TW202307059A - 光反射用熱硬化性樹脂組成物、光半導體元件搭載用基板及光半導體裝置 - Google Patents

光反射用熱硬化性樹脂組成物、光半導體元件搭載用基板及光半導體裝置 Download PDF

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Publication number
TW202307059A
TW202307059A TW111120363A TW111120363A TW202307059A TW 202307059 A TW202307059 A TW 202307059A TW 111120363 A TW111120363 A TW 111120363A TW 111120363 A TW111120363 A TW 111120363A TW 202307059 A TW202307059 A TW 202307059A
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Taiwan
Prior art keywords
optical semiconductor
semiconductor element
substrate
resin composition
mounting
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TW111120363A
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English (en)
Chinese (zh)
Inventor
山本高士
須藤光
中村龍汰
岡田順子
遠藤由則
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日商昭和電工材料股份有限公司
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Publication of TW202307059A publication Critical patent/TW202307059A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K3/2279—Oxides; Hydroxides of metals of antimony
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111120363A 2021-07-05 2022-06-01 光反射用熱硬化性樹脂組成物、光半導體元件搭載用基板及光半導體裝置 TW202307059A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021111370 2021-07-05
JP2021-111370 2021-07-05

Publications (1)

Publication Number Publication Date
TW202307059A true TW202307059A (zh) 2023-02-16

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TW111120363A TW202307059A (zh) 2021-07-05 2022-06-01 光反射用熱硬化性樹脂組成物、光半導體元件搭載用基板及光半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2023281922A1 (ja)
KR (1) KR20240031218A (ja)
CN (1) CN117425696A (ja)
TW (1) TW202307059A (ja)
WO (1) WO2023281922A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059856A1 (en) 2006-11-15 2008-05-22 Hitachi Chemical Co., Ltd. Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
IN2014DN10540A (ja) * 2012-05-16 2015-08-21 Novopolymers N V
JP6587169B2 (ja) * 2013-05-13 2019-10-09 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物
JP2015152643A (ja) * 2014-02-10 2015-08-24 パナソニックＩｐマネジメント株式会社 光反射体用熱硬化性樹脂組成物、光反射体、及び発光装置
JP2019108457A (ja) * 2017-12-18 2019-07-04 日立化成株式会社 光反射用熱硬化性樹脂タブレット、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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KR20240031218A (ko) 2024-03-07
WO2023281922A1 (ja) 2023-01-12
JPWO2023281922A1 (ja) 2023-01-12
CN117425696A (zh) 2024-01-19

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