CN112687580A

CN112687580A - Cooling equipment for wafer production cutting

Info

Publication number: CN112687580A
Application number: CN202011428944.0A
Authority: CN
Inventors: 高洪庆; 吴禹凡
Original assignee: Suzhou Like Industrial Design Co ltd
Current assignee: Suzhou Like Industrial Design Co ltd
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-04-20

Abstract

The invention relates to the technical field of mechanical equipment, in particular to cooling equipment for wafer production and cutting, which can conveniently and rapidly reduce the temperature of a wafer by automatically intercepting and cooling the wafer, shorten the cooling time of the wafer, improve the working efficiency, simultaneously avoid the pollution of impurities in the outside air to the wafer when the wafer is kept still for cooling, conveniently protect the wafer and improve the practicability and reliability; including workstation, four groups landing legs and three group shroudings, four groups landing legs are all installed in the bottom of workstation, and the top left side of workstation is provided with pusher, and three group shroudings annular are evenly installed in pusher's the outside, and the direction of three group shroudings is relative, and the outside upside of every group shrouding all is provided with two sets of first push rods.

Description

Cooling equipment for wafer production cutting

Technical Field

The invention relates to the technical field of mechanical equipment, in particular to cooling equipment for wafer production and cutting.

Background

As is known, a wafer is a basic element of an electronic component, and is in a circular thin slice shape, the wafer is mainly formed by laser cutting a cylindrical silicon rod, after the wafer is cut, the temperature of the wafer is high, the electronic component cannot be directly mounted on the wafer, and the wafer needs to be cooled.

Disclosure of Invention

In order to solve the technical problems, the invention provides the cooling equipment for wafer production cutting, which can conveniently and quickly reduce the temperature of the wafer, shorten the cooling time of the wafer, improve the working efficiency, simultaneously avoid the pollution of impurities in the outside air to the wafer when the wafer is kept still for cooling, conveniently protect the wafer and improve the practicability and reliability.

The invention relates to cooling equipment for wafer production and cutting, which comprises a workbench, four groups of supporting legs and three groups of sealing plates, wherein the four groups of supporting legs are all arranged at the bottom of the workbench, a pushing device is arranged on the left side of the top of the workbench, the three groups of sealing plates are annularly and uniformly arranged on the outer side of the pushing device, the directions of the three groups of sealing plates are opposite, two groups of first push rods are arranged on the upper outer side of each group of sealing plates, a first supporting plate is arranged on the lower outer side of each group of sealing plates, a fine hole sucking disc is arranged on the outer side of each group of first supporting plate, each group of fine hole sucking discs are communicated with an external air pump, a cooling bin is arranged on the right side of the top of the workbench, a central control box is arranged on the front side of the cooling bin, a through hole is communicated with the left side, the multiple groups of spray heads are all positioned in the through holes, the positions of the multiple groups of spray heads are staggered with the positions of the two groups of first push rods on each group of sealing plates, the right side of the cover plate is provided with an air guide bin which is communicated with the right sides of the multiple groups of spray heads, the right lower side of the cooling bin is communicated with a first air pipe, the lower side input end of the first air pipe is inclined, the top of the cooling bin is provided with a refrigerating bin, the inside of the refrigerating bin is vertically provided with a spiral refrigerating tank, the upper side inside the spiral refrigerating tank is provided with an air dispersing hopper, the top of the refrigerating bin is provided with a suction pump, the upper side input end and the lower side output end of the suction pump are respectively communicated with the upper side output end of the first air pipe and the upper side input end of the air dispersing hopper, the left lower side of the refrigerating bin is communicated with a second air pipe, the rear side of the top of the refrigerating bin is vertically provided with an air guide barrel, the inner part of the air guide barrel is provided with a piston block in a sealing and sliding manner, the bottom of the piston block is provided with a second push rod, the bottom of the second push rod penetrates through the bottom of the air guide barrel and extends into the cooling bin, the second push rod is connected with the air guide barrel in a sliding and sealing manner, the bottom of the second push rod is rotatably provided with a third push rod, the third push rod is inclined, the bottom of the third push rod is rotatably arranged on the upper right side of the air guide bin, a third air pipe is communicated with the upper right side of the air guide bin, the upper side input end of the third air pipe is arranged on the air guide barrel, the piston block blocks the rear side output end of the second air pipe and the upper side input end of the third air pipe on the air guide barrel, and the central control box is respectively connected with a; the wafer after external cutting is placed at the top of the fine hole sucker on the left rear side sealing plate, an external air pump can suck air inside the fine hole sucker on the left rear side, the fine hole sucker on the left rear side adsorbs and fixes the wafer on the fine hole sucker on the left rear side, the central control box controls the pushing device to rotate anticlockwise and drives the wafer to rotate, the wafer rotates to the right side of the pushing device and corresponds to the position of a left opening of the cooling bin, the central control box controls the pushing device to push the right side sealing plate and two groups of first push rods, a first supporting plate, the fine hole sucker and the wafer on the right side sealing plate to move rightwards, the two groups of first push rods on the right side sealing plate are firstly contacted with the left upper side of the cover plate in the opening and push the cover plate to open anticlockwise, the cover plate drives the air guide bin to rotate anticlockwise to the horizontal state, the first supporting plate, the pore sucking disc and the wafer all extend into the cooling bin through the through hole, the right sealing plate is covered on the left side of the through hole, when the cover plate rotates, the cover plate pushes the second push rod to move upwards through the air guide bin and the third push rod, the second push rod drives the piston block to move upwards in the air guide barrel, the piston block is far away from the rear side input end of the second air pipe and the upper side input end of the third air pipe and stops plugging the second air pipe and the third air pipe, at the moment, the second air pipe can be communicated with the third air pipe through the air guide barrel, the central control box controls to open the spiral refrigerating tank and the suction pump, the spiral refrigerating tank carries out refrigeration and cooling treatment on the air in the refrigerating bin and forms cold air flow, the suction pump extracts the air in the cooling bin through the first air pipe and discharges the air into the spiral refrigerating tank in the refrigerating bin through the air dispersing hopper, the air discharged into the refrigerating bin diffuses to the periphery of the spiral refrigerating tank and cools, cold air in the refrigerating bin is discharged into the air guide bin through the second air pipe, the air guide barrel and the third air pipe, the cold air in the air guide bin flows through a plurality of groups of nozzles to be sprayed downwards onto a wafer in the cooling bin, so that the wafer is cooled, the cold air in the cooling bin flows downwards and reenters the first air pipe through the lower side input end of the first air pipe, after the wafer in the cooling bin is cooled, the suction pump is closed, the central control box controls the right side sealing plate and the first push rod, the first supporting plate, the pore sucking disc and the wafer on the right side sealing plate to move leftwards and return to the initial position, at the moment, the right side sealing plate stops covering work on the opening on the left side of the cooling bin, the spring pushes the cover plate to rotate clockwise and cover the opening again, the cover plate drives the piston block to move downwards to the initial position through the air guide bin, the third push rod and the second push rod, and the piston block blocks the rear side output end of the second air, well accuse case control pusher rotates and will next a set of wafer conveying to the left side in cooling bin, and the pore sucking disc on three group's shroudings can carry out pay-off work to the wafer in succession, thereby realize the continuous automatic cooling treatment to the wafer, through carrying out automatic interception cooling treatment to the wafer, can conveniently make the wafer temperature reduce fast, shorten its cooling time, improve work efficiency, when avoiding the long cooling of stewing of wafer simultaneously, the pollution that causes it of impurity in the outside air, conveniently protect the wafer, improve practicality and reliability.

The invention relates to cooling equipment for wafer production and cutting, which comprises a pushing device, a fixed column, an annular slide rail, a power ring, a rotating platform, a first motor, a rotating shaft and a gear, wherein the fixed column is arranged at the left side of the top of a workbench, the annular slide rail is sleeved on the upper side of the outer wall of the fixed column, a plurality of groups of arc-shaped slide blocks are uniformly arranged on the outer wall of the annular slide rail in a sliding manner, the power ring is sleeved on the outer wall of the plurality of groups of arc-shaped slide blocks, a plurality of groups of teeth are uniformly arranged on the lower side of the inner wall of the power ring in an annular manner, the rotating platform is positioned above the fixed column, the bottom of the rotating platform is fixed at the top of the power ring, three groups of T-shaped fixed plates are uniformly arranged on the top of the rotating platform in an annular manner, the directions of the three groups, the extension ends of three groups of oil cylinder push rods on each group of T-shaped fixed plates penetrate through the T-shaped fixed plates and are installed on corresponding sealing plates, a first motor is located on the front side of a fixed column, the first motor is installed on the left front side of the top of a workbench, a rotating shaft is installed on the upper side output end of the first motor, a gear is installed on the top of the rotating shaft, the gear is located on the inner front side of a power ring and is meshed with teeth on the lower side of the inner wall of the power ring, and a central control box is in signal connection with each group of oil cylinder push rods and; the first motor is opened in well accuse case control, first motor drives gear revolve through the pivot, gear and the tooth meshing on the power ring, the gear drives the power ring and rotates, the power ring drives multiunit arc slider and slides on annular slide rail, simultaneously the power ring drives the revolving platform and rotates, the revolving platform drives every group T type fixed plate and every group hydro-cylinder push rod rotation on it, three group hydro-cylinder push rods on every group T type fixed plate drive corresponding shrouding and rotate, thereby realize the rotatory pay-off work to the wafer, simultaneously when the wafer conveying to the right side of revolving platform, well accuse case promotes the right side through three group hydro-cylinder push rods on the right side T type fixed plate and moves the shrouding right, thereby conveniently push the wafer on the right side shrouding into the cooling chamber, realize the propelling movement material work of wafer.

The invention relates to a cooling device for wafer production and cutting, which further comprises an installation platform, two groups of linear guide rails, two groups of linear sliding blocks, two groups of second motors, a bow-shaped frame, two groups of transmission shafts, a third motor and a synchronous belt, wherein the installation platform is installed on the left front side of a workbench, the installation direction of the installation platform is inclined, the directions of the two groups of linear guide rails correspond to the directions of the installation platform, the two groups of linear guide rails are installed on the installation platform, the two groups of linear sliding blocks are respectively installed on the two groups of linear guide rails in a sliding manner, lead screws are respectively inserted in the two groups of linear sliding blocks, the directions of the two groups of lead screws correspond to the installation direction of the installation platform, the two groups of lead screws are respectively in screw assembly connection with the two groups of linear sliding blocks, second support plates are respectively arranged on the left front side and the right rear side of the two groups of lead screws in, the right rear side output ends of the two groups of second motors respectively penetrate through the left front side two groups of second support plates and are in transmission connection with the left front sides of the two groups of screw rods, the left rear side and the right front side of the bottom of the arched frame are respectively installed on the two groups of linear sliding blocks, the two groups of transmission shafts are vertically and rotatably installed on the rear side wall of the arched frame, the directions of the two groups of transmission shafts correspond to the installation direction of the installation platform, the third motor is installed on the front side wall of the arched frame, the right rear side output end of the third motor penetrates through the arched frame and is in transmission connection with the right front side transmission shaft, the synchronous belt is laid on the outer walls of the two groups of transmission shafts and drives the two groups of transmission shafts to perform synchronous; opening a third motor, driving a synchronous belt by the third motor through a right front side transmission shaft, enabling a plurality of groups of soft hairbrushes on the synchronous belt and a left rear side transmission shaft to rotate, enabling bottoms of the plurality of groups of soft hairbrushes on the synchronous belt in a rotating state to be in contact with the upper surface of the wafer when the wafer on the pushing device rotates to the left front side of the pushing device, enabling the plurality of groups of soft hairbrushes to brush and clean the upper surface of the wafer so as to remove impurities on the surface of the wafer, opening two groups of second motors after the wafer is cleaned, driving two groups of lead screws to rotate by the two groups of second motors, connecting the two groups of lead screws with two groups of linear sliding blocks in a screw assembly mode respectively, driving the two groups of linear sliding blocks to move towards the left front side on the two groups of linear guide rails, driving the cambered frame, the two groups of transmission shafts, the third motor, the synchronous belt and the plurality of soft, thereby make things convenient for pusher to continue to rotate, prevent that shrouding and hold-in range on it from colliding, when the wafer after the clearance rotates to pusher's right side, the next set of wafer on the pusher rotates to left front side, and two sets of second motor reverse run promote the hold-in range and remove the upside to left front side wafer, and multiunit pappus brush on the hold-in range clears up the wafer surface again, improves practicality and reliability.

The cooling equipment for wafer production and cutting further comprises a right-angle plate, a push rod and a first contact switch, wherein the bottom of the right-angle plate is installed at the top of the piston block, the top of the right-angle plate penetrates through the top of the air guide barrel and extends out of the air guide barrel, the right-angle plate is connected with the air guide barrel in a sliding and sealing mode, the push rod is installed on the rear side of the air guide barrel, the upper side of the push rod is located above the air guide barrel, the first contact switch is installed on the upper side of the push rod, the position of the first contact switch corresponds to the position of the top of the right-angle plate, and the first contact switch is electrically connected with the; when piston piece rebound, the piston piece promotes the square plate rebound, the top of square plate and first contact switch's top contact, first contact switch transmits contact signal to the well accuse incasement, well accuse case control suction pump operation, when piston piece rebound, the square plate rebound and with the separation of first contact switch, first contact switch stops to well accuse incasement transmission contact signal, well accuse case control suction pump is closed, through setting up the square plate, ejector pin and first contact switch, can conveniently carry out automatic control to the switch opportunity of suction pump, improve practicality and reliability.

The cooling equipment for wafer production and cutting further comprises a second contact switch, wherein the second contact switch is installed on the right front side linear sliding block, the position of the second contact switch corresponds to the position of the left front side second supporting plate, and the second contact switch is electrically connected with the central control box; after the left front side wafer is cleaned, the right front side linear sliding block slides to the left front side on the right front side linear guide rail, the right front side linear sliding block drives the second contact switch to move, the second contact switch is in contact with the left front side second support plate, the synchronous belt is kept away from the left front side sealing plate at the moment, the second contact switch transmits contact signals to the central control box, the first motor capable of being controlled by the central control box at the moment is operated, the push device is controlled to operate, the second contact switch is arranged, the push device can be conveniently controlled to operate when the synchronous belt is kept away from the left front side sealing plate, the synchronous belt is prevented from colliding with the push device, the operation opportunity of the push device is conveniently controlled, and the practicability is improved.

The cooling equipment for wafer production and cutting also comprises a temperature detector, wherein the temperature detector is arranged at the left lower side of the cooling bin; through setting up the thermometer, can conveniently detect the cold air current temperature in the storehouse that refrigerates, improve the practicality.

The cooling equipment for wafer production and cutting further comprises two groups of water discharging pipes and two groups of water valves, wherein the two groups of water discharging pipes are respectively arranged on the right lower side of the cooling bin and the right lower side of the refrigerating bin, and the two groups of water valves are respectively arranged on the two groups of water discharging pipes; the cold air flow in the cooling bin and the refrigerating bin can condense the moisture in the air in the cooling bin and the refrigerating bin, the moisture is condensed and respectively deposited at the bottom of the cooling bin and the bottom of the refrigerating bin, two groups of water valves are opened, and the water in the cooling bin and the water in the refrigerating bin can be discharged to the outside through two groups of water discharge pipes.

The cooling equipment for wafer production and cutting further comprises a baffle, wherein the baffle is positioned on the outer side of the first motor and the rotating shaft, the baffle is positioned below the power ring, and the bottom of the baffle is arranged on the workbench; through setting up the baffle, can conveniently shelter from the protection to first motor and pivot, improve practicality and reliability.

Compared with the prior art, the invention has the beneficial effects that: the wafer after external cutting is placed at the top of the fine hole sucker on the left rear side sealing plate, an external air pump can suck air inside the fine hole sucker on the left rear side, the fine hole sucker on the left rear side adsorbs and fixes the wafer on the fine hole sucker on the left rear side, the central control box controls the pushing device to rotate anticlockwise and drives the wafer to rotate, the wafer rotates to the right side of the pushing device and corresponds to the position of a left opening of the cooling bin, the central control box controls the pushing device to push the right side sealing plate and two groups of first push rods, a first supporting plate, the fine hole sucker and the wafer on the right side sealing plate to move rightwards, the two groups of first push rods on the right side sealing plate are firstly contacted with the left upper side of the cover plate in the opening and push the cover plate to open anticlockwise, the cover plate drives the air guide bin to rotate anticlockwise to the horizontal state, the first supporting plate, the pore sucking disc and the wafer all extend into the cooling bin through the through hole, the right sealing plate is covered on the left side of the through hole, when the cover plate rotates, the cover plate pushes the second push rod to move upwards through the air guide bin and the third push rod, the second push rod drives the piston block to move upwards in the air guide barrel, the piston block is far away from the rear side input end of the second air pipe and the upper side input end of the third air pipe and stops plugging the second air pipe and the third air pipe, at the moment, the second air pipe can be communicated with the third air pipe through the air guide barrel, the central control box controls to open the spiral refrigerating tank and the suction pump, the spiral refrigerating tank carries out refrigeration and cooling treatment on the air in the refrigerating bin and forms cold air flow, the suction pump extracts the air in the cooling bin through the first air pipe and discharges the air into the spiral refrigerating tank in the refrigerating bin through the air dispersing hopper, the air discharged into the refrigerating bin diffuses to the periphery of the spiral refrigerating tank and cools, cold air in the refrigerating bin is discharged into the air guide bin through the second air pipe, the air guide barrel and the third air pipe, the cold air in the air guide bin flows through a plurality of groups of nozzles to be sprayed downwards onto a wafer in the cooling bin, so that the wafer is cooled, the cold air in the cooling bin flows downwards and reenters the first air pipe through the lower side input end of the first air pipe, after the wafer in the cooling bin is cooled, the suction pump is closed, the central control box controls the right side sealing plate and the first push rod, the first supporting plate, the pore sucking disc and the wafer on the right side sealing plate to move leftwards and return to the initial position, at the moment, the right side sealing plate stops covering work on the opening on the left side of the cooling bin, the spring pushes the cover plate to rotate clockwise and cover the opening again, the cover plate drives the piston block to move downwards to the initial position through the air guide bin, the third push rod and the second push rod, and the piston block blocks the rear side output end of the second air, well accuse case control pusher rotates and will next a set of wafer conveying to the left side in cooling bin, and the pore sucking disc on three group's shroudings can carry out pay-off work to the wafer in succession, thereby realize the continuous automatic cooling treatment to the wafer, through carrying out automatic interception cooling treatment to the wafer, can conveniently make the wafer temperature reduce fast, shorten its cooling time, improve work efficiency, when avoiding the long cooling of stewing of wafer simultaneously, the pollution that causes it of impurity in the outside air, conveniently protect the wafer, improve practicality and reliability.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a schematic top right oblique view of the present invention;

FIG. 3 is a schematic diagram of an oblique view of the interior of the cooling chamber of FIG. 1;

FIG. 4 is an enlarged view of the interior of the airway bucket of FIG. 3;

in the drawings, the reference numbers: 1. a work table; 2. a support leg; 3. closing the plate; 4. a first push rod; 5. a first support plate; 6. a fine hole sucker; 7. a cooling bin; 8. a central control box; 9. a cover plate; 10. a spring; 11. a spray head; 12. a gas guiding bin; 13. a first air pipe; 14. a refrigeration bin; 15. a spiral refrigeration tank; 16. a gas dispersing funnel; 17. a suction pump; 18. a second air pipe; 19. a gas guiding barrel; 20. a piston block; 21. a second push rod; 22. a third push rod; 23. a third air pipe; 24. fixing a column; 25. an annular slide rail; 26. an arc-shaped sliding block; 27. a power ring; 28. a rotating table; 29. a T-shaped fixing plate; 30. a cylinder push rod; 31. a first motor; 32. a rotating shaft; 33. a gear; 34. an installation table; 35. a linear guide rail; 36. a linear slider; 37. a lead screw; 38. a second support plate; 39. a second motor; 40. an arched frame; 41. a drive shaft; 42. a third motor; 43. a synchronous belt; 44. a right-angle plate; 45. a top rod; 46. a first contact switch; 47. a second contact switch; 48. a temperature detector; 49. a drain pipe; 50. a water valve; 51. and a baffle plate.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

As shown in fig. 1 to 4, in the cooling apparatus for wafer production and cutting of the present invention, during operation, an externally cut wafer is placed on top of the fine hole chuck 6 on the left rear sealing plate 3, an external air pump can suck air into the left rear fine hole chuck 6, the left rear fine hole chuck 6 can adsorb and fix the wafer thereon, the central control box 8 controls the pushing device to rotate counterclockwise and drive the wafer to rotate, the wafer rotates to the right side of the pushing device and corresponds to the position of the opening on the left side of the cooling chamber 7, the central control box 8 controls the pushing device to push the right sealing plate 3 and two sets of first push rods 4 thereon, the first support plate 5, the fine hole chuck 6 and the wafer to move rightward, the two sets of first push rods 4 on the right sealing plate 3 first contact with the upper left side of the cover plate 9 in the opening and push the cover plate 9 to open counterclockwise, the cover plate 9 drives the air guiding chamber 12 to rotate counterclockwise to, at the moment, the plurality of groups of nozzles 11 rotate to a vertical state, the cover plate 9 pushes the spring 10 to generate elastic deformation, at the moment, two groups of first push rods 4, the first support plate 5, the fine hole sucker 6 and the wafer on the right sealing plate 3 extend into the cooling bin 7 through the through opening, the right sealing plate 3 covers the left side of the through opening, when the cover plate 9 rotates, the cover plate 9 pushes the second push rod 21 to move upwards through the air guide bin 12 and the third push rod 22, the second push rod 21 drives the piston block 20 to move upwards in the air guide bin 19, the piston block 20 is far away from the rear side input end of the second air pipe 18 and the upper side input end of the third air pipe 23 and stops plugging the second air pipe 18 and the third air pipe 23, at the moment, the second air pipe 18 can be communicated with the third air pipe 23 through the air guide bin 19, the middle control box 8 controls the opening of the spiral refrigeration tank 15 and the suction pump 17, the spiral refrigeration tank 15 refrigerates and cools the air in, the suction pump 17 pumps air in the cooling bin 7 out through the first air pipe 13 and discharges the air into the spiral refrigeration tank 15 in the refrigeration bin 14 through the air dispersing hopper 16, the air discharged into the refrigeration bin 14 is diffused to the periphery of the spiral refrigeration tank 15 and cooled to form cold air flow, the cold air flow in the refrigeration bin 14 is discharged into the air guide bin 12 through the second air pipe 18, the air guide bucket 19 and the third air pipe 23, the cold air flow in the air guide bin 12 is downwards sprayed out of the wafer in the cooling bin 7 through the plurality of groups of nozzles 11 so as to cool the wafer, the cold air flow in the cooling bin 7 downwards flows and reenters the first air pipe 13 through the input end at the lower side of the first air pipe 13, after the wafer in the cooling bin 7 is cooled, the suction pump 17 is closed, the middle control box 8 controls the right sealing plate 3 and the first push rod 4, the first supporting plate 5, the fine hole sucker 6 and the wafer thereon to move leftwards and restore to the initial position, at this moment, the right sealing plate 3 stops the covering work of the left opening of the cooling bin 7, the spring 10 pushes the cover plate 9 to rotate clockwise and cover the opening again, the cover plate 9 passes through the air guide bin 12, the third push rod 22 and the second push rod 21 drive the piston block 20 to move downwards to the initial position, the piston block 20 blocks the rear side output end of the second air pipe 18 and the upper side input end of the third air pipe 23 again, the central control box 8 controls the pushing device to rotate and convey the next group of wafers to the left side of the cooling bin 7, the pore suckers 6 on the three sealing plates 3 can continuously feed the wafers, and therefore continuous automatic cooling treatment of the wafers is achieved.

The main functions realized by the invention are as follows: the wafer is automatically intercepted and cooled, so that the temperature of the wafer can be conveniently and rapidly reduced, the cooling time of the wafer is shortened, the working efficiency is improved, meanwhile, the pollution caused by impurities in the outside air when the wafer is kept still for cooling is avoided, and the wafer is conveniently protected; the pushing device works in a mode that the central control box 8 controls to open the first motor 31, the first motor 31 drives the gear 33 to rotate through the rotating shaft 32, the gear 33 is meshed with teeth on the power ring 27, the gear 33 drives the power ring 27 to rotate, the power ring 27 drives the plurality of groups of arc-shaped sliding blocks 26 to slide on the annular sliding rail 25, meanwhile, the power ring 27 drives the rotating platform 28 to rotate, the rotating platform 28 drives each group of T-shaped fixing plates 29 and each group of oil cylinder push rods 30 on the rotating platform to rotate, the three groups of oil cylinder push rods 30 on each group of T-shaped fixing plates 29 drive the corresponding sealing plates 3 to rotate, thereby realizing the rotary feeding work of the wafer, and when the wafer is conveyed to the right side of the rotary table 28, the central control box 8 pushes the right sealing plate 3 to move rightwards through three groups of oil cylinder push rods 30 on the right T-shaped fixing plate 29, therefore, the wafer on the right sealing plate 3 can be conveniently pushed into the cooling bin 7, and the pushing work of the wafer is realized; the third motor 42 is turned on, the third motor 42 drives the synchronous belt 43 through the right front transmission shaft 41, the multiple sets of the soft brushes on the synchronous belt 43 and the left rear transmission shaft 41 rotate, when the wafer on the pushing device rotates to the left front side of the pushing device, the bottoms of the multiple sets of the soft brushes on the rotating synchronous belt 43 can be contacted with the upper surface of the wafer, the multiple sets of the soft brushes can brush and clean the upper surface of the wafer so as to remove impurities on the surface of the wafer, after the wafer is cleaned, the two sets of the second motors 39 are turned on, the two sets of the second motors 39 drive the two sets of the lead screws 37 to rotate, the two sets of the lead screws 37 are respectively connected with the two sets of the linear sliding blocks 36 in a screw assembly mode, the two sets of the lead screws 37 drive the two sets of the linear sliding blocks 36 to move towards the left front side on the two sets of the linear guide rails 35, the two sets of the linear sliding blocks 36, the synchronous belt 43 is far away from the wafer on the left front side of the pushing device, so that the pushing device can conveniently continue to rotate, the sealing plate 3 on the pushing device is prevented from colliding with the synchronous belt 43, when the cleaned wafer rotates to the right side of the pushing device, the next group of wafers on the pushing device rotate to the left front side, the two groups of second motors 39 run reversely and push the synchronous belt 43 to move to the upper side of the wafer on the left front side, and the surfaces of the wafers are cleaned again by the multiple groups of soft brushes on the synchronous belt 43; when the piston block 20 moves upwards, the piston block 20 pushes the right-angle plate 44 to move upwards, the top of the right-angle plate 44 is in contact with the top of the first contact switch 46, the first contact switch 46 transmits a contact signal into the central control box 8, the central control box 8 controls the suction pump 17 to operate, when the piston block 20 moves downwards, the right-angle plate 44 moves downwards and is separated from the first contact switch 46, the first contact switch 46 stops transmitting the contact signal into the central control box 8, the central control box 8 controls the suction pump 17 to be closed, and the opening and closing time of the suction pump 17 can be automatically controlled conveniently by arranging the right-angle plate 44, the ejector rod 45 and the first contact switch 46; after the left front side wafer is cleaned, the right front side linear sliding block 36 slides to the left front side on the right front side linear guide rail 35, the right front side linear sliding block 36 drives the second contact switch 47 to move, the second contact switch 47 is in contact with the left front side second supporting plate 38, the synchronous belt 43 is far away from the left front side sealing plate 3 at the moment, the second contact switch 47 transmits a contact signal into the central control box 8, the central control box 8 can control the first motor 31 to operate so as to control the operation of the pushing device, and by arranging the second contact switch 47, the operation of the pushing device can be conveniently controlled when the synchronous belt 43 is far away from the left front side sealing plate 3, the synchronous belt 43 is prevented from colliding with the pushing device, and the operation time of the pushing device is conveniently controlled; the temperature of the cold air flow in the refrigerating bin 14 can be conveniently detected by arranging the temperature detector 48; the cold air flow in the cooling bin 7 and the refrigerating bin 14 can condense the moisture in the air in the cooling bin 7 and the refrigerating bin 14, the moisture is condensed and respectively deposited at the bottom of the cooling bin 7 and the bottom of the refrigerating bin 14, the two groups of water valves 50 are opened, and the water in the cooling bin 7 and the water in the refrigerating bin 14 can be discharged to the outside through the two groups of water discharge pipes 49; through setting up baffle 51, can conveniently shelter from the protection to first motor 31 and pivot 32, improve practicality and reliability.

According to the cooling equipment for wafer production and cutting, the installation mode, the connection mode or the arrangement mode are common mechanical modes, and the cooling equipment can be implemented as long as the beneficial effects of the cooling equipment can be achieved; the central control box 8, the spiral refrigeration tank 15, the oil cylinder push rod 30, the first contact switch 46, the second contact switch 47 and the temperature detector 48 can be purchased in the market.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A cooling device for wafer production and cutting is characterized by comprising a workbench (1), four groups of supporting legs (2) and three groups of sealing plates (3), wherein the four groups of supporting legs (2) are all arranged at the bottom of the workbench (1), a pushing device is arranged on the left side of the top of the workbench (1), the three groups of sealing plates (3) are uniformly arranged on the outer side of the pushing device in an annular mode, the three groups of sealing plates (3) are opposite in direction, two groups of first push rods (4) are arranged on the upper outer side of each group of sealing plates (3), a first supporting plate (5) is arranged on the lower outer side of each group of sealing plates (3), pore suckers (6) are arranged on the outer side of each group of first supporting plates (5), each group of pore suckers (6) is communicated with an external air pump, a cooling bin (7) is arranged on the right side of the top of the workbench (1), a central control box (8) is arranged on the front, a cover plate (9) is arranged on the right side of the through hole in a covering mode, the top of the cover plate (9) is hinged to the upper left side of the inner wall of the cooling bin (7) through a spring (10), a plurality of groups of spray heads (11) are uniformly arranged on the left side of the cover plate (9), the plurality of groups of spray heads (11) are all located in the through hole, the positions of the plurality of groups of spray heads (11) are staggered with the positions of two groups of first push rods (4) on each group of sealing plates (3), an air guide bin (12) is arranged on the right side of the cover plate (9), the air guide bin (12) is communicated with the right sides of the plurality of groups of spray heads (11), a first air pipe (13) is communicated with the right lower side of the cooling bin (7), the lower side input end of the first air pipe (13) is inclined, a cooling bin (14) is arranged on the top of the cooling bin (7), a spiral cooling bin (14) is vertically arranged in the, an upper side input end and a lower side output end of a suction pump (17) are respectively communicated with an upper side output end of a first air pipe (13) and an upper side input end of an air dispersing hopper (16), a second air pipe (18) is communicated with the left lower side of a refrigerating bin (14), an air guide barrel (19) is vertically arranged on the rear side of the top of the refrigerating bin (7), the bottom of the air guide barrel (19) extends into the upper side inside the refrigerating bin (7), a rear side output end of the second air pipe (18) is installed on the left lower side of the air guide barrel (19) and is communicated with the inside of the air guide barrel (19), a piston block (20) is arranged in the air guide barrel (19) in a sealing and sliding mode, a second push rod (21) is arranged at the bottom of the piston block (20), the bottom of the second push rod (21) penetrates through the bottom of the air guide barrel (19) and extends into the refrigerating bin (7), the second push rod (21) is connected with the air guide barrel (19) in a sliding and sealing mode, a third push rod (, third push rod (22) slope, the bottom of third push rod (22) is rotated and is installed the upper right side in air guide bin (12), the upper right side intercommunication in air guide bin (12) is provided with third trachea (23), the upside input of third trachea (23) is installed on air guide bucket (19), piston block (20) carry out the shutoff to the rear side output of second trachea (18) and the upside input of third trachea (23) on air guide bucket (19) and handle, well accuse case (8) respectively with pusher, spiral refrigeration jar (15) and suction pump (17) signal connection.

2. The cooling equipment for wafer production and cutting as claimed in claim 1, wherein the pushing device comprises a fixed column (24), an annular slide rail (25), a power ring (27), a rotating table (28), a first motor (31), a rotating shaft (32) and a gear (33), the fixed column (24) is installed on the left side of the top of the workbench (1), the annular slide rail (25) is sleeved on the upper side of the outer wall of the fixed column (24), a plurality of groups of arc-shaped sliders (26) are uniformly arranged on the outer wall of the annular slide rail (25) in a sliding manner, the power ring (27) is sleeved on the outer wall of the plurality of groups of arc-shaped sliders (26), a plurality of groups of teeth are uniformly arranged on the lower side of the inner wall of the power ring (27) in an annular manner, the rotating table (28) is positioned above the fixed column (24), the bottom of the rotating table (28) is fixed on the top of the power ring (27), three groups of T-shaped fixing plates (29) are opposite in direction, the positions of the three groups of T-shaped fixing plates (29) respectively correspond to the positions of the three groups of sealing plates (3), three groups of oil cylinder push rods (30) are arranged on each group of T-shaped fixing plates (29), the three groups of oil cylinder push rods (30) on each group of T-shaped fixing plates (29) are distributed in a triangular mode, the extending ends of the three groups of oil cylinder push rods (30) on each group of T-shaped fixing plates (29) penetrate through the T-shaped fixing plates (29) and are installed on the corresponding sealing plates (3), a first motor (31) is located on the front side of a fixing column (24), the first motor (31) is installed on the left front side of the top of the workbench (1), a rotating shaft (32) is installed on the output end of the upper side of the first motor (31), a gear (33) is installed on the top of the rotating shaft (32), the gear (33) is located on the inner front, the central control box (8) is respectively in signal connection with each group of oil cylinder push rods (30) and the first motor (31).

3. The cooling device for wafer production and cutting as claimed in claim 2, further comprising an installation table (34), two sets of linear guide rails (35), two sets of linear sliders (36), two sets of second motors (39), an arch-shaped frame (40), two sets of transmission shafts (41), a third motor (42) and a synchronous belt (43), wherein the installation table (34) is installed on the left front side of the workbench (1), the installation direction of the installation table (34) is inclined, the directions of the two sets of linear guide rails (35) correspond to the direction of the installation table (34), the two sets of linear guide rails (35) are installed on the installation table (34), the two sets of linear sliders (36) are respectively installed on the two sets of linear guide rails (35) in a sliding manner, the two sets of linear sliders (36) are respectively inserted with lead screws (37), the directions of the two sets of lead screws (37) correspond to the installation direction of the installation table (34), and the two sets of lead screws (37) are respectively connected with the linear sliders (36) in a threaded manner, the left front side and the right rear side of the two groups of screw rods (37) are respectively provided with a second support plate (38) in a rotating way, the bottom of each group of second support plates (38) is fixed on the mounting table (34), the two groups of second motors (39) are respectively arranged on the left front side of the mounting table (34), the right rear side output ends of the two groups of second motors (39) respectively penetrate through the two groups of second support plates (38) on the left front side and are in transmission connection with the left front side of the two groups of screw rods (37), the left rear side and the right front side of the bottom of the arched frame (40) are respectively arranged on the two groups of linear sliding blocks (36), the two groups of transmission shafts (41) are respectively arranged on the rear side wall of the arched frame (40) in a vertical rotating way, the directions of the two groups of transmission shafts (41) are respectively corresponding to the mounting direction of the mounting table (34), the third motor (42) is arranged on the front side wall of the arched frame (40), the right rear side output end of the third motor (42) penetrates, the synchronous belts (43) are laid on the outer walls of the two groups of transmission shafts (41) and drive the two groups of transmission shafts (41) to perform synchronous transmission, and a plurality of groups of soft brushes are uniformly arranged on the outer walls of the synchronous belts (43).

4. The cooling device for wafer production and cutting as claimed in claim 3, further comprising a right-angle plate (44), a top rod (45) and a first contact switch (46), wherein the bottom of the right-angle plate (44) is installed at the top of the piston block (20), the top of the right-angle plate (44) penetrates through the top of the air guide barrel (19) and extends out of the upper portion of the air guide barrel (19), the right-angle plate (44) is connected with the air guide barrel (19) in a sliding and sealing mode, the top rod (45) is installed on the rear side of the air guide barrel (19), the upper side of the top rod (45) is located above the air guide barrel (19), the first contact switch (46) is installed on the upper side of the top rod (45), the position of the first contact switch (46) corresponds to the top position of the right-angle plate (44), and the first contact switch (46) is electrically connected with the central control box (8).

5. The cooling device for wafer production and cutting as claimed in claim 4, further comprising a second contact switch (47), wherein the second contact switch (47) is mounted on the right front side linear slider (36), the position of the second contact switch (47) corresponds to the position of the left front side second support plate (38), and the second contact switch (47) is electrically connected with the central control box (8).

6. The cooling device for wafer production and cutting as claimed in claim 5, further comprising a temperature detector (48), wherein the temperature detector (48) is installed at the lower left side of the cooling chamber (14).

7. The cooling device for wafer production and cutting as claimed in claim 6, further comprising two sets of water discharge pipes (49) and two sets of water valves (50), wherein the two sets of water discharge pipes (49) are respectively installed at the lower right side of the cooling bin (7) and the lower right side of the cooling bin (14), and the two sets of water valves (50) are respectively installed on the two sets of water discharge pipes (49).

8. The cooling device for wafer production and cutting as claimed in claim 7, further comprising a baffle (51), wherein the baffle (51) is located outside the first motor (31) and the rotating shaft (32), the baffle (51) is located below the power ring (27), and the bottom of the baffle (51) is mounted on the worktable (1).