CN117425696A - 光反射用热固性树脂组合物、光半导体元件搭载用基板及光半导体装置 - Google Patents

光反射用热固性树脂组合物、光半导体元件搭载用基板及光半导体装置 Download PDF

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Publication number
CN117425696A
CN117425696A CN202280035085.XA CN202280035085A CN117425696A CN 117425696 A CN117425696 A CN 117425696A CN 202280035085 A CN202280035085 A CN 202280035085A CN 117425696 A CN117425696 A CN 117425696A
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CN
China
Prior art keywords
optical semiconductor
semiconductor element
resin composition
thermosetting resin
substrate
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Pending
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CN202280035085.XA
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English (en)
Chinese (zh)
Inventor
山本高士
须藤光
中村龙汰
冈田顺子
远藤由则
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Resonac Corp
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Resonac Corp
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Publication of CN117425696A publication Critical patent/CN117425696A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN202280035085.XA 2021-07-05 2022-05-17 光反射用热固性树脂组合物、光半导体元件搭载用基板及光半导体装置 Pending CN117425696A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-111370 2021-07-05
JP2021111370 2021-07-05
PCT/JP2022/020531 WO2023281922A1 (ja) 2021-07-05 2022-05-17 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

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Publication Number Publication Date
CN117425696A true CN117425696A (zh) 2024-01-19

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CN202280035085.XA Pending CN117425696A (zh) 2021-07-05 2022-05-17 光反射用热固性树脂组合物、光半导体元件搭载用基板及光半导体装置

Country Status (5)

Country Link
JP (1) JPWO2023281922A1 (https=)
KR (1) KR20240031218A (https=)
CN (1) CN117425696A (https=)
TW (1) TW202307059A (https=)
WO (1) WO2023281922A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102898837B1 (ko) * 2024-03-08 2025-12-11 한국다이요잉크 주식회사 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101535366A (zh) * 2006-11-15 2009-09-16 日立化成工业株式会社 光反射用热固化性树脂组合物及其制造方法、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
JP2014221856A (ja) * 2013-05-13 2014-11-27 パナソニック株式会社 光反射体用熱硬化性樹脂組成物
JP2015523920A (ja) * 2012-05-16 2015-08-20 ノヴォポリマーズ エヌフェーＮｏｖｏｐｏｌｙｍｅｒｓ Ｎ．Ｖ． ポリマーシート
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2019108457A (ja) * 2017-12-18 2019-07-04 日立化成株式会社 光反射用熱硬化性樹脂タブレット、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408541B (zh) * 2006-11-15 2016-10-05 日立化成株式会社 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101535366A (zh) * 2006-11-15 2009-09-16 日立化成工业株式会社 光反射用热固化性树脂组合物及其制造方法、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
JP2015523920A (ja) * 2012-05-16 2015-08-20 ノヴォポリマーズ エヌフェーＮｏｖｏｐｏｌｙｍｅｒｓ Ｎ．Ｖ． ポリマーシート
JP2014221856A (ja) * 2013-05-13 2014-11-27 パナソニック株式会社 光反射体用熱硬化性樹脂組成物
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2019026710A (ja) * 2017-07-28 2019-02-21 日立化成株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2019108457A (ja) * 2017-12-18 2019-07-04 日立化成株式会社 光反射用熱硬化性樹脂タブレット、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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JPWO2023281922A1 (https=) 2023-01-12
KR20240031218A (ko) 2024-03-07
TW202307059A (zh) 2023-02-16
WO2023281922A1 (ja) 2023-01-12

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