JPWO2023281922A1 - - Google Patents

Info

Publication number
JPWO2023281922A1
JPWO2023281922A1 JP2023533457A JP2023533457A JPWO2023281922A1 JP WO2023281922 A1 JPWO2023281922 A1 JP WO2023281922A1 JP 2023533457 A JP2023533457 A JP 2023533457A JP 2023533457 A JP2023533457 A JP 2023533457A JP WO2023281922 A1 JPWO2023281922 A1 JP WO2023281922A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023533457A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023281922A1 publication Critical patent/JPWO2023281922A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023533457A 2021-07-05 2022-05-17 Pending JPWO2023281922A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021111370 2021-07-05
PCT/JP2022/020531 WO2023281922A1 (ja) 2021-07-05 2022-05-17 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Publications (1)

Publication Number Publication Date
JPWO2023281922A1 true JPWO2023281922A1 (ja) 2023-01-12

Family

ID=84800540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533457A Pending JPWO2023281922A1 (ja) 2021-07-05 2022-05-17

Country Status (5)

Country Link
JP (1) JPWO2023281922A1 (ja)
KR (1) KR20240031218A (ja)
CN (1) CN117425696A (ja)
TW (1) TW202307059A (ja)
WO (1) WO2023281922A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102408543B (zh) * 2006-11-15 2014-10-29 日立化成工业株式会社 光反射用热固化性树脂组合物、用该组合物的光半导体元件搭载用基板及其光半导体装置
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
CN104540677B (zh) * 2012-05-16 2018-05-22 北欧化工公司 聚合物片材
JP6587169B2 (ja) * 2013-05-13 2019-10-09 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2019108457A (ja) * 2017-12-18 2019-07-04 日立化成株式会社 光反射用熱硬化性樹脂タブレット、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Also Published As

Publication number Publication date
CN117425696A (zh) 2024-01-19
WO2023281922A1 (ja) 2023-01-12
KR20240031218A (ko) 2024-03-07
TW202307059A (zh) 2023-02-16

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