periphery side, and has the shape of an arc part at least at two ends of the thickness direction,
the grindstone and the workpiece can be relatively moved in a mutually approaching or separating manner by the grindstone supporting mechanism or the workpiece supporting mechanism,
the grindstone support means or the workpiece support means moves the grindstone relative to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
The convex grinding portions and a rectangular grinding portion having a linear cross section parallel to the thickness direction of the grindstone are arranged in the thickness direction on the outer peripheral portion of the grindstone, and the rectangular grinding portion having a cross section parallel to the thickness direction of the grindstone is a portion which abuts on the outer peripheral portion of the work piece and grinds the work piece so as to move from the outer side to the inner side in the radial direction of the work piece through the grindstone and thereby reduce the radius of the work piece,
the radius of curvature of the arcuate portion of the grindstone is at least 10 times or more the thickness of the workpiece, so that the arcuate portion of the grindstone is brought into contact with the workpiece substantially without causing a gap between the arcuate portion and the chamfer portion of the workpiece having the desired cross-sectional shape.
[ additionally noted 2]
The workpiece processing apparatus according to supplementary note 1, wherein,
the grindstone support mechanism and the workpiece support mechanism move the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward one face while rotating the workpiece and the grindstone, move the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the other face while rotating the workpiece and the grindstone at an outer Zhou Bushi on the other face side of the workpiece,
The grindstone support mechanism and the workpiece support mechanism rotate the workpiece and the grindstone and simultaneously curve-move the arc-shaped portion of the convex grinding portion of the grindstone from the outer peripheral end face of the workpiece toward the one face or the other face relative to the workpiece at a predetermined angle in accordance with the movement condition, and thereafter stop the relative movement of the grindstone relative to the workpiece,
the grindstone support mechanism and the workpiece support mechanism are configured to rotate the workpiece and the grindstone while precisely grinding the outer peripheral portion of the one or the other of the surfaces of the workpiece, and to move the arcuate portion of the convex grinding portion of the grindstone linearly relative to the workpiece after relatively curved from the outer peripheral end surface of the workpiece toward the one or the other of the surfaces at a predetermined angle in accordance with the movement condition.
[ additionally recorded 3]
The workpiece processing apparatus according to supplementary note 1 or 2, wherein,
the rectangular cross-section grinding portion is smaller in radial dimension than the convex grinding portion, and is provided so as to be in close contact with the convex grinding portion.
[ additional note 4]
The workpiece processing apparatus according to any one of supplementary notes 1 to 3, wherein,
in addition to the grindstone having the convex grinding portion, the workpiece processing apparatus further includes a disk-shaped grooved grindstone which is disposed obliquely with respect to a tangential direction of an outer periphery of the workpiece and used for grinding more precisely than grinding by the convex grinding portion of the grindstone, and a grooved grindstone support mechanism which supports the grooved grindstone,
the fluted stone support mechanism rotates the fluted stone.
[ additional note 5]
A workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape,
the workpiece processing device is characterized in that,
the workpiece processing apparatus includes a workpiece support mechanism for supporting the workpiece, a disc-shaped grindstone disposed parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone,
the work support mechanism rotates the work, the grindstone support mechanism rotates the grindstone, a rotation axis which becomes a center of rotation of the work by the work support mechanism and a rotation axis which becomes a center of rotation of the grindstone by the grindstone support mechanism are parallel to each other,
The grinding stone has a convex grinding part on the outer periphery, the cross section of the convex grinding part in the cross section passing through the rotating shaft of the grinding stone is convex towards the outer periphery side, and has the shape of an arc part at least at two ends of the thickness direction,
the grindstone and the workpiece can be relatively moved in a mutually approaching or separating manner by the grindstone supporting mechanism or the workpiece supporting mechanism,
the grindstone support means or the workpiece support means moves the grindstone relative to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
in addition to the grindstone having the convex grinding portion, the workpiece processing apparatus further includes a disk-shaped grooved grindstone which is disposed obliquely with respect to a tangential direction of an outer periphery of the workpiece and used for grinding more precisely than grinding by the convex grinding portion of the grindstone, and a grooved grindstone support mechanism which supports the grooved grindstone,
The fluted stone support mechanism rotates the fluted stone,
the workpiece processing apparatus further has a dressing grind stone capable of being mounted to the workpiece support mechanism in place of the workpiece,
the dressing stone is shaped by relative movement with respect to the stone using the stone support mechanism or the workpiece support mechanism in accordance with the movement condition,
the fluted grindstone forms or shapes the flutes by pressing against the dressing grindstone and transferring the profile of the dressing grindstone.
[ additional note 6]
The workpiece processing apparatus according to any one of supplementary notes 1 to 5, wherein,
the cross-sectional shape of the convex grinding portion in a cross-section through the rotation axis of the grindstone is a semicircular shape, or a shape having a pair of the arcuate portions located at both ends in a thickness direction and a straight portion located between the pair of the arcuate portions.
[ additionally noted 7]
The workpiece processing apparatus according to any one of supplementary notes 1 to 6, wherein,
the workpiece support mechanism has a temperature adjustment mechanism that generates a flow of liquid or gas for maintaining a temperature of the rotation shaft of the workpiece support mechanism constant.
[ additionally recorded 8]
A grindstone included in a workpiece processing apparatus having a workpiece support mechanism for supporting a disk-shaped workpiece, the grindstone being arranged in parallel with respect to the workpiece, and a grindstone support mechanism for supporting the grindstone, the workpiece support mechanism rotating the workpiece, the grindstone support mechanism rotating the grindstone, a rotation axis serving as a center of rotation of the workpiece by the workpiece support mechanism and a rotation axis serving as a center of rotation of the grindstone by the grindstone support mechanism being parallel to each other, the grindstone having a convex grinding portion in an outer peripheral portion thereof, a cross-sectional shape of the convex grinding portion in a cross-section passing through the rotation axis of the grindstone being convex toward an outer peripheral side, and having a shape of a circular arc portion at least at both ends in a thickness direction thereof, the grindstone and the workpiece being relatively movable by the grindstone support mechanism or the workpiece support mechanism in a manner approaching or separating each other, the grindstone support mechanism or the workpiece support mechanism being movable in a manner in accordance with the cross-sectional shape of the grindstone along the desired cross-sectional shape by moving the convex grinding portion and the grindstone in accordance with a curvature condition that the grinding portion is desired to be moved relative to the cross-sectional shape of the workpiece,
The grindstone is characterized in that,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a shape having a pair of the arcuate portions at both ends in a thickness direction and a straight line portion between the pair of the arcuate portions,
the straight line portion is a portion having a larger grindstone grain size than the arcuate portion, the arcuate portion is a portion used in grinding finer than grinding by the straight line portion,
the radius of curvature of the arcuate portion is at least 10 times or more the thickness of the workpiece such that the arcuate portion is in contact with the workpiece with substantially no gap between the arcuate portion and the chamfer of the workpiece having the desired cross-sectional shape.
[ additional note 9]
A grindstone, which is included in the workpiece processing apparatus according to any one of supplementary notes 1 to 3,
the grindstone is characterized in that,
the rectangular cross-sectional grinding portion is a portion having a larger grinding stone grain size than the convex grinding portion, and the convex grinding portion is a portion used in grinding that is finer than grinding by the rectangular cross-sectional grinding portion.
[ additional note 10]
A grindstone, which is included in the workpiece processing apparatus according to any one of supplementary notes 1 to 7,
the grindstone is characterized in that,
the arcuate portion of one end portion and the arcuate portion of the other end portion in the thickness direction are portions formed separately so that the average value of the respective radii of curvature becomes a desired size.
[ additional note 11]
A grindstone, which is included in the workpiece processing apparatus according to any one of supplementary notes 1 to 7,
the grindstone is characterized in that,
the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at the other end are equal to or less than a first predetermined value,
the difference between the average value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the average value of the radius of curvature of the arc-shaped portion at the other end is equal to or less than a second predetermined value.
[ additional note 12]
A grindstone, which is included in the workpiece processing apparatus according to any one of supplementary notes 1 to 7,
the grindstone is characterized in that,
the grindstone has a straight or tapered mounting hole extending in the thickness direction.
[ additional note 13]
A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
the workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
the step of relatively moving the grindstone with respect to the workpiece includes:
the method includes rotating the workpiece and the grindstone, and simultaneously, curvilinearly moving the arcuate portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle from an outer peripheral end face of the workpiece toward one face in accordance with the movement condition, thereby grinding an outer peripheral portion of the one face side of the workpiece;
Relatively moving the grindstone along the outer peripheral end face of the workpiece from the one face side to the other face side with respect to the workpiece; and
the arc-shaped portion of the convex grinding portion of the grindstone is curved relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the other face while rotating the workpiece and the grindstone, thereby grinding the outer peripheral portion of the other face side of the workpiece,
when rough grinding is performed on the outer peripheral portion of the one surface side or the other surface side of the workpiece, the arcuate portion of the convex grinding portion of the grindstone is curved relative to the workpiece from the outer peripheral end surface of the workpiece toward the one surface or the other surface at a predetermined angle in accordance with the movement condition while rotating the workpiece and the grindstone, and then the relative movement of the grindstone relative to the workpiece is stopped,
when precisely grinding the outer peripheral portion of the one or the other surface of the workpiece, the arcuate portion of the convex grinding portion of the grindstone is curved relative to the workpiece from the outer peripheral end face of the workpiece toward the one or the other surface at a predetermined angle in accordance with the movement condition while rotating the workpiece and the grindstone, and then the grindstone is linearly moved relative to the workpiece.
[ additional note 14]
A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
the workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
the workpiece processing method includes adjusting a temperature of the rotation axis of the workpiece using a flow of a liquid or a gas,
before machining the workpiece, performing a preliminary rotation operation of rotating the rotation shaft, which is a rotation center at the time of rotation of the workpiece, in a state where the workpiece is not mounted,
In the preliminary rotation operation, the high-speed rotation at the same speed as the high-speed rotation of the workpiece during the machining by the grindstone and the low-speed rotation at the same speed as the low-speed rotation of the workpiece during the machining by the grindstone are alternately repeated,
the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation in the preliminary rotation action and the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation of the workpiece in the machining by the grindstone are made to coincide,
the duration of the high-speed rotation and the duration of the low-speed rotation in the preliminary rotation action are made shorter than the duration of the high-speed rotation and the duration of the low-speed rotation of the workpiece in the machining by the grindstone, respectively.
[ additional note 15]
The workpiece processing method according to supplementary note 13 or 14, wherein,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a semicircular shape.
[ additional note 16]
The workpiece processing method according to supplementary note 13 or 14, wherein,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a shape having a pair of arcuate portions at both ends in a thickness direction and a straight line portion between the pair of arcuate portions,
And a processing unit configured to perform processing for reducing a diameter of the workpiece by bringing the linear portion into contact with at least an outer peripheral end surface of the workpiece using the linear portion, and processing for forming the workpiece into the desired cross-sectional shape by bringing the arcuate portion into contact with at least one surface and the other surface of the workpiece using the arcuate portion.
[ additional note 17]
The workpiece processing method according to supplementary note 13 or 14, wherein,
the convex grinding portions and the rectangular grinding portions having a linear cross section parallel to the thickness direction of the grindstone are arranged in the thickness direction on the outer peripheral portion of the grindstone, and the surface facing the workpiece is a rectangular cross section along the rotation axis,
at least the processing is performed by using the rectangular cross-sectional grinding section, in which the grinding stone moves from the outer side to the inner side in the radial direction of the workpiece while the rectangular cross-sectional grinding section is brought into contact with the outer peripheral end surface of the workpiece, and the diameter of the workpiece is reduced.
[ additional note 18]
The workpiece processing method according to supplementary note 16 or 17, wherein,
in the machining for forming the workpiece into the desired cross-sectional shape, grinding is performed more precisely than grinding in the machining for reducing the diameter of the workpiece.
[ additional note 19]
The workpiece processing method according to any one of supplementary notes 13 to 17, wherein,
in addition to the grindstone, a disk-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the work is provided,
after the convex grinding portion of the grindstone is brought into contact with the workpiece to grind the workpiece, the inner peripheral surface of the groove of the grooved grindstone is brought into contact with the workpiece to grind the workpiece more precisely than the convex grinding portion.
[ additionally noted 20]
A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
The workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
in addition to the grindstone, a disk-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the work is provided,
after grinding the workpiece by bringing the convex grinding portion of the grindstone into contact with the workpiece, grinding the workpiece with precision higher than that by the convex grinding portion by bringing the inner peripheral surface of the groove of the grooved grindstone into contact with the workpiece,
the workpiece processing method includes, before the step of arranging the workpiece and the disc-shaped grindstone in parallel with each other, a step of arranging a disc-shaped dressing grindstone in parallel with the grindstone, a step of relatively moving the grindstone with respect to the dressing grindstone while rotating the grindstone about a rotation axis parallel with the rotation axis of the grindstone to form an outer shape of the dressing grindstone, and a step of pressing a material of the grooved grindstone against the dressing grindstone and transferring the outer shape of the dressing grindstone to form or shape the groove,
In the step of transferring the outer shape of the finishing grindstone to form or shape the groove, the groove is formed in a shape preset for forming the workpiece abutting against the inner peripheral surface of the groove into the desired cross-sectional shape,
in the step of forming the outer shape of the dressing grind stone, a movement condition under which a contact portion of the convex grinding portion of the grind stone, which is in contact with the dressing grind stone, moves along a shape corresponding to the predetermined shape of the groove is calculated in advance based on a radius of curvature of the arc-shaped portion of the grind stone, and in the step of forming the outer shape of the dressing grind stone, the dressing grind stone is moved relative to the grind stone in accordance with the movement condition.
Description of the reference numerals
1. Workpiece processing device
2. Workpiece
2a chamfer portion
3. 6, 14 rotation axis
4. Workpiece supporting mechanism
4a X direction moving table
4b Y direction moving table
4c Z direction moving table
4d motor
5. 8, 9 grindstone
5a, 8a, 9a base circular plate part
5b, 8b, 9b convex grinding portions
5c, 8c, 9c mounting holes
5d, 8d, 9d recesses
5e, 8e, 9e arc-shaped portions
7. Grindstone supporting mechanism
8f straight line portion
9f section rectangular grinding part
11. Dressing grinding stone (dressing piece)
12. Groove grinding stone
12a groove
13. Grooved grindstone supporting mechanism
15. Temperature adjusting mechanism
16. Grinding stone
16a are shaped grooves.

Claims (20)

1. A workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape,
the workpiece processing device is characterized in that,
the workpiece processing apparatus includes a workpiece support mechanism for supporting the workpiece, a disc-shaped grindstone disposed parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone,
the work support mechanism rotates the work, the grindstone support mechanism rotates the grindstone, a rotation axis which becomes a center of rotation of the work by the work support mechanism and a rotation axis which becomes a center of rotation of the grindstone by the grindstone support mechanism are parallel to each other,
the grinding stone has a convex grinding part on the outer periphery, the cross section of the convex grinding part in the cross section passing through the rotating shaft of the grinding stone is convex towards the outer periphery side, and has the shape of an arc part at least at two ends of the thickness direction,
the grindstone and the workpiece can be relatively moved in a mutually approaching or separating manner by the grindstone supporting mechanism or the workpiece supporting mechanism,
The grindstone support means or the workpiece support means moves the grindstone relative to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
the convex grinding portions and a rectangular grinding portion having a linear cross section parallel to the thickness direction of the grindstone are arranged in the thickness direction on the outer peripheral portion of the grindstone, and the rectangular grinding portion having a cross section parallel to the thickness direction of the grindstone is a portion which abuts on the outer peripheral portion of the work piece and grinds the work piece so as to move from the outer side to the inner side in the radial direction of the work piece through the grindstone and thereby reduce the radius of the work piece,
the radius of curvature of the arcuate portion of the grindstone is at least 10 times or more the thickness of the workpiece, so that the arcuate portion of the grindstone is brought into contact with the workpiece substantially without causing a gap between the arcuate portion and the chamfer portion of the workpiece having the desired cross-sectional shape.
2. The workpiece processing apparatus according to claim 1, wherein,
the grindstone support mechanism and the workpiece support mechanism move the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward one face while rotating the workpiece and the grindstone, move the arc-shaped portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the other face while rotating the workpiece and the grindstone at an outer Zhou Bushi on the other face side of the workpiece,
the grindstone support mechanism and the workpiece support mechanism rotate the workpiece and the grindstone and simultaneously curve-move the arc-shaped portion of the convex grinding portion of the grindstone from the outer peripheral end face of the workpiece toward the one face or the other face relative to the workpiece at a predetermined angle in accordance with the movement condition, and thereafter stop the relative movement of the grindstone relative to the workpiece,
The grindstone support mechanism and the workpiece support mechanism are configured to rotate the workpiece and the grindstone while precisely grinding the outer peripheral portion of the one or the other of the surfaces of the workpiece, and to move the arcuate portion of the convex grinding portion of the grindstone linearly relative to the workpiece after relatively curved from the outer peripheral end surface of the workpiece toward the one or the other of the surfaces at a predetermined angle in accordance with the movement condition.
3. The workpiece processing apparatus according to claim 1 or 2, wherein,
the rectangular cross-section grinding portion is smaller in radial dimension than the convex grinding portion, and is provided so as to be in close contact with the convex grinding portion.
4. The workpiece processing apparatus according to any one of claims 1 to 3, wherein,
in addition to the grindstone having the convex grinding portion, the workpiece processing apparatus further includes a disk-shaped grooved grindstone which is disposed obliquely with respect to a tangential direction of an outer periphery of the workpiece and used for grinding more precisely than grinding by the convex grinding portion of the grindstone, and a grooved grindstone support mechanism which supports the grooved grindstone,
The fluted stone support mechanism rotates the fluted stone.
5. A workpiece processing apparatus for forming a disk-shaped workpiece into a desired cross-sectional shape,
the workpiece processing device is characterized in that,
the workpiece processing apparatus includes a workpiece support mechanism for supporting the workpiece, a disc-shaped grindstone disposed parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone,
the work support mechanism rotates the work, the grindstone support mechanism rotates the grindstone, a rotation axis which becomes a center of rotation of the work by the work support mechanism and a rotation axis which becomes a center of rotation of the grindstone by the grindstone support mechanism are parallel to each other,
the grinding stone has a convex grinding part on the outer periphery, the cross section of the convex grinding part in the cross section passing through the rotating shaft of the grinding stone is convex towards the outer periphery side, and has the shape of an arc part at least at two ends of the thickness direction,
the grindstone and the workpiece can be relatively moved in a mutually approaching or separating manner by the grindstone supporting mechanism or the workpiece supporting mechanism,
The grindstone support means or the workpiece support means moves the grindstone relative to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
in addition to the grindstone having the convex grinding portion, the workpiece processing apparatus further includes a disk-shaped grooved grindstone which is disposed obliquely with respect to a tangential direction of an outer periphery of the workpiece and used for grinding more precisely than grinding by the convex grinding portion of the grindstone, and a grooved grindstone support mechanism which supports the grooved grindstone,
the fluted stone support mechanism rotates the fluted stone,
the workpiece processing apparatus further has a dressing grind stone capable of being mounted to the workpiece support mechanism in place of the workpiece,
the dressing stone is shaped by relative movement with respect to the stone using the stone support mechanism or the workpiece support mechanism in accordance with the movement condition,
the fluted grindstone forms or shapes the flutes by pressing against the dressing grindstone and transferring the profile of the dressing grindstone.
6. The workpiece processing apparatus according to any one of claims 1 to 5, wherein,
the cross-sectional shape of the convex grinding portion in a cross-section through the rotation axis of the grindstone is a semicircular shape, or a shape having a pair of the arcuate portions located at both ends in a thickness direction and a straight portion located between the pair of the arcuate portions.
7. The workpiece processing apparatus according to any one of claims 1 to 6, wherein,
the workpiece support mechanism has a temperature adjustment mechanism that generates a flow of liquid or gas for maintaining a temperature of the rotation shaft of the workpiece support mechanism constant.
8. A grindstone included in a workpiece processing apparatus having a workpiece support mechanism for supporting a disk-shaped workpiece, the grindstone being arranged in parallel with respect to the workpiece, and a grindstone support mechanism for supporting the grindstone, the workpiece support mechanism rotating the workpiece, the grindstone support mechanism rotating the grindstone, a rotation axis serving as a center of rotation of the workpiece by the workpiece support mechanism and a rotation axis serving as a center of rotation of the grindstone by the grindstone support mechanism being parallel to each other, the grindstone having a convex grinding portion in an outer peripheral portion thereof, a cross-sectional shape of the convex grinding portion in a cross-section passing through the rotation axis of the grindstone being convex toward an outer peripheral side, and having a shape of a circular arc portion at least at both ends in a thickness direction thereof, the grindstone and the workpiece being relatively movable by the grindstone support mechanism or the workpiece support mechanism in a manner approaching or separating each other, the grindstone support mechanism or the workpiece support mechanism being movable in a manner in accordance with the cross-sectional shape of the grindstone along the desired cross-sectional shape by moving the convex grinding portion and the grindstone in accordance with a curvature condition that the grinding portion is desired to be moved relative to the cross-sectional shape of the workpiece,
The grindstone is characterized in that,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a shape having a pair of the arcuate portions at both ends in a thickness direction and a straight line portion between the pair of the arcuate portions,
the straight line portion is a portion having a larger grindstone grain size than the arcuate portion, the arcuate portion is a portion used in grinding finer than grinding by the straight line portion,
the radius of curvature of the arcuate portion is at least 10 times or more the thickness of the workpiece such that the arcuate portion is in contact with the workpiece with substantially no gap between the arcuate portion and the chamfer of the workpiece having the desired cross-sectional shape.
9. A grindstone, which is contained in the workpiece processing device according to any one of claims 1 to 3,
the grindstone is characterized in that,
the rectangular cross-sectional grinding portion is a portion having a larger grinding stone grain size than the convex grinding portion, and the convex grinding portion is a portion used in grinding that is finer than grinding by the rectangular cross-sectional grinding portion.
10. A grindstone, which is included in the workpiece processing apparatus according to any one of claims 1 to 7,
The grindstone is characterized in that,
the arcuate portion of one end portion and the arcuate portion of the other end portion in the thickness direction are portions formed separately so that the average value of the respective radii of curvature becomes a desired size.
11. A grindstone, which is included in the workpiece processing apparatus according to any one of claims 1 to 7,
the grindstone is characterized in that,
the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at the other end are equal to or less than a first predetermined value,
the difference between the average value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the average value of the radius of curvature of the arc-shaped portion at the other end is equal to or less than a second predetermined value.
12. A grindstone, which is included in the workpiece processing apparatus according to any one of claims 1 to 7,
the grindstone is characterized in that,
the grindstone has a straight or tapered mounting hole extending in the thickness direction.
13. A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
The workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
the step of relatively moving the grindstone with respect to the workpiece includes:
the method includes rotating the workpiece and the grindstone, and simultaneously, curvilinearly moving the arcuate portion of the convex grinding portion of the grindstone relative to the workpiece at a predetermined angle from an outer peripheral end face of the workpiece toward one face in accordance with the movement condition, thereby grinding an outer peripheral portion of the one face side of the workpiece;
relatively moving the grindstone along the outer peripheral end face of the workpiece from the one face side to the other face side with respect to the workpiece; and
The arc-shaped portion of the convex grinding portion of the grindstone is curved relative to the workpiece at a predetermined angle in accordance with the movement condition from the outer peripheral end face of the workpiece toward the other face while rotating the workpiece and the grindstone, thereby grinding the outer peripheral portion of the other face side of the workpiece,
when rough grinding is performed on the outer peripheral portion of the one surface side or the other surface side of the workpiece, the arcuate portion of the convex grinding portion of the grindstone is curved relative to the workpiece from the outer peripheral end surface of the workpiece toward the one surface or the other surface at a predetermined angle in accordance with the movement condition while rotating the workpiece and the grindstone, and then the relative movement of the grindstone relative to the workpiece is stopped,
when precisely grinding the outer peripheral portion of the one or the other surface of the workpiece, the arcuate portion of the convex grinding portion of the grindstone is curved relative to the workpiece from the outer peripheral end face of the workpiece toward the one or the other surface at a predetermined angle in accordance with the movement condition while rotating the workpiece and the grindstone, and then the grindstone is linearly moved relative to the workpiece.
14. A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
the workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
the workpiece processing method includes adjusting a temperature of the rotation axis of the workpiece using a flow of a liquid or a gas,
before machining the workpiece, performing a preliminary rotation operation of rotating the rotation shaft, which is a rotation center at the time of rotation of the workpiece, in a state where the workpiece is not mounted,
In the preliminary rotation operation, the high-speed rotation at the same speed as the high-speed rotation of the workpiece during the machining by the grindstone and the low-speed rotation at the same speed as the low-speed rotation of the workpiece during the machining by the grindstone are alternately repeated,
the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation in the preliminary rotation action and the ratio of the duration of the high-speed rotation to the duration of the low-speed rotation of the workpiece in the machining by the grindstone are made to coincide,
the duration of the high-speed rotation and the duration of the low-speed rotation in the preliminary rotation action are made shorter than the duration of the high-speed rotation and the duration of the low-speed rotation of the workpiece in the machining by the grindstone, respectively.
15. The method for processing a workpiece according to claim 13 or 14, wherein,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a semicircular shape.
16. The method for processing a workpiece according to claim 13 or 14, wherein,
the cross-sectional shape of the convex grinding section in a cross-section through the rotation axis of the grindstone is a shape having a pair of arcuate portions at both ends in a thickness direction and a straight line portion between the pair of arcuate portions,
And a processing unit configured to perform processing for reducing a diameter of the workpiece by bringing the linear portion into contact with at least an outer peripheral end surface of the workpiece using the linear portion, and processing for forming the workpiece into the desired cross-sectional shape by bringing the arcuate portion into contact with at least one surface and the other surface of the workpiece using the arcuate portion.
17. The method for processing a workpiece according to claim 13 or 14, wherein,
the convex grinding portions and the rectangular grinding portions having a linear cross section parallel to the thickness direction of the grindstone are arranged in the thickness direction on the outer peripheral portion of the grindstone, and the surface facing the workpiece is a rectangular cross section along the rotation axis,
at least the processing of reducing the diameter of the workpiece by bringing the rectangular cross-sectional grinding section into contact with the outer peripheral end surface of the workpiece and moving the grindstone from the radially outer side to the inner side of the workpiece is performed using the rectangular cross-sectional grinding section, and the processing of forming the workpiece into the desired cross-sectional shape by bringing the convex grinding section into contact with one surface and the other surface of the workpiece, respectively, is performed using the convex grinding section.
18. The method for processing a workpiece according to claim 16 or 17, wherein,
in the machining for forming the workpiece into the desired cross-sectional shape, grinding is performed more precisely than grinding in the machining for reducing the diameter of the workpiece.
19. The method for machining a workpiece according to any one of claims 13 to 17, wherein,
in addition to the grindstone, a disk-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the work is provided,
after the convex grinding portion of the grindstone is brought into contact with the workpiece to grind the workpiece, the inner peripheral surface of the groove of the grooved grindstone is brought into contact with the workpiece to grind the workpiece more precisely than the convex grinding portion.
20. A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone which has a convex grinding section in a peripheral portion and is rotatable and disk-shaped, the cross-sectional shape of the convex grinding section in a cross section passing through a rotation axis of the grindstone being convex toward the peripheral side and having a shape of an arc-shaped section at least at both ends in a thickness direction,
The workpiece processing method is characterized by comprising the following steps:
a step of arranging the workpiece and the grindstone parallel to each other; and
a step of rotating the grindstone and rotating the workpiece about a rotation axis parallel to the rotation axis of the grindstone, and relatively moving the grindstone with respect to the workpiece in accordance with a movement condition calculated based on a radius of curvature of the arcuate portion of the grindstone so that a contact portion of the convex grinding portion with the workpiece moves along the desired cross-sectional shape of the workpiece,
in addition to the grindstone, a disk-shaped grooved grindstone disposed obliquely to a tangential direction of an outer periphery of the work is provided,
after grinding the workpiece by bringing the convex grinding portion of the grindstone into contact with the workpiece, grinding the workpiece with precision higher than that by the convex grinding portion by bringing the inner peripheral surface of the groove of the grooved grindstone into contact with the workpiece,
the workpiece processing method includes, before the step of arranging the workpiece and the disc-shaped grindstone in parallel with each other, a step of arranging a disc-shaped dressing grindstone in parallel with the grindstone, a step of relatively moving the grindstone with respect to the dressing grindstone while rotating the grindstone about a rotation axis parallel with the rotation axis of the grindstone to form an outer shape of the dressing grindstone, and a step of pressing a material of the grooved grindstone against the dressing grindstone and transferring the outer shape of the dressing grindstone to form or shape the groove,
In the step of transferring the outer shape of the finishing grindstone to form or shape the groove, the groove is formed in a shape preset for forming the workpiece abutting against the inner peripheral surface of the groove into the desired cross-sectional shape,
in the step of forming the outer shape of the dressing grind stone, a movement condition under which a contact portion of the convex grinding portion of the grind stone, which is in contact with the dressing grind stone, moves along a shape corresponding to the predetermined shape of the groove is calculated in advance based on a radius of curvature of the arc-shaped portion of the grind stone, and in the step of forming the outer shape of the dressing grind stone, the dressing grind stone is moved relative to the grind stone in accordance with the movement condition.
CN202280043686.5A 2021-06-24 2022-05-13 Workpiece processing device, grinding stone and workpiece processing method Pending CN117500636A (en)

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Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2876572B2 (en) 1991-11-28 1999-03-31 株式会社東京精密 Semiconductor wafer chamfering method
JPH11207585A (en) 1998-01-27 1999-08-03 Mitsubishi Materials Silicon Corp Wafer chamfering method
JP3197253B2 (en) * 1998-04-13 2001-08-13 株式会社日平トヤマ Wafer chamfering method
JP3459058B2 (en) 1998-05-18 2003-10-20 株式会社東京精密 Wafer chamfering method
JP3334609B2 (en) * 1998-05-29 2002-10-15 信越半導体株式会社 Processing method and processing machine for thin plate edge
JPH11347953A (en) * 1998-06-10 1999-12-21 Tokyo Seimitsu Co Ltd Wafer chamfering grinding wheel
JP3906603B2 (en) 1999-05-12 2007-04-18 株式会社東京精密 Wafer chamfering method and apparatus
GB0002251D0 (en) * 2000-02-02 2000-03-22 Unova Uk Ltd Improvements in and relating to grinding machines
JP3434801B2 (en) * 2001-02-07 2003-08-11 株式会社ノリタケスーパーアブレーシブ Method for manufacturing beveling wheel for processing peripheral portion of silicon wafer
JP2003025198A (en) 2001-07-10 2003-01-29 Sharp Corp Chamfering device and chamfered board
JP4441823B2 (en) 2003-11-26 2010-03-31 株式会社東京精密 Truing method and chamfering device for chamfering grindstone
JP2006021279A (en) 2004-07-08 2006-01-26 Olympus Corp Grinding apparatus of optical raw material
JP2007044817A (en) 2005-08-10 2007-02-22 Tokyo Seimitsu Co Ltd Apparatus for chamfering wafer, grinding wheel therefor and truing grinding wheel
JP4742845B2 (en) 2005-12-15 2011-08-10 信越半導体株式会社 Method for processing chamfered portion of semiconductor wafer and method for correcting groove shape of grindstone
JP2008034776A (en) 2006-07-31 2008-02-14 M Tec Kk Treatment method of work edge and treatment device
KR20090063804A (en) 2007-12-14 2009-06-18 주식회사 실트론 Grinding wheel truing tool and manufacturing method thereof, truing apparatus, manufacturing method of grinding wheel, and wafer edge grinding apparatus using the same
JP5988765B2 (en) 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 Wafer chamfering method, wafer chamfering apparatus, and jig for angle adjustment
JP5954251B2 (en) 2013-05-02 2016-07-20 信越半導体株式会社 Wafer chamfering apparatus and wafer chamfering method
KR20160041908A (en) * 2013-08-09 2016-04-18 가부시키가이샤 후지미인코퍼레이티드 Polishing tool and processing method for member
JP6345988B2 (en) 2014-05-28 2018-06-20 株式会社Screenホールディングス Substrate processing equipment
JP6725831B2 (en) 2016-03-04 2020-07-22 ダイトロン株式会社 Work processing device
TWM527441U (en) * 2016-05-04 2016-08-21 Kinik Co Composite abrasive tool
JP7046668B2 (en) 2018-03-23 2022-04-04 株式会社東京精密 Wafer chamfering device and wafer chamfering method
JP7158702B2 (en) 2018-05-14 2022-10-24 中村留精密工業株式会社 chamfering grinder
CN209157942U (en) * 2018-12-29 2019-07-26 青岛新韩金刚石工业有限公司 A kind of processing ultra-thin glass edging wheel
JP2020171970A (en) 2019-04-08 2020-10-22 中村留精密工業株式会社 Method for chamfering and grinding disk-like substrate
JP2020171971A (en) 2019-04-08 2020-10-22 中村留精密工業株式会社 Grinding device
JP7288373B2 (en) * 2019-09-09 2023-06-07 キオクシア株式会社 Grinding device, grinding wheel, and grinding method

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