CN112309923A

CN112309923A - Whole cleaning equipment of semiconductor wafer

Info

Publication number: CN112309923A
Application number: CN202011249959.0A
Authority: CN
Inventors: 吴禹凡; 高洪庆
Original assignee: Taicang Zhishi Machinery Technology Co ltd
Current assignee: Taicang Zhishi Machinery Technology Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-02-02

Abstract

The invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer overall cleaning device, which can effectively save physical strength and time during manual cleaning by automatically cleaning a wafer, simplify a cleaning mode and improve the working efficiency, meanwhile, the stability of the device during operation is higher, the stability of the wafer overturning and cleaning work is improved, the wafer is conveniently protected, the damage of the wafer is reduced, the cleaning effect can be effectively improved and the practicability and reliability are improved after the wafer is washed and cleaned; including cleaning bin, door, handle, well accuse case and water guide dish, the front side intercommunication in cleaning bin is provided with the door mouth, and the door articulates on the door mouth, and the handle is installed on the door, and well accuse case is installed on cleaning bin, and the water guide dish is located the inside upside in cleaning bin, and the inside of water guide dish is provided with first cavity, and cleaning bin's top is provided with water injection device and rotatory thrust unit.

Description

Whole cleaning equipment of semiconductor wafer

Technical Field

The invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer overall cleaning device.

Background

As is known, a semiconductor wafer can be processed into a circuit element, the main component of the semiconductor wafer is silicon, the semiconductor wafer needs to clean the scraps remained in the surface processing when in processing production, so that the surface of the wafer is clean and tidy, the scraps are prevented from influencing subsequent processing, the conventional cleaning mode is mainly that the wafer is slowly washed through water flow manually, when the mode is adopted, each group of wafers need to be overturned continuously, so that the scraps are flushed away from the wafer, the cleaning mode is more complicated, the working time is longer, the cleaning efficiency is lower, the physical consumption of workers is higher, the stability of workers is poorer, the hardness of the wafer is lower, the wafer is easy to damage when the wafer is overturned and cleaned manually, and stubborn scraps are easy to remain on the cleaned wafer.

Disclosure of Invention

In order to solve the technical problems, the invention provides the whole semiconductor wafer cleaning equipment which can effectively save physical force and time during manual cleaning, simplify a cleaning mode, improve the working efficiency, simultaneously has higher stability during equipment operation, improves the stability of the turnover cleaning work of the wafer, is convenient to protect the wafer, reduces the damage of the wafer, can effectively improve the cleaning effect and improves the practicability and reliability after the wafer is washed and cleaned.

The invention relates to an integral cleaning device for a semiconductor wafer, which comprises a cleaning bin, a bin door, a handle, a central control box and a water guide disc, wherein a bin opening is formed in the front side of the cleaning bin in a communicating mode, the bin door is hinged to the bin opening, the handle is installed on the bin door, the central control box is installed on the cleaning bin, the water guide disc is located on the upper side inside the cleaning bin, a first cavity is formed in the water guide disc, a water injection device and a rotary pushing device are arranged at the top of the cleaning bin, the output end of the water injection device penetrates through the cleaning bin and is communicated with the first cavity in the water guide disc, the bottom of the rotary pushing device penetrates through the cleaning bin and is installed on the water guide disc, multiple groups of brushes and multiple groups of water gaps are uniformly arranged at the bottom of the water guide disc, the multiple groups of brushes and the multiple groups of water gaps are mutually staggered, the multiple groups of water gaps are communicated with the inside of the, The connecting ring, the rotating column, the annular guide rail, the annular chute, the rotating barrel and the worm wheel, a cylindrical air guide bin on the left side turnover device is arranged on the left side of the inner wall of the cleaning bin, the right lower side of the cylindrical air guide bin is communicated with a first vent hole, the left side of the connecting ring is sleeved and fixed on the right side of the outer wall of the cylindrical air guide bin, the left side of the rotating column extends into the connecting ring and is in sealing contact with the right side of the cylindrical air guide bin, the rotating column is respectively and rotatably connected with the cylindrical air guide bin and the connecting ring, the upper side and the lower side of the inside of the rotating column are respectively and transversely provided with a second cavity, the left sides of the two groups of second cavities are respectively communicated with a second vent hole, the positions of the two groups of second vent holes are respectively corresponding to the positions of the first vent hole, the second vent hole on the, the annular chute is slidably mounted on the annular guide rail, the rotating barrel is sleeved outside the rotating column, the right side of the rotating column is fixed on the right side of the inner wall of the rotating barrel, the left side of the rotating barrel is fixed on the annular chute, the worm wheel is sleeved and fixed on the outer wall of the rotating barrel, the upper right side and the lower right side of the rotating barrel are both rotatably provided with rotating plates, the right sides of the two groups of rotating plates are both provided with square adsorption barrels, the directions of the two groups of square adsorption barrels are opposite, the inner sides of the two groups of square adsorption barrels are both provided with supporting rings, the inner sides of the left ends of the two groups of supporting rings are both communicated with first air pipes, the left sides of the two groups of first air pipes both penetrate through the right sides of the rotating barrel and are respectively communicated with the two groups of second cavities, the upper side and the lower side of the rotating barrel are both provided, the right sides of two groups of first oil cylinder push rods are respectively rotatably arranged on two groups of square adsorption barrels, the front side and the rear side of each rotary barrel are respectively provided with a second air pipe, the inner side output ends of the two groups of second air pipes respectively penetrate through the outer side wall of the rotary barrel and the outer side wall of the rotary column and are respectively communicated with the insides of the two groups of second cavities, the outer side input ends of the two groups of second air pipes are opposite in direction, the two groups of second air pipes are respectively provided with a first electromagnetic valve, the left side and the right side of the cleaning bin are respectively provided with a third air pipe, the front side input ends of the two groups of third air pipes are respectively communicated with two groups of cylindrical air guide bins on the two groups of turnover devices, the rear side of the cleaning bin is provided with a three-way pipe, an air pump and a fourth air pipe, the air pump is fixed on the cleaning bin, the three-way pipe, the rear side of the cleaning bin is provided with a power device, the power device is in transmission connection with worm gears on the two groups of turnover devices respectively, the front side and the rear side of the bottom of the inner wall of the cleaning bin are provided with positioning devices, the directions of the two groups of positioning devices are opposite, and the central control box is electrically connected with the first oil cylinder push rod, the first electromagnetic valve, the air pump, the second electromagnetic valve, the water injection device, the rotary pushing device and the power device respectively; the operation mode of the turnover device is that the central control box controls to open the power device, the power device drives a worm wheel on the turnover device to rotate, the worm wheel drives a rotating barrel to rotate, the rotating barrel drives an annular chute to slide on an annular guide rail, the rotating barrel simultaneously drives a rotating column to rotate on a connecting ring and a cylindrical air guide bin, when a second vent hole on the lower side of the rotating column is turned over to the upper side of the second vent hole, the second vent hole on the upper side is turned over to the position of a first vent hole and communicated with the first vent hole, the second vent hole turned over to the upper side is sealed through the cylindrical air guide bin at the moment, the second cavity on the upper side is in a sealed state, the central control box can control a first electromagnetic valve corresponding to the second cavity on the upper side to be opened, the second cavity on the upper side can be communicated with the outside air through a second air pipe corresponding to the second, Two groups of supporting rings, two groups of sealing rings, two groups of first air pipes, two groups of first supporting plates and two groups of first oil cylinder push rods carry out synchronous turnover motion, meanwhile, a central control box can control the first oil cylinder push rods on the turnover devices to carry out telescopic motion, the right sides of the first oil cylinder push rods can drive corresponding square adsorption barrels and rotating plates to rotate on the rotating barrels, so that the two groups of square adsorption barrels are separated, when wafers need to be cleaned, the central control box controls the upper side first oil cylinder push rods on the two groups of turnover devices to pull the corresponding square adsorption barrels, the rotating plates, the supporting rings, the sealing rings and the first air pipes to rotate, the upper side square adsorption barrels, the upper side supporting rings and the upper side sealing rings rotate to be in a vertical state, at the moment, the upper side square adsorption barrels, the upper side supporting rings and the upper side sealing rings are all positioned outside the water guide disc, a bin gate is opened through a handle, the central control box controls the air pump to be opened, the air pump pumps air in the two groups of cylindrical air guide bins through the three-way pipe and the two groups of third air pipes and discharges the air to the outside through the fourth air pipe, negative pressure is formed inside the two groups of cylindrical air guide bins, the two groups of cylindrical air guide bins pump air in the two groups of square adsorption buckets at the lower side through the two groups of first air holes, the second cavity at the lower side inside the two groups of rotating columns and the two groups of first air pipes at the lower side, negative pressure is formed inside the two groups of square adsorption buckets at the lower side, wafers are adsorbed and fixed through the two groups of supporting rings and the two groups of sealing rings on the supporting rings, the air pump is closed after the pressure value in the two groups of square adsorption buckets at the lower side meets the specified requirements, the central control box controls the rotary pushing device to be opened, the rotary pushing device drives the water guide disc, the multiple groups of brushes, the water guide disc drives a plurality of groups of hairbrushes to rotate, the plurality of groups of hairbrushes can slowly clean impurities on the surface of the wafer, so that stubborn impurities on the surface of the wafer are separated from the wafer, the central control box controls to open the water injection device, the water injection device injects water in the water injection device into the water guide disc, the water in the water guide disc slowly flows onto the wafer through a plurality of groups of water gaps, so that the impurities on the surface of the wafer are cleaned, after the impurities on the surface of the wafer are cleaned, the central control box controls the rotary pushing device to drive the water guide disc to move upwards, the water injection device continuously works at the moment, the water guide disc drives the plurality of groups of hairbrushes to move upwards and return to an initial position, the central control box controls the first oil cylinder push rods on the upper sides of the two groups of turnover devices to extend, the first oil cylinder push rods on the upper sides push the corresponding square adsorption barrels, the rotating plates, the, the central control box drives two groups of turning devices to rotate through a power device, the two groups of turning devices rotate 180 degrees so as to drive the wafer to turn, two groups of second vent holes turned to the lower side are respectively communicated with first vent holes on two groups of cylindrical gas guide bins, the central control box controls to open the air pump, the air pump performs air suction treatment on the two groups of cylindrical gas guide bins again, the two groups of cylindrical gas guide bins respectively pump air in two groups of square adsorption buckets turned to the lower side through the two groups of first vent holes, negative pressure is gradually formed inside the two groups of square adsorption buckets, in the process, the central control box controls to open two groups of first electromagnetic valves on the upper side second cavity inside the two groups of rotary columns, and outside air enters the upper side two groups of second cavities through the corresponding two groups of second air pipes, so that the upper side two groups of second cavities are in a normal pressure state, and the upper side, so that the two groups of square adsorption barrels on the upper side stop adsorbing and fixing the wafer, the two groups of square adsorption barrels on the lower side are in a negative pressure state and start adsorbing and fixing the bottom of the wafer, the air pump is closed, the central control box pulls the two corresponding groups of square adsorption barrels, the two groups of support rings, the two groups of sealing rings and the two groups of first air pipes to rotate to a vertical state through the two groups of first oil cylinder push rods which are overturned to the upper side, the central control box drives the water guide disc to move downwards through the water injection device and the rotary pushing device repeatedly and cleans the surface of the wafer which is overturned to the upper side, and therefore the purpose of automatically cleaning the two sides of the wafer is achieved, after the wafer is cleaned, the central control box controls the air pump to be closed, controls the upper side square adsorption barrels on the two groups of overturning devices to be in an open state, and controls the two groups of first electromagnetic, make two sets of square adsorption buckets of downside inside be in the ordinary pressure state, stop the adsorption work to the wafer, open the door, take off the wafer, the inside downside in washing the storehouse is being washd in the water deposit after washing in the washing storehouse, well accuse case control is opened the second solenoid valve, the water accessible in the washing storehouse is in the first water pipe discharge to external collection device, through carrying out self-cleaning to the wafer and handling, physical power and time when can effectively saving artifical washing, simplify the cleaning method, and the improvement work efficiency, stability when equipment operation is higher simultaneously, wafer upset cleaning job stabilization nature improves, the convenience is protected the wafer, it is damaged to reduce the wafer, the wafer is through washing and cleaning process, can effectively improve the cleaning performance, and the practicability and reliability are improved.

According to the semiconductor wafer integral cleaning equipment, each group of square adsorption barrels is provided with the secondary pressurizing device, each secondary pressurizing device comprises the first motor, the thread bush, the threaded rod and the piston, the first motor in the secondary pressurizing device on the upper left side square adsorption barrel is installed on the corresponding square adsorption barrel, the thread bush, the threaded rod and the piston are all located in the square adsorption barrel, the top of the thread bush penetrates through the inner wall of the square adsorption barrel and is in transmission connection with the lower side output end of the first motor, the threaded rod is screwed on the lower side of the thread bush, the bottom of the threaded rod is fixed to the top of the piston, the outer side wall of the piston is in contact with the inner wall of the square adsorption barrel, and the first motor is electrically connected with the central control; first motor is opened in well accuse case control, first motor can drive the thread bush and rotate, the thread bush is connected with threaded rod spiral shell, the thread bush can drive the threaded rod and reciprocate in the thread bush, the threaded rod drives the piston and reciprocates, thereby adjust the space of the inside downside of square absorption bucket, when the square absorption bucket of adjusting device downside adsorbs the fixing to the wafer, through adjusting the piston position in the square absorption bucket of downside, the inside upside space size of adjustable downside square absorption bucket, thereby adjust the inside upside atmospheric pressure value of the square absorption bucket of downside, therefore, the practicality and the reliability are improved.

The invention relates to an integral cleaning device for a semiconductor wafer, which comprises a water injection device, a water pump, a second water pipe, a third water pipe, a first annular water guide bin and a second annular water guide bin, wherein the water tank is arranged on the left side of the top of a cleaning bin; the water pump is opened in well accuse case control, and the water pump is taken out the water in the water tank through the second water pipe and is gone into to the water guide dish through third water pipe, second annular water guide storehouse and first annular water guide storehouse to carry out water interpolation work to the water guide dish is inside, when rotatory thrust unit drives the water guide dish and rotates, the water guide dish drives first annular water guide storehouse and rotates, first annular water guide storehouse rotates on second annular water guide storehouse and keeps the connected state with second annular water guide storehouse is inside.

The invention relates to a semiconductor wafer integral cleaning device, which comprises four groups of second oil cylinder push rods, a second support plate, a second motor, a square rotating sleeve, a fixing ring and a square rotating rod, wherein the four groups of second oil cylinder push rods are uniformly positioned at the top of a cleaning bin, the bottoms of the four groups of second oil cylinder push rods penetrate through the top of the cleaning bin and extend into the upper side of the interior of the cleaning bin, the bottoms of the four groups of second oil cylinder push rods are all arranged on a second annular water guide bin, the second support plate is arranged at the tops of the four groups of second oil cylinder push rods, the second motor is arranged on the second support plate, the square rotating sleeve is positioned below the second support plate, the lower side output end of the second motor penetrates through the second support plate and is in transmission connection with the top of the square rotating sleeve, the fixing ring is inserted on the top wall of the cleaning bin, the fixing ring is in rotation connection with the cleaning bin, the bottom of the square, the square rotating rod is positioned in the square rotating sleeve, the bottom of the square rotating rod extends out of the bottom of the square rotating sleeve and is arranged on the water guide disc, and the four groups of second oil cylinder push rods and the second motor are electrically connected with the central control box; the central control box controls the second annular water guide bin to move downwards through four groups of second oil cylinder push rods, the second annular water guide bin drives the water guide disc to move downwards through the first annular water guide bin, meanwhile, the water guide disc drives the square rotating rod to slide on the square rotating sleeve, the square rotating rod synchronously moves downwards, the height of the water guide disc is controlled, when the bottoms of the multiple groups of brushes are in surface contact with the wafer, the central control box controls the second motor to be opened, the second motor drives the square rotating sleeve to rotate, the square rotating sleeve drives the water guide disc to rotate through the square rotating rod, the water guide disc drives the multiple groups of brushes to rotate, meanwhile, the water guide disc drives the first annular water guide bin to slide on the second annular water guide bin, the rotating square rotating sleeve drives the fixing ring to rotate on the cleaning bin, therefore, the water guide disc and the multiple groups of brushes are controlled to move up and down, and the.

The invention relates to a semiconductor wafer integral cleaning device, which comprises a power device, a third motor, a double-output shaft reducer, two groups of first rotating shafts, two groups of fixed sleeves, two groups of first bevel gears, two groups of second rotating shafts, two groups of worms and two groups of third supporting plates, wherein the third motor and the double-output shaft reducer are both arranged at the rear side of a cleaning bin and are in transmission connection with each other, the two groups of first rotating shafts are both arranged on the double-output shaft reducer, the two groups of fixed sleeves are respectively and rotatably sleeved on the two groups of first rotating shafts, the front sides of the two groups of fixed sleeves are both fixed on the cleaning bin, the two groups of first bevel gears are respectively arranged at the outer sides of the two groups of first rotating shafts, the two groups of second bevel gears are respectively engaged with the two groups of first bevel gears, the rear sides of the two groups of second rotating shafts are respectively arranged on the two groups of second bevel gears, two groups of second rotating shafts are rotatably connected with the cleaning bin, two groups of worms are respectively arranged on the two groups of second rotating shafts, the bottoms of the two groups of worms are respectively meshed with the tops of two groups of worm gears, two groups of third supporting plates are respectively rotatably arranged on the front sides of the two groups of second rotating shafts, the outer sides of the two groups of third supporting plates are respectively fixed on the inner wall of the cleaning bin, and a third motor is electrically connected with the central control box; the third motor is opened in well accuse case control, the third motor drives the operation of dual output shaft reduction gear, dual output shaft reduction gear drives two sets of worms through two sets of first pivots, two sets of first bevel gears, two sets of second bevel gears and two sets of second pivots and rotates, two sets of worms mesh with two sets of worm wheels respectively, two sets of first bevel gears drive two sets of rotation buckets through two sets of worm wheels respectively and rotate to drive the wafer and carry out the turn-over motion, two sets of fixed covers support two sets of first pivots respectively, two sets of third backup pads support the front side of two sets of second pivots respectively, practicality and reliability are improved.

The invention relates to an integral cleaning device for a semiconductor wafer, which comprises a positioning device, a cleaning bin and a cleaning bin, wherein the positioning device comprises an arc-shaped teaching supporting plate, a third oil cylinder push rod and two groups of telescopic rods, the arc-shaped teaching supporting plate on the rear side positioning device is positioned on the rear side in the cleaning bin, the upper side of the inner side wall of the arc-shaped teaching supporting plate is provided with an inclined surface, the third oil cylinder push rod is obliquely arranged in the middle of the rear side of the arc-shaped teaching supporting plate, the bottom of the third oil cylinder push rod is positioned behind the top of the cleaning bin, the bottom of the third oil cylinder push rod is fixed at the bottom of the inner wall of the cleaning bin, the two groups of telescopic rods are obliquely arranged on the left side; open the third hydro-cylinder push rod on the rear side positioner, third hydro-cylinder push rod promotes arc finger teaching layer board and moves to the upper front, when third hydro-cylinder push rod extends to the maximum value, downside sealing ring upper surface parallel and level on the inner wall bottom of arc finger teaching layer board and the turning device, when the wafer is placed on the downside sealing ring, the lateral wall of wafer is located arc finger teaching layer board, thereby carry out positioning process to the wafer, set up to the inclined plane through pointing teaching layer board inside wall upside with the arc, can make things convenient for the wafer to fall into in the arc finger teaching layer board on two sets of positioner, when the arc finger teaching layer board removed, the upside that the arc finger teaching layer board drove two sets of telescopic links carries out synchronous motion, and the practicability and.

The invention discloses semiconductor wafer integral cleaning equipment, which further comprises a barometer, wherein the barometer is arranged on a third air pipe on the right side and is electrically connected with a central control box; can conveniently carry out real-time supervision to the atmospheric pressure value in the third trachea in right side through setting up the barometer to carry out real-time supervision and transmit the detected value to well accuse incasement to the atmospheric pressure value in third trachea in left side and two sets of cylindrical air guide storehouse, well accuse case can conveniently be according to the opening time of atmospheric pressure value control air pump, improves practicality and reliability.

The invention discloses an integral cleaning device for a semiconductor wafer, which further comprises a protective cover, wherein the protective cover is positioned at the outer side of a power device, a three-way pipe and an air pump at the rear side of a cleaning bin; through setting up the guard shield, can conveniently keep apart the protection to power device, three-way pipe and the air pump of washing storehouse rear side, conveniently protect it, improve practicality and reliability.

Compared with the prior art, the invention has the beneficial effects that: the operation mode of the turnover device is that the central control box controls to open the power device, the power device drives a worm wheel on the turnover device to rotate, the worm wheel drives a rotating barrel to rotate, the rotating barrel drives an annular chute to slide on an annular guide rail, the rotating barrel simultaneously drives a rotating column to rotate on a connecting ring and a cylindrical air guide bin, when a second vent hole on the lower side of the rotating column is turned over to the upper side of the second vent hole, the second vent hole on the upper side is turned over to the position of a first vent hole and communicated with the first vent hole, the second vent hole turned over to the upper side is sealed through the cylindrical air guide bin at the moment, the second cavity on the upper side is in a sealed state, the central control box can control a first electromagnetic valve corresponding to the second cavity on the upper side to be opened, the second cavity on the upper side can be communicated with the outside air through a second air pipe corresponding to the second, Two groups of supporting rings, two groups of sealing rings, two groups of first air pipes, two groups of first supporting plates and two groups of first oil cylinder push rods carry out synchronous turnover motion, meanwhile, a central control box can control the first oil cylinder push rods on the turnover devices to carry out telescopic motion, the right sides of the first oil cylinder push rods can drive corresponding square adsorption barrels and rotating plates to rotate on the rotating barrels, so that the two groups of square adsorption barrels are separated, when wafers need to be cleaned, the central control box controls the upper side first oil cylinder push rods on the two groups of turnover devices to pull the corresponding square adsorption barrels, the rotating plates, the supporting rings, the sealing rings and the first air pipes to rotate, the upper side square adsorption barrels, the upper side supporting rings and the upper side sealing rings rotate to be in a vertical state, at the moment, the upper side square adsorption barrels, the upper side supporting rings and the upper side sealing rings are all positioned outside the water guide disc, a bin gate is opened through a handle, the central control box controls the air pump to be opened, the air pump pumps air in the two groups of cylindrical air guide bins through the three-way pipe and the two groups of third air pipes and discharges the air to the outside through the fourth air pipe, negative pressure is formed inside the two groups of cylindrical air guide bins, the two groups of cylindrical air guide bins pump air in the two groups of square adsorption buckets at the lower side through the two groups of first air holes, the second cavity at the lower side inside the two groups of rotating columns and the two groups of first air pipes at the lower side, negative pressure is formed inside the two groups of square adsorption buckets at the lower side, wafers are adsorbed and fixed through the two groups of supporting rings and the two groups of sealing rings on the supporting rings, the air pump is closed after the pressure value in the two groups of square adsorption buckets at the lower side meets the specified requirements, the central control box controls the rotary pushing device to be opened, the rotary pushing device drives the water guide disc, the multiple groups of brushes, the water guide disc drives a plurality of groups of hairbrushes to rotate, the plurality of groups of hairbrushes can slowly clean impurities on the surface of the wafer, so that stubborn impurities on the surface of the wafer are separated from the wafer, the central control box controls to open the water injection device, the water injection device injects water in the water injection device into the water guide disc, the water in the water guide disc slowly flows onto the wafer through a plurality of groups of water gaps, so that the impurities on the surface of the wafer are cleaned, after the impurities on the surface of the wafer are cleaned, the central control box controls the rotary pushing device to drive the water guide disc to move upwards, the water injection device continuously works at the moment, the water guide disc drives the plurality of groups of hairbrushes to move upwards and return to an initial position, the central control box controls the first oil cylinder push rods on the upper sides of the two groups of turnover devices to extend, the first oil cylinder push rods on the upper sides push the corresponding square adsorption barrels, the rotating plates, the, the central control box drives two groups of turning devices to rotate through a power device, the two groups of turning devices rotate 180 degrees so as to drive the wafer to turn, two groups of second vent holes turned to the lower side are respectively communicated with first vent holes on two groups of cylindrical gas guide bins, the central control box controls to open the air pump, the air pump performs air suction treatment on the two groups of cylindrical gas guide bins again, the two groups of cylindrical gas guide bins respectively pump air in two groups of square adsorption buckets turned to the lower side through the two groups of first vent holes, negative pressure is gradually formed inside the two groups of square adsorption buckets, in the process, the central control box controls to open two groups of first electromagnetic valves on the upper side second cavity inside the two groups of rotary columns, and outside air enters the upper side two groups of second cavities through the corresponding two groups of second air pipes, so that the upper side two groups of second cavities are in a normal pressure state, and the upper side, so that the two groups of square adsorption barrels on the upper side stop adsorbing and fixing the wafer, the two groups of square adsorption barrels on the lower side are in a negative pressure state and start adsorbing and fixing the bottom of the wafer, the air pump is closed, the central control box pulls the two corresponding groups of square adsorption barrels, the two groups of support rings, the two groups of sealing rings and the two groups of first air pipes to rotate to a vertical state through the two groups of first oil cylinder push rods which are overturned to the upper side, the central control box drives the water guide disc to move downwards through the water injection device and the rotary pushing device repeatedly and cleans the surface of the wafer which is overturned to the upper side, and therefore the purpose of automatically cleaning the two sides of the wafer is achieved, after the wafer is cleaned, the central control box controls the air pump to be closed, controls the upper side square adsorption barrels on the two groups of overturning devices to be in an open state, and controls the two groups of first electromagnetic, make two sets of square adsorption buckets of downside inside be in the ordinary pressure state, stop the adsorption work to the wafer, open the door, take off the wafer, the inside downside in washing the storehouse is being washd in the water deposit after washing in the washing storehouse, well accuse case control is opened the second solenoid valve, the water accessible in the washing storehouse is in the first water pipe discharge to external collection device, through carrying out self-cleaning to the wafer and handling, physical power and time when can effectively saving artifical washing, simplify the cleaning method, and the improvement work efficiency, stability when equipment operation is higher simultaneously, wafer upset cleaning job stabilization nature improves, the convenience is protected the wafer, it is damaged to reduce the wafer, the wafer is through washing and cleaning process, can effectively improve the cleaning performance, and the practicability and reliability are improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the cleaning chamber in FIG. 1;

FIG. 3 is a schematic view of the interior of the rotary tub of FIG. 2 viewed obliquely from the bottom right;

FIG. 4 is a rear side oblique view of the cleaning bin of FIG. 1;

FIG. 5 is an enlarged view of the rotary tub of FIG. 2;

FIG. 6 is an enlarged schematic view of the push rod of the first cylinder in FIG. 3;

FIG. 7 is an enlarged view of the second support plate of FIG. 3;

in the drawings, the reference numbers: 1. cleaning the bin; 2. a bin gate; 3. a handle; 4. a central control box; 5. a water guide tray; 6. a brush; 7. a cylindrical gas guide bin; 8. a first vent hole; 9. a connecting ring; 10. rotating the column; 11. a second vent hole; 12. an annular guide rail; 13. an annular chute; 14. rotating the barrel; 15. a worm gear; 16. a rotating plate; 17. a square adsorption bucket; 18. a ring; 19. a seal ring; 20. a first air pipe; 21. a first support plate; 22. a first cylinder push rod; 23. a second air pipe; 24. a first solenoid valve; 25. a third air pipe; 26. a three-way pipe; 27. an air pump; 28. a fourth gas pipe; 29. a first water pipe; 30. a second solenoid valve; 31. a first motor; 32. a threaded sleeve; 33. a threaded rod; 34. a piston; 35. a water tank; 36. a water pump; 37. a second water pipe; 38. a third water pipe; 39. a first annular water guide bin; 40. a second annular water guide bin; 41. a second cylinder push rod; 42. a second support plate; 43. a second motor; 44. a square rotating sleeve; 45. a fixing ring; 46. a square rotating rod; 47. a third motor; 48. a speed reducer with double output shafts; 49. a first rotating shaft; 50. fixing a sleeve; 51. a first bevel gear; 52. a second bevel gear; 53. a second rotating shaft; 4. a worm; 55. a third support plate; 56. an arc-shaped teaching supporting plate; 57. a third oil cylinder push rod; 58. a telescopic rod; 59. a barometer; 60. a shield.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

As shown in fig. 1 to 7, in the overall cleaning apparatus for semiconductor wafers according to the present invention, when the apparatus works, the operation mode of the turning device is that the central control box 4 controls to turn on the power device, the power device drives the worm wheel 15 on the turning device to rotate, the worm wheel 15 drives the rotating barrel 14 to rotate, the rotating barrel 14 drives the annular chute 13 to slide on the annular guide rail 12, the rotating barrel 14 drives the rotating column 10 to rotate on the connecting ring 9 and the cylindrical air guiding bin 7, when the second vent hole 11 at the lower side of the rotating column 10 is turned over to the upper side of the second vent hole 11, the second vent hole 11 at the upper side is turned over to the position of the first vent hole 8 and is communicated with the first vent hole 8, at this time, the second vent hole 11 turned over to the upper side is sealed by the cylindrical air guiding bin 7, the second cavity at the upper side is in a sealed state, the central control box 4 can control, the upper second cavity can be communicated with the outside air through a second air pipe 23 corresponding to the upper second cavity, the rotary barrel 14 can be driven to synchronously turn over when turning over, the two groups of rotary plates 16, the two groups of square adsorption barrels 17, the two groups of supporting rings 18, the two groups of sealing rings 19, the two groups of first air pipes 20, the two groups of first supporting plates 21 and the two groups of first oil cylinder push rods 22 can be driven by the rotary barrel 14 to synchronously turn over, meanwhile, the central control box 4 can control the first oil cylinder push rods 22 on the turning device to perform telescopic motion, the right side of the first oil cylinder push rods 22 can drive the corresponding square adsorption barrels 17 and the rotary plates 16 to rotate on the rotary barrel 14, so that the two groups of square adsorption barrels 17 are separated, when wafers need to be cleaned, the central control box 4 controls the upper first oil cylinder push rods 22 on the two groups of turning device to pull the corresponding square adsorption barrels 17, the rotary plates 16, the supporting rings, The upper side supporting ring 18 and the upper side sealing ring 19 rotate to a vertical state, at the moment, the upper side square adsorption barrel 17, the upper side supporting ring 18 and the upper side sealing ring 19 are all positioned at the outer side of the water guide disc 5, the bin door 2 is opened through the handle 3, an external wafer is placed on the lower side sealing rings 19 on the two groups of turnover devices through the bin opening, the central control box 4 controls the air pump 27 to be opened to pump air in the two groups of cylindrical air guide bins 7 out through the three-way pipe 26 and the two groups of third air pipes 25 and to be discharged to the outside through the fourth air pipe 28, negative pressure is formed inside the two groups of cylindrical air guide bins 7, air in the two groups of lower side square adsorption barrels 17 is pumped out through the two groups of first vent holes 8, the second cavity at the lower side inside the two groups of rotating columns 10 and the two groups of first air pipes 20 at the lower side, negative pressure is formed inside the two groups of lower side square adsorption barrels 17, when the air pressure value in the two groups of square adsorption buckets 17 at the lower side meets the specified requirements, the air pump 27 is closed, the central control box 4 controls to open the rotary pushing device, the rotary pushing device drives the water guide disc 5, the multiple groups of brushes 6 and the multiple groups of water gaps on the water guide disc 5 to move downwards, the bottoms of the multiple groups of brushes 6 are in contact with the upper surface of the wafer, the rotary pushing device drives the water guide disc 5 to rotate, the water guide disc 5 drives the multiple groups of brushes 6 to rotate, the multiple groups of brushes 6 can slowly clean impurities on the surface of the wafer, so that stubborn impurities on the surface of the wafer are separated from the wafer, the central control box 4 controls to open the water injection device, the water injection device discharges water in the water guide disc 5 into the water guide disc 5, the water in the water guide disc 5 slowly flows onto the wafer through the multiple groups of water gaps, so as to clean the impurities on the surface of the wafer, and after the, at this moment, the water injection device continuously works, the water guide disc 5 drives the multiple groups of hairbrushes 6 to move upwards and restore to the initial position, the upper side first oil cylinder push rods 22 on the two groups of overturning devices are controlled by the central control box 4 to extend, the upper side two groups of first oil cylinder push rods 22 push the corresponding square adsorption barrels 17, the rotating plate 16, the supporting ring 18, the sealing ring 19 and the first air pipe 20 rotate to the initial position, at this moment, the bottoms of the upper side two groups of sealing rings 19 are contacted with the top of a wafer, the central control box 4 drives the two groups of overturning devices to rotate through a power device, the two groups of overturning devices rotate 180 degrees, so as to drive the wafer to overturn, the two groups of second air vents 11 turned to the lower side are respectively communicated with the first air vents 8 on the two groups of cylindrical air guide bins 7, the central control box 4 opens the air pump 27, the air pump 27 re-inhales the two groups of cylindrical air guide bins 7, and the air is pumped away, a negative pressure state is gradually formed inside the two groups of square adsorption buckets 17, in the process, the central control box 4 controls to open the two groups of first electromagnetic valves 24 on the upper side second cavity inside the two groups of rotating columns 10, outside air enters the upper side two groups of second cavities through the corresponding two groups of second air pipes 23, so that the upper side two groups of second cavities are in a normal pressure state, the upper side two groups of square adsorption buckets 17 are in a normal pressure state, so that the upper side two groups of square adsorption buckets 17 stop carrying out adsorption and fixation treatment on the wafer, the lower side two groups of square adsorption buckets 17 are in a negative pressure state and start to carry out adsorption and fixation treatment on the bottom of the wafer, the air pump 27 is closed, the central control box 4 pulls the corresponding two groups of square adsorption buckets 17, two groups of support rings 18, two groups of seal rings 19 and two groups of first air pipes 20 to rotate to a vertical, the central control box 4 repeatedly drives the water guide disc 5 to move downwards through the water injection device and the rotary pushing device and cleans the surface of the wafer turned over to the upper side, thereby realize carrying out self-cleaning's purpose to the wafer two-sided, after the wafer washing is accomplished, well accuse case 4 control closes air pump 27, the square adsorption bucket 17 of upside on the two sets of turning devices of well accuse case 4 control is in the open mode, two sets of first solenoid valves 24 on the two sets of second cavities of downside in the two sets of turning devices of well accuse case 4 control are opened, make two sets of square adsorption buckets 17 of downside inside be in the ordinary pressure state, stop the adsorption work to the wafer, open door 2, take off the wafer, the water after the washing deposits at the inside downside in washing storehouse 1 in the washing storehouse 1, well accuse case 4 control is opened second solenoid valve 30, the water in washing storehouse 1 accessible first water pipe 29 discharges to in the external collection device.

The main functions realized by the invention are as follows: the wafer is automatically cleaned, so that physical strength and time during manual cleaning can be effectively saved, a cleaning mode is simplified, the working efficiency is improved, the stability of the equipment during operation is high, the stability of the wafer overturning and cleaning operation is improved, the wafer is conveniently protected, the damage of the wafer is reduced, and the cleaning effect can be effectively improved after the wafer is washed and cleaned; the working mode of the secondary supercharging device is that the central control box 4 controls to open the first motor 31, the first motor 31 can drive the threaded sleeve 32 to rotate, the threaded sleeve 32 is in threaded connection with the threaded rod 33, the threaded sleeve 32 can drive the threaded rod 33 to move up and down in the threaded sleeve 32, and the threaded rod 33 drives the piston 34 to move up and down, so that the space on the lower side inside the square adsorption barrel 17 can be adjusted; the water injection device works in a mode that the central control box 4 controls the water pump 36 to be started, the water pump 36 pumps water in the water tank 35 through the second water pipe 37 and discharges the water into the water guide disc 5 through the third water pipe 38, the second annular water guide bin 40 and the first annular water guide bin 39, so that water adding work is carried out on the interior of the water guide disc 5, when the water guide disc 5 is driven to rotate by the rotary pushing device, the water guide disc 5 drives the first annular water guide bin 39 to rotate, and the first annular water guide bin 39 rotates on the second annular water guide bin 40 and keeps a communicated state with the interior of the second annular water guide bin 40; the working mode of the rotary pushing device is that the central control box 4 controls the second annular water guide bin 40 to move downwards through four groups of second oil cylinder push rods 41, the second annular water guide bin 40 drives the water guide disc 5 to move downwards through the first annular water guide bin 39, meanwhile, the water guide disc 5 drives the square rotating rod 46 to slide on the square rotating sleeve 44, the square rotating rod 46 synchronously moves downwards, thereby controlling the height of the water guide disc 5, when the bottoms of a plurality of groups of brushes 6 are all contacted with the surface of a wafer, the central control box 4 controls the second motor 43 to be opened, the second motor 43 drives the square rotating sleeve 44 to rotate, the square rotating sleeve 44 drives the water guide disc 5 to rotate through the square rotating rod 46, the water guide disc 5 drives a plurality of groups of brushes 6 to rotate, meanwhile, the water guide disc 5 drives the first annular water guide bin 39 to slide on the second annular water guide bin 40, the square rotating sleeve 44 in a rotating state drives the fixing ring 45 to rotate on the, thereby controlling the water guide disc 5 and the plurality of groups of brushes 6 to move up and down and rotate; the working mode of the power device is that the central control box 4 controls to open a third motor 47, the third motor 47 drives a double-output shaft reducer 48 to operate, the double-output shaft reducer 48 drives two sets of worms 54 to rotate through two sets of first rotating shafts 49, two sets of first bevel gears 51, two sets of second bevel gears 52 and two sets of second rotating shafts 53, the two sets of worms 54 are respectively meshed with the two sets of worm gears 15, the two sets of first bevel gears 51 respectively drive two sets of rotating barrels 14 to rotate through the two sets of worm gears 15, so that wafers are driven to perform turning motion, the two sets of fixing sleeves 50 respectively support the two sets of first rotating shafts 49, and the two sets of third supporting plates 55 respectively support the front sides of the two sets of second rotating shafts; the working mode of the positioning device is that the third oil cylinder push rod 57 on the rear side positioning device is opened, the third oil cylinder push rod 57 pushes the arc teaching support plate 56 to move upwards, when the third oil cylinder push rod 57 extends to the maximum value, the bottom of the inner wall of the arc teaching support plate 56 is flush with the upper surface of the lower side sealing ring 19 on the turnover device, when a wafer is placed on the lower side sealing ring 19, the outer side wall of the wafer is positioned in the arc teaching support plate 56, so that the wafer is positioned, the wafer can conveniently fall into the arc teaching support plates 56 on the two groups of positioning devices by setting the upper side of the inner wall of the arc teaching support plate 56 to be an inclined plane, and when the arc teaching support plate 56 moves, the arc teaching support plate 56 drives the upper sides of the two groups of telescopic; the air pressure in the third air pipe 25 on the right side can be conveniently monitored in real time by arranging the barometer 59, so that the air pressure in the third air pipe 25 on the left side and the air pressure in the two groups of cylindrical air guide bins 7 are monitored in real time, the detection values are transmitted into the central control box 4, and the central control box 4 can conveniently control the opening time of the air pump 27 according to the air pressure values; through setting up guard shield 60, can conveniently keep apart the protection to power device, three-way pipe 26 and the air pump 27 of cleaning bin 1 rear side, conveniently protect it, improve practicality and reliability.

According to the semiconductor wafer overall cleaning equipment, the installation mode, the connection mode or the arrangement mode are common mechanical modes, and the equipment can be implemented as long as the beneficial effects of the equipment can be achieved; the center console box 4, the first cylinder push rod 22, the first solenoid valve 24, the second solenoid valve 30, the second cylinder push rod 41, the third cylinder push rod 57, and the barometer 59 are commercially available.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. The integral cleaning equipment for the semiconductor wafer is characterized by comprising a cleaning bin (1), a bin door (2), a handle (3), a central control box (4) and a water guide disc (5), wherein a bin opening is formed in the front side of the cleaning bin (1) in a communicated mode, the bin door (2) is hinged to the bin opening, the handle (3) is installed on the bin door (2), the central control box (4) is installed on the cleaning bin (1), the water guide disc (5) is located on the upper side inside the cleaning bin (1), a first cavity is arranged inside the water guide disc (5), a water injection device and a rotary pushing device are arranged at the top of the cleaning bin (1), the output end of the water injection device penetrates through the cleaning bin (1) and is communicated with the first cavity in the water guide disc (5), the bottom of the rotary pushing device penetrates through the cleaning bin (1) and is installed on the water guide disc (5), and a plurality of groups of brushes (6) and a plurality of water gaps are uniformly arranged at the bottom of the water guide disc (5), the multiple groups of brushes (6) and the multiple groups of water gaps are staggered with each other, the multiple groups of water gaps are communicated with the inside of the first cavity, turning devices are arranged on the left side and the right side of the inside of the cleaning bin (1), each turning device comprises a cylindrical air guide bin (7), a connecting ring (9), a rotating column (10), an annular guide rail (12), an annular sliding chute (13), a rotating barrel (14) and a worm wheel (15), the cylindrical air guide bin (7) on the turning device on the left side is arranged on the left side of the inner wall of the cleaning bin (1), a first air vent (8) is communicated with the lower right side of the cylindrical air guide bin (7), the left side of the connecting ring (9) is sleeved and fixed on the right side of the outer wall of the cylindrical air guide bin (7), the left side of the rotating column (10) extends into the connecting ring (9) and is in sealing contact with the right side of the cylindrical air guide bin (7), and the rotating, the upper side and the lower side of the interior of the rotating column (10) are respectively and transversely provided with a second cavity, the left sides of the two groups of second cavities are respectively communicated with a second vent hole (11), the positions of the two groups of second vent holes (11) are respectively corresponding to the positions of the first vent holes (8), the second vent holes (11) at the lower side are communicated with the first vent holes (8), the annular guide rail (12) is positioned at the outer side of the cylindrical air guide bin (7), the left side of the annular guide rail (12) is fixed at the left side of the inner wall of the cleaning bin (1), the annular sliding chute (13) is slidably arranged on the annular guide rail (12), the rotating barrel (14) is sleeved at the outer side of the rotating column (10), the right side of the rotating column (10) is fixed at the right side of the inner wall of the rotating barrel (14), the left side of the rotating barrel (14) is fixed on the annular sliding chute (13), the worm wheel (15) is sleeved and fixed on the outer wall of the rotating barrel (, the right sides of the two groups of rotating plates (16) are respectively provided with a square adsorption barrel (17), the directions of the two groups of square adsorption barrels (17) are opposite, the inner sides of the two groups of square adsorption barrels (17) are respectively provided with a supporting ring (18), the inner sides of the two groups of supporting rings (18) are respectively provided with a sealing ring (19), the inner sides of the left ends of the two groups of square adsorption barrels (17) are respectively communicated with a first air pipe (20), the left sides of the two groups of first air pipes (20) penetrate through the right sides of the rotating barrels (14) and are respectively communicated with the two groups of second cavities, the upper side and the lower side of the rotating barrels (14) are respectively provided with a first supporting plate (21), the right sides of the two groups of first supporting plates (21) are respectively rotatably and obliquely provided with a first oil cylinder push rod (22), the right sides of the two groups of first oil cylinder push rods (22) are respectively rotatably arranged on the two, the inner side output ends of the two groups of second air pipes (23) penetrate through the outer side wall of the rotating barrel (14) and the outer side wall of the rotating column (10) and are respectively communicated with the inner parts of the two groups of second cavities, the outer side input ends of the two groups of second air pipes (23) are opposite in direction, the two groups of second air pipes (23) are respectively provided with a first electromagnetic valve (24), the left side and the right side of the cleaning bin (1) are respectively provided with a third air pipe (25), the front side input ends of the two groups of third air pipes (25) are respectively communicated with the two groups of cylindrical air guide bins (7) on the two groups of turning devices, the rear side of the cleaning bin (1) is provided with a three-way pipe (26), an air pump (27) and a fourth air pipe (28), the air pump (27) is fixed on the cleaning bin (1), the three-way pipe (26) and the fourth air pipe (28) are both installed on the air pump (27), the rear side output ends of the two groups of, the rear side of the cleaning bin (1) is provided with a power device, the power device is in transmission connection with worm gears (15) on the two groups of turnover devices respectively, the front side and the rear side of the bottom of the inner wall of the cleaning bin (1) are provided with positioning devices, the directions of the two groups of positioning devices are opposite, and the central control box (4) is electrically connected with a first oil cylinder push rod (22), a first electromagnetic valve (24), an air pump (27), a second electromagnetic valve (30), a water injection device, a rotary pushing device and the power device respectively.

2. The semiconductor wafer overall cleaning device as claimed in claim 1, wherein each group of square adsorption buckets (17) is provided with a secondary pressurization device, the secondary pressurization device comprises a first motor (31), a threaded sleeve (32), a threaded rod (33) and a piston (34), the first motor (31) in the secondary pressurization device on the upper left side square adsorption bucket (17) is installed on the corresponding square adsorption bucket (17), the threaded sleeve (32), the threaded rod (33) and the piston (34) are all located in the square adsorption bucket (17), the top of the threaded sleeve (32) penetrates through the inner wall of the square adsorption bucket (17) and is in transmission connection with the lower side output end of the first motor (31), the threaded rod (33) is screwed on the lower side of the threaded sleeve (32), the bottom of the threaded rod (33) is fixed on the top of the piston (34), the outer side wall of the piston (34) is in contact with the inner wall of the square adsorption bucket (17), the first motor (31) is electrically connected with the central control box (4).

3. The integrated cleaning equipment for the semiconductor wafer as claimed in claim 2, wherein the water injection device comprises a water tank (35), a water pump (36), a second water pipe (37), a third water pipe (38), a first annular water guide bin (39) and a second annular water guide bin (40), the water tank (35) is installed on the left side of the top of the cleaning bin (1), the water pump (36) is installed on the water tank (35), the second water pipe (37) and the third water pipe (38) are installed on the water pump (36), the left input end of the second water pipe (37) extends into the lower side of the inside of the water tank (35), the first annular water guide bin (39) is installed on the top of the water guide tray (5), the first annular water guide bin (39) is communicated with a first cavity in the water guide tray (5), the second annular water guide bin (40) is rotatably installed on the first annular water guide bin (39), and the second annular water guide bin (40) is communicated with the first annular water guide bin (39), the output end of the lower side of the third water pipe (38) penetrates through the cleaning bin (1) and is installed on the second annular water guide bin (40), the bottom of the rotary pushing device is installed on the second annular water guide bin (40), and the water pump (36) is electrically connected with the central control box (4).

4. The overall cleaning equipment for the semiconductor wafer as claimed in claim 3, wherein the rotary pushing device comprises four groups of second cylinder push rods (41), a second support plate (42), a second motor (43), a square rotating sleeve (44), a fixing ring (45) and a square rotating rod (46), the four groups of second cylinder push rods (41) are uniformly positioned at the top of the cleaning bin (1), the bottoms of the four groups of second cylinder push rods (41) all penetrate through the top of the cleaning bin (1) and extend into the upper side inside the cleaning bin (1), the bottoms of the four groups of second cylinder push rods (41) are all installed on a second annular water guide bin (40), the second support plate (42) is installed at the top of the four groups of second cylinder push rods (41), the second motor (43) is installed on the second support plate (42), the square rotating sleeve (44) is positioned below the second support plate (42), and the lower output end of the second motor (43) penetrates through the second support plate (42) and is connected with the square rotating sleeve (44) The top transmission is connected, solid fixed ring (45) alternate on washing storehouse (1) roof, gu fixed ring (45) rotates with washing storehouse (1) and is connected, gu fixed ring (45) are passed and solid fixed ring (45) are stretched into to washing storehouse (1) inside upside to the bottom of square rotating sleeve (44), square dwang (46) are located inside square rotating sleeve (44), the bottom of square dwang (46) is stretched out square rotating sleeve (44) bottom and is installed on water guide dish (5), four groups of second hydro-cylinder push rods (41) and second motor (43) all are connected with well accuse case (4) electricity.

5. The integrated cleaning apparatus for semiconductor wafers as claimed in claim 4, wherein the power device comprises a third motor (47), a dual output shaft reducer (48), two sets of first rotating shafts (49), two sets of retaining sleeves (50), two sets of first bevel gears (51), two sets of second bevel gears (52), two sets of second rotating shafts (53), two sets of worms (54) and two sets of third supporting plates (55), the third motor (47) and the dual output shaft reducer (48) are installed at the rear side of the cleaning chamber (1) and are in transmission connection with each other, two sets of first rotating shafts (49) are installed on the dual output shaft reducer (48), two sets of retaining sleeves (50) are respectively rotatably sleeved on the two sets of first rotating shafts (49), the front sides of two sets of retaining sleeves (50) are both fixed on the cleaning chamber (1), two sets of first bevel gears (51) are respectively installed at the outer sides of the two sets of first rotating shafts (49), two groups of second bevel gears (52) are respectively meshed with two groups of first bevel gears (51), the rear sides of two groups of second rotating shafts (53) are respectively installed on the two groups of second bevel gears (52), the front sides of the two groups of second rotating shafts (53) penetrate through the cleaning bin (1) and respectively extend into the left front side and the right front side of the cleaning bin (1), the two groups of second rotating shafts (53) are respectively rotatably connected with the cleaning bin (1), two groups of worms (54) are respectively installed on the two groups of second rotating shafts (53), the bottoms of the two groups of worms (54) are respectively meshed with the tops of two groups of worm gears (15), two groups of third supporting plates (55) are respectively rotatably installed on the front sides of the two groups of second rotating shafts (53), the outer sides of the two groups of third supporting plates (55) are respectively fixed on the inner wall of the cleaning bin (1), and a third motor (47) is electrically connected with a central control box (4).

6. An apparatus for bulk cleaning of semiconductor wafers as claimed in claim 5, characterized in that the positioning means comprise an arc-shaped teaching support plate (56), third hydro-cylinder push rod (57) and two sets of telescopic link (58), arc on the rear side positioner indicates that layer board (56) are located cleaning bin (1) inside rear side, the inside wall upside of arc indicates that layer board (56) sets up to the inclined plane, the rear side middle part at arc indicates that layer board (56) is installed in third hydro-cylinder push rod (57) slope, the bottom of third hydro-cylinder push rod (57) is located the rear at top, the bottom of third hydro-cylinder push rod (57) is fixed in cleaning bin (1) inner wall bottom, left side and the rear side at arc indicates that layer board (56) are installed in two sets of telescopic link (58) slope respectively, two sets of telescopic link (58) all are parallel with third hydro-cylinder push rod (57), the bottom army of two sets of telescopic link (58) is fixed in cleaning bin (1) inner wall bottom.

7. The apparatus for cleaning a semiconductor wafer as claimed in claim 6, further comprising a barometer (59), wherein the barometer (59) is installed on the third air pipe (25) on the right side, and the barometer (59) is electrically connected with the central control box (4).

8. The integrated cleaning equipment for the semiconductor wafer as claimed in claim 7, further comprising a shield (60), wherein the shield (60) is positioned at the outer side of the power device, the tee pipe (26) and the air pump (27) at the rear side of the cleaning bin (1), the front side of the shield (60) is fixed on the cleaning bin (1), and the two groups of the third air pipes (25) and the fourth air pipes (28) penetrate through the shield (60).