KR100749756B1 - Device for driving wafer mapping movements - Google Patents

Abstract

A wafer mapping operation apparatus is provided to map a wafer with less rotational operation and to simplify its structure by using an incremental encoder. A loadless cylinder is transferred to a vertical direction with respect to a main housing(10). A forward and backward unit is fixed on a mover(225) of the loadless cylinder to fix a door holder in a standing-up condition and make it move forward and backward. A solenoid valve operation unit(250) blocks pneumatic pressure or releases the blocking of the pneumatic pressure so that the transfer of the loadless cylinder is intermittently stopped on a predetermined position. Slide guides are standing-straightly installed in parallel to guide a sliding movement of the forward and backward unit and the loadless cylinder upwardly and downwardly. A dual cycle cylinder intermittently moves through the slide guide so that the loadless cylinder moves up and down by two steps. An incremental encoder(240) determines a position of coupling loads with a sensor in a first cycle period, a detection cycle period, in a second cycle period.

Description

Device for driving wafer mapping movements

1 is a side view showing a schematic configuration of a general ball screw wafer mapping mechanism operating device;

2 is a side view showing a schematic configuration of a mapping mechanism driving apparatus of a rodless cylinder driving method according to the present invention;

3 is a perspective view showing a schematic configuration of a semiconductor device showing a mapping device for semiconductor wafers according to the present invention;

4A and 4B are planar structural views of a semiconductor wafer mapping operating mechanism according to the present invention;

5 is a perspective view showing the configuration of a semiconductor wafer mapping operating mechanism according to an embodiment of the present invention;

6 is an exploded perspective view illustrating an exploded configuration of a semiconductor wafer mapping operating mechanism according to an embodiment of the present invention;

Fig. 7 is a perspective view showing the forward and backward means and the rodless cylinder, which are main parts of the wafer mapping operating mechanism according to the present invention, as viewed from the direction A of Fig. 6;

8 is a side structural view of the wafer mapping operating mechanism of FIG. 7;

9 is a bottom structure diagram of the wafer mapping operating mechanism of FIG. 8;

FIG. 10 is a perspective view illustrating a wafer mapping operation according to an embodiment of the present invention, in which the rodless cylinder is moved downward and backward in the forward and backward moving means in a first stroke position at which a coupling rod is inserted;

11 is a cross-sectional view taken along the line B-B of FIG. 7,

12 is a circuit block diagram schematically showing a circuit for operating a driving device of the wafer mapping operating mechanism according to the present invention;

Figure 13 is a perspective view showing a state in which the door is opened by the drive device according to the invention,

14 is a perspective view showing a state in which the door is moved to the first stroke by the driving device of the present invention and the mapping start step is reached;

15 is a perspective view showing a state in which a door is moved from a first stroke of FIG. 14 to a detection stroke completion step at which a second stroke is started;

FIG. 16 is a perspective view showing a state in which all the mapping is completed after the drive completion state of the driving device showing a state in which the mapping sensor is restored to its original state by moving downward from the detection stroke completion step of FIG. 15;

<Description of Signs of Major Parts of Drawings>

  50: storage container W: wafer

  54: slot guide 100: wafer mapping operating mechanism

 110: mapping sensor D1: first light emitting device

  Q1: first light receiving element 121, 123: coupling rod

 130: fixed block 210: forward and backward means

 220: rodless cylinder 230: dual stroke cylinder

 240: encoder

The present invention relates to a hoop opener mapping driving apparatus for determining the presence or absence of a wafer abnormality in a storage container using a mapping sensor.

The present invention relates to a wafer mapping drive device capable of reliably detecting an abnormal accommodating state, which can achieve compactness of the detection device, reduce energy consumption, and reduce the overall cost of the device. It was possible to provide a mapping drive.

In general, a semiconductor wafer mapping apparatus for determining the correct storage state and position of a semiconductor wafer accommodated is processed to process a wafer formed of polycrystalline silicon made of high-purity polysilicon to obtain an arbitrary semiconductor device or circuit. And sorting the processed wafers. When the above operation is performed, most of the wafers formed by the above process are mounted and moved in a storage container, and the storage container employs one capable of mounting approximately 25 wafers. In addition, the wafer is stored in a pod so as to maintain the freshness, and is taken out of the pod during operation.

According to the conventional semiconductor mapping apparatus, first, a storage container in which semiconductor wafers are stored is loaded into a mounting portion. The wafers are inserted between the slots formed in the container. In addition, the storage container into which the wafers are inserted is transferred to the inside of the relay room by the operation of the driving unit existing in the relay room. And, in the storage container transfer process as described above, the position sensing means for detecting the position of the wafers accommodated in the storage container is provided in the relay room. In addition, the position sensing means is composed of a light emitting sensor and a light receiving sensor. That is, the light emitting sensor irradiates light adjacent to edge portions of the wafers stored between the slots of the storage containers. Subsequently, the light receiving sensor checks the light irradiated from the light emitting sensor. If a portion of the wafers accommodated in the storage container is not stored in the correct position and protrudes abnormally from the storage container, the light emitted from the light emitting sensor is reflected by the protruding wafer W. The light receiving sensor does not detect the light. For this reason, it is possible to confirm the state in which the wafers W are not stored in the correct position.

1 is a configuration diagram of a semiconductor device showing a semiconductor wafer mapping apparatus of the present invention, wherein the storage container POD 50 has a plurality of U-shaped slot guides for storing a plurality of wafers W; 54 are formed, and each of the slot guides 54 is provided with a first sensor 56 for sensing the position of the semiconductor wafers W.

Each of the slot guides 54 formed in the storage container 50 is provided with at least three first sensors 56.

Specifically, at least three first sensors 56 are provided on respective slot guides 54 that support the semiconductor wafer W, and the semiconductor wafer W is generated due to the transfer of the storage container. Detect the position and state of the to form the mapping data.

One side of the storage container 50 is provided with a detachable storage container door 52 so that the semiconductor wafer (W) can be carried in. In addition, a gripping means 58 is attached to an upper surface of the storage container 50, which is used to automatically transport the storage container 50 through a storage container transport device (not shown) disposed on the ceiling of the process chamber. . Nitrogen gas is injected into the storage container 50 to maintain the cleanliness of the interior during the semiconductor manufacturing process. The storage container 50 and the storage container door 52 are optically transparent to facilitate observation.

In addition, the mounting unit 60 on which the storage container 50 is placed is disposed on one side of the relay chamber 70 for processing and transporting the semiconductor wafers. The storage container 50 is supported by a pedestal 66 which can be reciprocated in the direction of the door holder 68 of the relay room 70 so as to be engaged with the door holder 68 of the relay room and carry the wafer W therein. have. When the storage container 50 is seated in the mounting part 60, three terminal parts 62 for positioning the storage container 50 and closing the first sensor 56 and the control unit 72 are formed to transfer current. ) Is formed. That is, the terminal part 62 provides a current to the first sensor 56 to enable an operation of sensing the storage state of the wafers W and accommodates the wafers W accommodated in the storage container. The switching terminal serves to transfer the mapping data of the first sensor 56 that detects the control unit to the controller.

In addition, three terminal portions 62 present in the mounting portion 60 are formed on the bottom surface of the storage container 50. The storage container 50 is terminal-connected with the terminal portion 62 to transmit current to the first sensor 56 present in the slot guide 54 inside the storage container 50 and the first sensor 56. It serves to form a closed circuit for transmitting the mapping data of the control unit. In addition, mapping data of the first sensor 56, which senses the state of receiving the semiconductor wafer W, is transferred to the lower portion of the pedestal 66 through the terminal portion 62, and is operated on the wafer transfer member according to the mapping data. The control unit 72 is provided to provide a signal and to provide an alarm signal when the storage state of the wafers in the storage container is wrong.

The door holder 68 of the relay room is located to correspond to the storage container door 52 and the storage container door 52 and the door holder 68 of the relay room are suction-fastened by the movement of the pedestal 66 on the mounting part. Due to the operation of the drive shaft (not shown), the door holder 68 and the storage container door 52 of the relay room are opened and closed. In addition, a semiconductor wafer transfer member (not shown) is provided in the relay chamber 70 of the semiconductor device, and the semiconductor wafers W in the storage container 50 are transferred to the relay chamber 70.

However, the mapping device of the semiconductor wafer is not installed in the storage container itself in which the wafer is stored, but is installed in a separate position to measure the correct storage position and existence of the semiconductor wafer. The mapping device may determine the storage position of the wafers only before the mounting portion moves up and down. Therefore, the mapping device does not detect abnormally protruding wafers inserted into the storage container by the vibration generated during the vertical movement of the storage container. Thereafter, the abnormally protruding wafers may not be placed in the correct position of the chamber when the wafer is transferred into the process chamber by the operation of the transfer member, thereby causing breakage of the wafers. In addition, the broken wafer particles may cause contamination of other wafers present in the storage container, thereby lowering the yield of the semiconductor device and the productivity of the semiconductor device due to the shutdown of the equipment.

SUMMARY OF THE INVENTION The present invention has been made in view of the above disadvantages, and an object of the present invention is to provide a wafer mapping mechanism that detects a correct storage state of a semiconductor wafer in a storage container without having a separate system for the semiconductor wafer mapping operation device. The present invention provides a semiconductor wafer mapping operation device that achieves a more precise and robust mapping mechanism, thereby minimizing damage to the semiconductor wafer in a subsequent manufacturing process.

A semiconductor wafer mapping apparatus of the present invention for achieving the above object,

In the driving device of the hoop opener mapping operating mechanism for determining the presence or absence of a wafer abnormality in the storage container by using the mapping operating mechanism,

A rodless cylinder which can be transferred in a vertical direction with respect to the main housing;

A forward and backward means fixed on the mover of the rodless cylinder to fix the door holder in an upright state and to advance back and forth;

It characterized in that it comprises a solenoid valve operating mechanism for blocking or canceling the pneumatic pressure so that the rodless cylinder to stop the transfer intermittently at a predetermined position.

Further, a further feature of the mapping drive device for semiconductor wafers is a drive device for a hoop opener mapping drive device that determines whether there is a wafer abnormality in a storage container by using a mapping drive device.

A rodless cylinder which can be transferred in a vertical direction with respect to the main housing;

A forward and backward means fixed on the mover of the rodless cylinder to fix the door holder in an upright state and to advance back and forth;

A slide guide, which is erected in parallel so as to guide sliding of the forward and backward means and the rodless cylinder in the vertical direction;

A dual stroke cylinder which intermittently moves the rodless cylinder in two stages so as to be movable upward and downward through the slide guide;

A first stroke section in which the mapping sensor-equipment coupling rod moves to a position for detecting the top wafer inside the storage container by the dual stroke cylinder, and scanning the entire wafer in the storage container from the upper direction to the lower direction; An incremental encoder installed in the hoop opener body to determine the position in the detection stroke section and the second stroke section further downwardly moving from the completion position of scanning to fully open the hoop opener door. Characterized in that made.

This allows for faster and more precise detection of the wafer containment environment by allowing insertion and escape operations into the pod through a single connection, thanks to the compactness of the overall structure and the attraction of the connections connected between the mating rod pairs. It is to be able to achieve the purpose of the simplification of the drive device to drive the function.

Hereinafter, a hoop opener mapping driving apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a side view showing a schematic configuration of a general ball screw wafer mapping mechanism operating apparatus, Figure 2 is a side view showing a schematic configuration of a rodless cylinder driving method mapping apparatus according to the present invention, Figure 3 4 is a perspective view showing a schematic configuration of a semiconductor device showing a semiconductor wafer mapping apparatus according to the present invention, FIGS. 4A and 4B are planar structural views of a semiconductor wafer mapping operating mechanism according to the present invention, and FIG. 5 is an embodiment of the present invention. Figure 6 is a perspective view showing the configuration of the semiconductor wafer mapping operating mechanism according to the present invention, Figure 6 is an exploded perspective view showing an exploded configuration of the semiconductor wafer mapping operating mechanism according to an embodiment of the present invention of Figure 5, Figure 7 is a present invention Fig. 8 is a perspective view showing the forward and backward means and the rodless cylinder, which are the main parts of the wafer mapping operation mechanism according to the present invention, in the direction A of FIG. 9 is a bottom structural view of the wafer mapping actuator of FIG. 8, and FIG. 10 is a wafer mapping operation step 1 according to the present invention, in a first stroke position where a coupling rod is inserted. Fig. 11 is a perspective view showing the downward movement of the rodless cylinder and the rearward movement of the forward and backward means of Fig. 11, Fig. 11 is a sectional view taken along the line BB of Fig. 7, FIG. 13 is a circuit block diagram schematically showing a circuit for operation, and FIG. 13 is a perspective view showing a state in which a door is opened by a driving apparatus according to the present invention, and FIG. It is a state perspective view which shows the state which moved to 1 stroke, and reached | attained the mapping start stage, and FIG. 15 is a process from the 1st stroke of FIG. 16 is a state perspective view showing a state, and FIG. 16 is further moved downward from the completion of the detection stroke of FIG. 15 to reach a driving completion state of the driving device showing a state in which the mapping sensor is restored to its original state, and all mappings are performed. It is a state perspective view which shows the completed state.

As illustrated in the drawings, the hoop opener mapping driving apparatus for mapping the semiconductor wafer of the present invention includes a plurality of sheets each of a plurality of 'U' shaped slot guides 54 formed in a receiving container POD 50. The wafers W are accommodated, and each of the slot guides 54 is provided with a mapping sensor 110 for sensing positions of the semiconductor wafers W.

The hoop opener mapping operation mechanism driving device 200 moves the door of the storage container 50 upward and downward by a moving means 71 such as a power cylinder or a solenoid. Door holder 68 for gripping opening and closing 52, and the mapping sensor 110-equipped coupling rods 121 and 123 coupled to be movable in conjunction with the door holder 68 is hingedly coupled. It is comprised so that the presence or absence of abnormality of the wafer W in the storage container 50 using the mapping actuating mechanism 100 may be carried out.

In addition, the hoop opener mapping actuator drive device 200, the cylinder body 221 and the end block (attached to both ends of the cylinder body 221) to be transported in a vertical direction with respect to the main housing 10 ( 223 and a rodless cylinder 220 composed of a mover 225 moving in the longitudinal direction along the upper surface of the cylinder body 221 and fixed to the mover 225 of the rodless cylinder 220, A fixed block 211 having linear guides 211a and 211b disposed on a lower surface of the door holder 68 in a standing state and simultaneously moving forward and backward, and linear guides 211a and 211b of the fixed block 211. Sliding forward and backward means 210 having a moving block 213 having bent parts 213a and 213b to move forward and backward through the medium, and sliding the forward and backward means and the rodless cylinder 220 in the vertical direction. A slide guide 227 standing upright in parallel to guide movement and the slide Dual-stroke cylinder 230 for intermittently moving up and down the rodless cylinder 220 in two stages via a guide 227 and the mapping sensor 110 by the dual-stroke cylinder 230. -The combination coupling rods 121 and 123 move to a position for sensing the uppermost wafer W in the storage container 50, so that the mapping sensor 110-the combination coupling rods 121 and 123 are stored in the storage container ( 50) a driving force of the rodless cylinder 220 inserted into the first stroke section S0-S1 for detecting the wafer W and downward from the first stroke section S0-S1. While moving in the intermediate direction, the entire surface of the wafer W in the container 50 is scanned from the upward direction to the downward direction, and then the mapping sensor 110-the detection of rotating the binding coupling rods 121 and 123 in the backward direction. Position to move further downward at the completion position of the row stop section S1-S2 to fully open the hoop opener door 52. During the second stroke section S2-S3, the hoop opener to determine the respective positions during the first stroke, the detection stroke and the second stroke section to move the rodless cylinder 220 to the second stage. It comprises an incremental encoder 240 installed in the housing 10 (see Figs. 13 to 16).

As the basic structure of such a rodless cylinder 220, conventionally well-known various structures can be employ | adopted. For example, a magnet drive type in which both the piston 211 and the moving table 215a and the mover 215 integrated structure are attracted to each other and a magnet train for synchronously moving the piston 211 and the moving table 215a is adopted. can do.

Incidentally, the incremental encoder 240 is formed by a transparent transparent plate 241 in the form of a strip having a scale in the longitudinal direction, light transmission in the front and rear directions of the transmission plate 241, and the scale 243. It consists of a sensor dog with third light emitting elements D3, Q3 which read out the current position using the interference phenomenon.

On the other hand, the configuration for the driving method of the hoop opener mapping operating mechanism driving device 200, the end of the pair of coupling rods 121, 123 between the wafer (W) to form the mapping sensor 110. A first driving circuit F1 for outputting a driving pulse to the light emitting element based on the first light emitting element D1 and the first light receiving element Q1 disposed on the first light receiving element and a pulse for driving the LED according to the infra red as a logic signal. And a light receiving signal output from the first light receiving device D2 in which the wafer W is disposed with respect to the first light emitting device D1, and outputting a driving pulse signal output from the first driving circuit F1. And a control unit connected to the first signal processing unit S1 for processing the synchronous rectified signal, and connected to the first signal processing unit S1 and controlling a signal indicating a position calculation by synchronizing with the first light receiving signal; A way by comparing the position calculation value and the reference value obtained by the controller A memory for storing a reference value for determining a normal / abnormal array of (W) and a reference value for providing the control unit with characteristic information for each size and thickness of the wafer W for determining a signal input through the determination of the determination unit; Can be mentioned.

The memory also stores reference values for the positions of the first stroke, the detected stroke, and the second stroke, so that the rodless cylinder 220 and the dual stroke cylinder 230 of the mapping operation mechanism are controlled by the controller. And by controlling the individual operation of the solenoid valve operating mechanism 250, through the independent pneumatic control of the rodless cylinder 220 is configured to control the transfer operation for each set position.

To perform the mapping function of the wafer W using the above-described driving device, first, a type of the wafer W to be positioned on the hoop opener is selected, and the alignment of the wafer W by the controller is performed. Instruct the operation means 150 to rotate the mapping sensor 110-the mounting coupling rods 121 and 123 according to the insertion instruction into the storage container 50 of the mapping sensor 110 to check the state. In the second step of recognizing that the mapping sensor 110 is positioned, the third step of activating the first light emitting device D1, the first light receiving device Q1, and the first signal processing unit S1, the wafer The signal received from (W) is recognized by the first light receiving element Q1, and is processed by the first signal processing unit S1, the reference value signal information stored in the memory through the control unit and the mapping sensor ( 110) to determine whether the output value matches the reference value stored in the memory In a fifth step, if the output values of the mapping sensor part do not coincide with the reference values stored in the memory, the sixth step of sequentially transmitting an abnormal signal indicating an abnormal alignment state of the wafer W to the controller is performed. will be.

Accordingly, the main function is to include the position recognition function of the driver to determine the operating position of the driving device by using the incremental encoder 240, and more specifically, various dogs and incremental encoder 240 The second driving circuit F2, the second light emitting element, and the second light receiving element to have a digital scale gauge or a sequential recognition function to quickly find the current position, such as using the absolute encoder 240 using And position recognition for quickly finding the absolute coordinate value of the current position as a reference for positioning of the drive shaft by installing sensor dogs having different lengths or different angles in the transfer system using the sensor dog composed of the second signal processing unit S2. To do it.

 Therefore, the step-by-step position recognition method and apparatus equipped with the incremental encoder 240 has the effect of improving the economics by reducing the manufacturing cost, productivity by shortening the time, and stability by minimum movement.

In this case, signals indicating an unaligned state of the wafer W reacted from the wafer W are recognized through the first and second light receiving elements D1 and D2, and the first and second signal processing units S1 and S2. Is processed by the control unit, and compares the signal information stored in the memory with the output value of each sensor unit with the reference value stored in the memory, and determines whether or not the result is matched with the robot. By notifying the operator, the sensor unit aligns all of the wafers W with a transfer robot or the like until the output value of the sensor matches the reference value stored in the memory, and then passes through the relay room 70 for subsequent processing. .

On the other hand, the unaligned state of the wafer W reacted from the wafer W is a state in which the wafer W protrudes a predetermined distance toward the door 52 on the opposite side thereof, rather than inward of the storage container 50. It includes an abnormal alignment state of, which is installed by additionally installing the second light receiving sensor (Q2) and the second light emitting sensor (D2) on the side facing both across the approximately central portion of the pair of coupling rod (121, 123), If the second light emitting sensors D2 and Q2 do not react due to the interference of the wafer W, the wafer W is detected to protrude abnormally, so that normal alignment including subsequent remedies, that is, rearrangement and the like. The controller may control to selectively follow only other normal array wafers W while performing a procedure of inducing or removing an abnormal array portion.

In conclusion, using the incremental encoder 240 has a position recognition function of the driver to determine the operating position of the driving device, and more specifically, using a variety of dog and incremental encoder 240 In order to quickly find the current position such as using the absolute encoder 240, the drive shaft may be installed by installing sensor dogs of different lengths or angles in a transfer system using a digimatic scale gauge or a sensor dog having a sequential recognition function. This function performs the position recognition function to quickly find the absolute coordinate value of the current position, which is the reference for positioning.

The sensor dog of the present invention, as shown in FIG. 2, uses a sensor dog, an incremental encoder 240, and an additional mapping sensor 110 to detect the alignment state of the wafer W. If the length of each section and Z phase pulse (P / R) and offset value of each section are input in advance, the current position can be quickly obtained at any position on the sensor dog during the current position recognition operation. By mounting the incremental encoder 240 to be able to, it is possible to accurately detect the position of the wafer (W) through the current position recognition of the mapping sensor 110 at the time of mapping the wafer (W).

On the other hand, the mapping operation mechanism 100, is located in the center of the upper side of the door holder 68, the control board 260 and the solenoid control for driving the rodless cylinder 220 and the dual stroke cylinder 230 It is connected to the valve device 250, both ends are rotatable in the forward and rearward direction, the pair of mapping sensor 110-equipped with coupling rods 121, 123 is hingedly coupled.

The incremental optical encoder 240 may include a third light emitting device D3 mounted on the hoop opener body 10, and a strip-shaped transmission plate having a plurality of scales 243 engraved therefrom from the third light emitting device D3. A circuit for detecting the movement amount or the transfer position from the third light receiving element Q3 mounted to the main body through the sub-substrate receiving light transmitted or reflected through 241 and the light received by the third light receiving element Q3. Is an optical encoder having a control board mounted on the main body.

The incremental optical encoder 240 has a mounting block portion 245 having a cross-sectional shape in a? -Shape, and a third light emitting element D3 and a light receiving element Q3 supporting portion formed in the mounting block portion 245. It is preferred to be configured as a sensor dog having 245a and 245b.

In addition, the mapping operation mechanism 100, the pair of coupling rods 121 and 123 on which the mapping sensor 110 is mounted, and the pair of coupling rods 121 and 123 are rotated in the front-rear direction about one rotation point. A fixed block, possibly pinned, and a pair of pins fixed at one end to the fixed block 130 at the same time to tow at the same angle to the other end of the pair of coupling rods 121 and 123. Is fixed to the fixing block 130 to move the connecting portion 140 and the connecting portion 140 in the forward and backward directions to correspond to the inner surface with the wafer (W) in the interior of the receiving container 50 therebetween. And 150.

In addition, the connection portion 140 of the mapping actuating mechanism 100 is preferably composed of a linkage member hinged to each end of each of the pair of coupling rods 121 and 123.

In addition, first and second mapping sensors 110 and 111 formed of first and second light receiving elements Q1, D1 and Q2 and D2 are supported at the other end and the center of the pair of coupling rods 121 and 123. It is.

Here, the operation means 150 is preferably made of a power cylinder or a solenoid having the connection portion 140, which can be mounted.

On the other hand, the reference numeral (CO) is a connecting fixture for fixing the forward and backward means 210 and the mover 115 integrally, the reference sign 11 is arranged in parallel to the rear of the main body 10 and the mover 225 ) Is a guide plate to which the movement is guided through the connection port, code (H) is a flexible connection hose for pneumatic transmission, code 231 is the rodless cylinder 220 and the dual stroke cylinder 230 It is a bracket connecting the piston end of the.

Thereby, the detection function of the presence or absence of the storage of the wafer W in the storage container 50 can be stably performed, and in particular, it is possible to reliably detect the abnormal accommodating state such as when the wafer W is misaligned or not stored. The wafer mapping drive can be made compact, and at the same time, it is possible to provide a mapping drive that can reduce energy consumption and reduce the overall cost of the device.

Therefore, the method and apparatus for recognizing the position of the drive shaft equipped with the incremental encoder 240, which is an embodiment of the present invention, has the effect of improving productivity by reducing manufacturing cost, improving productivity by shortening time, and improving stability on position recognition by minimum movement. Will provide

In addition, the hoop opener mapping driving device for determining the presence or absence of an abnormality of the wafer W in the storage container 50 using the mapping sensor 110 moves while being moved up and down by the operation means 150. A door holder 68 for gripping and opening the door 52 of the container 50 and a central portion of the upper side of the door holder 68 are connected to the control board 260 and can be rotated forward and backward. Preferably, the mapping sensor 110-equipped with a coupling rod (121, 123) comprises a mapping operating mechanism 100 is hingedly coupled.

In addition, the mapping operation mechanism 110, the pair of coupling rods 121 and 123 on which the mapping sensor 110 is mounted, and the pair of coupling rods 121 and 123 are rotated in the front-rear direction about one rotation point. It is possible to pull the coupling rods 121 and 123 at the same angle at the same time so that the other end of the pair of coupling rods 121 and 123 rotates to correspond to the inner surface of the storage container 50 with the wafer W therebetween. In addition, the mapping detection is achieved while moving up and down using the administrative sections as reference positions.

In addition, the mapping sensor 110 is rotatably supported at the other end of the pair of coupling rods 121 and 123.

The actuating means 150 is preferably composed of a power cylinder or a solenoid having the wanderable connection portion.

Meanwhile, the individual driving of the bidirectional coupling rods 121 and 123 illustrated in FIG. 3 is preferably driven by driving by a transmission means such as a motor or a belt.

According to this configuration, in performing the detection function of the storage of the wafer W in the storage container 50, first, a general sensing circuit including a power supply circuit, a start key, a sensor circuit, and a controller and an output controller (not shown) In the present invention including a), the infrared light emitting device (D1) for fastening a small hole in the other end of the coupling rod (121, 123) and the corresponding light coupled from the infrared light emitting device (D1) Each of the light from the optical fiber OF1 selectively transmitted according to the arrangement of the optical fiber OF1 transmitted through the holes 121 and 123 and the wafer W placed inside the storage container 50 is infrared. The storage state of the wafer W is determined through the optical fiber OF2 transmitted to the light receiving element Q1.

Meanwhile, the mapping sensor 110 made of the infrared light emitting device rotates the coupling rods 121 and 123 by a predetermined angle in a rearward direction so as to detect an abnormal accommodation state such as when the wafer W is misaligned or not received. The light receiving element receives the optical signal of the light emitting element at the front end side of the wafer W, senses that the wafer W is abnormally accommodated inclined, and displays or alerts an abnormal signal (not shown), thereby providing the wafer W It is operated so that the abnormal alignment state of can be detected reliably.

As a result, according to the present invention, when the wafer W is mapped, the operation of the mapping mechanism is performed by one operation mechanism, thereby making it possible to compact the entire apparatus and reduce energy consumption.

This combination eliminates the need for an additional drive to detect an extra wafer W misalignment.

Thus, according to the wafer (W) mapping drive device of the present application, it is possible to map the wafer (W) with only a smaller rotational operation, the overall structure by excluding the additional configuration for the separate lifting movement through the configuration as described above There is a very good effect such as to simplify.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Claims (7)

In the driving device of the hoop opener mapping operating mechanism for determining the presence or absence of a wafer abnormality in the storage container by using the mapping operating mechanism, A rodless cylinder which can be transferred in a vertical direction with respect to the main housing; A forward and backward means fixed on the mover of the rodless cylinder to fix the door holder in an upright state and to advance back and forth; And a solenoid valve actuating mechanism configured to block or cancel the pneumatic pressure so that the rodless cylinder can be intermittently stopped at a predetermined position. The method of claim 1, A slide guide, which is erected in parallel so as to guide sliding of the forward and backward means and the rodless cylinder in the vertical direction; A dual stroke cylinder which intermittently moves the rodless cylinder in two stages so as to be movable upward and downward through the slide guide; A first stroke section in which the mapping sensor-equipped coupling rod pair is moved to a position for sensing the top wafer inside the storage container by the dual stroke cylinder, and scanning the entire wafer in the storage container from the upper direction to the lower direction; And further including an incremental encoder installed in the hoop opener body to determine the position in the detection stroke section and the second stroke section further downwardly moving from the completion position of scanning to fully open the hoop opener door. Hoop opener mapping actuator drive device characterized in that. The method of claim 1, The encoder includes a transparent transparent plate in the form of a strip having a scale formed in the longitudinal direction, and a third light emitting device that reads a current position using light transmission in the front and rear directions of the transmission plate and interference caused by the scale. Hoop opener mapping actuator drive device characterized in that consisting of a sensor dog provided. The method of claim 2, The hoop opener mapping actuator driving device, characterized in that the first and second mapping sensors made of the first and second light receiving elements are supported at the other end and the center of the coupling rod pair. As a configuration for the driving method of the hoop opener mapping actuator drive device according to any one of claims 1 to 4, The first light emitting device and the first light receiving device disposed at the ends of the coupling rod pair with the wafer interposed therebetween to form the mapping sensor, and a driving pulse is emitted based on a pulse driving the LED according to Infrared as a logic signal. A first driving circuit output to the device, a driving pulse signal output from the first driving circuit, and a light receiving signal and a synchronous rectification signal output from the first light receiving device in which the wafer is disposed with respect to the first light emitting device; A control unit connected to the first signal processing unit and controlling a signal indicating a position calculation by the first light receiving signal and a synchronization and rectification signal; and a position calculation value obtained by the control unit. A judging section for judging normal / abnormal arrangement of the wafers by comparing the reference values, and the size and the size of the wafer for judging an input signal through the judging And a memory for storing a reference value for providing characteristic information to each controller. The method of claim 5, The memory also stores reference values for the positions of the first stroke, the detected stroke, and the second stroke, so that the loadless cylinder of the mapping actuator and the dual stroke cylinder and the solenoid valve actuating mechanism of the mapping actuator are controlled by the controller. Mapping mechanism driving device, characterized in that for controlling the movement and stop operation. In performing the mapping function of the wafer using the driving device of claim 5, A first step of selecting a type of wafer to be placed in the hoop opener, A second step of instructing the moving means to rotate the mapping sensor-equipped coupling rod based on an insertion instruction into the storage container of the mapping sensor by the controller to confirm the alignment state of the wafer; Recognizing that the mapping sensor is positioned, a third step of activating a first light emitting device, a first light receiving device, and a first signal processor; A fourth step in which the signal received from the wafer is recognized through a first light receiving element and processed by the first signal processor; A fifth step of determining whether the reference value signal information stored in the memory and the output value of the mapping sensor match the reference value stored in the memory through the control unit; And a sixth step of transmitting an abnormal signal indicating an abnormal alignment state of the wafer to the controller if the output value of the mapping sensor unit does not coincide with the reference value stored in the memory.

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