CN117352440A - Semiconductor cooling device - Google Patents
Semiconductor cooling device Download PDFInfo
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- CN117352440A CN117352440A CN202311648175.9A CN202311648175A CN117352440A CN 117352440 A CN117352440 A CN 117352440A CN 202311648175 A CN202311648175 A CN 202311648175A CN 117352440 A CN117352440 A CN 117352440A
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- 238000001816 cooling Methods 0.000 title claims abstract description 192
- 239000004065 semiconductor Substances 0.000 title claims abstract description 167
- 235000012431 wafers Nutrition 0.000 claims abstract description 163
- 239000012535 impurity Substances 0.000 claims abstract description 81
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000013519 translation Methods 0.000 claims description 27
- 238000003032 molecular docking Methods 0.000 claims description 20
- 210000001503 joint Anatomy 0.000 claims description 11
- 230000007306 turnover Effects 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000003781 tooth socket Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D25/00—Charging, supporting, and discharging the articles to be cooled
- F25D25/04—Charging, supporting, and discharging the articles to be cooled by conveyors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses semiconductor heat sink, including the cooling table, still include: the conveying unit is arranged on one side of the cooling table and used for conveying the semiconductor wafer to the cooling table for cooling and cooling the two side surfaces of the semiconductor wafer in the conveying process; the conveying unit includes: the first conveying plate is arranged at the top of the cooling table and is used for receiving and conveying semiconductor wafers, the problems that impurities are adhered to the surfaces of the semiconductor wafers in the conveying process and the surfaces of the semiconductor wafers can only be cooled down on one side of the wafer in the prior art are solved, one wafer can only be cooled down at a time, the cooling rate is reduced, the impurities on the surfaces of the two sides of the semiconductor wafers are removed when the semiconductor wafers are preliminarily cooled in the conveying process, and the semiconductor wafers can be cooled down on the two sides of the semiconductor wafers when the semiconductor wafers are cooled down on the cooling table.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a semiconductor cooling device.
Background
Semiconductors (semiconductors) refer to materials having conductivity properties at ordinary temperatures between those of conductors and insulators, and are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, and the like, and diodes are devices fabricated using semiconductors.
The manufacturing process of semiconductor products is generally divided into eight steps: wafer processing-oxidation-lithography-etching-thin film deposition-interconnection-testing-packaging, wherein wafer temperature is one of the very important parameters in semiconductor processing during the wafer processing step, which has an important impact on the quality and performance of the wafer, thereby being able to affect the quality of subsequent semiconductor product fabrication.
According to the cooling method of the semiconductor wafer and the cooling device of the semiconductor wafer disclosed in the patent number CN116884882A, the cooling device comprises a base, a cooling table and a controller, wherein the cooling table is arranged above the base and is cooled in a contact mode, the controller is arranged on the outer side of the cooling table and is used for controlling the temperature of the cooling table, a supporting seat is fixed above the base, and a driving shaft is rotatably arranged above the supporting seat. According to the cooling method of the semiconductor wafer and the cooling device of the semiconductor wafer, the placing ring is matched with the supporting plate to provide support for the wafer main body, the wafer main body can be placed on the cooling table through movement of the placing ring, the wafer main body can automatically slide to the middle of the placing ring through the cooling inclined supporting plate, consistency of positions of the wafer main body on the cooling table is guaranteed, the plurality of placing rings can be arranged to realize continuous cooling of the wafer main body, overall working efficiency of the cooling device is improved, and pollution caused by manual feeding and discharging to the wafer main body is avoided.
However, in the process of implementing the related technical scheme, at least the following technical problems are found: firstly, though not using the manual work to transport, carry the in-process of carrying on feeding mechanism, very easily make its surface adhesion have impurity to still there is the problem that the wafer surface exists impurity, secondly, when cooling the wafer, can only cool down one side of wafer, and can only cool down one wafer once, has reduced refrigerated speed, thereby influences production.
Disclosure of Invention
The application is through providing a semiconductor heat sink, the semiconductor wafer surface has been solved among the prior art and has been adhered with impurity and can only cool down to one side of wafer in the transportation, and can only cool off a wafer once, the problem of the refrigerated speed has been reduced, the realization is carried out preliminary cooling to it in the transportation and is carried out the edulcoration to its both sides surface, it can also cool off its both sides when together cooling on the cooling table to make multiunit semiconductor wafer fall on the cooling table.
The application provides a semiconductor heat sink, including the cooling table, still include: the conveying unit is arranged on one side of the cooling table and used for conveying the semiconductor wafer to the cooling table for cooling and cooling the two side surfaces of the semiconductor wafer in the conveying process; the conveying unit includes: the first conveying plate is arranged at the top of the cooling table and is used for receiving and conveying the semiconductor wafer; the second conveying plate is arranged at the bottom of the first conveying plate and is used for continuously conveying the overturned semiconductor wafer; the cooling cavity is arranged between the first conveying plate and the second conveying plate and used for cooling both sides of the semiconductor wafer; the impurity removing unit is arranged in the conveying unit and is used for removing impurities on two sides of the semiconductor wafer in the conveying process; and the cooling units are arranged at two sides of the cooling table and are used for uniformly cooling the two sides of the semiconductor wafer which falls onto the cooling table through conveying.
Further, the impurity removal unit includes: the first impurity removal component is arranged at one end of the first conveying plate and is used for cleaning one side surface of the semiconductor wafer; and the secondary impurity removing component is arranged on one side of the second conveying plate and used for cleaning the surface of the other side of the semiconductor wafer.
Further, the cooling unit includes: the cooling assembly is connected with the cooling table and arranged on one side of the output end of the second conveying plate and used for driving the cooling table to move and simultaneously cooling the two sides of the semiconductor wafer; and the butt joint assembly is arranged on one side of the cooling assembly and is used for being abutted with the cooling table and butt-jointing the semiconductor wafer.
Further, the primary impurity removal assembly includes: the impurity removing cavity is arranged along the length direction of the first conveying plate, an arc-shaped plate is arranged at the bottom of the impurity removing cavity, and a leak hole for discharging impurities is formed in the arc-shaped plate; the arc-shaped tooth grooves are formed in the side wall of the impurity removing cavity, the arc-shaped tooth grooves are opposite to the arc-shaped plate, and limiting grooves are formed in the outer portions of the arc-shaped tooth grooves at equal intervals; the first moving gear is meshed with the arc tooth grooves and driven by the first power device, the first moving gear is coaxially connected with a moving rod, and a plurality of groups of first fans are arranged on the moving rod along the length direction of the moving rod; the first power device drives the first movable gear to move along the track of the arc-shaped tooth slot, so that the first fan can remove impurities on one side surface of the semiconductor wafer while running along with the first fan.
Further, the re-impurity removal assembly includes: the falling channel is formed between the impurity removal cavity and the side wall of the cooling cavity and is used for enabling the semiconductor wafer to run to the tail end of the first conveying plate along the first conveying plate so as to enable the semiconductor wafer to be overturned by gravity and fall; the rotating disc is arranged at one end of the second conveying plate and is driven by the second power device; the placement plate is connected with the rotating disc, and a clamping plate is arranged in the placement plate; an elastic piece is arranged between the placement plate and the clamping plate; the second fan is arranged on one side of the rotating disc, which is close to the placement plate, and is used for removing impurities from the surface of the turned semiconductor wafer; the semiconductor wafer falls into the clamping plate through the falling channel, and is driven by the second power device, so that the clamping plate rotates and removes impurities on the surface of the semiconductor wafer through the second fan, and meanwhile, the semiconductor wafer falls onto the second conveying plate.
Further, the top of the placing plate and the top of the clamping plate are respectively provided with an introduction plate for the semiconductor wafer to enter.
Further, the cooling assembly includes: the moving plate is arranged on one side of the cooling table; the first moving rail is provided with a first moving rail, the first moving rail is provided with tooth grooves, and the first moving rail is provided with a first translation part and a first turnover part; the second moving gear is connected with the cooling table and meshed with the first moving track, and is driven by a third power device; the first limiting piece is arranged between the second moving gear and the first translation part and used for enabling the second moving gear to drive the cooling table to move in parallel; the third power device drives the second moving gear to move along the first moving track, so that the second moving gear moves in parallel along the first translation part and the first turnover part in turnover degree respectively.
Further, the docking assembly includes: the mounting plate is arranged on one side of the moving plate; the mounting plate is provided with a first moving rail, a first tooth socket is arranged on the first moving rail, and a first translation part and a first turnover part are arranged on the first moving rail; the third moving gear is in meshed connection with the second moving track and is driven by a fourth power device; the third movable gear is coaxially connected with an abutting plate, and the abutting plate is used for abutting against the cooling table and enabling the cooling table to support the semiconductor wafer after the cooling table turns over; the second limiting piece is arranged between the third movable gears of the butt joint plates and used for enabling the third movable gears to drive the butt joint plates to move in parallel.
Further, the first stopper includes: the first limiting block is coaxially connected with the second movable gear; the first limiting plate is arranged on two sides, close to the first translation part, of the moving plate, and the first limiting block is matched with the first limiting plate and used for limiting the first limiting block to enable the cooling table not to rotate.
Further, the second limiting member includes: the second limiting block is coaxially connected with the third movable gear; the second limiting plates are arranged on two sides, close to the second translation part, of the mounting plate, and the second limiting blocks are matched with the second limiting plates and used for limiting the second limiting blocks to enable the butt joint plates not to rotate.
The technical scheme provided by the application has at least the following technical effects or advantages:
(1) The conveying unit and the impurity removing unit are adopted, so that impurities can be removed from the surfaces of the two sides of the semiconductor wafer when the conveying unit and the impurity removing unit move along the first conveying plate and the second conveying plate, and meanwhile, the pre-cooling effect can be carried out on the two sides of the semiconductor wafer by utilizing the cooling cavity in the conveying process, so that the problem that the existing semiconductor wafer is easy to adhere to impurities in the conveying process to influence the production quality of the semiconductor wafer is effectively solved.
(2) The application is characterized in that the cooling unit is adopted, so that the cooling unit is uniformly cooled on the cooling table, when the cooling table moves along the first moving track, the semiconductor wafer on the cooling table is turned 180 degrees to be placed on the butt plate when moving to one half of the arc of the first turning part, and then the semiconductor wafer is continuously moved along the first turning part and separated from the butt plate to be translated along the first translation part, at the moment, the butt plate is moved along the second translation part and the turned semiconductor wafer is placed on the cooling table to be cooled again, so that the problem that the semiconductor wafer can only be cooled once is solved, the problem that the two sides of the existing semiconductor wafer cannot be cooled is solved, and the cooling rate is improved.
Drawings
FIG. 1 is a schematic view of a structure of a whole positive axis measurement in a first embodiment of the present application;
FIG. 2 is a schematic view of the structure of the first embodiment of the present application in a top view;
FIG. 3 is a schematic diagram of the overall front view of the first embodiment of the present application;
FIG. 4 is a schematic structural diagram of a primary impurity removing unit according to a first embodiment of the present disclosure;
FIG. 5 is a schematic diagram illustrating the operation of the primary impurity removal unit according to the first embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a structure of a re-impurity removal unit for receiving a semiconductor wafer according to a first embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a second embodiment of a structure of a re-impurity removal device for receiving a semiconductor wafer;
FIG. 8 is a schematic diagram of a second impurity removal device for receiving a semiconductor wafer according to the first embodiment of the present disclosure;
FIG. 9 is a schematic diagram of a cooling table according to a second embodiment of the present disclosure;
FIG. 10 is a schematic diagram illustrating a movement structure of a cooling stage according to a second embodiment of the present application;
FIG. 11 is a schematic view of the initial position of the abutment plate according to the second embodiment of the present application;
FIG. 12 is a schematic diagram of a cooling stage flip 90 according to a second embodiment of the present disclosure;
FIG. 13 is a schematic diagram showing a structure in which the abutment plate is turned 90 degrees in a second embodiment of the present application;
FIG. 14 is a schematic diagram showing a structure in which the cooling table and the butt plate are turned 90 degrees together in the second embodiment of the present application;
FIG. 15 is a schematic view showing the structure of the cooling table of FIG. 14 after being turned 90 degrees;
FIG. 16 is a schematic view of the abutting plate of FIG. 14 after being turned 90 degrees;
FIG. 17 is a schematic diagram of a second embodiment of the present application with both the cooling table and the docking plate flipped 180 degrees together;
FIG. 18 is a schematic view showing the structure of the cooling table in FIG. 17;
FIG. 19 is a schematic view showing the structure of the cooling table of FIG. 18 after being turned 180 degrees again and being moved along the first translation part;
fig. 20 is a schematic view showing the structure of the movement of the abutment plate in fig. 19.
In the figure: 100. a cooling table; 1. a conveying unit; 11. a first conveying plate; 12. a second conveying plate; 13. a cooling chamber; 2. a impurity removing unit; 21. a primary impurity removal component; 211. a impurity removing cavity; 212. an arc-shaped plate; 213. a leak hole; 214. arc tooth slots; 215. a limiting groove; 216. a first moving gear; 217. a moving rod; 218. a first fan; 22. removing impurities again; 221. a falling channel; 222. a rotating disc; 223. a setting plate; 224. a clamping plate; 225. an elastic member; 226. a second fan; 227. an introduction plate; 3. a cooling unit; 31. a cooling assembly; 311. a moving plate; 312. a first moving track; 313. a first translation portion; 314. a first turning part; 315. a second moving gear; 32. a docking assembly; 321. a mounting plate; 322. a second moving rail; 323. a second translation section; 324. a second overturning part; 325. a third moving gear; 326. an abutting plate; 4. a first limiting member; 41. a first limiting block; 42. a first limiting plate; 5. a second limiting piece; 51. a second limiting block; 52. and the second limiting plate.
Detailed Description
The embodiment of the application discloses provides a semiconductor heat sink, through placing two sets of semiconductor wafers on first delivery board 11 together carry, remove the terminal back of first delivery board 11, remove its one side surface through first fan 218 and remove the impurity processing, the semiconductor wafer is in the edulcoration in the vertical drop grip block 224 along falling passageway 221 influenced by gravity, rotate it to the opposite side through the rolling disc 222, and drive second fan 226 and remove the impurity to its opposite side, at this moment, the semiconductor wafer falls on second delivery board 12, carry on cooling table 100 through second delivery board 12, cooling table 100 can be operated along the orbit of first removal track 312, and accept the semiconductor wafer after the upset and place it again and cool off on cooling table 100, the semiconductor wafer surface has adhered impurity and can only cool down to one side of wafer in the transportation in the prior art, and it can only cool off to one wafer once, the semiconductor wafer has reduced the transport rate of cooling down and can also cool off the semiconductor wafer both sides simultaneously on the both sides of the cooling table 100 simultaneously can also be cooled down to the both sides of the semiconductor wafer that can be cooled down simultaneously.
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Embodiment one:
referring to fig. 1-3, a semiconductor cooling device comprises a cooling table 100, and further comprises a conveying unit 1 arranged at one side of the cooling table 100, wherein the conveying unit 1 is used for conveying a semiconductor wafer to the cooling table 100 for cooling and cooling two side surfaces of the semiconductor wafer in the conveying process, the conveying unit 1 comprises a first conveying plate 11 arranged at the top of the cooling table 100, the first conveying plate 11 is used for receiving and conveying the semiconductor wafer, a second conveying plate 12 is arranged at the bottom of the first conveying plate 11, the second conveying plate 12 is used for continuously conveying the overturned semiconductor wafer, a cooling cavity 13 used for cooling two sides of the semiconductor wafer is arranged between the first conveying plate 11 and the second conveying plate 12, a impurity removing unit 2 is arranged in the conveying unit 1, and the impurity removing unit 2 is used for removing impurities at two sides of the semiconductor wafer in the conveying process;
the cooling table 100 is provided with a cooling temperature for cooling the semiconductor wafer, which is the same as the prior art and is not described in detail herein;
the first conveying plate 11 and the second conveying plate 12 can convey two groups of semiconductor wafers side by side, and the first conveying plate 11 and the second conveying plate 12 are internally provided with conveying rollers, wherein gaps are formed in the conveying rollers, so that the contact area between the conveying rollers and the semiconductor wafers can be reduced, the impurities adhered to the surfaces of the conveying rollers can be reduced, the impurities can be facilitated to fall off, the first conveying plate 11 is positioned at the top of the second conveying plate 12, and a cooling cavity 13 arranged between the first conveying plate 11 and the second conveying plate can be commonly applied to the semiconductor wafers, so that the semiconductor wafers are pre-cooled;
the impurity removing unit 2 comprises a primary impurity removing component 21 arranged at one end of the first conveying plate 11, wherein the primary impurity removing component 21 is used for cleaning the surface of one side of the semiconductor wafer, a secondary impurity removing component 22 is arranged at one side of the second conveying plate 12, and the secondary impurity removing component 22 is used for cleaning the surface of the other side of the semiconductor wafer;
the impurities on both sides of the first and second transfer plates 11 and 12 can be removed while being cooled while being operated along them.
Referring to fig. 3-8, the primary impurity removing assembly 21 includes an impurity removing cavity 211 disposed along a length direction of the first conveying plate 11, the impurity removing cavity 211 is a cavity connected with the first conveying plate 11, an arc plate 212 is disposed at a bottom of the impurity removing cavity 211, a drain hole 213 for discharging impurities is formed in the arc plate 212, an arc-shaped slot 214 is fixedly connected to a side wall of the impurity removing cavity 211, the arc-shaped slot 214 is opposite to the arc plate 212, limiting grooves 215 are disposed at equal intervals outside the arc-shaped slot 214, the arc-shaped slot 214 is engaged with and connected with a first moving gear 216, the first moving gear 216 is driven by a first power device, a second power device is preferably a motor, not labeled in the drawing, the first moving gear 216 is coaxially connected with a moving rod 217, a plurality of groups of first fans 218 are disposed along a length direction of the moving rod 217, the first power device drives the first moving gear 216 to move along a track of the arc-shaped slot 214, and the first fans 218 move along a track of the arc-shaped slot 214 while removing impurities on a side surface of a semiconductor wafer 218;
the re-impurity removing assembly 22 includes a falling channel 221 formed between the impurity removing cavity 211 and the side wall of the cooling cavity 13, the falling channel 221 is used for enabling the semiconductor wafer to run along the first conveying plate 11 to the tail end thereof to be overturned by gravity and fall, one end of the second conveying plate 12 is rotatably connected with a rotating disc 222, the rotating disc 222 is driven by a second power device, the second power device is preferably a motor, not shown in the drawing, the rotating disc 222 is fixedly connected with a placing plate 223, a clamping plate 224 is arranged in the placing plate 223, the top of the placing plate 223 and the top of the clamping plate 224 are both provided with a leading-in plate 227 for leading the semiconductor wafer in, an elastic piece 225 is preferably a spring, one side, close to the placing plate 223, of the rotating disc 222 is provided with a second fan 226, the second fan 226 is used for removing impurities on the surface of the overturned semiconductor wafer, the semiconductor wafer falls into the clamping plate 224 through the falling channel 221, and is driven by the second power device, and the clamping plate 224 is driven by the second fan 226 to fall into the second fan 12 through the second fan;
after the semiconductor wafer is conveyed to the tail end position on the right side of the first conveying plate 11 through the first conveying plate 11, the first fan 218 is started when the semiconductor wafer is about to turn over by taking one end of the first conveying plate 11 as an axle center, and at the moment, the first power device drives the first movable gear 216 to move along the track of the arc-shaped tooth groove 214, the first fan 218 is always aligned to the semiconductor wafer in the moving process, not only can provide power for the semiconductor wafer in the turning over process, but also can blow impurities on the surface of the semiconductor wafer towards the direction of the arc-shaped plate 212, so that the impurities on the surface of the semiconductor wafer can be discharged out of the impurity removing cavity 211 through the drain hole 213, and the semiconductor wafer moves vertically downwards along the falling channel 221 after the semiconductor wafer is completely subjected to the action of gravity, at the moment, the first movable gear 216 continues to move along the track of the arc-shaped tooth groove 214, so that the first movable gear 216 can move back to the initial position for a circle, and the limiting groove 215 can stably move;
the semiconductor wafer falling through the falling channel 221 enters the clamping plate 224 through the guiding action of the guiding plate 227, the clamping plate 224 is clamped under the action of the elastic piece 225, the clamping plate 224 is required to be described to be positioned at the center of the semiconductor wafer, after the semiconductor wafer is received, the rotating plate 222 is driven by the second power device to rotate, after the semiconductor wafer is rotated to a certain angle (the angle can be separated from the clamping plate 224 according to the rotation angle of the semiconductor wafer), the purpose of the rotation angle is three, firstly, the second fan 226 can act on the other side of the semiconductor wafer while the semiconductor wafer is overturned, so that impurities can be removed from the surface of the other side of the semiconductor wafer while the semiconductor wafer is overturned, thirdly, the semiconductor wafer can be separated from the clamping plate 224 in the rotation angle, and falls onto the second conveying plate 12 along the rotation angle under the action of gravity, so that the semiconductor wafer is continuously conveyed, the semiconductor wafer can be further cooled down until the semiconductor wafer is completely separated from the clamping plate 224 after the semiconductor wafer is overturned, and the semiconductor wafer can be completely rotated to the initial rotation position after the semiconductor wafer is completely overturned.
Embodiment two:
referring to fig. 1 to 3, cooling units 3 are disposed on both sides of the cooling table 100, the cooling units 3 are used for uniformly cooling both sides of the semiconductor wafer which is conveyed and falls onto the cooling table 100, the cooling units 3 include a cooling assembly 31 connected with the cooling table 100, the cooling assembly 31 is disposed on one side of the output end of the second conveying plate 12, the cooling assembly 31 is used for driving the cooling table 100 to move and simultaneously cooling both sides of the semiconductor wafer, a docking assembly 32 is disposed on one side of the cooling assembly 31, and the docking assembly 32 is used for abutting against and docking the semiconductor wafer with the cooling table 100;
the docking assembly 32 may cooperate with the cooling assembly 31 to receive the flipped semiconductor wafer and convey it again to the cooling station 100, thereby cooling both sides thereof and making it more uniformly cooled.
Referring to fig. 9-20, the cooling assembly 31 includes a moving plate 311 disposed on one side of the cooling platform 100, a first moving track 312 is disposed on the moving plate 311, a tooth slot (not labeled in the drawing) is disposed on the first moving track 312, a first translation portion 313 and a first turning portion 314 are disposed on the first moving track 312, a second moving gear 315 is fixedly connected to the cooling platform 100, the second moving gear 315 is engaged with the first moving track 312, the second moving gear 315 is driven by a third power device, preferably a motor, not labeled in the motor drawing, a first limiting member 4 is disposed between the second moving gear 315 and the first translation portion 313, the first limiting member 4 is used for driving the second moving gear 315 to move in parallel with the cooling platform 100, the third power device drives the second moving gear 315 to move along the first moving track 312, so as to move in parallel with the first translation portion 313 and the first turning portion 314 by 180 degrees, the first limiting member 4 includes a first limiting block 41 connected to the first moving gear 315 coaxially, and the first limiting plate 41 is disposed on two sides of the first limiting plate 41 and is not matched with the first limiting plate 41;
the docking assembly 32 comprises a mounting plate 321 arranged on one side of the moving plate 311, a second moving track 322 is arranged on the mounting plate 321, tooth grooves (the tooth grooves are not marked in the figure) are formed in the second moving track 322, a second translating part 323 and a second overturning part 324 are arranged on the second moving track 322, the moving tracks of the second translating part 323, the first translating part 313 and the second overturning part 324 are different from those of the first overturning part 314, a third moving gear 325 is connected in an engaged manner in the second moving track 322, the third moving gear 325 is driven by a fourth power device, the fourth power device is preferably a motor, the motor is not marked in the figure, the third moving gear 325 is coaxially connected with a docking plate 326, the docking plate 326 is used for abutting against the cooling table 100 and enabling the docking plate 326 to follow the cooling table 100 for overturning 180 degrees, a second limiting piece 5 is arranged between the third moving gear 325, the second limiting piece 5 is used for enabling the third moving gear 325 to drive the docking plate 326 to move in parallel, the second limiting piece 326 comprises a limiting block 5 and a limiting block 51 which is coaxially connected with the second limiting plate 325, and is used for limiting the second limiting plate 51, and the second limiting plate 51 is not matched with the second limiting plate 51;
the semiconductor wafer moves along the second conveying plate 12, moves into the cooling table 100, the cooling table 100 rotates, so that a plurality of groups of semiconductor wafers can be accommodated in the cooling table 100, after the semiconductor wafer is fully paved on the cooling table 100, the third power device drives the second moving gear 315 to move along the first moving track 312, the first moving track 312 is in a communicated quarter arc shape, the second moving gear 315 firstly moves along the first translation part 313 thereof, namely moves along the radius direction of the quarter arc until moving to the position of the butt joint plate 326, and the second moving gear 315 can move but cannot rotate under the action of the first limiting block 41 and the first limiting plate 42 while moving along the radius direction of the quarter arc, so that the second moving gear 315 can vertically move to the bottom of the butt joint plate 326, and then continues to move along the first overturning part 314 of the first moving track 312, at this time, the first limiting block 41 is separated from the limitation of the first limiting plate 42, so that the first limiting block 41 can rotate when moving along the first turning part 314, the cooling table 100 continuously turns over in the process of moving along the first turning part 314, the cooling table 100 rotates for 90 degrees at the quarter of the arc of the first turning part 314, and when rotating to the tail end of the first turning part 314, 270 degrees of turning over occurs, meanwhile, the abutting plate 326 rotates together with the first limiting block, the third moving gear 325 moves along the second turning part 324 under the driving of the fourth power device, and the abutting plate 326 can turn over to the bottom of the cooling table 100 in the rotating process due to the different tracks of the second turning part 324 and the first turning part 314, so that the semiconductor wafer on the cooling table 100 can be received;
the docking plate 326, which is connected to the semiconductor wafer, continues to move along the second translation part 323 on the second moving track 322, and moves to a position far away from the cooling table 100, meanwhile, the cooling table 100 also continues to move along the first turnover part 314 at the same time until the cooling table 100 moves to the first translation part 313 again, and the cooling table 100 stops after having turned to an upward angle on the front (because the docking plate 326 moves to a direction far away from the cooling table 100 and does not interfere in the rotation process), the docking plate 326 continues to move along the direction of the second translation part 323 under the driving of the third moving gear 325, that is, moves towards the direction of the cooling table 100 until the semiconductor wafer, which is connected to the docking plate, falls onto the cooling table 100 again after moving to the overlapping position, on one hand, cools the other side of the semiconductor wafer on the cooling table 100, and the cooling time is the same as the time of the first placing and cooling on the cooling table 100, on the other hand, the docking plate 326 continues to move along the second translation part 323 until the docking plate 326 moves to a position far away from the cooling table 100, and the third moving gear is connected to the second limiting block 51, which is disconnected from the first rotating position of the docking plate 52 until the second limiting block is limited to rotate around the second limiting block 51;
it should be noted that, through experiments in the rotation process, the rotation device belongs to the prior art;
the butt plate 326 has a connecting shaft at the center thereof and a plurality of groups of adsorption plates capable of adsorbing semiconductor wafers along the circumferential direction thereof, and the adsorption plates can fix the semiconductor wafers and place them on the cooling table 100 after butt-joint.
The working principle of the application is as follows:
the first conveying and impurity removing process includes the steps that firstly, a semiconductor wafer is conveyed through a first conveying plate 11, after the semiconductor wafer is conveyed to the tail end position on the right side of the first conveying plate 11, when the semiconductor wafer is about to turn over by taking one end of the first conveying plate 11 as an axis, a first fan 218 is started to remove impurities on one side surface of the semiconductor wafer;
the semiconductor wafer which is turned over and falls down through the falling channel 221 is guided by the guide plate 227 to enter the clamping plate 224, and the second fan 226 is used for removing impurities on the other side surface of the semiconductor wafer in the process of turning over along with the rotating disc 222;
pre-cooling both sides, and pre-cooling both sides by using the cooling cavity 13 while conveying on the first conveying plate 11 and the second conveying plate 12;
the semiconductor wafer is cooled at one side, moves along the second conveying plate 12, moves into the cooling table 100, moves along the first translation part 313 of the first moving track 312 after the semiconductor wafer is fully paved on the cooling table 100, cools in the process, and is in butt joint with the butt joint plate 326;
the cooling table 100 is turned over together with the butt plate 326, and the butt plate 326 is turned over to the bottom of the cooling table 100, so that the semiconductor wafer is received, the received cooling table 100 continues to be turned over in rotation along the first turning part 314, and the butt plate 326 moves along the second translating part 323;
double-sided cooling, the butt plate 326 is translated again to the upper side of the cooling stage 100, and the semiconductor wafer is put on the cooling stage 100 moved to the first translation part 313, so that the cooling stage 100 continues to cool the other side of the semiconductor wafer;
and (3) finishing the blanking, blanking the cooled wafer by adopting a mechanical arm mode, and repeating the operation to continuously cool the semiconductor wafer.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, within the scope of the present application, should apply to the present application, and all equivalents and modifications as fall within the scope of the present application.
Claims (10)
1. A semiconductor cooling device comprising a cooling station (100), characterized in that it further comprises:
the conveying unit (1) is arranged on one side of the cooling table (100) and is used for conveying the semiconductor wafer to the cooling table (100) for cooling and cooling the two side surfaces of the semiconductor wafer in the conveying process;
the conveying unit (1) includes:
a first conveying plate (11), wherein the first conveying plate (11) is arranged at the top of the cooling table (100) and is used for receiving and conveying the semiconductor wafers;
the second conveying plate (12) is arranged at the bottom of the first conveying plate (11) and is used for continuously conveying the overturned semiconductor wafer;
a cooling cavity (13) for cooling both sides of the semiconductor wafer is arranged between the first conveying plate (11) and the second conveying plate (12);
the impurity removing unit (2) is arranged in the conveying unit (1) and is used for removing impurities on two sides of the semiconductor wafer in the conveying process;
and the cooling units (3) are arranged at two sides of the cooling table (100) and are used for uniformly cooling the two sides of the semiconductor wafer which falls onto the cooling table (100) through conveying.
2. A semiconductor cooling device according to claim 1, wherein the impurity removal unit (2) comprises:
the primary impurity removal assembly (21), the primary impurity removal assembly (21) is arranged at one end of the first conveying plate (11) and is used for cleaning one side surface of the semiconductor wafer;
and the re-impurity removing component (22) is arranged on one side of the second conveying plate (12) and used for cleaning the surface of the other side of the semiconductor wafer.
3. A semiconductor cooling device according to claim 1, characterized in that the cooling unit (3) comprises:
the cooling assembly (31) is connected with the cooling table (100), is arranged on one side of the output end of the second conveying plate (12), and is used for driving the cooling table (100) to move and simultaneously cooling two sides of the semiconductor wafer;
and the butt joint assembly (32) is arranged on one side of the cooling assembly (31) and is used for abutting against the cooling table (100) and butt-jointing the semiconductor wafer.
4. A semiconductor cooling device according to claim 2, wherein the primary impurity removal assembly (21) comprises:
the impurity removing cavity (211), the impurity removing cavity (211) is arranged along the length direction of the first conveying plate (11), an arc-shaped plate (212) is arranged at the bottom of the impurity removing cavity (211), and a leak hole (213) for discharging impurities is formed in the arc-shaped plate (212);
the arc-shaped tooth grooves (214) are formed in the side wall of the impurity removing cavity (211), the arc-shaped tooth grooves (214) are opposite to the arc-shaped plate (212), and limiting grooves (215) are formed in the outer portions of the arc-shaped tooth grooves (214) at equal intervals;
the first movable gear (216), the first movable gear (216) is meshed with the arc tooth grooves (214), the first movable gear (216) is driven by a first power device, the first movable gear (216) is coaxially connected with a movable rod (217), and the movable rod (217) is provided with a plurality of groups of first fans (218) along the length direction of the movable rod;
the first power device drives the first movable gear (216) to move along the track of the arc-shaped tooth slot (214), so that the first fan (218) moves along with the first movable gear and simultaneously removes impurities on one side surface of the semiconductor wafer.
5. A semiconductor cooling device according to claim 4, wherein the re-impurity removal assembly (22) comprises:
a falling channel (221), wherein a falling channel (221) is formed between the impurity removing cavity (211) and the side wall of the cooling cavity (13) and is used for enabling the semiconductor wafer to run to the tail end of the first conveying plate (11) along the first conveying plate so as to be overturned by gravity and fall;
the rotating disc (222) is arranged at one end of the second conveying plate (12), and the rotating disc (222) is driven by a second power device;
the positioning plate (223), the positioning plate (223) is connected with the rotating disc (222), and a clamping plate (224) is arranged in the positioning plate (223);
an elastic piece (225), wherein the elastic piece (225) is arranged between the placement plate (223) and the clamping plate (224);
the second fan (226) is arranged on one side, close to the placement plate (223), of the rotating disc (222) and is used for removing impurities from the surface of the turned semiconductor wafer;
the semiconductor wafer falls into the clamping plate (224) through the falling channel (221), and under the drive of the second power device, the clamping plate (224) rotates and removes impurities on the surface of the semiconductor wafer through the second fan (226), and meanwhile the semiconductor wafer falls onto the second conveying plate (12).
6. A semiconductor cooling device according to claim 5, characterized in that the top of the mounting plate (223) and the clamping plate (224) are provided with an introduction plate (227) for the semiconductor wafer.
7. A semiconductor cooling device according to claim 3, characterized in that the cooling assembly (31) comprises:
a moving plate (311), wherein the moving plate (311) is arranged on one side of the cooling table (100);
the first moving track (312), a first moving track (312) is arranged on the moving plate (311), a tooth slot is arranged on the first moving track (312), and a first translation part (313) and a first turnover part (314) are arranged on the first moving track (312);
the second movable gear (315), the second movable gear (315) is connected with the cooling table (100), the second movable gear (315) is meshed with the first movable track (312), and the second movable gear (315) is driven by a third power device;
a first limiting piece (4) is arranged between the second moving gear (315) and the first translation part (313), and the first limiting piece (4) is used for enabling the second moving gear (315) to drive the cooling table (100) to move in parallel;
the third power device drives the second moving gear (315) to move along the first moving track (312) so as to respectively move in parallel along the first translation part (313) and turn over the first turning part (314) for 180 degrees.
8. A semiconductor cooling device according to claim 3, wherein the docking assembly (32) comprises:
a mounting plate (321), wherein the mounting plate (321) is arranged on one side of the moving plate (311);
the second moving track (322) is arranged on the mounting plate (321), the second moving track (322) is provided with a tooth slot, and the second moving track (322) is provided with a second translation part (323) and a second turnover part (324);
the third moving gear (325) is in meshed connection with the second moving track (322), and the third moving gear (325) is driven by a fourth power device;
the third movable gear (325) is coaxially connected with the abutting plate (326), and the abutting plate (326) is used for abutting against the cooling table (100) and enabling the cooling table (100) to turn 180 degrees along with the cooling table to receive the semiconductor wafer;
and a second limiting piece (5) is arranged between the third movable gears (325) of the butt joint plate (326), and the second limiting piece (5) is used for enabling the third movable gears (325) to drive the butt joint plate (326) to move in parallel.
9. A semiconductor cooling device according to claim 7, wherein the first limiting member (4) comprises:
the first limiting block (41), the first limiting block (41) is coaxially connected with the second movable gear (315);
the first limiting plates (42), the first limiting plates (42) are arranged on the two sides, close to the first translation parts (313), of the moving plates (311), and the first limiting blocks (41) are matched with the first limiting plates (42) and used for limiting the first limiting blocks (41) to prevent the cooling table (100) from rotating.
10. A semiconductor cooling device according to claim 8, wherein the second limiting member (5) comprises:
the second limiting block (51), the second limiting block (51) is coaxially connected with the third movable gear (325);
the second limiting plates (52) are arranged on two sides, close to the second translation parts (323), of the mounting plate (321), and the second limiting blocks (51) are matched with the second limiting plates (52) and used for limiting the second limiting blocks (51) to enable the abutting plates (326) not to rotate.
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| CN202311648175.9A CN117352440B (en) | 2023-12-05 | 2023-12-05 | Semiconductor cooling device |
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| CN202311648175.9A CN117352440B (en) | 2023-12-05 | 2023-12-05 | Semiconductor cooling device |
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| JP2003224174A (en) * | 2002-01-30 | 2003-08-08 | Seiko Epson Corp | Semiconductor manufacturing apparatus and control method |
| KR20030097005A (en) * | 2002-06-18 | 2003-12-31 | 주식회사 엘티케이 | Apparatus for fabricating semiconductor device |
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