CN116654624B - Wafer conveying device comprising traction driving speed reducer - Google Patents
Wafer conveying device comprising traction driving speed reducer Download PDFInfo
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- CN116654624B CN116654624B CN202310502649.2A CN202310502649A CN116654624B CN 116654624 B CN116654624 B CN 116654624B CN 202310502649 A CN202310502649 A CN 202310502649A CN 116654624 B CN116654624 B CN 116654624B
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- 239000003638 chemical reducing agent Substances 0.000 title abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 51
- 239000007788 liquid Substances 0.000 description 6
- 230000001050 lubricating effect Effects 0.000 description 6
- 230000003044 adaptive effect Effects 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
- B65G47/841—Devices having endless travelling belts or chains equipped with article-engaging elements
- B65G47/843—Devices having endless travelling belts or chains equipped with article-engaging elements the article-engaging elements being suction or magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/40—Safety features of loads, equipment or persons
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer conveying, and discloses a wafer conveying device comprising a traction driving speed reducer, which comprises a dustproof frame, wherein the surface of the dustproof frame is hinged with a sealing door, the top of the dustproof frame is fixedly connected with an air pump, the output end of the air pump is communicated with a bent pipe, the surface of the dustproof frame is provided with a discharging part, the inside of the dustproof frame is provided with a placement part, and the wafer conveying device further comprises: the conveying component comprises a gear motor, the output end of the gear motor is fixedly connected with a rotating rod, the surface of the gear motor is fixedly connected with a support, and the support is fixedly connected with the top of the inner wall of the dust-proof frame. According to the invention, after the speed reducing motor is electrified, the rotating rod drives the gear to rotate through the speed reducing motor, the gear drives the driving gear to rotate through meshing, the driving gear is meshed with the inner wall of the conveying belt, and the ends of the driving gear and the locating ring extend into the conveying belt to support the conveying belt.
Description
Technical Field
The invention relates to the technical field of wafer conveying equipment, in particular to a wafer conveying device comprising a traction driving speed reducer.
Background
The wafer is a carrier for producing semiconductor chips, the production comprises the steps of die bonding, cutting, polishing, gluing, etching, exposing, developing and the like, and a conveying belt or a transfer frame is generally adopted to transfer and convey the wafer between or in each step;
when the wafer is conveyed by the belt, the wafer is not limited on the surface of the belt, and when the wafer is displaced on the surface of the belt, friction is generated between the wafer and the belt, so that scratches are easily caused on the surface of the wafer.
Disclosure of Invention
The present invention is directed to a wafer conveying apparatus including a traction drive decelerator, so as to solve the above-mentioned problems.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a wafer conveying device comprising a traction driving speed reducer, which comprises a dustproof frame, wherein the surface of the dustproof frame is hinged with a sealing door, the top of the dustproof frame is fixedly connected with an air pump, the output end of the air pump is communicated with a bent pipe, the surface of the dustproof frame is provided with a discharging part, the inside of the dustproof frame is provided with a placement part, and the wafer conveying device further comprises:
the conveying component comprises a speed reducing motor, the output end of the speed reducing motor is fixedly connected with a rotating rod, the surface of the speed reducing motor is fixedly connected with a bracket, and the bracket is fixedly connected with the top of the inner wall of the dust-proof frame;
the cooling component comprises a ring frame, the ring frame is communicated with the inside of the gear motor, the surface of the rotating rod is fixedly connected with a protruding block, a concave hole ring is arranged in the ring frame, and the concave hole ring is communicated with the ring frame through a right-angle pipe;
the adsorption component comprises an electric push rod, a movable belt is fixedly connected to the bottom of the electric push rod, an adaptive frame is arranged in the movable belt, and the adaptive frame and the bent pipe are mutually communicated through a circular pipe.
Further, the number of the bent pipes is two, and the two bent pipes penetrate through the dustproof frame and extend to the inside of the dustproof frame.
Further, the conveying part comprises a driving gear, the driving gear is sleeved with the bottom of the support, one end, far away from the driving gear, of the support is sleeved with a locating ring, the surface of the driving gear is meshed with a transmission belt, and the surface of the rotating rod is fixedly connected with a gear;
the transmission belt is arranged in the dustproof frame.
Further, one end of the transmission belt far away from the driving gear is in contact with the surface of the positioning ring, the gear is meshed with the driving gear, and the gear is positioned at one end of the positioning ring, which is close to the driving gear.
Further, the cooling component comprises a top ring, the top ring is fixedly connected with the inner wall of the circular ring frame, the bottom of the top ring is fixedly connected with a lifting ring through a spring, the lifting ring is fixedly connected with the top ring through a telescopic rod, and the bottom of the lifting ring is fixedly connected with a right-angle frame;
the right angle frame penetrates through the ring frame and extends to the outer end of the ring frame.
Further, the right-angle pipe sets up the outer end at the ring frame, the bottom fixedly connected with extrusion piece of lift ring, the one end that the lift ring was kept away from to extrusion piece sets up the inside at the right-angle pipe.
Further, the adsorption component comprises a vertical pipe, the vertical pipe is communicated with the movable belt, the bottom of the vertical pipe is communicated with a sucker, a bifurcation frame is fixedly connected to the inside of the sucker, a fixing rod is sleeved on the upper surface of the bifurcation frame, the fixing rod is fixedly connected with the inner wall of the vertical pipe, an extension rod is hinged to the top of the bifurcation frame, and an arc plate is fixedly connected to one end of the extension rod, which is far away from the bifurcation frame;
the top of the bifurcation extends to the inside of the drop tube, and the extension rod penetrates the drop tube and extends to the outer end of the drop tube.
Further, the placement component comprises a fixed plate, a round hole is formed in the top of the fixed plate, and a round hole plate is arranged in the round hole;
the round hole plate is fixedly connected with the bottom of the inner wall of the round hole through an elastic spring.
Further, the discharging part comprises a threaded frame, the threaded frame is fixedly connected with a dustproof frame, the surface of the dustproof frame is fixedly connected with a limiting frame, and a discharging rod is inserted into the limiting frame;
the discharging rod is in threaded connection with the inner wall of the threaded frame, and the threaded frame penetrates through the dustproof frame and extends to the inside of the dustproof frame.
The invention has the following beneficial effects:
according to the invention, after the gear motor is electrified, the rotating rod drives the gear to rotate through the gear motor, the gear drives the driving gear to rotate through meshing, the driving gear is meshed with the inner wall of the conveying belt, the ends of the driving gear and the locating ring extend into the conveying belt, the conveying belt is supported, the stability of the conveying belt in transporting wafers is improved, and the phenomenon that the wafers fall off due to unstable operation of the conveying belt is avoided.
According to the invention, when the rotating rod drives the protruding block to rotate, the protruding block can extrude the right-angle frame to move upwards, the right-angle frame pushes the lifting plate to move upwards towards the inner part of the circular ring frame, the extruding block is separated from the inner part of the right-angle pipe along with the lifting of the lifting plate, lubricating oil in the circular ring frame can flow into the inner part of the right-angle pipe, after the protruding block is separated from the right-angle frame, the lifting plate pushes the extruding block to move towards the inner part of the right-angle pipe through the pressure of the spring, lubricating liquid in the right-angle pipe enters the concave hole ring after being extruded, and enters the reducing motor through the concave hole ring, the lubricating liquid circularly flows in the inner part of the reducing motor, so that the cooling efficiency of the reducing motor is improved, and the service life of the reducing motor is prolonged.
After the air pump starts to work, air generated by the air pump enters the inside of the movable belt through the bent pipe, the bent pipe is a hose and is in sliding connection with the dust-proof frame, the movable belt moves up and down through the electric push rod, the movable belt slides on the surface of the adapting frame, the electric push rod pushes the sucker to move to the surface of the fixed plate, the sucker adsorbs a wafer to the bottom of the sucker through suction force generated by the air pump to fix the wafer, meanwhile, the movable belt is used for transporting the wafer, the sucker is arranged through rubber, and the wafer is prevented from inclining during transportation.
According to the invention, the wafer is placed on the surface of the round hole plate through the sealing door, and the round hole plate is connected with the inner wall of the round hole through the elastic spring, so that the round hole plate can squeeze the sucker, the stability of adsorbing the wafer is improved, the round hole plate is arranged, the suction force between the wafer and the round hole plate is reduced, and the sucker can transport the wafer more conveniently.
According to the invention, the unloading rod is twisted to rotate, the unloading rod moves towards the inside of the dustproof frame by utilizing the threads in the threaded frame, the inside of the dustproof frame is contacted with the arc plate when the unloading rod moves, the extension rod is extruded by the arc plate to move towards the inside of the vertical pipe, the bifurcation frame is pushed by the extension rod to incline, the bifurcation frame extrudes the sucker to deform, so that a gap is formed between the sucker and a wafer, and air pressure is released, so that the wafer is unloaded.
Of course, it is not necessary for any one product to practice the invention to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic top cross-sectional view of the dust-proof rack of the present invention;
FIG. 3 is a schematic view of the overall structure of the conveying member of the present invention;
FIG. 4 is a schematic view showing the overall structure of the cooling unit of the present invention;
FIG. 5 is a schematic view showing the overall structure of the adsorption member of the present invention;
FIG. 6 is a schematic view of the overall structure of the arc plate of the present invention;
FIG. 7 is a schematic view of the overall structure of the placement unit of the present invention;
fig. 8 is an enlarged schematic view of the portion a in fig. 2 according to the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
in the figure: 1. a dust-proof frame; 2. sealing the door; 3. an air pump; 4. bending the pipe; 8. a discharge member; 60. a screw thread rack; 61. a limiting frame; 62. a discharge rod; 9. a placement member; 51. a circular orifice plate; 52. a fixing plate; 53. a round hole; 5. a conveying member; 10. a speed reducing motor; 36. a rotating rod; 12. a bracket; 11. a cooling member; 30. a concave hole ring; 31. a spring; 32. a telescopic rod; 33. a top ring; 34. a protruding block; 35. a right angle tube; 37. a right angle frame; 38. a ring frame; 7. an adsorption member; 40. an electric push rod; 41. a round tube; 43. a moving belt; 44. a vertical pipe; 45. an adapter rack; 46. a suction cup; 47. a bifurcation frame; 48. a fixed rod; 49. an extension rod; 50. an arc plate; 13. a drive gear; 14. a transmission belt; 15. a gear; 16. and a positioning ring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, the invention discloses a wafer conveying device comprising a traction driving speed reducer, which comprises a dust-proof frame 1, wherein the surface of the dust-proof frame 1 is hinged with a sealing door 2, the top of the dust-proof frame 1 is fixedly connected with an air pump 3, the output end of the air pump 3 is communicated with a bent pipe 4, the surface of the dust-proof frame 1 is provided with a discharging part 8, the inside of the dust-proof frame 1 is provided with a placement part 9, and the wafer conveying device further comprises:
the conveying component 5, the conveying component 5 comprises a gear motor 10, the output end of the gear motor 10 is fixedly connected with a rotating rod 36, the surface of the gear motor 10 is fixedly connected with a bracket 12, and the bracket 12 is fixedly connected with the top of the inner wall of the dust-proof frame 1;
the cooling component 11, the cooling component 11 comprises a ring frame 38, the ring frame 38 is communicated with the inside of the gear motor 10, the surface of the rotating rod 36 is fixedly connected with a protruding block 34, a concave hole ring 30 is arranged in the ring frame 38, and the concave hole ring 30 is communicated with the ring frame 38 through a right-angle pipe 35;
the adsorption component 7, the adsorption component 7 includes electric push rod 40, and electric push rod 40's bottom fixedly connected with removes area 43, and the inside of removing area 43 is provided with adapter frame 45, and adapter frame 45 and return bend 4 are through pipe 41 intercommunication each other.
The number of the bent pipes 4 is two, and the two bent pipes 4 penetrate through the dust-proof frame 1 and extend to the inside of the dust-proof frame 1.
The conveying part 5 comprises a driving gear 13, the driving gear 13 is sleeved with the bottom of a support 12, one end of the support 12 far away from the driving gear 13 is sleeved with a locating ring 16, after a gear motor 10 is electrified, a rotating rod 36 drives a gear 15 to rotate through the gear motor 10, the gear 15 drives the driving gear 13 to rotate through meshing, the driving gear 13 is meshed with the inner wall of a conveying belt 14, the end parts of the driving gear 13 and the locating ring 16 extend into the conveying belt 14, the conveying belt 14 is supported, the stability of the conveying belt 14 in conveying wafers is improved, the falling of the wafers caused by unstable operation of the conveying belt 14 is avoided, the conveying belt 14 is meshed with the surface of the driving gear 13, and the gear 15 is fixedly connected with the surface of the rotating rod 36;
the conveyor belt 14 is provided inside the dust-proof frame 1.
The end of the conveyor belt 14 remote from the drive gear 13 is in contact with the surface of the positioning ring 16, the gear 15 is intermeshed with the drive gear 13, and the gear 15 is located at the end of the positioning ring 16 and the drive gear 13 close to each other.
The cooling part 11 comprises a top ring 33, the top ring 33 is fixedly connected with the inner wall of a circular ring frame 38, the bottom of the top ring 33 is fixedly connected with a lifting ring through a spring 31, a rotating rod 36 drives a protruding block 34 to rotate when rotating, the protruding block 34 can extrude a right-angle frame 37 to move upwards, the right-angle frame 37 pushes a lifting plate to move upwards towards the upper part of the inner part of the circular ring frame 38, the extruding block is separated from the inner part of a right-angle pipe 35 along with the rising of the lifting plate, lubricating oil in the circular ring frame 38 flows into the inner part of the right-angle pipe 35, after the protruding block is separated from the right-angle frame 37, the lifting plate pushes the extruding block to move towards the inner part of the right-angle pipe through the pressure of the spring, lubricating liquid in the right-angle pipe 35 enters into the concave hole ring 30 after being extruded, and enters into the gear motor 10 through the concave hole ring 30, the lubricating liquid circularly flows in the inner part of the gear motor 10, the cooling efficiency of the gear motor 10 is improved, the service life of the gear motor 10 is prolonged, the lifting ring is fixedly connected with the top ring 33 through a telescopic rod 32, and the bottom of the lifting ring is fixedly connected with the right-angle frame 37;
the right angle frame 37 penetrates the ring frame 38 and extends to the outer end of the ring frame 38.
The right-angle pipe 35 is arranged at the outer end of the ring frame 38, the bottom of the lifting ring is fixedly connected with an extrusion block, and one end of the extrusion block, which is far away from the lifting ring, is arranged inside the right-angle pipe 35.
The adsorption part 7 comprises a vertical pipe 44, the vertical pipe 44 is communicated with a movable belt 43, the bottom of the vertical pipe 44 is communicated with a sucker 46, the inside of the sucker 46 is fixedly connected with a bifurcation frame 47, the upper surface of the bifurcation frame 47 is sleeved with a fixed rod 48, the fixed rod 48 is fixedly connected with the inner wall of the vertical pipe 44, after the air pump 3 starts to work, gas generated by the air pump 3 enters the inside of the movable belt 43 through a bent pipe 4, the bent pipe 4 is a hose and is in sliding connection with the dustproof frame 1, the movable belt 43 carries out lifting movement through an electric push rod 40, the movable belt 43 slides on the surface of an adaptive frame 45, the sucker 46 is pushed to the surface of a fixed plate 52 through the electric push rod 40, the sucker 46 adsorbs a wafer on the bottom of the sucker 46 through the suction force generated by the air pump 3, the wafer is fixed, meanwhile, the wafer is transported through the movable belt 43, the sucker 46 is in a rubber arrangement, the inclination of the wafer is avoided during transportation, the top of the bifurcation frame 47 is hinged with an extension rod 49, and one end of the extension rod 49, which is far away from the bifurcation frame 47, is fixedly connected with an arc plate 50;
the top of the fork 47 extends to the inside of the drop tube 44, and the extension rod 49 penetrates the drop tube 44 and extends to the outer end of the drop tube 44.
The placement part 9 comprises a fixing plate 52, a round hole 53 is formed in the top of the fixing plate 52, a wafer is placed on the surface of a round hole plate 51 through a sealing door, the round hole plate 51 is connected with the inner wall of the round hole 53 through an elastic spring, the round hole plate 51 can squeeze the suction disc 46, the stability of wafer adsorption is improved, the round hole plate 51 is arranged, the suction force between the wafer and the round hole plate 51 is reduced, the suction disc 46 can transport the wafer more conveniently, and the round hole plate 51 is arranged in the round hole 53;
the circular hole plate 51 is fixedly connected with the bottom of the inner wall of the circular hole 53 through an elastic spring.
The unloading part 8 comprises a threaded frame 60, the threaded frame 60 is fixedly connected with a dustproof frame 1, a limiting frame 61 is fixedly connected to the surface of the dustproof frame 1, an unloading rod 62 is twisted to rotate, the unloading rod 62 moves towards the inside of the dustproof frame 1 by utilizing threads in the threaded frame 60, the unloading rod 62 contacts with an arc plate 50 after moving, an extension rod 49 is extruded to move towards the inside of a vertical pipe 44 by the arc plate 50, a bifurcation frame 47 is pushed by the extension rod 49 to incline, the bifurcation frame 47 is extruded to deform to enable gaps to be formed between the sucker 46 and a wafer, air pressure is released so as to unload the wafer, and the unloading rod 62 is inserted into the limiting frame 61;
the discharge rod 62 is screwed to the inner wall of the screw frame 60, and the screw frame 60 penetrates the dust frame 1 and extends into the dust frame 1.
When the device is used, after the gear motor 10 is electrified, the rotating rod 36 drives the gear 15 to rotate through the gear motor 10, the gear 15 drives the driving gear 13 to rotate through meshing, the driving gear 13 is meshed with the inner wall of the conveying belt 14, the ends of the driving gear 13 and the locating ring 16 are both extended into the conveying belt 14, the conveying belt 14 is supported, the stability of the conveying belt 14 in transporting wafers is improved, the falling off of the wafers caused by the instability of the conveying belt 14 in operation is avoided, the rotating rod 36 drives the protruding block 34 to rotate in rotation, the protruding block 34 can extrude the right-angle frame 37 to move upwards, the right-angle frame 37 pushes the lifting plate to move upwards in the interior of the right-angle frame 38, the extruding block is separated from the interior of the right-angle pipe 35 along with the rising of the lifting plate, lubricating oil in the ring frame 38 flows into the interior of the right-angle pipe 35, and after the protruding block is separated from the right-angle frame 37, the lifting plate pushes the extrusion block to move towards the inside of the right-angle pipe through the pressure of the spring, the lubricating liquid in the right-angle pipe 35 enters the inside of the concave hole ring 30 after being extruded, and enters the inside of the gear motor 10 through the concave hole ring 30, the lubricating liquid circularly flows in the inside of the gear motor 10, the cooling efficiency of the gear motor 10 is improved, the service life of the gear motor 10 is prolonged, after the air pump 3 starts to work, the air generated by the air pump 3 enters the inside of the movable belt 43 through the bent pipe 4, the bent pipe 4 is a hose and is in sliding connection with the dust-proof frame 1, the movable belt 43 moves up and down through the electric push rod 40, the movable belt 43 slides on the surface of the adapting frame 45, the sucker 46 is pushed to move to the surface of the fixed plate 52 through the electric push rod 40, the sucker 46 adsorbs the wafer at the bottom of the sucker 46 through the suction force generated by the air pump 3, the wafer is fixed, and meanwhile the movable belt 43 is utilized to transport the wafer, the sucking disc 46 is the rubber setting, avoid the wafer to appear the slope when transporting, the wafer passes through the sealing door and places on the surface of round hole board 51, round hole board 51 passes through the inner wall connection of elastic spring and round hole 53, make round hole board 51 can extrude sucking disc 46, improve the absorptive stability to the wafer, set up round hole board 51, reduce the suction between wafer and the round hole board 51, so that sucking disc 46 can more convenient transport the wafer, twist discharge rod 62 rotates, discharge rod 62 utilizes the screw thread of screw frame 60 inside to remove to dust-proof frame 1, the inside back of dust-proof frame 1 contacts with circular arc board 50 when discharge rod 62 removes, extrude the inside removal of extension rod 49 vertical pipe 44 through circular arc board 50, promote the slope of branch fork 47 through extension rod 49, branch fork 47 extrudees sucking disc 46 and produces deformation, make the gap between sucking disc 46 and the wafer, release atmospheric pressure, in order to discharge the wafer.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (9)
1. The utility model provides a wafer conveyor including dragging drive reduction gear, includes dust-proof frame (1), the surface of dust-proof frame (1) articulates there is sealing door (2), the top fixedly connected with air pump (3) of dust-proof frame (1), the output intercommunication of air pump (3) has return bend (4), the surface of dust-proof frame (1) is provided with discharge unit (8), the inside of dust-proof frame (1) is provided with settles part (9), its characterized in that still includes:
the conveying component (5), the conveying component (5) comprises a gear motor (10), the output end of the gear motor (10) is fixedly connected with a rotating rod (36), the surface of the gear motor (10) is fixedly connected with a bracket (12), and the bracket (12) is fixedly connected with the top of the inner wall of the dust-proof frame (1);
the cooling component (11), the cooling component (11) comprises a ring frame (38), the ring frame (38) is communicated with the inside of the gear motor (10), a protruding block (34) is fixedly connected to the surface of the rotating rod (36), a concave hole ring (30) is arranged in the ring frame (38), and the concave hole ring (30) and the ring frame (38) are mutually communicated through a right-angle pipe (35);
the adsorption component (7), adsorption component (7) include electric push rod (40), the bottom fixedly connected with of electric push rod (40) removes area (43), the inside of removing area (43) is provided with adapter frame (45), adapter frame (45) and return bend (4) are through pipe (41) intercommunication each other.
2. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the number of the bent pipes (4) is two, and the two bent pipes (4) penetrate through the dustproof frame (1) and extend to the inside of the dustproof frame (1).
3. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the conveying component (5) comprises a driving gear (13), the driving gear (13) is sleeved with the bottom of the support (12), one end, far away from the driving gear (13), of the support (12) is sleeved with a positioning ring (16), the surface of the driving gear (13) is meshed with a transmission belt (14), and the surface of the rotating rod (36) is fixedly connected with a gear (15);
the transmission belt (14) is arranged inside the dustproof frame (1).
4. A wafer transport apparatus including a traction drive decelerator as claimed in claim 3, wherein: one end of the transmission belt (14) far away from the driving gear (13) is in contact with the surface of the positioning ring (16), the gear (15) is meshed with the driving gear (13), and the gear (15) is positioned at one end of the positioning ring (16) and one end of the driving gear (13) close to each other.
5. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the cooling component (11) comprises a top ring (33), the top ring (33) is fixedly connected with the inner wall of the ring frame (38), the bottom of the top ring (33) is fixedly connected with a lifting ring through a spring (31), the lifting ring is fixedly connected with the top ring (33) through a telescopic rod (32), and the bottom of the lifting ring is fixedly connected with a right-angle frame (37);
the right-angle frame (37) penetrates through the ring frame (38) and extends to the outer end of the ring frame (38).
6. A wafer transport apparatus including a traction drive decelerator as claimed in claim 5, wherein: the right-angle pipe (35) is arranged at the outer end of the circular ring frame (38), the bottom of the lifting ring is fixedly connected with an extrusion block, and one end of the extrusion block, which is far away from the lifting ring, is arranged inside the right-angle pipe (35).
7. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the adsorption component (7) comprises a vertical pipe (44), the vertical pipe (44) is communicated with the movable belt (43), a sucker (46) is communicated with the bottom of the vertical pipe (44), a bifurcation frame (47) is fixedly connected to the inside of the sucker (46), a fixing rod (48) is sleeved on the upper surface of the bifurcation frame (47), the fixing rod (48) is fixedly connected with the inner wall of the vertical pipe (44), an extension rod (49) is hinged to the top of the bifurcation frame (47), and an arc plate (50) is fixedly connected to one end, far away from the bifurcation frame (47), of the extension rod (49);
the top of the bifurcation frame (47) extends to the inside of the drop tube (44), and the extension rod (49) penetrates the drop tube (44) and extends to the outer end of the drop tube (44).
8. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the placement component (9) comprises a fixed plate (52), a round hole (53) is formed in the top of the fixed plate (52), and a round hole plate (51) is arranged in the round hole (53);
the round hole plate (51) is fixedly connected with the bottom of the inner wall of the round hole (53) through an elastic spring.
9. A wafer transport apparatus including a traction drive decelerator as claimed in claim 1, wherein: the discharging component (8) comprises a threaded frame (60), the threaded frame (60) is fixedly connected with the dustproof frame (1), a limiting frame (61) is fixedly connected to the surface of the dustproof frame (1), and a discharging rod (62) is inserted into the limiting frame (61);
the discharging rod (62) is in threaded connection with the inner wall of the threaded frame (60), and the threaded frame (60) penetrates through the dustproof frame (1) and extends to the inside of the dustproof frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310502649.2A CN116654624B (en) | 2023-05-06 | 2023-05-06 | Wafer conveying device comprising traction driving speed reducer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310502649.2A CN116654624B (en) | 2023-05-06 | 2023-05-06 | Wafer conveying device comprising traction driving speed reducer |
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| Publication Number | Publication Date |
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| CN116654624A CN116654624A (en) | 2023-08-29 |
| CN116654624B true CN116654624B (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310502649.2A Active CN116654624B (en) | 2023-05-06 | 2023-05-06 | Wafer conveying device comprising traction driving speed reducer |
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| JPH10223704A (en) * | 1997-02-03 | 1998-08-21 | Tokyo Electron Ltd | Apparatus and method for collective inspection of wafer |
| CN1256509A (en) * | 1998-12-09 | 2000-06-14 | 太阳诱电株式会社 | Cutting device |
| KR20020095845A (en) * | 2001-06-16 | 2002-12-28 | 삼성전자 주식회사 | semiconductor device manufacturing equipment and wafer washing method |
| CN112687580A (en) * | 2020-12-09 | 2021-04-20 | 苏州立科工业设计有限公司 | Cooling equipment for wafer production cutting |
| CN113814854A (en) * | 2021-09-28 | 2021-12-21 | 浙江芯晖装备技术有限公司 | A novel burnishing machine for wafer processing |
| CN115027048A (en) * | 2022-08-09 | 2022-09-09 | 苏州米洛微纳电子科技有限公司 | Wafer surface coating treatment device for processing acceleration sensing chip |
| CN115924421A (en) * | 2023-01-10 | 2023-04-07 | 江苏立晶工业科技有限公司 | Glassware split charging mechanism |
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2023
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10223704A (en) * | 1997-02-03 | 1998-08-21 | Tokyo Electron Ltd | Apparatus and method for collective inspection of wafer |
| CN1256509A (en) * | 1998-12-09 | 2000-06-14 | 太阳诱电株式会社 | Cutting device |
| KR20020095845A (en) * | 2001-06-16 | 2002-12-28 | 삼성전자 주식회사 | semiconductor device manufacturing equipment and wafer washing method |
| CN112687580A (en) * | 2020-12-09 | 2021-04-20 | 苏州立科工业设计有限公司 | Cooling equipment for wafer production cutting |
| CN113814854A (en) * | 2021-09-28 | 2021-12-21 | 浙江芯晖装备技术有限公司 | A novel burnishing machine for wafer processing |
| CN115027048A (en) * | 2022-08-09 | 2022-09-09 | 苏州米洛微纳电子科技有限公司 | Wafer surface coating treatment device for processing acceleration sensing chip |
| CN115924421A (en) * | 2023-01-10 | 2023-04-07 | 江苏立晶工业科技有限公司 | Glassware split charging mechanism |
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| Publication number | Publication date |
|---|---|
| CN116654624A (en) | 2023-08-29 |
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