JPWO2023281922A1 - - Google Patents

Info

Publication number
JPWO2023281922A1
JPWO2023281922A1 JP2023533457A JP2023533457A JPWO2023281922A1 JP WO2023281922 A1 JPWO2023281922 A1 JP WO2023281922A1 JP 2023533457 A JP2023533457 A JP 2023533457A JP 2023533457 A JP2023533457 A JP 2023533457A JP WO2023281922 A1 JPWO2023281922 A1 JP WO2023281922A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533457A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023281922A1 publication Critical patent/JPWO2023281922A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K3/2279Oxides; Hydroxides of metals of antimony
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/35Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2023533457A 2021-07-05 2022-05-17 Pending JPWO2023281922A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021111370 2021-07-05
PCT/JP2022/020531 WO2023281922A1 (ja) 2021-07-05 2022-05-17 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Publications (1)

Publication Number Publication Date
JPWO2023281922A1 true JPWO2023281922A1 (https=) 2023-01-12

Family

ID=84800540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533457A Pending JPWO2023281922A1 (https=) 2021-07-05 2022-05-17

Country Status (5)

Country Link
JP (1) JPWO2023281922A1 (https=)
KR (1) KR20240031218A (https=)
CN (1) CN117425696A (https=)
TW (1) TW202307059A (https=)
WO (1) WO2023281922A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102898837B1 (ko) * 2024-03-08 2025-12-11 한국다이요잉크 주식회사 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008144127A (ja) * 2006-11-15 2008-06-26 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体素子搭載用基板、光半導体装置およびこれらの製造方法
CN102408541B (zh) * 2006-11-15 2016-10-05 日立化成株式会社 光反射用热固化性树脂组合物、及使用了所述树脂组合物的光半导体元件搭载用基板及光半导体装置
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
WO2013171275A2 (en) * 2012-05-16 2013-11-21 Novopolymers N.V. Polymer sheet
JP6587169B2 (ja) * 2013-05-13 2019-10-09 パナソニックIpマネジメント株式会社 光反射体用熱硬化性樹脂組成物
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックIpマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP7095239B2 (ja) * 2017-07-28 2022-07-05 昭和電工マテリアルズ株式会社 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2019108457A (ja) * 2017-12-18 2019-07-04 日立化成株式会社 光反射用熱硬化性樹脂タブレット、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Also Published As

Publication number Publication date
CN117425696A (zh) 2024-01-19
KR20240031218A (ko) 2024-03-07
TW202307059A (zh) 2023-02-16
WO2023281922A1 (ja) 2023-01-12

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Legal Events

Date Code Title Description
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Effective date: 20250324