CN117480876A - 元件安装机及校正处理的控制方法 - Google Patents
元件安装机及校正处理的控制方法 Download PDFInfo
- Publication number
- CN117480876A CN117480876A CN202180099343.6A CN202180099343A CN117480876A CN 117480876 A CN117480876 A CN 117480876A CN 202180099343 A CN202180099343 A CN 202180099343A CN 117480876 A CN117480876 A CN 117480876A
- Authority
- CN
- China
- Prior art keywords
- mounting head
- component
- specific
- mounting
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012937 correction Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 80
- 230000008569 process Effects 0.000 title claims abstract description 65
- 238000012545 processing Methods 0.000 claims abstract description 46
- 238000004886 process control Methods 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 28
- 238000003384 imaging method Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/023662 WO2022269771A1 (ja) | 2021-06-22 | 2021-06-22 | 部品実装機及び校正処理の制御方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN117480876A true CN117480876A (zh) | 2024-01-30 |
Family
ID=84545347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180099343.6A Pending CN117480876A (zh) | 2021-06-22 | 2021-06-22 | 元件安装机及校正处理的控制方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022269771A1 (ja) |
CN (1) | CN117480876A (ja) |
DE (1) | DE112021007861T5 (ja) |
WO (1) | WO2022269771A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4322092B2 (ja) | 2002-11-13 | 2009-08-26 | 富士機械製造株式会社 | 電子部品実装装置における校正方法および装置 |
EP1701231A1 (en) * | 2005-03-08 | 2006-09-13 | Mydata Automation AB | Method of calibration |
JP4824641B2 (ja) * | 2007-07-06 | 2011-11-30 | ヤマハ発動機株式会社 | 部品移載装置 |
EP3054756B1 (en) * | 2013-10-01 | 2019-11-20 | FUJI Corporation | Component mounting device and component mounting method |
JP6553709B2 (ja) * | 2015-03-19 | 2019-07-31 | 株式会社Fuji | 部品実装ライン、および部品実装ラインの段取り方法 |
JP6739152B2 (ja) * | 2015-08-07 | 2020-08-12 | 株式会社Fuji | 交換支援装置 |
WO2019111377A1 (ja) * | 2017-12-07 | 2019-06-13 | 株式会社Fuji | 基板生産ライン管理装置および基板生産ライン管理方法 |
-
2021
- 2021-06-22 CN CN202180099343.6A patent/CN117480876A/zh active Pending
- 2021-06-22 JP JP2023529290A patent/JPWO2022269771A1/ja active Pending
- 2021-06-22 WO PCT/JP2021/023662 patent/WO2022269771A1/ja active Application Filing
- 2021-06-22 DE DE112021007861.5T patent/DE112021007861T5/de active Pending
Also Published As
Publication number | Publication date |
---|---|
JPWO2022269771A1 (ja) | 2022-12-29 |
WO2022269771A1 (ja) | 2022-12-29 |
DE112021007861T5 (de) | 2024-04-11 |
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PB01 | Publication | ||
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