CN117476525B - Wafer box equipment of uncapping - Google Patents
Wafer box equipment of uncapping Download PDFInfo
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- CN117476525B CN117476525B CN202311814462.2A CN202311814462A CN117476525B CN 117476525 B CN117476525 B CN 117476525B CN 202311814462 A CN202311814462 A CN 202311814462A CN 117476525 B CN117476525 B CN 117476525B
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- 230000007246 mechanism Effects 0.000 claims abstract description 148
- 238000003825 pressing Methods 0.000 claims description 7
- 230000001960 triggered effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 83
- 230000003028 elevating effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a wafer box equipment of uncapping belongs to box body transportation and uncapping mechanism's technical field, specifically includes: the translation device and the grabbing device grab the wafer box and move to the position above the positioning device, the positioning device comprises a placing table, a positioning mechanism and a locking mechanism, the positioning mechanism and the locking mechanism are positioned on the placing table, the positioning mechanism is matched with the bottom of the wafer box to position the wafer box on the placing table, and the locking mechanism and the locking groove are clamped tightly to lock the wafer box on the placing table; the cover opening device comprises a cover opening mounting plate, a cover opening lifting mechanism, a deflector rod and a toggle driving mechanism, wherein the cover opening lifting mechanism is used for driving the cover opening mounting plate to lift; after the cover opening mounting plate is lifted, the top end of the deflector rod passes through the through groove and is positioned between the buckle and the box body, and the deflector rod is driven by the poking driving mechanism to apply acting force far away from the side wall of the box body to the buckle so as to separate the buckle from the second bulge. Through the processing scheme of this application, improve the efficiency of transferring the wafer box and opening the wafer box.
Description
Technical Field
The application relates to the field of box body transportation and uncapping mechanisms, in particular to wafer box uncapping equipment.
Background
The wafer box is used for protecting and transporting and temporarily storing wafers, can be stacked for convenient storage and is mainly used for placing thinned wafers. When wafers are transferred between manufacturing plants, the wafers need to be put into wafer boxes which are horizontally placed, and electrostatic paper and buffer cotton are also needed to be put into the wafer boxes. In addition, the wafers need to be taken out of the horizontally placed wafer box and put into the front-opening type shipment box/the full-transparent wafer box, so that the application of other procedures is facilitated. At present, the operation is mainly finished manually, but the manual operation efficiency is low, and the problems of wafer breakage and the like are easy to occur.
Disclosure of Invention
In view of this, the present application provides a wafer cassette uncapping apparatus, which solves the problems in the prior art, and improves the efficiency of transferring and opening the wafer cassette.
The wafer box uncapping equipment provided by the application adopts the following technical scheme:
the wafer box cover opening device comprises a box cover and an open box body, wherein a plurality of first bulges are arranged on the side wall of the box body, buckles extending to the opening of the box body are arranged on the first bulges, second bulges matched with the buckles are arranged on the box cover, through holes adjacent to the buckles are formed in the first bulges, the through holes are positioned on one side, facing the box body, of the buckles, and locking grooves are formed in the bottom surface of the box body; the wafer cassette uncapping apparatus includes:
the positioning device comprises a placing table, a positioning mechanism and a locking mechanism, wherein the positioning mechanism and the locking mechanism are positioned on the placing table, the placing table is used for placing the wafer box, a through groove corresponding to the through hole is formed in the placing table, the positioning mechanism is matched with the bottom of the wafer box to position the wafer box on the placing table, and the locking mechanism and the locking groove are clamped to lock the wafer box on the placing table;
the cover opening device comprises a cover opening mounting plate, a cover opening lifting mechanism, a plurality of deflector rods and a poking driving mechanism, wherein the cover opening mounting plate is positioned below the placing table, the poking driving mechanism is arranged on the cover opening mounting plate, the positions of the deflector rods correspond to the through grooves, and the cover opening lifting mechanism is used for driving the cover opening mounting plate to lift; after the cover opening mounting plate is lifted, the top end of the deflector rod passes through the through groove and is positioned between the buckle and the box body, and the poking driving mechanism drives the deflector rod to apply acting force far away from the side wall of the box body to the buckle so as to separate the buckle from the second bulge;
the device comprises a translation device and a grabbing device, wherein the grabbing device is arranged at the output end of the translation device, the translation device drives the grabbing device to move to the upper side of the placement table, the grabbing device comprises a fixed base, a grabbing lifting mechanism and a gripper mechanism, the grabbing lifting mechanism is arranged on the fixed base, the gripper mechanism is arranged at the output end of the grabbing lifting mechanism, and the gripper mechanism is used for applying or cancelling clamping acting force to the side wall of the wafer box.
Optionally, toggle actuating mechanism is including installing a plurality of first cylinders on uncapping the mounting panel, first cylinder and driving lever one-to-one, the flexible direction of first cylinder is on a parallel with the protrusion direction of buckling part on the corresponding buckle, the bottom of driving lever is equipped with the waist type hole that extends along driving lever length direction, the output of first cylinder is fixed with the connecting axle, the axis direction of connecting axle is on a parallel with uncapping the mounting panel and perpendicular to the flexible direction of first cylinder, the connecting axle with waist type hole rotates to be connected, the connecting axle can be followed the length direction in waist type hole slides, the preset position of driving lever with uncapping the mounting panel rotates to be connected, first cylinder flexible drive the driving lever is around preset position rotation, so that the top of driving lever is close to or keep away from the buckle.
Optionally, a bump is arranged on the side surface of the top of the deflector rod, which faces the buckle.
Optionally, the cover opening device further comprises a cover opening bottom plate, the cover opening bottom plate is connected with the placing table through guide posts, guide holes for the guide posts to pass through are formed in the cover opening mounting plate, and the cover opening lifting mechanism is fixed on the cover opening bottom plate.
Optionally, the toggle driving mechanism is located on the bottom surface of the cover opening mounting plate, and the cover opening mounting plate is provided with a design hole for the toggle rod to pass through and for the toggle rod to move.
Optionally, the tongs mechanism includes polygonal mainboard, swing arm, arm lock and second cylinder, the mainboard with snatch elevating system's output is connected, every side of mainboard is all rotated and is connected with the arm lock, the pivot of arm lock is on a parallel with the mainboard side at place, every the arm lock corresponds one arm lock and a second cylinder, the flexible direction of second cylinder perpendicular to corresponds the pivot of arm lock, the casing pivoted of second cylinder is installed on the mainboard, the telescopic link of second cylinder with the one end rotation of swing arm is connected, the other end of swing arm with arm lock fixed connection, the flexible pulling of second cylinder or promotion the arm lock is in order to make the arm lock rotates.
Optionally, be equipped with spring depression bar and overvoltage sensor on the mainboard, spring depression bar one end is located the mainboard below, the spring depression bar other end is located the mainboard top, overvoltage sensor installs the top surface at the mainboard, when the bottom of spring depression bar supports the pressure the top surface of wafer box, the spring depression bar is by the jack-up, the top of spring depression bar is exceeded when predetermineeing the height triggering overvoltage sensor.
Optionally, grabbing device still includes and is located the collet mechanism in the tongs mechanism outside, the both sides that the tongs mechanism is relative all are equipped with and hold in the palm collet mechanism, hold in the palm collet mechanism and include collet elevating system, rotary drive mechanism and layer board, it installs to hold in the palm collet elevating system on unable adjustment base, rotary drive mechanism installs on holding in the palm collet elevating system's output, the layer board is installed on rotary drive mechanism's output, rotary drive mechanism is used for the drive layer board part is rotatory to be located the mainboard below.
Optionally, be equipped with the locking arch on the opening one side edge of locking recess, the locking arch covers the partial opening of locking recess, locking mechanism includes third cylinder, connecting rod and gyro wheel, the third cylinder is installed place on the bottom surface of platform, place the bench and be equipped with the perforation that corresponds with the locking recess, the connecting rod passes the perforation, the middle part or the bottom of connecting rod with place the platform rotation and be connected, the top of connecting rod is located places the bench top and stretches into in the locking recess, the top of connecting rod is equipped with the locking lever that extends to the lateral wall of locking recess, gyro wheel pivoted installs the one end that keeps away from the connecting rod at the locking lever, the third cylinder drives the partial motion that the connecting rod is located place the bench below makes the top of connecting rod is close to locking arch and make the gyro wheel compresses tightly on locking bellied top surface.
In summary, the present application includes the following beneficial technical effects:
after the wafer box is placed on the placing table, the positioning mechanism is used for positioning the position of the wafer box on the placing table, so that the locking groove and the locking mechanism can be accurately matched, and the wafer box is locked on the placing table through the matching of the locking mechanism and the locking groove. After the position of the wafer box is locked, the through hole of the wafer box is aligned with the through groove on the placing table, at the moment, the cover opening mounting plate is driven to rise through the cover opening lifting mechanism, the top end of the deflector rod penetrates through the through groove and is positioned between the buckle and the box body, and the deflector rod is driven by the poking driving mechanism to apply acting force far away from the side wall of the box body to the buckle so as to separate the buckle from the second bulge. Thereby achieving the function of quick opening the cover and improving the cover opening efficiency of the wafer box.
According to the wafer box transfer device, the wafer box is placed on the placing table through movement after being grabbed from the working position of the previous working procedure in a mechanical mode through the translation device and the grabbing device, so that the automatic transfer, grabbing and placing of the wafer box are realized, and the efficiency of transferring the wafer box is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer cassette according to an embodiment of the present disclosure at a first view angle;
FIG. 2 is a schematic view of a wafer cassette according to a second embodiment of the present disclosure;
FIG. 3 is a schematic view of the overall structure of the positioning device and the uncapping device of the present application at a first view angle;
FIG. 4 is a schematic overall structure of a second view of the positioning device and the door opening device of the present application;
FIG. 5 is a schematic view of the structure of the uncovering device according to the present application at a first view angle;
fig. 6 is a schematic structural view of a second view of the door opening device;
FIG. 7 is a schematic view of the gripping device of the present application;
fig. 8 is a schematic structural view of the gripper mechanism of the present application.
Reference numerals illustrate: 1. a wafer cassette; 11. a case body; 111. a positioning groove; 112. positioning the lug; 12. a box cover; 13. a first protrusion; 14. a buckle; 15. a second protrusion; 16. a through hole; 17. a locking groove; 18. a locking protrusion; 21. a placement table; 211. a limiting block; 212. positioning columns; 213. positioning a sensor; 22. a locking mechanism; 221. a third cylinder; 222. a connecting rod; 223. a locking lever; 224. a roller; 225. perforating; 23. a through groove; 31. a cover opening mounting plate; 32. a cover opening lifting mechanism; 33. a deflector rod; 331. a bump; 332. designing a hole; 34. a toggle driving mechanism; 341. a first cylinder; 35. a cover opening bottom plate; 36. a guide post; 37. a guide hole; 4. a gripping device; 41. a fixed base; 42. grabbing a lifting mechanism; 43. a gripper mechanism; 431. a main board; 432. swing arms; 433. a clamp arm; 434. a second cylinder; 435. a spring compression bar; 436. an overpressure sensor; 44. a bottom supporting mechanism; 441. a connecting rod; 442. a bottom supporting lifting mechanism; 443. a rotary driving mechanism; 444. a supporting plate; 45. a distance sensor; 46. a sensor signal amplifier.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the illustrations, not according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
The embodiment of the application provides wafer box uncapping equipment.
As shown in fig. 1 and 2, the wafer box 1 includes a box cover 12 and an open box body 11, a plurality of first protrusions 13 are disposed on a side wall of the box body 11, a buckle 14 extending to the opening of the box body 11 is disposed on the first protrusions 13, a second protrusion 15 matched with the buckle 14 is disposed on the box cover 12, a through hole 16 adjacent to the buckle 14 is disposed on the first protrusions 13, the through hole 16 is located on one side of the buckle 14 facing the box body 11, a locking groove 17 is disposed on a bottom surface of the box body 11, a locking protrusion 18 is disposed on an edge of one side of the opening of the locking groove 17, the locking protrusion 18 covers a part of the opening of the locking groove 17, and a positioning groove 111 and a positioning lug 112 are disposed on the bottom surface of the wafer box 1.
As shown in fig. 3 and 4, the wafer cassette door opening apparatus includes:
the positioning device comprises a placing table 21, a positioning mechanism and a locking mechanism 22, wherein the positioning mechanism and the locking mechanism are positioned on the placing table 21, the placing table 21 is used for placing the wafer box 1, a through groove 23 corresponding to the through hole 16 is formed in the placing table 21, the positioning mechanism is matched with the bottom of the wafer box 1 to position the wafer box 1 on the placing table 21, and the locking mechanism 22 and the locking groove 17 are clamped tightly to lock the wafer box 1 on the placing table 21.
The cover opening device comprises a cover opening mounting plate 31, a cover opening lifting mechanism 32, a deflector rod 33 and a poking driving mechanism 34, wherein the cover opening mounting plate 31 is positioned below the placing table 21, the poking driving mechanism 34 is mounted on the cover opening mounting plate 31, the deflector rod 33 is mounted on the cover opening mounting plate 31, the position of the deflector rod 33 corresponds to the through groove 23, and the cover opening lifting mechanism 32 is used for driving the cover opening mounting plate 31 to lift; after the cover-opening mounting plate 31 is lifted, the top end of the deflector rod 33 passes through the through groove 23 and is located between the buckle 14 and the box body 11, and the deflector rod 33 is driven by the toggle driving mechanism 34 to apply an acting force to the buckle 14 far away from the side wall of the box body 11, so that the buckle 14 and the second protrusion 15 are separated. The cover opening and lifting mechanism 32 may be an air cylinder or an electric cylinder.
After the wafer box 1 is placed on the placing table 21, the position of the wafer box 1 on the placing table 21 is positioned through the positioning mechanism, so that the locking groove 17 can be accurately matched with the locking mechanism 22, and the wafer box 1 is locked on the placing table 21 through the matching of the locking mechanism 22 and the locking groove 17. After the position of the wafer box 1 is locked, the through hole 16 of the wafer box 1 is aligned with the through groove 23 on the placing table 21, at this time, the cover opening mounting plate 31 is driven to rise by the cover opening lifting mechanism 32, the top end of the deflector rod 33 passes through the through groove 23 and is located between the buckle 14 and the box body 11, and the deflector rod 33 is driven by the toggle driving mechanism 34 to apply an acting force to the buckle 14 far away from the side wall of the box body 11, so that the buckle 14 and the second protrusion 15 are separated. Thereby achieving the function of quick opening the cover and improving the cover opening efficiency of the wafer box 1.
In this embodiment, the positioning mechanism includes four groups of positioning blocks 211 mounted on the placement table 21, where the four groups of positioning blocks 211 respectively correspond to four corners of the wafer cassette 1, each group of positioning blocks 211 includes two positioning blocks 211, one group of two positioning blocks 211 contacts two sidewalls of one corner of the wafer cassette 1, and the four groups of positioning blocks 211 enclose a shape matching with the bottom sidewall of the wafer cassette 1. In other embodiments, the bottom of the wafer box 1 may be circular or other shapes, and if the bottom is circular, a plurality of limiting blocks 211 uniformly distributed along the circumference may be provided, the plurality of limiting blocks 211 enclose a shape matching with the side wall of the bottom of the wafer box 1, and the specific distribution of the limiting blocks 211 may be adapted according to the shape of the bottom of the wafer box 1. The positioning mechanism further comprises a positioning column 212 arranged on the placing table 21, the positioning column 212 is used for being matched with the positioning groove 111 on the bottom surface of the wafer box 1 in advance, preliminary guiding is carried out before the wafer box 1 is matched with the limiting block 211, in the embodiment of the application, three positioning grooves 111 are arranged at the bottom of the wafer box 1, the positioning grooves 111 are in a long strip shape, and one end of each positioning groove 111 points to the center of the wafer box 1. The positioning mechanism further comprises a plurality of positioning sensors 213, when the wafer box 1 is placed on the placement table 21, the positioning sensors 213 contact the positioning lugs 112, the positioning lugs 112 are pressed on the positioning sensors 213, after the wafer box 1 is normally placed, the positioning sensors 213 are pressed down, at this time, the top ends of the positioning sensors 213 are flush with the top surface of the placement table 21, the positioning sensors 213 detect downward pressure of the wafer box 1 at different positions so as to judge whether the wafer box 1 is placed horizontally, and the positioning sensors 213 are contactless positioning switches.
The locking mechanism 22 comprises a third air cylinder 221, a connecting rod 222 and a roller 224, wherein the third air cylinder 221 is installed on the bottom surface of the placing table 21, a through hole 225 corresponding to the locking groove 17 is formed in the placing table 21, the connecting rod 222 penetrates through the through hole 225, the middle part or the bottom end of the connecting rod 222 is rotatably connected with the placing table 21, the top end of the connecting rod 222 is located above the placing table 21 and extends into the locking groove 17, a locking rod 223 extending towards the side wall of the locking groove 17 is arranged at the top end of the connecting rod 222, and the roller 224 is rotatably installed at one end, far away from the connecting rod 222, of the locking rod 223. In this embodiment, the third cylinder 221 stretches out and draws back along the horizontal direction, the bottom of connecting rod 222 passes through mount pad pivoted and installs on placing the platform 21, the middle part of connecting rod 222 is through being equipped with along connecting rod 441 length direction's waist type slide opening, the tip of the telescopic link of third cylinder 221 is through rotating round bar connection waist type slide opening, rotate round bar and can slide in waist type slide opening, locking lever 223 and third cylinder 221 are located the both sides that connecting rod 222 is relative, and locking lever 223 perpendicular to connecting rod 222, third cylinder 221 stretches out and drives locking lever 223 and keep away from locking arch 18, at this moment, connecting rod 222 is inclined relatively placing the platform 21, the telescopic link shrink of third cylinder 221, drive connecting rod 222 rotate to with place the platform 21 perpendicularly after, locking lever 223 is close to locking arch 18, until gyro wheel 224 compresses tightly on the top surface of locking arch 18, realize the locking to wafer box 1.
As shown in fig. 5 and 6, the toggle driving mechanism 34 includes a plurality of first cylinders 341 mounted on the lid opening mounting plate 31, the first cylinders 341 and the deflector rods 33 are in one-to-one correspondence, the telescopic directions of the first cylinders 341 are parallel to the corresponding protruding directions of the fastening parts on the buckles 14, the bottom ends of the deflector rods 33 are provided with waist-shaped holes extending along the length direction of the deflector rods 33, the output ends of the first cylinders 341 are fixed with connecting shafts, the axial directions of the connecting shafts are parallel to the lid opening mounting plate 31 and perpendicular to the telescopic directions of the first cylinders 341, the connecting shafts are rotationally connected with the waist-shaped holes, the connecting shafts can slide along the length direction of the waist-shaped holes, the connecting shafts can rotate and slide relative to the waist-shaped holes, the preset positions of the deflector rods 33 are rotationally connected with the lid opening mounting plate 31, the first cylinders 341 are telescopically driven to rotate around the preset positions so that the top ends of the deflector rods 33 are close to or far away from the buckles 14, and the second acting force on the buckles 33 can be separated from the second protrusions 15 through the buckles 14. In this embodiment, the distance from the preset position to the waist-shaped hole is smaller than the distance from the preset position to the top end of the shift lever 33, and the preset position is closer to the bottom end of the shift lever 33.
The toggle driving mechanism 34 is located at the bottom surface of the cover mounting plate 31, and the cover mounting plate 31 is provided with a design hole 332 for the toggle lever 33 to pass through and for the toggle lever 33 to move. The toggle driving mechanism 34 is located on the bottom surface of the cover mounting plate 31, so that the cover mounting plate 31 is closer to the placement table 21, and the design length of the toggle lever 33 is reduced.
The side of driving lever 33 top towards buckle 14 is last to be equipped with lug 331, and the setting of lug 331 can make the top of driving lever 33 earlier contact buckle 14, reduces the swing stroke of driving lever 33, reduces the stroke of first cylinder 341, can use less cylinder, reduces equipment volume. Meanwhile, the swinging stroke of the deflector rod 33 can be satisfied through the smaller design hole 332, and the size of the design hole 332 is reduced.
The cover opening device further comprises a cover opening bottom plate 35, the cover opening bottom plate 35 is connected with the placing table 21 through guide posts 36, guide holes 37 for the guide posts 36 to pass through are formed in the cover opening mounting plate 31, the cover opening lifting mechanism 32 is fixed on the cover opening bottom plate 35, and the cover opening mounting plate 31 is connected with the output end of the cover opening lifting mechanism 32.
As shown in fig. 7 and 8, the wafer box uncapping apparatus further includes a translation device and a gripping device 4, the translation device is not shown in the drawing, the translation device may be an air cylinder or an electric cylinder, the gripping device 4 is installed on an output end of the translation device, the translation device drives the gripping device 4 to move in a horizontal direction, the translation device drives the gripping device 4 to move between a working position of a previous process and the placement table 21, the gripping device 4 includes a fixed base 41, a gripping lifting mechanism 42 and a gripper mechanism 43, the gripping lifting mechanism 42 is installed on the fixed base 41, the gripper mechanism 43 is installed on an output end of the gripping lifting mechanism 42, and the gripper mechanism 43 is used for applying or canceling a gripping force to a side wall of the wafer box 1. The utility model discloses a through translation device and grabbing device 4 realization snatch and place wafer box 1 on placing the platform 21 with the mode of machinery, improve the efficiency of transferring wafer box 1. The grabbing lifting mechanism 42 may be a vertically arranged electric cylinder.
Specifically, the gripper mechanism 43 includes a polygonal main board 431, a swing arm 432, a clamping arm 433 and a second air cylinder 434, where the main board 431 is connected to an output end of the grabbing lifting mechanism 42, each side edge of the main board 431 is rotatably connected to the clamping arm 433, and a rotation axis of the clamping arm 433 is parallel to a side edge of the main board 431 where the clamping arm 433 is located, in this embodiment, the main board 431 is rectangular and has four side edges for installing the clamping arm 433; each arm lock 433 corresponds one arm lock 432 and a second cylinder 434, the direction of extension and contraction of second cylinder 434 is perpendicular to the pivot of corresponding arm lock 433, the casing pivoted of second cylinder 434 is installed on mainboard 431, the telescopic link of second cylinder 434 with the one end rotation of arm lock 432 is connected, the other end of arm lock 432 with arm lock 433 fixed connection, the flexible pulling of second cylinder 434 or promote arm lock 432 is so that arm lock 433 rotates, in this embodiment, when the telescopic link of second cylinder 434 stretches out, a plurality of arm locks 433 are close to each other and snatch wafer box 1, and when the telescopic link of second cylinder 434 contracts, a plurality of arm locks 433 keep away from each other and loosen the centre gripping to wafer box 1.
The main board 431 is provided with a distance sensor 45 and a sensor signal amplifier 46, the distance sensor 45 is used for detecting the movement displacement of the gripper mechanism 43 and controlling the starting and stopping of the gripping elevating mechanism 42, and the sensor signal amplifier 46 is used for amplifying the signal of the distance sensor 45.
Be equipped with spring depression bar 435 and overvoltage sensor 436 on the mainboard 431, spring depression bar 435 one end is located the mainboard 431 below, the spring depression bar 435 other end is located the mainboard 431 top, overvoltage sensor 436 installs the top surface at the mainboard 431, when the bottom of spring depression bar 435 supports the pressure when the top surface of wafer box 1, spring depression bar 435 is jacked, the top of spring depression bar 435 is surpassed when predetermineeing the height and triggers overvoltage sensor 436, in this embodiment, overvoltage sensor 436 is photoelectric sensor, and the top of spring depression bar 435 is equipped with the separation blade between the transmitting end and the receiving end that correspond photoelectric sensor. When the placing table 21 is provided with foreign matters or the wafer box 1 is not aligned with the positioning mechanism, but the gripper mechanism 43 is not lowered in place yet and can continue to descend, the wafer box 1 is jacked up too high, the top end of the spring pressing rod 435 exceeds the preset height, the baffle is located between the transmitting end and the receiving end of the photoelectric sensor, the receiving end of the photoelectric sensor cannot receive signals of the transmitting end, and the output signals of the receiving end are changed, so that the overvoltage of the wafer box 1 is detected.
The gripping device 4 further comprises a bottom supporting mechanism 44 positioned at the outer side of the gripper mechanism 43, the bottom supporting mechanisms 44 are arranged at two opposite sides of the gripper mechanism 43, the bottom supporting mechanism 44 comprises a bottom supporting lifting mechanism 442, a rotary driving mechanism 443 and a supporting plate 444, the bottom supporting lifting mechanism 442 is installed on the fixed base 41, the rotary driving mechanism 443 is installed at the output end of the bottom supporting lifting mechanism 442, the supporting plate 444 is installed at the output end of the rotary driving mechanism 443, the rotary driving mechanism 443 is used for driving the supporting plate 444 to rotate partially to be positioned below the main plate 431, when the gripper mechanism 43 grips the wafer box 1, the supporting plate 444 is positioned below the wafer box 1, the supporting plate 444 keeps a gap with the wafer box 1, the specific gap can be 2-3cm, and when the gripper mechanism 43 loses the clamping force under abnormal conditions, the dropped wafer box 1 can be supported again by the supporting plate 444, and the effect of preventing the wafer box 1 from falling is achieved. When it is necessary to place the wafer cassette 1 on the placement stage 21, the rotation driving mechanism 443 drives the pallet 444 to rotate to the outside of the wafer cassette 1. The supporting base lifting mechanism 442 may be an air cylinder or an electric cylinder, and the rotation driving mechanism 443 is a motor.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. The wafer box cover opening device comprises a box cover (12) and an open box body (11), wherein a plurality of first bulges (13) are arranged on the side wall of the box body (11), buckles (14) extending to the opening of the box body (11) are arranged on the first bulges (13), second bulges (15) matched with the buckles (14) are arranged on the box cover (12), through holes (16) adjacent to the buckles (14) are formed in the first bulges (13), the through holes (16) are positioned on one side, facing the box body (11), of the buckles (14), and locking grooves (17) are formed in the bottom surface of the box body (11); the wafer box uncapping device is characterized by comprising: the positioning device comprises a placing table (21), a positioning mechanism and a locking mechanism (22), wherein the positioning mechanism and the locking mechanism are arranged on the placing table (21), the placing table (21) is used for placing the wafer box (1), a through groove (23) corresponding to the through hole (16) is formed in the placing table (21), the positioning mechanism is matched with the bottom of the wafer box (1) to position the wafer box (1) on the placing table (21), and the locking mechanism (22) and the locking groove (17) are clamped tightly to lock the wafer box (1) on the placing table (21);
the cover opening device comprises a cover opening mounting plate (31), a cover opening lifting mechanism (32), a plurality of deflector rods (33) and a poking driving mechanism (34), wherein the cover opening mounting plate (31) is positioned below the placing table (21), the poking driving mechanism (34) is mounted on the cover opening mounting plate (31), the deflector rods (33) correspond to the through grooves (23) in position, and the cover opening lifting mechanism (32) is used for driving the cover opening mounting plate (31) to lift; after the cover opening mounting plate (31) is lifted, the top end of the deflector rod (33) passes through the through groove (23) and is positioned between the buckle (14) and the box body (11), and the deflector rod (33) is driven by the deflector drive mechanism (34) to apply an acting force to the buckle (14) far away from the side wall of the box body (11) so as to separate the buckle (14) from the second bulge (15);
the device comprises a translation device and a grabbing device (4), wherein the grabbing device (4) is installed at the output end of the translation device, the translation device drives the grabbing device (4) to move to the upper portion of a placement table (21), the grabbing device (4) comprises a fixed base (41), a grabbing lifting mechanism (42) and a grabbing hand mechanism (43), the grabbing lifting mechanism (42) is installed on the fixed base (41), the grabbing hand mechanism (43) is installed at the output end of the grabbing lifting mechanism (42), and the grabbing hand mechanism (43) is used for applying or canceling clamping force to the side wall of the wafer box (1).
2. The wafer box uncapping apparatus according to claim 1, wherein the toggle driving mechanism (34) comprises a plurality of first cylinders (341) mounted on an uncapping mounting plate (31), the first cylinders (341) and a deflector rod (33) are in one-to-one correspondence, the telescopic direction of the first cylinders (341) is parallel to the corresponding protruding direction of the buckling part on the buckle (14), a waist-shaped hole extending along the length direction of the deflector rod (33) is formed in the bottom end of the deflector rod (33), a connecting shaft is fixed at the output end of the first cylinders (341), the axial direction of the connecting shaft is parallel to the uncapping mounting plate (31) and perpendicular to the telescopic direction of the first cylinders (341), the connecting shaft is rotationally connected with the waist-shaped hole, the connecting shaft can slide along the length direction of the waist-shaped hole, the preset position of the deflector rod (33) is rotationally connected with the uncapping mounting plate (31), and the first cylinders (341) telescopically drive the deflector rod (33) to rotate around the preset position to enable the deflector rod (33) to be close to the top end of the buckle (14).
3. The wafer cassette door apparatus according to claim 2, wherein a projection (331) is provided on a side of the top of the lever (33) facing the buckle (14).
4. The wafer cassette door apparatus according to claim 2, wherein the door opening device further comprises a door bottom plate (35), the door bottom plate (35) and the placement table (21) are connected by a guide post (36), the door mounting plate (31) is provided with a guide hole (37) through which the guide post (36) passes, and the door lifting mechanism (32) is fixed on the door bottom plate (35).
5. The wafer cassette door apparatus as claimed in claim 1, wherein the toggle driving mechanism (34) is located at a bottom surface of the door mounting plate (31), and a design hole (332) for passing through the toggle lever (33) and moving the toggle lever (33) is provided on the door mounting plate (31).
6. The wafer cassette door opening device according to claim 1, wherein the gripper mechanism (43) comprises a polygonal main plate (431), swing arms (432), clamping arms (433) and second air cylinders (434), the main plate (431) is connected with an output end of the grabbing lifting mechanism (42), each side edge of the main plate (431) is rotatably connected with the clamping arm (433), a rotating shaft of each clamping arm (433) is parallel to a side edge of the main plate (431) where the clamping arm (433) is located, each clamping arm (433) corresponds to one swing arm (432) and one second air cylinder (434), a telescopic direction of each second air cylinder (434) is perpendicular to a rotating shaft of the corresponding clamping arm (433), a shell of each second air cylinder (434) is rotatably mounted on the main plate (431), a telescopic rod of each second air cylinder (434) is rotatably connected with one end of each swing arm (432), the other end of each second air cylinder (432) is fixedly connected with the corresponding clamping arm (433), and the second air cylinder (434) pulls or pulls the swing arm (433) to rotate.
7. The wafer cassette door opening device according to claim 6, wherein a spring pressing rod (435) and an overpressure sensor (436) are arranged on the main board (431), one end of the spring pressing rod (435) is located below the main board (431), the other end of the spring pressing rod (435) is located above the main board (431), the overpressure sensor (436) is installed on the top surface of the main board (431), when the bottom end of the spring pressing rod (435) abuts against the top surface of the wafer cassette (1), the spring pressing rod (435) is jacked up, and when the top end of the spring pressing rod (435) exceeds a preset height, the overpressure sensor (436) is triggered.
8. The wafer cassette door apparatus as claimed in claim 6, wherein the gripping device (4) further comprises a supporting base mechanism (44) located outside the gripper mechanism (43), both sides of the gripper mechanism (43) being opposite to each other are provided with the supporting base mechanism (44), the supporting base mechanism (44) comprises a supporting base lifting mechanism (442), a rotation driving mechanism (443) and a supporting plate (444), the supporting base lifting mechanism (442) is mounted on the fixed base (41), the rotation driving mechanism (443) is mounted on an output end of the supporting base lifting mechanism (442), the supporting plate (444) is mounted on an output end of the rotation driving mechanism (443), and the rotation driving mechanism (443) is used for driving the supporting plate (444) to partially rotate to be located below the main plate (431).
9. The wafer cassette door apparatus as claimed in claim 1, wherein a locking protrusion (18) is provided on an opening side edge of the locking recess (17), the locking protrusion (18) covers a portion of the opening of the locking recess (17), the locking mechanism (22) includes a third cylinder (221), a link (222), and a roller (224), the third cylinder (221) is mounted on a bottom surface of the placement table (21), the placement table (21) is provided with a through hole (225) corresponding to the locking recess (17), the link (222) passes through the through hole (225), a middle or bottom end of the link (222) is rotatably connected with the placement table (21), a top end of the link (222) is located above the placement table (21) and protrudes into the locking recess (17), a locking lever (223) extending toward a sidewall of the locking recess (17) is provided on a top end of the link (222), the roller (224) is rotatably mounted on an end of the locking lever (223) remote from the link (222), the third air cylinder (221) drives the part of the connecting rod (222) positioned below the placing table (21) to move so that the top end of the connecting rod (222) is close to the locking protrusion (18) and the roller (224) is pressed on the top surface of the locking protrusion (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311814462.2A CN117476525B (en) | 2023-12-27 | 2023-12-27 | Wafer box equipment of uncapping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311814462.2A CN117476525B (en) | 2023-12-27 | 2023-12-27 | Wafer box equipment of uncapping |
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| Publication Number | Publication Date |
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| CN117476525A CN117476525A (en) | 2024-01-30 |
| CN117476525B true CN117476525B (en) | 2024-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311814462.2A Active CN117476525B (en) | 2023-12-27 | 2023-12-27 | Wafer box equipment of uncapping |
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| TW460035U (en) * | 2000-09-08 | 2001-10-11 | Ind Tech Res Inst | Automatic front-opening load-in device for wafer box |
| US6393334B1 (en) * | 1999-02-12 | 2002-05-21 | Honeywell International Inc. | Method and apparatus for processing tool interface in a manufacturing environment |
| CN104576461A (en) * | 2014-12-31 | 2015-04-29 | 上海新阳半导体材料股份有限公司 | Cover opening device for wafer storage box |
| CN113658898A (en) * | 2021-08-04 | 2021-11-16 | 深圳市森美协尔科技有限公司 | Automatic wafer feeding device and feeding detection method |
| CN217641247U (en) * | 2022-05-19 | 2022-10-21 | 精芯智能装备(苏州)有限公司 | Wafer magazine uncapping mechanism, wafer loading attachment and check out test set |
| WO2023070900A1 (en) * | 2021-10-26 | 2023-05-04 | 江苏亚电科技有限公司 | Wafer box alignment turnover mechanism and device |
| CN116705646A (en) * | 2022-02-28 | 2023-09-05 | 昆山思特威集成电路有限公司 | Wafer slicing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6393334B1 (en) * | 1999-02-12 | 2002-05-21 | Honeywell International Inc. | Method and apparatus for processing tool interface in a manufacturing environment |
| TW460035U (en) * | 2000-09-08 | 2001-10-11 | Ind Tech Res Inst | Automatic front-opening load-in device for wafer box |
| CN104576461A (en) * | 2014-12-31 | 2015-04-29 | 上海新阳半导体材料股份有限公司 | Cover opening device for wafer storage box |
| CN113658898A (en) * | 2021-08-04 | 2021-11-16 | 深圳市森美协尔科技有限公司 | Automatic wafer feeding device and feeding detection method |
| WO2023070900A1 (en) * | 2021-10-26 | 2023-05-04 | 江苏亚电科技有限公司 | Wafer box alignment turnover mechanism and device |
| CN116705646A (en) * | 2022-02-28 | 2023-09-05 | 昆山思特威集成电路有限公司 | Wafer slicing device |
| CN217641247U (en) * | 2022-05-19 | 2022-10-21 | 精芯智能装备(苏州)有限公司 | Wafer magazine uncapping mechanism, wafer loading attachment and check out test set |
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| CN117476525A (en) | 2024-01-30 |
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