CN114985359B

CN114985359B - Wafer cleaning equipment applied to acceleration sensing chip production

Info

Publication number: CN114985359B
Application number: CN202210923072.8A
Authority: CN
Inventors: 徐宝; 吴刚; 徐元
Original assignee: Suzhou Milo Weina Electronic Technology Co ltd
Current assignee: Suzhou Milo Weina Electronic Technology Co ltd
Priority date: 2022-08-02
Filing date: 2022-08-02
Publication date: 2022-11-08
Anticipated expiration: 2042-08-02
Also published as: CN114985359A

Abstract

The invention relates to the technical field of cleaning equipment, in particular to wafer cleaning equipment applied to acceleration sensing chip production, which comprises two guide plate groups, wherein the two guide plate groups are mutually parallel and are distributed in an inclined manner, each guide plate group consists of an outer frame and an inner plate, the inner plate is positioned in the middle of the outer frame, the outer wall of the inner plate and the inner wall of the outer frame form an annular groove, the left side of the annular groove is arc-shaped, and the right side of the annular groove is square; the wafer cleaning mode can be effectively simplified by carrying out one-time comprehensive cleaning treatment on the double sides and the side walls of the wafer, the process complexity of cleaning and overturning the single side of the wafer is reduced, the cleaning efficiency is improved, the wafer cleaning speed is improved, the continuous conveying type cleaning mode of the wafer is realized, and the product processing efficiency is improved.

Description

Wafer cleaning equipment applied to acceleration sensing chip production

Technical Field

The invention relates to the technical field of cleaning equipment, in particular to wafer cleaning equipment applied to acceleration sensing chip production.

Background

As is well known, a wafer is a circular sheet-like structure, which is obtained by cutting a silicon crystal column, and can be used in the field of electronic automation control equipment such as various chips, semiconductors, etc., after the wafer is cut, the surface of the wafer generally needs to be cleaned, so as to remove impurities on the surface of the wafer, and facilitate subsequent circuit etching or electronic component installation on the wafer.

Disclosure of Invention

In order to solve the technical problem, the invention provides wafer cleaning equipment applied to acceleration sensing chip production.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the wafer cleaning equipment applied to the production of the acceleration sensing chip comprises two guide plate groups, wherein the two guide plate groups are parallel to each other and are distributed in an inclined manner, each guide plate group consists of an outer frame and an inner plate, the inner plate is positioned in the middle of the outer frame, the outer wall of the inner plate and the inner wall of the outer frame form an annular groove, the left side of the annular groove is arc-shaped, and the right side of the annular groove is square;

a plurality of crankshafts are arranged between the two guide plate groups, the arrangement directions of the crankshafts are the same, two ends of each crankshaft respectively penetrate through the annular grooves in the two guide plate groups, the crankshafts slide along the annular grooves, and the end parts of the crankshafts are provided with rotary clamping structures which are used for fixing the chips and driving the chips to rotate;

the annular water delivery groove plate is positioned on the outer side of the two guide plate groups, a plurality of water guide pipes are communicated and arranged on the outer wall of the annular water delivery groove plate and are rotatably connected with the annular water delivery groove plate, and the outer ends of the water guide pipes are communicated and provided with spray heads.

The two power rings are positioned between the two guide plate groups, the two power rings are respectively and rotatably installed in the middle parts of the two inner plates, the two power rings are obliquely distributed, a plurality of pull rods are obliquely arranged between the two power rings, and two ends of each pull rod are respectively and rotatably connected with the two power rings;

a plurality of first telescopic links are installed on the outer wall of the power ring, a first lantern ring is installed at the movable end of each first telescopic link, and the first lantern ring is rotatably sleeved on the outer wall of the crankshaft.

Furthermore, the rotary clamping structure comprises an arc-shaped plate, the arc-shaped plate is fixed on the crankshaft, a supporting arm is arranged at the outer end of the arc-shaped plate, a supporting sleeve is arranged at the outer end of the supporting arm, a sliding rod is sleeved in the supporting sleeve in a sliding manner, a first air cylinder is rotatably arranged at one end of the sliding rod, and the fixed end of the first air cylinder is rotatably arranged on the outer wall of the arc-shaped plate;

three V-shaped rubber wheels are arranged on the inner side of the arc-shaped plate, the three V-shaped rubber wheels are distributed in an acute triangle shape, one V-shaped rubber wheel is rotatably arranged on the slide rod, and the remaining two V-shaped rubber wheels are rotatably arranged on the inner wall of the arc-shaped plate;

install first motor on the arc, the output of first motor is connected with a V type rubber wheel transmission on the arc, and the outside of first motor is detained and is equipped with water proof cover, and water proof cover is fixed on the arc.

Furthermore, an annular fixed groove plate is sleeved on the inner side of the annular water delivery groove plate and is rotatably connected with the annular water delivery groove plate, the annular fixed groove plate and the annular water delivery groove plate form a closed cavity, the annular fixed groove plate is fixed on the inner plate, two partition plates are arranged in the annular fixed groove plate, the outer ends of the two partition plates extend into the annular water delivery groove plate, the closed cavity formed by the annular fixed groove plate and the annular water delivery groove plate is divided into a flow guide cavity and a vacant cavity by the two partition plates, and the vacant cavity is close to one side of a square area of the annular groove;

the conveying pipe is communicated with the flow guide cavity, the outer end of the conveying pipe is communicated with a water inlet bent pipe, and the water inlet bent pipe penetrates through the two inner plates and is fixedly connected with the two inner plates.

The rotating ring is rotatably arranged on the side wall of the annular fixed groove plate, a plurality of rotating discs are rotatably arranged on the rotating ring, shifting fork rods are arranged on the rotating discs, and the water guide pipe penetrates through fork openings of the shifting fork rods and slides relatively;

the outer wall of the rotating ring is rotatably provided with a second cylinder, the fixed end of the second cylinder is provided with a mounting plate, the mounting plate is rotatably connected with the second cylinder, and the mounting plate is fixed on the annular water delivery trough plate.

Furthermore, a plurality of second telescopic rods are fixed on the outer wall of the annular water delivery trough plate, second lantern rings are installed at the movable ends of the second telescopic rods, and the second lantern rings are rotatably sleeved on the outer wall of the crankshaft.

The water inlet bent pipe is fixed on the base plate, the second motor is fixed on an inner plate close to the base plate, a driving wheel is arranged at the output end of the second motor and is positioned on the inner side of a power ring on the inner plate close to the base plate, and the driving wheel is in transmission connection with the power ring.

Furthermore, the outer end of the water inlet elbow is provided with an arched reinforcing frame, and the outer end of the arched reinforcing frame is connected with the outer frame far away from the base plate.

Compared with the prior art, the invention has the beneficial effects that: the wafer cleaning mode can be effectively simplified by carrying out one-time comprehensive cleaning treatment on the double sides and the side walls of the wafer, the process complexity of cleaning and overturning the single side of the wafer is reduced, the cleaning efficiency is improved, the wafer cleaning speed is improved, the continuous conveying type cleaning mode of the wafer is realized, and the product processing efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic sectional view of the ring-shaped water transport trough plate of FIG. 1;

FIG. 3 is a schematic cross-sectional right side view of the guide plate assembly of FIG. 1;

FIG. 4 is a schematic right-view enlarged structure of two guide plate groups in FIG. 2;

FIG. 5 is an enlarged view of the arcuate plate of FIG. 1;

FIG. 6 is an enlarged view of the ring-shaped water transport trough plate of FIG. 1;

FIG. 7 is an enlarged view of a portion A of FIG. 3;

in the drawings, the reference numbers: 1. a guide plate group; 2. an outer frame; 3. an inner plate; 4. a crankshaft; 5. an annular water delivery groove plate; 6. a water conduit; 7. a spray head; 8. a power ring; 9. a pull rod; 10. a first telescopic rod; 11. a first collar; 12. an arc-shaped plate; 13. a support arm; 14. a support sleeve; 15. a slide bar; 16. a first cylinder; 17. a V-shaped rubber wheel; 18. a first motor; 19. a water-insulating cover; 20. an annular fixed groove plate; 21. a partition plate; 22. a delivery pipe; 23. a water inlet bent pipe; 24. a rotating ring; 25. a turntable; 26. a fork lever; 27. a second cylinder; 28. mounting a plate; 29. a second telescopic rod; 30. a second collar; 31. a substrate; 32. a support plate; 33. a second motor; 34. a driving wheel; 35. an arch-shaped reinforcing frame.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect through an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. This embodiment is written in a progressive manner.

As shown in fig. 2, 3 and 6, the wafer cleaning apparatus applied to the acceleration sensing chip production according to the present invention includes two guide plate groups 1, the two guide plate groups 1 are parallel to each other, the two guide plate groups 1 are distributed in an inclined manner, the guide plate group 1 is composed of an outer frame 2 and an inner plate 3, the inner plate 3 is located in the middle of the outer frame 2, and an outer wall of the inner plate 3 and an inner wall of the outer frame 2 form an annular groove, a left side of the annular groove is set to be arc-shaped, and a right side of the annular groove is set to be square;

a plurality of crankshafts 4 are arranged between the two guide plate groups 1, the arrangement directions of the crankshafts 4 are the same, two ends of each crankshaft 4 respectively penetrate through the annular grooves in the two guide plate groups 1, the crankshafts 4 slide along the annular grooves, and the ends of the crankshafts 4 are provided with rotary clamping structures which are used for fixing the chips and driving the chips to rotate;

still include annular water delivery frid 5, annular water delivery frid 5 is located the outside of two deflector group 1, and the intercommunication is provided with a plurality of aqueducts 6 on the outer wall of annular water delivery frid 5 to aqueduct 6 rotates with annular water delivery frid 5 to be connected, and the outer end intercommunication of aqueduct 6 is provided with shower nozzle 7.

In the embodiment, the crankshaft 4 is pushed to move, because the two guide plate groups 1 are distributed in an inclined manner, the annular grooves on the two guide plate groups 1 are distributed in an inclined manner, the left side and the right side of the crankshaft 4 respectively slide in the two annular grooves, so that the two annular grooves perform synchronous guide treatment on the crankshaft 4, the left side and the right side of the crankshaft 4 always move in a height difference manner, so that the crankshaft 4 performs translational motion, the crankshaft 4 performs annular motion around the annular grooves, the chip is fixed on the rotary clamping structure, the crankshaft 4 drives the rotary clamping structure and the chip to perform synchronous translational motion, the chip is kept in a horizontal state, the annular water conveying trough plate 5 is rotated, so that the annular water conveying trough plate 5 and the crankshaft 4 synchronously move, the annular water conveying trough plate 5 drives the plurality of water guide pipes 6 and the plurality of spray nozzles 7 to synchronously rotate, and the nozzle directions of the spray nozzles 7 always face the chip, when the chip moves to the lower side of the annular groove and moves towards the arc-shaped area of the annular groove, the nozzle of the spray nozzle 7 faces downwards, water in the annular water delivery groove plate 5 is discharged through the water guide pipe 6 and the spray nozzle 7, the water discharged by the spray nozzle 7 is sprayed to the upper surface of the chip, the water guide pipe 6 is rotated simultaneously, the water guide pipe 6 and the spray nozzle 7 are in a swinging state, the rotary clamping structure synchronously drives the chip to rotate, the water discharged by the spray nozzle 7 in a swinging spraying mode can completely fall onto the chip in the rotating state, so that the upper surface of the chip is completely cleaned, meanwhile, when the chip moves in the arc-shaped area of the annular groove, the angle between the water spraying direction of the spray nozzle 7 and the upper surface of the wafer is gradually reduced, so that the multi-angle inclined water spraying cleaning work of the wafer is realized, the shielding residue of impurities on the wafer is avoided, and the synchronous cleaning treatment of the circumferential side wall of the wafer is convenient, when the wafer moves to the upper side of the spray head 7 and moves towards the upper side of the annular groove, water sprayed from the spray head 7 cleans the lower surface of the wafer, so that the wafer can be cleaned comprehensively at one time, when the wafer moves to the square area on the right side of the annular groove, an external mechanical arm transfers the cleaned wafer and loads the next wafer to be cleaned onto the rotary clamping structure, the crankshafts 4 rotate circularly, so that the continuous automatic cleaning of the wafer is realized, the wafer cleaning mode can be effectively simplified by performing the one-time comprehensive cleaning treatment on the double sides and the side walls of the wafer, the process complexity of cleaning and overturning the single side of the wafer is reduced, the cleaning efficiency is improved, the wafer cleaning speed is improved, the continuous conveying type cleaning mode of the wafer is realized, and the product processing efficiency is improved.

In this embodiment, the wafer in the autorotation state can rapidly spin away the impurities and water thereon, so as to improve the cleaning effect, and simultaneously, the water sprayed from the spray head 7 can conveniently fall on the wafer, thereby improving the cleaning comprehensiveness of the wafer.

As shown in fig. 4, as a preferable embodiment, the guide plate further includes two power rings 8, the two power rings 8 are located between the two guide plate groups 1, the two power rings 8 are respectively rotatably installed in the middle of the two inner plates 3, the two power rings 8 are distributed in an inclined manner, a plurality of pull rods 9 are obliquely arranged between the two power rings 8, and two ends of each pull rod 9 are respectively rotatably connected with the two power rings 8;

a plurality of first telescopic links 10 are installed on the outer wall of the power ring 8, a first collar 11 is installed at the movable end of the first telescopic links 10, and the first collar 11 is rotatably sleeved on the outer wall of the crankshaft 4.

In this embodiment, rotate a power ring 8, this power ring 8 drives another power ring 8 synchronous rotation through a plurality of pull rods 9, power ring 8 promotes bent axle 4 through first telescopic link 10 and first lantern ring 11 and slides in the ring channel, the left and right sides of bent axle 4 keeps synchronous motion, thereby make bent axle 4 carry out annular translation motion, bent axle 4's direction remains inconvenient throughout, when bent axle 4 removes to the square region in ring channel right side, first telescopic link 10 carries out concertina movement.

As shown in fig. 5 and fig. 7, as a preferred embodiment of the above embodiment, the rotary clamping structure includes an arc-shaped plate 12, the arc-shaped plate 12 is fixed on the crankshaft 4, a supporting arm 13 is installed at an outer end of the arc-shaped plate 12, a supporting sleeve 14 is installed at an outer end of the supporting arm 13, a sliding rod 15 is slidably sleeved in the supporting sleeve 14, one end of the sliding rod 15 is rotatably installed with a first air cylinder 16, and a fixed end of the first air cylinder 16 is rotatably installed on an outer wall of the arc-shaped plate 12;

three V-shaped rubber wheels 17 are arranged on the inner side of the arc-shaped plate 12, the three V-shaped rubber wheels 17 are distributed in an acute triangle shape, one V-shaped rubber wheel 17 is rotatably arranged on the slide rod 15, and the remaining two V-shaped rubber wheels 17 are rotatably arranged on the inner wall of the arc-shaped plate 12;

the arc-shaped plate 12 is provided with a first motor 18, the output end of the first motor 18 is in transmission connection with a V-shaped rubber wheel 17 on the arc-shaped plate 12, the outer side of the first motor 18 is buckled with a water-proof cover 19, and the water-proof cover 19 is fixed on the arc-shaped plate 12.

In this embodiment, when the wafer is conveyed to between the three V-shaped rubber wheels 17, the first cylinder 16 pushes the V-shaped rubber wheel 17 on the sliding rod 15 to move towards the inner side of the arc-shaped plate 12 through the sliding rod 15, at this time, the V-shaped rubber wheel 17 on the sliding rod 15 and the two V-shaped rubber wheels 17 on the arc-shaped plate 12 gradually approach to each other, the three V-shaped rubber wheels 17 extrude and fix the wafer therebetween, so that the wafer is fixed on the arc-shaped plate 12, the moving crankshaft 4 drives the wafer to perform translational motion through the arc-shaped plate 12, the supporting arm 13 and the supporting sleeve 14 support the sliding rod 15, the first motor 18 can drive the V-shaped rubber wheel 17 thereon to rotate, so as to drive the wafer to rotate between the three V-shaped rubber wheels 17, and the water-stop cover 19 can shield the first motor 18.

As shown in fig. 2, 6 and 7, as a preference of the above embodiment, an annular fixing groove plate 20 is sleeved on the inner side of the annular water delivery groove plate 5, the annular fixing groove plate 20 is rotatably connected with the annular water delivery groove plate 5, the annular fixing groove plate 20 and the annular water delivery groove plate 5 form a closed chamber, the annular fixing groove plate 20 is fixed on the inner plate 3, two partition plates 21 are arranged in the annular fixing groove plate 20, the outer ends of the two partition plates 21 extend into the annular water delivery groove plate 5, the two partition plates 21 divide the closed chamber formed by the annular fixing groove plate 20 and the annular water delivery groove plate 5 into a diversion chamber and an empty chamber, and the empty chamber is close to one side of the square area of the annular groove;

the inner wall of the annular fixed groove plate 20 is provided with a conveying pipe 22 in a communicating manner, the conveying pipe 22 is communicated with the diversion chamber, the outer end of the conveying pipe 22 is provided with a water inlet bent pipe 23 in a communicating manner, and the water inlet bent pipe 23 penetrates through the two inner plates 3 and is fixedly connected with the two inner plates.

In this embodiment, the annular water delivery groove plate 5 can rotate on the annular fixed groove plate 20, external water can be pumped into the flow guide cavity between the annular fixed groove plate 20 and the annular water delivery groove plate 5 through the water inlet bent pipe 23 and the conveying pipe 22, when the crankshaft 4 moves into the square region of the annular groove, the input end of the water guide pipe 6 is communicated with the vacant cavity, the shower nozzle 7 stops draining water at this moment, so that the shower nozzle 7 is in an idle state when the wafer is subjected to loading and unloading work, the influence of water discharged by the shower nozzle 7 on the wafer loading and unloading work is avoided, when the crankshaft 4 moves out of the square region of the annular groove, the input end of the water guide pipe 6 is communicated with the flow guide cavity, water in the flow guide cavity can be discharged through the water guide pipe 6 and the shower nozzle 7, and therefore the water discharged by the shower nozzle 7 can clean the wafer.

As shown in fig. 6, as a preferable mode of the above embodiment, the water guide pipe further includes a rotating ring 24, the rotating ring 24 is rotatably installed on the side wall of the annular fixed groove plate 20, a plurality of rotating discs 25 are rotatably installed on the rotating ring 24, a shifting fork rod 26 is installed on the rotating discs 25, and the water guide pipe 6 passes through the fork mouth of the shifting fork rod 26 and slides relatively;

a second cylinder 27 is rotatably mounted on the outer wall of the rotating ring 24, a mounting plate 28 is arranged at the fixed end of the second cylinder 27, the mounting plate 28 is rotatably connected with the second cylinder 27, and the mounting plate 28 is fixed on the annular water delivery trough plate 5.

In this embodiment, when the circular water delivery chute board 5 rotates, the circular water delivery chute board 5 pulls the rotating ring 24 to rotate on the circular fixing chute board 20 through the second air cylinder 27 and the mounting board 28, the rotating ring 24 pushes the water conduit 6 to move synchronously along with the circular water delivery chute board 5 through the rotating disc 25 and the fork lever 26, when the second air cylinder 27 performs telescopic motion, the second air cylinder 27 drives the rotating ring 24 and the circular water delivery chute board 5 to rotate relatively, the rotating ring 24 pulls the water conduit 6 to rotate back and forth on the circular water delivery chute board 5 through the rotating disc 25 and the fork lever 26, so that the water conduit 6 and the shower nozzle 7 perform reciprocating swing while performing circular rotation along with the circular water delivery chute board 5, and water sprayed from the shower nozzle 7 is conveniently attached to the wafer in a whole manner and performs a whole cleaning process on the wafer, at this time, the water conduit 6 slides in the fork lever 26, and the water conduit 6 drives the rotating disc 25 to rotate on the rotating ring 24 through the fork lever 26.

As shown in fig. 5 and 6, preferably, a plurality of second telescopic rods 29 are fixed on the outer wall of the annular water delivery trough plate 5, a second collar 30 is mounted on the movable end of each second telescopic rod 29, and the second collar 30 is rotatably sleeved on the outer wall of the crankshaft 4.

In this embodiment, when the crankshaft 4 performs circular motion, the crankshaft 4 pulls the annular water delivery groove plate 5 to rotate synchronously through the second sleeve ring 30 and the second telescopic rod 29, and the second telescopic rod 29 can perform telescopic motion, so as to ensure that the spray head 7 and the wafer move synchronously, and the nozzle direction of the spray head 7 and the wafer can be kept corresponding all the time.

As shown in fig. 3, as a preferred embodiment, the device further includes a base plate 31 and a second motor 33, wherein a plurality of supporting plates 32 are mounted on the base plate 31, the supporting plates 32 are connected to the two outer frames 2, the water inlet elbow 23 is fixed on the base plate 31, the second motor 33 is fixed on the inner plate 3 close to the base plate 31, an output end of the second motor 33 is provided with a driving wheel 34, the driving wheel 34 is located inside the power ring 8 on the inner plate 3 close to the base plate 31, and the driving wheel 34 is in transmission connection with the power ring 8.

In this embodiment, the water inlet elbow 23, the base plate 31 and the supporting plate 32 can support the two outer frames 2 and the two inner plates 3, so as to ensure that the outer frames 2 and the inner plates 3 on the guide plate group 1 are in a relatively static state, and the second motor 33 can drive the power ring 8 to rotate through the driving wheel 34, so as to drive the equipment to operate.

As shown in fig. 1, as a preferred embodiment of the above embodiment, an arcuate reinforcing frame 35 is mounted to an outer end of the water inlet elbow 23, and an outer end of the arcuate reinforcing frame 35 is connected to the outer frame 2 away from the base plate 31.

In this embodiment, through setting up bow-shaped reinforcing frame 35, can conveniently make two frames 2 and two inner panels 3 fixed connection, improve the firm intensity between two deflector group 1 to the convenience supports 23 outer ends of return bend of intaking.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make various improvements and modifications without departing from the technical principle of the present invention, and those improvements and modifications should be also considered as the protection scope of the present invention.

Claims

1. The wafer cleaning equipment applied to the production of the acceleration sensing chip is characterized by comprising two guide plate groups (1), wherein the two guide plate groups (1) are mutually parallel, the two guide plate groups (1) are distributed in an inclined manner, each guide plate group (1) consists of an outer frame (2) and an inner plate (3), the inner plate (3) is positioned in the middle of the outer frame (2), the outer wall of the inner plate (3) and the inner wall of the outer frame (2) form an annular groove, the left side of the annular groove is arc-shaped, and the right side of the annular groove is square;

a plurality of crankshafts (4) are arranged between the two guide plate groups (1), the arrangement directions of the crankshafts (4) are the same, two ends of each crankshaft (4) respectively penetrate through the annular grooves on the two guide plate groups (1), the crankshafts (4) slide along the annular grooves, and the end parts of the crankshafts (4) are provided with rotary clamping structures which are used for fixing the chips and driving the chips to rotate;

the water guide pipe is characterized by further comprising an annular water delivery groove plate (5), wherein the annular water delivery groove plate (5) is located on the outer side of the two guide plate groups (1), the outer wall of the annular water delivery groove plate (5) is communicated with a plurality of water guide pipes (6), the water guide pipes (6) are rotatably connected with the annular water delivery groove plate (5), and the outer ends of the water guide pipes (6) are communicated with a spray head (7).

2. The wafer cleaning equipment applied to the production of the acceleration sensing chip as claimed in claim 1, further comprising two power rings (8), wherein the two power rings (8) are located between the two guide plate groups (1), the two power rings (8) are respectively rotatably mounted in the middle of the two inner plates (3), the two power rings (8) are distributed in an inclined manner, a plurality of pull rods (9) are obliquely arranged between the two power rings (8), and two ends of each pull rod (9) are respectively rotatably connected with the two power rings (8);

a plurality of first telescopic rods (10) are installed on the outer wall of the power ring (8), a first sleeve ring (11) is installed at the movable end of each first telescopic rod (10), and the first sleeve ring (11) is rotatably sleeved on the outer wall of the crankshaft (4).

3. The wafer cleaning equipment applied to the production of the acceleration sensing chip as claimed in claim 2, wherein the rotating clamping structure comprises an arc-shaped plate (12), the arc-shaped plate (12) is fixed on the crankshaft (4), a supporting arm (13) is installed at the outer end of the arc-shaped plate (12), a supporting sleeve (14) is installed at the outer end of the supporting arm (13), a sliding rod (15) is sleeved in the supporting sleeve (14) in a sliding manner, a first cylinder (16) is installed at one end of the sliding rod (15) in a rotating manner, and the fixed end of the first cylinder (16) is installed on the outer wall of the arc-shaped plate (12) in a rotating manner;

three V-shaped rubber wheels (17) are arranged on the inner side of the arc-shaped plate (12), the three V-shaped rubber wheels (17) are distributed in an acute triangle shape, one V-shaped rubber wheel (17) is rotatably installed on the sliding rod (15), and the remaining two V-shaped rubber wheels (17) are rotatably installed on the inner wall of the arc-shaped plate (12);

install first motor (18) on arc (12), the output of first motor (18) is connected with a V type rubber pulley (17) transmission on arc (12), and the outside of first motor (18) is detained and is equipped with water proof cover (19), and water proof cover (19) are fixed on arc (12).

4. The wafer cleaning equipment applied to the production of the acceleration sensing chip as recited in claim 3, wherein the annular water delivery groove plate (5) is sleeved with an annular fixed groove plate (20), the annular fixed groove plate (20) is rotatably connected with the annular water delivery groove plate (5), the annular fixed groove plate (20) and the annular water delivery groove plate (5) form a closed chamber, the annular fixed groove plate (20) is fixed on the inner plate (3), two partition plates (21) are arranged in the annular fixed groove plate (20), outer ends of the two partition plates (21) extend into the annular water delivery groove plate (5), the two partition plates (21) divide the closed chamber formed by the annular fixed groove plate (20) and the annular water delivery groove plate (5) into a flow guide chamber and an empty chamber, and the empty chamber is close to one side of a square area of the annular groove;

the inner wall of the annular fixed groove plate (20) is provided with a conveying pipe (22) in a communicating mode, the conveying pipe (22) is communicated with the diversion chamber, the outer end of the conveying pipe (22) is provided with a water inlet bent pipe (23) in a communicating mode, and the water inlet bent pipe (23) penetrates through the two inner plates (3) and is fixedly connected with the inner plates.

5. The wafer cleaning equipment applied to the production of the acceleration sensing chips as claimed in claim 4, further comprising a rotating ring (24), wherein the rotating ring (24) is rotatably installed on the side wall of the annular fixed groove plate (20), a plurality of rotating discs (25) are rotatably installed on the rotating ring (24), a shifting fork rod (26) is installed on each rotating disc (25), and the water guide pipe (6) penetrates through the fork mouth of the shifting fork rod (26) and slides relatively;

a second air cylinder (27) is rotatably mounted on the outer wall of the rotating ring (24), a mounting plate (28) is arranged at the fixed end of the second air cylinder (27), the mounting plate (28) is rotatably connected with the second air cylinder (27), and the mounting plate (28) is fixed on the annular water delivery trough plate (5).

6. The wafer cleaning equipment applied to the production of the acceleration sensing chip as recited in claim 5, characterized in that a plurality of second telescopic rods (29) are fixed on the outer wall of the annular water delivery groove plate (5), a second sleeve ring (30) is installed at the movable end of the second telescopic rods (29), and the second sleeve ring (30) is rotatably sleeved on the outer wall of the crankshaft (4).

7. The wafer cleaning equipment applied to the production of the acceleration sensing chip as recited in claim 6, further comprising a base plate (31) and a second motor (33), wherein a plurality of support plates (32) are installed on the base plate (31), the support plates (32) are connected with the two outer frames (2), the water inlet elbow (23) is fixed on the base plate (31), the second motor (33) is fixed on the inner plate (3) close to the base plate (31), the output end of the second motor (33) is provided with a driving wheel (34), the driving wheel (34) is located on the inner side of the power ring (8) on the inner plate (3) close to the base plate (31), and the driving wheel (34) is in transmission connection with the power ring (8).

8. The wafer cleaning equipment applied to the production of the acceleration sensing chip as recited in claim 7, characterized in that the outer end of the water inlet elbow (23) is provided with an arched reinforcing frame (35), and the outer end of the arched reinforcing frame (35) is connected with the outer frame (2) far away from the base plate (31).