CN116705646A - Wafer slicing device - Google Patents

Wafer slicing device Download PDF

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Publication number
CN116705646A
CN116705646A CN202210211462.2A CN202210211462A CN116705646A CN 116705646 A CN116705646 A CN 116705646A CN 202210211462 A CN202210211462 A CN 202210211462A CN 116705646 A CN116705646 A CN 116705646A
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CN
China
Prior art keywords
wafer
box
cover opening
cover
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210211462.2A
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Chinese (zh)
Inventor
杨建设
张雅凯
贾勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Sitewei Integrated Circuit Co ltd
Original Assignee
Kunshan Sitewei Integrated Circuit Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Sitewei Integrated Circuit Co ltd filed Critical Kunshan Sitewei Integrated Circuit Co ltd
Priority to CN202210211462.2A priority Critical patent/CN116705646A/en
Publication of CN116705646A publication Critical patent/CN116705646A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application relates to the technical field of wafer testing and discloses a wafer slicing device, which comprises a frame, wherein the frame is provided with a table top; the machine case is arranged on the table top, an accommodating space is arranged in the machine case, and at least two openings communicated with the accommodating space are formed in the machine case; the at least two wafer boxes are arranged on the table top, each wafer box comprises a box body and a box cover which are detachably connected, the box covers are arranged towards the corresponding openings, and the box bodies are positioned on one side of the box covers, which is away from the case; the cover opening mechanism is connected to the frame in a sliding manner and used for disassembling and assembling and moving the box cover; the picking and placing mechanism is positioned in the accommodating space and used for transferring the wafer in one wafer box into the other wafer box. The wafer slicing device can realize wafer slicing in an environment with a sealed environment, so that secondary pollution is avoided; in addition, the automatic degree of the slicing process is high, the slicing risk caused by manual slicing is avoided, the slicing efficiency is improved, and the product quality is ensured.

Description

Wafer slicing device
Technical Field
The application relates to the technical field of wafer testing, in particular to a wafer slicing device.
Background
Currently, early verification of wafer products requires shipment of wafers to different packaging plants, and therefore, dicing of wafers within a wafer cassette is required. The traditional slicing mode has the following two modes: the first is to move the wafer out of the wafer box by using the probe station, then put a new wafer box, and put the wafer taken out before into the new wafer box by using the probe station, so that the method is tedious and time-consuming; the second type is to manually move the wafer from one wafer cassette to another, which is prone to secondary pollution and breakage. The two methods have high operation risk and low slicing efficiency, and cannot guarantee the product quality.
Disclosure of Invention
In view of this, the present application provides a wafer dicing apparatus, which at least solves the problems of complicated dicing steps, low efficiency, and failure to ensure product quality in the prior art.
The embodiment of the application provides a wafer slicing device, which comprises a rack, wherein the rack is provided with a table top, and the wafer slicing device further comprises:
the machine case is arranged on the table top, an accommodating space is arranged in the machine case, and at least two openings communicated with the accommodating space are formed in the machine case;
the at least two wafer boxes are arranged on the table top and each wafer box comprises a box body and a box cover which are detachably connected, the box covers are arranged towards the corresponding openings, and the box bodies are positioned on one side of the box covers, which is away from the case;
the cover opening mechanism is connected to the frame in a sliding way and used for disassembling and moving the box cover;
and the taking and placing mechanism is positioned in the accommodating space and used for transferring the wafer in one wafer box into the other wafer box.
In an embodiment, the cover opening mechanism includes a lifting member and a cover opening member, the lifting member is slidably connected to the frame along a first direction, and the cover opening member is slidably connected to the lifting member along a second direction perpendicular to the first direction so as to contact the box cover and be fixedly connected to the box cover.
In an embodiment, a locking piece is arranged on the box cover, the locking piece comprises an open state and a closed state, and when the locking piece is in the open state, the box cover is fixedly connected with the box body; when the locking piece is in the closed state, the box cover can be separated from the box body along with the cover opening piece;
the cover opening mechanism further comprises an unlocking piece, one end of the unlocking piece is fixedly connected to the cover opening piece, and the other end of the unlocking piece can be inserted into the locking piece and drive the locking piece to switch between the opening state and the closing state.
In one embodiment, the frame is provided with a support column extending along the first direction, and the lifting piece is connected to the support column in a sliding manner along the first direction; the cover opening piece can be attached to the box cover, and the cover opening piece is provided with a suction hole communicated with the vacuum pump.
In an embodiment, the cover opening mechanism further comprises an inductor connected to the lifting member, wherein the inductor is used for collecting position information between the lifting member and the cover opening member and transmitting the position information to an external control center, and the external control center is used for sending a control instruction to drive or close the vacuum pump, or is used for controlling movement of the lifting member, or is used for controlling movement of the cover opening member.
In an embodiment, the cover opening mechanism further comprises a first driving member, the first driving member comprises a driving cylinder and a limiting member extending along the second direction, the driving cylinder is arranged on one side, deviating from the cover opening member, of the lifting member, a driving shaft of the driving cylinder penetrates through the lifting member and abuts against the cover opening member to drive the cover opening member to move along the second direction, one end of the limiting member is fixedly connected with the cover opening member, and the other end of the limiting member is slidably connected with the lifting member.
In an embodiment, the cover opening mechanism further includes a second driving member disposed on the support column, where the second driving member is connected to the lifting member and is used to drive the lifting member and the cover opening member to move in the frame and the accommodating space along the first direction.
In an embodiment, a machine body is disposed in the rack, and the machine body penetrates through the table board along the first direction and extends to the accommodating space;
the picking and placing mechanism comprises an adjusting piece and at least one arm, wherein the adjusting piece is connected with the machine body, the adjusting piece is arranged at the end part, far away from the rack, of the machine body and used for adjusting the position of the arm, and the arm is used for picking wafers.
In an embodiment, the wafer dicing apparatus further includes a wafer box cover hinged to the chassis, and the wafer box cover is covered on the wafer box and isolates the wafer box from communicating with the outside.
In an embodiment, the wafer slicing device further comprises an observation mechanism arranged on the case, the observation mechanism comprises a lens, an observation hole communicated with the accommodating space is formed in the case, and the lens is correspondingly arranged with the observation hole and used for collecting surface images of the wafer.
The wafer slicing device comprises a rack, a case, at least two wafer boxes, a cover opening mechanism and a picking and placing mechanism, wherein an accommodating space is arranged in the case, and an opening communicated with the accommodating space is formed in the case; in addition, the slicing process is high in automation degree, the slicing risk caused by manual slicing is avoided, the slicing efficiency is improved, the product quality is ensured, and the problems that in the prior art, the slicing steps of a wafer product are complicated, the efficiency is low, and the product quality cannot be ensured are effectively solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a wafer dicing apparatus according to an embodiment of the application;
FIG. 2 is a schematic view of an internal structure of the wafer dicing apparatus shown in FIG. 1;
FIG. 3 is a perspective view of a wafer cassette in the wafer dicing apparatus of FIG. 1;
FIG. 4 is an exploded perspective view of the wafer cassette of FIG. 3;
FIG. 5 is a perspective view of an uncapping mechanism in the wafer dicing apparatus of FIG. 1;
FIG. 6 is an exploded perspective view of the door opening mechanism of FIG. 5;
FIG. 7 is a schematic perspective view of a second driving member of the wafer dicing apparatus shown in FIG. 1;
FIG. 8 is an exploded perspective view of the second drive member of FIG. 7;
FIG. 9 is a perspective view of a pick-and-place mechanism in the wafer dicing apparatus of FIG. 1;
FIG. 10 is an exploded perspective view of the pick-and-place mechanism of FIG. 9;
FIG. 11 is a perspective view of an arm of the pick-and-place mechanism of FIG. 9;
FIG. 12 is an exploded perspective view of the arm of FIG. 11;
FIG. 13 is a perspective view of an observation mechanism in the wafer dicing apparatus of FIG. 1;
fig. 14 is a schematic perspective view of a chassis in the wafer dicing apparatus shown in fig. 1.
The meaning of the labels in the figures is:
100. wafer slicing device;
10. a frame; 11. a table top; 12. a support column; 13. a machine body; 14. a wafer cassette holder;
20. a chassis; 21. an accommodating space; 22. an opening; 23. an observation hole; 24. an emergency stop button;
30. a wafer cassette; 31. a case body; 32. a box cover; 33. a wafer; 34. a locking member; 35. a wafer holder; 36. a seal ring;
40. a cover opening mechanism; 41. a lifting member; 411. a shaft sleeve; 42. a cover opening member; 421. an air suction hole; 422. a joint; 43. an unlocking member; 431. a first motor; 432. an unlocking part; 44. an inductor; 45. a first driving member; 451. a drive cylinder; 452. a limiting piece; 46. a second driving member; 461. a guide rail; 462. a screw rod; 463. a second motor; 464. a slide block; 465. a motor fixing frame;
50. a picking and placing mechanism; 51. an adjusting member; 511. a lifting shaft portion; 512. a second shaft rotating part; 513. a third shaft rotating part; 514. a fourth shaft rotating part; 52. an arm; 521. a connection end; 522. a picking and placing end; 523. a blind hole; 524. a metal sealing plate;
60. a wafer cassette cover; 61. a hinge;
70. an observation mechanism; 71. and a lens.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings, i.e., embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In order to describe the technical scheme of the application, the following description is made with reference to specific drawings and embodiments.
The embodiment of the application provides a wafer slicing device which is used for slicing wafers in a wafer box in a sealed environment.
Referring to fig. 1 to 3, a wafer dicing apparatus 100 according to an embodiment of the application includes a frame 10, a case 20, at least two wafer cassettes 30, a cover opening mechanism 40, and a pick-and-place mechanism 50.
The frame 10 has a table top 11, the case 20 is disposed on the table top 11, the case 20 is provided with a containing space 21, and the case 20 is provided with at least two openings 22 communicating with the containing space 21, that is, the case 20 communicates with the outside through the openings 22. It can be appreciated that when the opening 22 is blocked, the accommodating space 21 in the case 20 is isolated from the outside.
At least two wafer cassettes 30 are all disposed on the table 11, and each wafer cassette 30 includes a detachably connected cassette body 31 and a cassette cover 32, where the cassette cover 32 is disposed toward the corresponding opening 22, i.e., the cassette cover 32 is disposed between the opening 22 and the cassette body 31, and the cassette body 31 is disposed on a side of the cassette cover 32 facing away from the chassis 20.
The cover opening mechanism 40 is slidably connected to the frame 10, and is used for disassembling and assembling the cover 32, so that the accommodating space 21 in the case 20 is communicated with the case 31 through the opening 22. It will be appreciated that the wafer cassette 30 communicates with the housing 20 after the lid mechanism 40 has been removed and the lid 32 has been moved.
The pick-and-place mechanism 50 is located in the accommodating space 21 and is used for transferring the wafer 33 in one of the wafer cassettes 30 into the other wafer cassette 30.
In this embodiment, the wafer dicing apparatus 100 includes two wafer cassettes 30 that are distributed in a central symmetry manner, and the picking and placing mechanism 50 is located in the accommodating space 21 and is located in a middle position of the two wafer cassettes 30, so that the distances between the picking and placing mechanism 50 and the two wafer cassettes 30 are equal, and the accuracy of picking and placing the wafers 33 is facilitated.
The wafer dicing apparatus 100 includes a frame 10, a case 20, at least two wafer cassettes 30, a cover opening mechanism 40, and a picking and placing mechanism 50, where an accommodating space 21 is provided in the case 20 and an opening 22 communicating with the accommodating space 21 is provided on the case 20, and since the wafer cassettes 30 include a cover 32 and a case body 31 that are detachably connected, and the cover 32 is disposed towards the corresponding opening 22, the cover opening mechanism 40 removes and moves the cover 32, and the case body 31 communicates with the accommodating space 21, so that the picking and placing mechanism 50 can directly grasp a wafer 33 in the case body 31 through the opening 22 and transfer the wafer 33 to another wafer cassette 30 as required, and dicing of the wafer 33 can be implemented in an sealed environment, avoiding secondary pollution; in addition, the slicing process is high in automation degree, the slicing risk caused by manual slicing is avoided, the slicing efficiency is improved, the product quality is ensured, and the problems that in the prior art, the slicing steps of a wafer product are complicated, the efficiency is low, and the product quality cannot be ensured are effectively solved.
In the dicing process of the wafers 33 in the wafer cassette 30, the wafer cassette 30 may be placed at the target position, the lid 32 and the opening 22 are faced to each other, and then the lid opening mechanism 40 and the pick-and-place mechanism 50 are driven by the control center to perform the dicing operation.
Referring to fig. 1 to 3 and 5, in one embodiment of the present application, the cover opening mechanism 40 includes a lifting member 41 and a cover opening member 42, wherein the lifting member 41 is slidably connected to the frame 10 along a first direction (X direction shown) and the cover opening member 42 is slidably connected to the lifting member 41 along a second direction (Y direction shown) perpendicular to the first direction to contact the cover 32 and fixedly connected to the cover 32. In this way, the moving distance and position of the lifting member 41 and the cover opening member 42 along the first direction and the moving distance and position of the cover opening member 42 along the second direction are changed by the linear movement, so that the position of the cover opening member 42 can be flexibly adjusted, the cover opening member 42 can be precisely moved, and the adjustment mode is simple.
Since the lifting member 41 is slidably connected to the frame 10 along the first direction, and the cover opening member 42 is slidably connected to the lifting member 41 along the second direction perpendicular to the first direction, when the lifting member 41 slides along the first direction, the cover opening member 42 also slides along the first direction along with the lifting member 41; while the cover 42 slides in the second direction, it will be appreciated that the lifter 41 should be at rest.
Referring to fig. 5 again, the lifting member 41 and the cover opening member 42 are parallel lifting plates and cover opening plates, but not limited thereto.
It will be appreciated that in other embodiments of the present application, the lifting member 41 may be omitted, and the cover member 42 may be freely moved and adjusted in position in a two-dimensional horizontal plane, so that the lid 32 of the wafer cassette 30 may be translated in the horizontal plane to expose the cassette 31 and the wafers 33 in the cassette 31, which is not limited herein.
Referring to fig. 2 to 5, in one embodiment of the present application, a locking member 34 is disposed on a lid 32, the locking member 34 includes an open state and a closed state, when the locking member 34 is in the open state, the wafer cassette 30 is in the locked state, the lid 32 is fixedly connected to the cassette 31, and the lid 32 cannot be removed from the cassette 31; when the locking member 34 is in the closed state, the wafer cassette 30 is in the open state, the connection between the cassette cover 32 and the cassette body 31 is released, and the cassette cover 32 can be separated from the cassette body 31 along with the cover member 42.
Correspondingly, the cover opening mechanism 40 further includes an unlocking member 43, one end of the unlocking member 43 is fixedly connected to the cover opening member 42, and the other end of the unlocking member 43 can be inserted into the locking member 34 and drive the locking member 34 to switch between the open state and the closed state. In this way, the unlocking piece 43 of the cover opening mechanism 40 can change the connection relationship between the box body 31 and the box cover 32 of the wafer box 30, manual operation is not needed, automation of taking and placing the box cover 32 of the wafer box 30 is realized, and secondary pollution is avoided.
In this embodiment, referring to fig. 4 to 6, the locking member 34 includes two fixing knobs disposed on the lid 32, the unlocking member 43 includes two first motors 431, one end of a motor shaft of each first motor 431 is provided with an unlocking portion 432, the lid 42 is provided with a through hole, the unlocking portion 432 can penetrate through the through hole and be inserted into the fixing knobs, at this time, the first motor 431 abuts against the lid 42, and the motor shaft rotates by a certain angle to release the fixing relationship between the lid 32 and the case 31 of the wafer case 30. Wherein, the unlocking part 432 is matched with the shape of the fixed knob and is clamped; accordingly, the through hole is shaped and sized to allow the unlocking portion 432 to pass through and block the first motor 431.
It should be understood that in other embodiments of the present application, the number and structure of the locking member 34 and the unlocking member 43 may be other, for example, in another embodiment, the locking member 34 may include a locking tongue slidably connected to the lid 32 through an elastic member such as a spring, a locking slot for limiting the locking tongue is provided on the case 31, the unlocking member 43 may be pressed or stretched to change the compression state of the elastic member such as the spring, so as to drive the locking tongue to slide into or separate from the locking slot, and the change of the state of the locking member 34 may enable the connection relationship between the case 31 and the lid 32 of the wafer case 30 to be changed, but is not limited thereto.
Referring to fig. 4, the cover 32 of the wafer cassette 30 and the opposite side walls of the cassette body 31 are provided with wafer holders 35, and the wafer holders 35 include a plurality of parallel grooves, which are uniformly sized and used for supporting the edges of the wafers 33, and the wafers 33 can be held in the grooves. It will be appreciated that the structure and mounting height of the plurality of wafer holders 35 should be uniform to ensure parallel and spaced apart distribution between the plurality of wafers 33. In particular, the wafer cassette 30 of the present application is used for placing 12 inch wafers 33, and it is understood that the dimensions of the wafers 33 and the dimensions of the wafer cassette 30 are adapted to avoid the wafers 33 from shaking or clamping too tightly.
In addition, in the present embodiment, the wafer cassette 30 further includes a sealing ring 36 disposed between the cassette cover 32 and the cassette body 31, so as to ensure tightness of the wafer cassette 30.
Referring to fig. 1 to 3, 5 and 6, in one embodiment of the present application, a support column 12 extending along a first direction is disposed in a rack 10, and a lifting member 41 is slidably connected to the support column 12 along the first direction; the cover 42 can be attached to the lid 32, and the cover 42 is provided with a suction hole 421 communicating with the vacuum pump. Thus, the vacuum pump can be started to exhaust the air between the cover opening piece 42 and the box cover 32 through the air exhaust hole 421, so that the cover opening piece 42 and the box cover 32 are tightly and fixedly connected under the action of atmospheric pressure, and the follow-up box cover 32 can conveniently move to a target position along with the cover opening piece 42.
In this embodiment, referring to fig. 5 and 6, the cover 42 is further provided with a connector 422 for connecting a vacuum tube to communicate with a vacuum pump, and the connector 422 is inserted into the air outlet 421. Wherein, the number of the connectors 422 is two, and the exhaust process can be efficiently completed.
In this embodiment, the number of support columns 12 and wafer cassettes 30 is equal to two. It will be appreciated that the process of opening the two wafer cassettes 30 is independent, and the opening sequence of the two wafer cassettes 30 can be designed according to practical requirements.
Referring to fig. 5 and 6, in the present embodiment, the cover opening mechanism 40 further includes a sensor 44 connected to the lifting member 41, where the sensor 44 is configured to collect positional information between the lifting member 41 and the cover opening member 42 and transmit the positional information to an external control center, and the external control center is configured to send a control command to drive or close the vacuum pump, or to control movement of the lifting member 41, or to control movement of the cover opening member 42. Because the external control center can control the vacuum pump, the lifting part 41 and the cover opening part 42 through the related information collected by the sensor 44, the working condition of each combined part is not required to be judged manually in the wafer slicing process, and the automation of the wafer slicing process is realized.
Specifically, referring to fig. 5 and 6, the cover opening mechanism 40 further includes a first driving member 45, the first driving member 45 includes a driving cylinder 451 and a limiting member 452 extending along a second direction, the driving cylinder 451 is disposed on a side of the lifting member 41 away from the cover opening member 42, and a driving shaft of the driving cylinder 451 penetrates through the lifting member 41 and abuts against the cover opening member 42 to drive the cover opening member 42 to move along the second direction, one end of the limiting member 452 is fixedly connected to the cover opening member 42, and the other end is slidably connected to the lifting member 41. So, the spacing piece 452 can be used for limiting the movement of the cover opening piece 42, so that the cover opening piece 42 is ensured to accurately move along the second direction, the movement deviation is avoided, and the accuracy and the efficiency of the cover opening process of the cover opening mechanism 40 are improved.
In this embodiment, the inductors 44 include two inductors and are all disposed on the driving cylinder 451, the limiting member 452 includes four guide rods disposed in parallel, the lifting member 41 is provided with a shaft sleeve 411, one end of the limiting member 452 far away from the cover opening member 42 is sleeved in the shaft sleeve 411, and the limiting member 452 can slide through the shaft sleeve 411, i.e. the limiting member 452 can be slidably connected to the lifting member 41 along the second direction. When the driving shaft of the driving cylinder 451 extends to one of the sensors 44, the cover opening member 42 is attached to the lid 32 of the wafer box 30 and is evacuated by starting the vacuum pump to suck the lid 32, at this time, the first motor 431 in the unlocking member 43 rotates and drives the unlocking portion 432 to open the locking member 34 on the wafer box 30, and the driving cylinder 451 drives the lid 32 to retract through the driving shaft and the limiting member 452 until triggered by the other sensor 44, at this time, the lifting member 41 starts to descend along the first direction and drives the lid 32 to move into the frame 10, so as to complete the cover opening action.
It will be appreciated that in other embodiments of the present application, the sensor 44 may be mounted at any position on the lifting member 41 or the cover member 42, and may be an infrared sensor or a laser ranging sensor, etc., and the sensor may sense whether the distance between the cover member 42 and the lifting member 41 reaches a predetermined distance, and transmit the position information to an external control center after the predetermined distance is reached, which is not limited herein.
In addition, referring to fig. 2, 7 and 8, in the present embodiment, the cover opening mechanism 40 further includes a second driving member 46 disposed on the support column 12, where the second driving member 46 is connected to the lifting member 41, and is used to drive the lifting member 41 and the cover opening member 42 to move in the rack 10 and the accommodating space 21 along the first direction. Thus, the lifting member 41 and the lid member 42 provided on the lifting member 41 can be accurately moved to be in line with the horizontal position of the lid 32 of the wafer cassette 30.
The second driving member 46 includes a guide rail 461 and a screw rod 462 connected to each other, a second motor 463 disposed at one end of the screw rod 462, and a slider 464 disposed on the screw rod 462, where the second motor 463 is used for driving the screw rod 462 to rotate, and external threads are formed on the surface of the screw rod 462 and match with internal threads on the slider 464, the slider 464 slides along the extending direction of the screw rod 462 along with the rotation of the screw rod 462, i.e. along the first direction, and the lifting member 41 can be fixedly connected to the slider 464 by a screw connection or a snap connection, and can realize a reciprocating movement along the first direction along with the slider 464. In addition, the second driving part 46 further includes a motor mount 465 disposed between the second motor 463 and the guide rail 461, which protects a motor shaft of the second motor 463 and reinforces the connection between the second motor 463 and the guide rail 461.
It should be understood that the structure of the second driving member 46 is not unique, and in other embodiments of the present application, the second driving member 46 may be a linear driving member such as a rack and pinion, a cylinder, etc., which is not limited herein.
In addition, the table top 11 is provided with a avoidance channel, and then the lifting member 41 and the cover opening member 42 can penetrate through the table top 11 from the avoidance channel along the first direction, so that the lifting member 41 and the cover opening member 42 can move in the frame 10 and the accommodating space 21, and collision is avoided.
It will be appreciated that the unlocking member 43, the sensor 44, the first driving member 45, the second driving member 46, and the vacuum pump are all electrically connected to an external control center.
Referring to fig. 1, 2 and 9, in an embodiment of the present application, a machine body 13 is disposed in a rack 10, and the machine body 13 penetrates a table 11 along a first direction and extends to a receiving space 21, so that the machine body 13 is received in the rack 10 and a case 20, and the wafer dicing device 100 has high integrity, so that a space occupied by the wafer dicing device 100 can be saved.
The pick-and-place mechanism 50 includes an adjusting member 51 and at least one arm 52, where the adjusting member 51 is disposed at an end of the machine body 13 away from the frame 10 and is used to adjust a position of the arm 52, and the arm 52 is used to pick up the wafer 33. Thus, the wafer 33 can be picked and placed by the mechanized arm 52, so that the wafer 33 is prevented from being damaged in the manual transfer process, and pollution can be avoided.
Referring to fig. 9 and 10, the adjusting member 51 is a four-axis manipulator, and includes a lifting shaft 511, a second axis rotating portion 512, a third axis rotating portion 513, and a fourth axis rotating portion 514, which are sequentially connected, the lifting shaft 511 is used for adjusting the height of the arm 52, the second axis rotating portion 512, the third axis rotating portion 513, and the fourth axis rotating portion 514 are all used for adjusting the position of the arm 52 in the horizontal plane, so that the degree of freedom is high, and the flexibility of the adjusting member 51 is high.
In this embodiment, referring to fig. 2 and fig. 9 to fig. 12, the wafer slicing apparatus 100 includes two wafer cassettes 30 with central symmetry distribution, the pick-and-place mechanism 50 includes two ceramic arms 52, each arm 52 includes a connection end 521 and a pick-and-place end 522, the connection ends 521 of the two arms 52 are fixedly connected to the adjusting member 51, the pick-and-place ends 522 of the two arms 52 are central symmetry, and then the pick-and-place of the wafer 33 can be performed simultaneously. In addition, the pick-and-place end 522 of each arm 52 is U-shaped, and a blind hole 523 is formed at the pick-and-place end 522 for communicating with an air passage in the arm 52 and connecting to a vacuum pump, so that when the pick-and-place end 522 contacts the wafer 33, the wafer 33 is fixedly connected to the arm 52 under the action of atmospheric pressure. In order to ensure the tightness of the air passage in the arm 52, the ceramic arm 52 is also subjected to sealing treatment by a metal sealing plate 524.
It will be appreciated that in other embodiments of the present application, the pick-and-place mechanism 50 may include only one arm 52, so that the wafer 33 may be sequentially removed and placed.
Referring to fig. 1, 2 and 14, in an embodiment of the present application, the wafer dicing apparatus 100 further includes a wafer box cover 60 hinged to the chassis 20, and the wafer box cover 60 is covered on the wafer box 30 and isolates the wafer box 30 from communication with the outside. Thus, when the wafer box 30 is placed at the preset position, the wafer box cover 60 can be rotated to cover the wafer box 30, so that the wafer 33 is always isolated from the outside air and communicated in the wafer slicing process, and pollution is avoided.
The table top 11 is provided with a wafer box fixing seat 14, and the wafer box 30 is detachably connected to the wafer box fixing seat 14 to achieve fixing. The wafer box covers 60 are hinged to the top of the outer side of the case 20 through hinges 61, so that the wafer box 30 can be conveniently taken and placed, and each wafer box cover 60 is hinged to the case 20 through two hinges 61, so that stability of the wafer box cover 60 in the rotation process is guaranteed. It will be appreciated that in other embodiments of the present application, the wafer cassette cover 60 and the chassis 20 may be detachably connected by a buckle, but is not limited thereto.
Referring to fig. 1, 2, 13 and 14, in an embodiment of the present application, the wafer dicing apparatus 100 further includes an observation mechanism 70 disposed on the case 20, the observation mechanism 70 includes a lens 71, an observation hole 23 communicating with the accommodating space 21 is formed on the case 20, and the lens 71 is disposed corresponding to the observation hole 23 and is used for collecting a surface image of the wafer 33.
It will be appreciated that after the surface image of the wafer 33 is acquired by the observation mechanism 70, if the quality of the wafer 33 is not a problem, the wafer may be transferred to another wafer cassette 30 by the pick-and-place mechanism 50; if there is a mechanical damage on the surface of the wafer 33, the wafer may be transferred into the original cassette 30 by the pick-and-place mechanism 50.
In this embodiment, the observation mechanism 70 is disposed at the top of the housing 20, so as to observe the wafer 33 conveniently. In addition, an emergency stop button 24 is arranged at the top of the case 20, so that an operator can conveniently and quickly brake at any time to stop the slicing process in the case 20.
The wafer slicing device 100 provided by the application comprises a frame 10, a case 20, at least two wafer cassettes 30, a cover opening mechanism 40 and a picking and placing mechanism 50, wherein the wafer cassettes 30 comprise a cover 32 and a case body 31 which are detachably connected, and the cover 32 is arranged towards a corresponding opening 22, so that the cover opening mechanism 40 is dismounted and moves the cover 32, and the case body 31 is communicated with an accommodating space 21, and therefore, the picking and placing mechanism 50 can directly pick a wafer 33 in the case body 31 through the opening 22 and transfer the wafer 33 to another wafer cassette 30 according to the requirement, and the wafer 33 slicing can be realized in an environment with a sealing environment, so that secondary pollution is avoided; in addition, the automatic degree of the slicing process is high, the slicing risk caused by manual slicing is avoided, the slicing efficiency is improved, the product quality is ensured, and the problems that the slicing steps of the wafer product are complicated, the efficiency is low and the product quality cannot be ensured in the prior art are effectively solved; in addition, the arrangement of the observation mechanism 70 meets the requirement of wafer appearance detection, and one device can realize two functions, so that the device utilization rate is improved, and the device cost is greatly reduced.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims (10)

1. A wafer dicing apparatus comprising a frame having a table top, the wafer dicing apparatus further comprising:
the machine case is arranged on the table top, an accommodating space is arranged in the machine case, and at least two openings communicated with the accommodating space are formed in the machine case;
the at least two wafer boxes are arranged on the table top and each wafer box comprises a box body and a box cover which are detachably connected, the box covers are arranged towards the corresponding openings, and the box bodies are positioned on one side of the box covers, which is away from the case;
the cover opening mechanism is connected to the frame in a sliding way and used for disassembling and moving the box cover;
and the taking and placing mechanism is positioned in the accommodating space and used for transferring the wafer in one wafer box into the other wafer box.
2. The wafer dicing apparatus of claim 1, wherein the lid opening mechanism comprises a lifting member slidably coupled to the frame in a first direction and a lid opening member slidably coupled to the lifting member in a second direction perpendicular to the first direction to contact the lid and fixedly coupled to the lid.
3. The wafer dicing apparatus of claim 2, wherein the lid is provided with a locking member, the locking member comprising an open state and a closed state, the lid being fixedly connected to the case when the locking member is in the open state; when the locking piece is in the closed state, the box cover can be separated from the box body along with the cover opening piece;
the cover opening mechanism further comprises an unlocking piece, one end of the unlocking piece is fixedly connected to the cover opening piece, and the other end of the unlocking piece can be inserted into the locking piece and drive the locking piece to switch between the opening state and the closing state.
4. The wafer dicing apparatus of claim 2, wherein a support column extending in the first direction is provided in the frame, and the lifting member is slidably connected to the support column in the first direction; the cover opening piece can be attached to the box cover, and the cover opening piece is provided with a suction hole communicated with the vacuum pump.
5. The wafer dicing apparatus of claim 4, wherein the cover opening mechanism further comprises an inductor connected to the lifting member, the inductor being configured to collect positional information between the lifting member and the cover opening member and transmit the positional information to an external control center, the external control center being configured to issue a control instruction to drive or close the vacuum pump, or to control movement of the lifting member, or to control movement of the cover opening member.
6. The wafer dicing apparatus of claim 4, wherein the cover opening mechanism further comprises a first driving member, the first driving member comprises a driving cylinder and a limiting member extending along the second direction, the driving cylinder is disposed on a side of the lifting member away from the cover opening member, and a driving shaft of the driving cylinder penetrates through the lifting member and abuts against the cover opening member to drive the cover opening member to move along the second direction, and one end of the limiting member is fixedly connected to the cover opening member, and the other end of the limiting member is slidably connected to the lifting member.
7. The wafer dicing apparatus of claim 4, wherein the cover opening mechanism further comprises a second driving member disposed on the support column, the second driving member being connected to the lifting member for driving the lifting member and the cover opening member to move in the housing and the accommodating space along the first direction.
8. The wafer dicing apparatus of claim 2, wherein a machine body is provided in the frame, the machine body penetrating the table top in the first direction and extending to the accommodation space;
the picking and placing mechanism comprises an adjusting piece and at least one arm, wherein the adjusting piece is connected with the machine body, the adjusting piece is arranged at the end part, far away from the rack, of the machine body and used for adjusting the position of the arm, and the arm is used for picking wafers.
9. The wafer dicing apparatus of any one of claims 1-8, further comprising a cassette cover hinged to the chassis, the cassette cover being disposed over the cassette and isolating the cassette from communication with the environment.
10. The wafer dicing apparatus according to any one of claims 1 to 8, further comprising an observation mechanism provided on the casing, the observation mechanism comprising a lens provided on the casing and communicating with the accommodation space, the lens being provided corresponding to the observation hole and being used for collecting the surface image of the wafer.
CN202210211462.2A 2022-02-28 2022-02-28 Wafer slicing device Pending CN116705646A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN202210211462.2A CN116705646A (en) 2022-02-28 2022-02-28 Wafer slicing device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117476525A (en) * 2023-12-27 2024-01-30 苏州芯慧联半导体科技有限公司 Wafer box equipment of uncapping
CN118658816A (en) * 2024-08-21 2024-09-17 青岛天仁微纳科技有限责任公司 Nanometer impression silicon wafer segmenting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117476525A (en) * 2023-12-27 2024-01-30 苏州芯慧联半导体科技有限公司 Wafer box equipment of uncapping
CN117476525B (en) * 2023-12-27 2024-03-12 苏州芯慧联半导体科技有限公司 Wafer box equipment of uncapping
CN118658816A (en) * 2024-08-21 2024-09-17 青岛天仁微纳科技有限责任公司 Nanometer impression silicon wafer segmenting device

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