CN115027048A

CN115027048A - Wafer surface coating treatment device for processing acceleration sensing chip

Info

Publication number: CN115027048A
Application number: CN202210951272.4A
Authority: CN
Inventors: 徐宝; 吴刚; 徐元
Original assignee: Suzhou Milo Weina Electronic Technology Co ltd
Current assignee: Suzhou Milo Weina Electronic Technology Co ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2022-09-09
Anticipated expiration: 2042-08-09
Also published as: CN115027048B

Abstract

The invention relates to the technical field of laminating equipment, in particular to a wafer surface laminating treatment device for processing an acceleration sensing chip, which comprises a fixed barrel and a conveying chain plate, wherein the conveying chain plate penetrates through the middle part of the fixed barrel, a plurality of suckers are arranged on the conveying chain plate, two rotating rings are rotatably arranged on the inner wall of the fixed barrel, clamping structures are respectively arranged on the left side and the right side of the inside of the fixed barrel, the clamping structures are fixed on the two rotating rings, and a conveying port is formed in the outer wall of the fixed barrel; the film is alternately pulled by the two groups of clamping structures, and the wafers in a conveying state are subjected to continuous automatic film coating treatment, so that the automation degree of the film coating work of the wafers can be effectively improved, the film coating mode is simplified, the labor and the time are saved, the film coating time of the wafers is shortened, and the working efficiency is improved.

Description

Wafer surface coating treatment device for processing acceleration sensing chip

Technical Field

The invention relates to the technical field of laminating equipment, in particular to a wafer surface laminating treatment device for processing an acceleration sensing chip.

Background

As is well known, the basic material of an acceleration sensor chip is a wafer, a finished chip is manufactured by etching a circuit or mounting an electronic element on the wafer, the wafer is mainly cut from a silicon crystal column and is circular, so the wafer is called as a wafer, in the processing process of the wafer, in order to conveniently protect the wafer, a layer of protective film needs to be covered on the wafer so as to isolate impurities, the traditional film covering mode is mainly carried out by manually pasting a film, and the manual film pasting mode is time-consuming and labor-consuming, has low working efficiency, and cannot realize the automatic working mode of wafer processing.

Disclosure of Invention

In order to solve the above technical problems, the present invention provides a wafer surface coating processing apparatus for processing an acceleration sensor chip.

In order to achieve the purpose, the invention adopts the technical scheme that:

the wafer surface film coating processing device processed by the acceleration sensing chip comprises a fixed barrel and a conveying chain plate, wherein the conveying chain plate penetrates through the middle part of the fixed barrel, a plurality of suckers are arranged on the conveying chain plate, two rotating rings are rotatably arranged on the inner wall of the fixed barrel, clamping structures are respectively arranged on the left side and the right side inside the fixed barrel, the clamping structures are fixed on the two rotating rings, and a material conveying port is formed in the outer wall of the fixed barrel;

the film pulling to the upper surface of the wafer is extruded and pasted on the wafer through the arc extrusion plate;

wherein, two sets of clamping structure position symmetry and opposite direction in fixed bucket, one of them group clamping structure is close to the material conveying mouth, and material conveying mouth is kept away from to another group clamping structure.

Further, clamping structure is including removing the seat, it fixes on two swivel becks to remove the seat, it is provided with two tray on the seat to remove, both sides all are provided with the planking around removing the seat, be provided with the riser on the planking, the spacing groove has been seted up on the lateral wall of riser orientation removal seat, it is provided with the right angle slide to slide in the spacing groove, it installs the depression bar to rotate on the right angle slide, and the depression bar is located the outer wall middle part of right angle slide with the rotation hookup location of right angle slide, be fixed with first leaf spring on the depression bar, the outer end at the right angle slide is fixed to the outer end of first leaf spring, the outer end of riser is rotated and is installed first extrusion cylinder, the expansion end of first extrusion cylinder rotates and installs on the depression bar.

Furthermore, the outer wall of the supporting block is provided with a convex cambered surface, the moving seat is provided with two sliding grooves, the two sliding grooves are inclined and opposite in inclination direction, the two supporting blocks are respectively and slidably mounted on the two sliding grooves, a second plate spring is arranged in each sliding groove, one end of each second plate spring is fixed on the inner wall of each sliding groove, and the other end of each second plate spring is fixed on the supporting block;

the pressing rod is arranged to be an elastic telescopic rod, the fixed end of the pressing rod is rotatably installed on the right-angle sliding plate, the movable end of the pressing rod is far away from the right-angle sliding plate, the outer wall of the movable end of the pressing rod, facing the support block, is arranged to be an inwards concave cambered surface, and a baffle is fixed on the inner wall of the cambered surface of the movable end of the pressing rod;

the riser with planking sliding connection rotates on the planking and installs second extrusion cylinder, and the expansion end of second extrusion cylinder rotates and installs on the riser.

Furthermore, a first motor is mounted on the side wall of the moving seat, the first motor is located between the moving seat and the conveying chain plate, a lead screw is arranged at the output end of the first motor, a threaded sleeve is arranged at the outer end of the lead screw and is rotationally connected with the lead screw, the threaded sleeve is fixed on the moving seat, a mounting plate is mounted on the first motor in a threaded sleeve mode, and the mounting plate is slidably mounted on the side wall of the moving seat;

the sliding sleeve is installed at the mounting panel top, and it is provided with the slide bar to slide in the sliding sleeve, and stretch out to the sliding sleeve outside the slide bar top, and the cutter is installed in the slope of slide bar top, installs the traveller on the lateral wall of slide bar, has seted up the guide way on the lateral wall of removal seat, and the guide way comprises wave-shaped groove and straight line type groove, and wave-shaped groove is located the tip in straight line type groove, and the outer end sliding insertion of traveller is to the wave-shaped inslot.

Furthermore, the wavy groove on the guide groove is positioned below the linear groove, the upper part of the cutting edge of the cutter is serrated, and the lower part of the cutting edge of the cutter is linear.

Furthermore, two openings are formed in conveying chain plates on the left side and the right side of each sucking disc, the four openings surround one sucking disc, a plurality of bases are arranged at the bottoms of the conveying chain plates, and the bases are located below the sucking discs;

be provided with the layer board in the fixed bucket, the layer board is located the below of carrying the link joint, the top of layer board and the contact of the inboard base bottom of fixed bucket, and the bottom of layer board is provided with a plurality of bows, and the outer end of bows is fixed on the outer wall of fixed bucket, and the sliding opening has all been seted up to the left and right sides of layer board, and it is provided with the slider to slide in the sliding opening, and the slider top is provided with the movable plate, and the movable plate is located the upside of layer board, and the lateral wall mid-rotation that the base was kept away from to the movable plate installs two push pedals. A third plate spring is arranged on the outer wall of the push plate, the outer end of the third plate spring is fixed on the movable plate, the third plate spring pushes the side wall of the push plate to be tightly attached to the side wall of the movable plate, the push plate keeps a vertical state, and four right-angle stop rods are arranged at the top of the supporting plate;

the bottom of the supporting plate is provided with a first adjusting cylinder, the movable end of the first adjusting cylinder is rotatably provided with two push-pull rods, the two push-pull rods are inclined and opposite in inclination direction, and the outer ends of the two push-pull rods are respectively rotatably connected with the two sliding blocks.

Further, still including the pushing structure, the pushing structure is used for promoting the arc stripper plate and removes, the pushing structure includes uide bushing and bow-shaped board, the uide bushing is fixed at fixed bucket top, in the upside slip insert uide bushing of bow-shaped board, the second adjust cylinder is installed at the uide bushing top, the expansion end of second adjust cylinder is fixed on the bow-shaped board, the downside of bow-shaped board is provided with a plurality of third adjust cylinder, the downside expansion end of a plurality of third adjust cylinder is fixed with the fixed plate, install the second motor on the fixed plate, the output and the arc stripper plate of second motor are connected.

Furthermore, two driving wheels are rotatably mounted at the bottom of the inner wall of the fixed barrel and located between the two rotating rings, the two driving wheels are in transmission connection with each other, the two driving wheels are in transmission connection with the two rotating rings respectively, a third motor is mounted at the bottom of the fixed barrel, and an output end of the third motor is in transmission connection with one driving wheel.

Compared with the prior art, the invention has the beneficial effects that: the film is alternately pulled by the two groups of clamping structures, and the continuous automatic film coating treatment is carried out on the wafers in the conveying state, so that the automation degree of the film coating work of the wafers can be effectively improved, the film coating mode is simplified, the labor and the time are saved, the film coating time of the wafers is shortened, and the working efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of the present invention;

FIG. 2 is an enlarged schematic view of the clamping structure of FIG. 1;

FIG. 3 is an enlarged schematic view of the ram of FIG. 2;

FIG. 4 is an enlarged view of a portion A of FIG. 2;

fig. 5 is an enlarged structural schematic view of the conveying chain plate in fig. 1;

FIG. 6 is an enlarged top view of the pallet of FIG. 5;

FIG. 7 is a bottom view of the pallet of FIG. 6;

in the drawings, the reference numbers: 1. fixing the barrel; 2. conveying chain plates; 3. a suction cup; 4. a rotating ring; 5. a material conveying port; 6. an arc-shaped extrusion plate; 7. a movable seat; 8. a support block; 9. an outer plate; 10. a vertical plate; 11. a right-angle slide plate; 12. a pressure lever; 13. a first plate spring; 14. a first extrusion cylinder; 15. a chute; 16. a second plate spring; 17. a baffle plate; 18. a first motor; 19. a lead screw; 20. a threaded sleeve; 21. mounting a plate; 22. a sliding sleeve; 23. a slide bar; 24. a cutter; 25. a traveler; 26. a guide groove; 27. opening; 28. a base; 29. a support plate; 30. an arched frame; 31. a sliding port; 32. a slider; 33. moving the plate; 34. pushing the plate; 35. a third plate spring; 36. a first adjusting cylinder; 37. a push-pull rod; 38. a guide sleeve; 39. an arcuate plate; 40. a second adjusting cylinder; 41. a third adjusting cylinder; 42. a fixing plate; 43. a second motor; 44. a driving wheel; 45. a third motor; 46. a second extrusion cylinder; 47. a right-angle stop lever.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. This embodiment is written in a progressive manner.

As shown in fig. 1, the device for processing the surface coating of the wafer processed by the acceleration sensing chip comprises a fixed barrel 1 and a conveying chain plate 2, wherein the conveying chain plate 2 penetrates through the middle of the fixed barrel 1, a plurality of suckers 3 are installed on the conveying chain plate 2, two rotating rings 4 are rotatably arranged on the inner wall of the fixed barrel 1, clamping structures are arranged on the left side and the right side of the inside of the fixed barrel 1, the clamping structures are fixed on the two rotating rings 4, and a material conveying port 5 is formed in the outer wall of the fixed barrel 1;

the device also comprises an arc-shaped extrusion plate 6, and the film pulled to the upper surface of the wafer is extruded and pasted on the wafer through the arc-shaped extrusion plate 6;

wherein, two sets of clamping structure position symmetry and opposite direction in fixed bucket 1, one of them group of clamping structure is close to material conveying mouth 5, and another group of clamping structure is kept away from material conveying mouth 5.

In this embodiment, an external conveyor drives a conveying chain plate 2 to continuously pass through a fixed barrel 1 to move, a wafer is adsorbed and fixed on a sucker 3 and synchronously moves along with the conveying chain plate 2, a film output by an external film roller passes through a conveying port 5 and is fixed on a clamping structure close to the conveying port 5, the wafer is conveyed into the fixed barrel 1 along the conveying chain plate 2, two rotating rings 4 are rotated, the two rotating rings 4 drive two groups of clamping structures to synchronously rotate and exchange the positions of the two groups of clamping structures, the clamping structure fixed with the film pulls the film to move along the upper side in the fixed barrel 1, the film is gradually close to the wafer above the wafer, when the two groups of clamping structures complete position exchange, the film covers the wafer, and meanwhile, the clamping structure not fixed with the film moves to the position of the conveying port 5, the clamping structure fixes the film output by passing through the conveying port 5, thereby fixing two ends of a film on a wafer through two groups of clamping structures, pushing the arc-shaped extrusion plate 6 to move to the wafer, contacting the bottom of the arc-shaped extrusion plate 6 with the upper surface of the wafer, rotating the arc-shaped extrusion plate 6, carrying out rotary extrusion treatment on the film on the wafer by the arc-shaped extrusion plate 6, thereby enabling the film to be pasted on the wafer, simultaneously facilitating the arc-shaped extrusion plate 6 to push bubbles between the wafer and the film to be discharged, improving the film laminating effect, cutting off the film between the wafer and the clamping structure close to the material conveying port 5 after the film laminating work is finished, loosening the film by the clamping structure far away from the material conveying port 5, driving the conveying chain plate 2 to continuously move and conveying the next wafer into the fixed barrel 1 through an external conveyor, repeatedly rotating the two rotating rings 4, repeatedly pulling the film by the two groups of clamping structures to cover on the wafer and repeatedly carry out the film laminating work on the wafer, and continuously conveying the wafer due to the conveying chain plate 2, therefore, the continuous conveying type film laminating work of the wafer is realized, the automatic film laminating treatment is carried out on the wafer in a continuous film laminating mode, the automation degree of the film laminating work of the wafer can be effectively improved, the film laminating mode is simplified, the labor and the time are saved, the film laminating time of the wafer is shortened, and the working efficiency is improved.

As shown in fig. 2 and fig. 3, as a preferred embodiment of the above embodiment, the clamping structure includes a moving seat 7, the moving seat 7 is fixed on two rotating rings 4, two supporting blocks 8 are arranged on the moving seat 7, outer plates 9 are arranged on the front and rear sides of the moving seat 7, a vertical plate 10 is arranged on the outer plates 9, a limiting groove is formed in the side wall of the vertical plate 10 facing the moving seat 7, a right-angle sliding plate 11 is slidably arranged in the limiting groove, a pressing rod 12 is rotatably arranged on the right-angle sliding plate 11, and a rotating connection position of the pressing rod 12 and the right-angle sliding plate 11 is located in the middle of the outer wall of the right-angle sliding plate 11, a first plate spring 13 is fixed on the pressing rod 12, the outer end of the first plate spring 13 is fixed on the outer end of the right-angle sliding plate 11, a first extrusion cylinder 14 is rotatably arranged on the outer end of the vertical plate 10, and the movable end of the first extrusion cylinder 14 is rotatably arranged on the pressing rod 12.

In this embodiment, when the first extruding cylinder 14 is in a contracted state in an initial state, the pressing rods 12 are in an inclined state, and at this time, the two pressing rods 12 on the moving base 7 are far away from each other, when the moving base 7 moves the position of the material conveying port 5 along with the rotating ring 4, the film output by the material conveying port 5 passes through the space between the two pressing rods 12 and is lapped on the two supporting blocks 8, the first plate spring 13 is in an elastic stretching state, the first extruding cylinder 14 performs stretching motion, the first extruding cylinder 14 pushes the pressing rods 12 to rotate on the right-angle sliding plate 11, the deformation of the first plate spring 13 is gradually reduced, because the rotational connection positions of the pressing rods 12 and the right-angle sliding plate 11 are located in the middle of the outer wall of the right-angle sliding plate 11, when the outer wall plane of the pressing rods 12 contacts with the outer wall plane of the right-angle sliding plate 11, the first extruding cylinder 14 pushes the right-angle sliding plate 11 to synchronously move downward through the pressing rods 12, at this time, the pressing rods 12 and the right-angle sliding plate 11 are relatively stationary and synchronously move, first leaf spring 13 pulling depression bar 12 and right angle slide 11 are in the state of hugging closely, and when right angle slide 11 slided to the spacing groove bottom portion, the spacing groove was spacing to right angle slide 11, and right angle slide 11 infories to remove, the film contact on depression bar 12 and the tray 8 this moment to depression bar 12 extrudees fixed processing to the film on the tray 8, thereby makes the film fix on removing seat 7, realizes the fixed work of centre gripping of film.

In this embodiment, when depression bar 12 and right angle slide 11 move downwards in step, depression bar 12 keeps the horizontality and translation motion downwards, thereby make depression bar 12 carry out the plane extrusion processing to the film, improve the fixed effect of film, when avoiding depression bar 12 to incline the extrusion to the film, the fold appears in the film, right angle slide 11 plays the effect of direction to depression bar 12, when the centre gripping work of needs stop to the film, 14 pulling depression bar 12 of first extrusion cylinder upwards move, depression bar 12 and the 11 translation upwards movements of right angle slide, when right angle slide 11 moves to the spacing groove top, right angle slide 11 stops moving, 14 pulling depression bar 12 of first extrusion cylinder this moment outwards rotate to initial position, thereby make two depression bar 12 alternate segregation on two removal seats 7, make things convenient for the film to pass the space between two depression bars 12.

As shown in fig. 2 and fig. 3, as a preferable embodiment of the above embodiment, the outer wall of the support block 8 is a convex arc surface, two sliding grooves 15 are formed in the movable seat 7, the two sliding grooves 15 are inclined and opposite in inclination direction, the two support blocks 8 are respectively slidably mounted on the two sliding grooves 15, a second plate spring 16 is arranged in the sliding groove 15, one end of the second plate spring 16 is fixed on the inner wall of the sliding groove 15, and the other end of the second plate spring 16 is fixed on the support block 8;

the pressing rod 12 is arranged to be an elastic telescopic rod, the fixed end of the pressing rod 12 is rotatably installed on the right-angle sliding plate 11, the movable end of the pressing rod 12 is far away from the right-angle sliding plate 11, the outer wall, facing the support block 8, of the movable end of the pressing rod 12 is arranged to be an inwards concave arc surface, and a baffle plate 17 is fixed on the inner wall of the arc surface of the movable end of the pressing rod 12;

the riser 10 with planking 9 sliding connection rotates on the planking 9 and installs second extrusion cylinder 46, and the expansion end of second extrusion cylinder 46 rotates and installs on riser 10.

In the embodiment, when the pressing rod 12 and the supporting block 8 extrude and fix the film, the arc surface of the movable end of the pressing rod 12 is buckled on the arc surface of the supporting block 8, the side wall of the baffle 17 is in contact with the side wall of the supporting block 8, the second extrusion cylinder 46 pulls the vertical plate 10 to slide on the outer plate 9, the vertical plate 10 pushes the supporting block 8 to synchronously move through the arc surface of the movable end of the pressing rod 12, the supporting block 8 moves towards the direction far away from the conveying chain plate 2, the supporting block 8 slides in the sliding groove 15, and the supporting block 8 pushes the second plate spring 16 to elastically deform, because the sliding groove 15 is inclined, the sliding groove 15 guides the supporting blocks 8, so that the two supporting blocks 8 are separated from each other, because the support blocks 8 are gradually far away from the conveying chain plate 2 and the two support blocks 8 are mutually separated, the film can be stretched in the length direction and the width direction, the film is conveniently in a tightening state, and the film is prevented from being folded.

In this embodiment, because the support block 8 moves obliquely, the support block 8 pushes the pressing rod 12 to perform a contraction movement through the baffle 17, so that the movable end of the pressing rod 12 and the support block 8 keep moving synchronously, and the film is conveniently and stably clamped.

As shown in fig. 2 and 4, as a preferable embodiment of the foregoing embodiment, a first motor 18 is mounted on a side wall of the moving seat 7, the first motor 18 is located between the moving seat 7 and the conveying chain plate 2, an output end of the first motor 18 is provided with a lead screw 19, an outer end of the lead screw 19 is provided with a threaded sleeve 20, the threaded sleeve 20 is rotatably connected with the lead screw 19, the threaded sleeve 20 is fixed on the moving seat 7, a mounting plate 21 is mounted on the first motor 18 in a threaded manner, and the mounting plate 21 is slidably mounted on the side wall of the moving seat 7;

sliding sleeve 22 is installed at mounting panel 21 top, it is provided with slide bar 23 to slide in the sliding sleeve 22, slide bar 23 top stretches out to the sliding sleeve 22 outside, and cutter 24 is installed to slide bar 23 top slope, install traveller 25 on slide bar 23's the lateral wall, the guide way 26 has been seted up on the lateral wall of removal seat 7, guide way 26 comprises wave-shaped groove and straight line type groove, and the wave-shaped groove is located the tip in straight line type groove, the outer end sliding insertion of traveller 25 is to the wave-shaped inslot.

In this embodiment, when the film needs to be cut, the first motor 18 drives the mounting plate 21 to move through the lead screw 19, the mounting plate 21 slides on the side wall of the moving seat 7, the mounting plate 21 drives the sliding sleeve 22, the sliding rod 23, the cutter 24 and the sliding column 25 to move synchronously, when the sliding column 25 slides in the wave-shaped groove in the guide groove 26, the sliding column 25 synchronously moves up and down, the sliding column 25 drives the sliding rod 23 to slide up and down in the sliding sleeve 22, the sliding rod 23 drives the cutter 24 to synchronously slide up and down, thereby the cutter 24 moves up and down when moving along the direction of the screw rod 19, the cutter 24 conveniently cuts a cut at the edge position of the film on the moving seat 7, when the sliding column 25 slides into the linear groove in the guide groove 26, the sliding column 25 moves linearly, at this time, the cutter 24 moves in a translation manner, and the cutter 24 can directly cut off the film through the notch on the film, so that the film cutting work is completed.

As shown in fig. 4, in the above embodiment, it is preferable that the wave-shaped groove of the guide groove 26 is located below the linear groove, the upper portion of the cutting edge of the cutter 24 is formed in a zigzag shape, and the lower portion of the cutting edge of the cutter 24 is formed in a linear shape.

In this embodiment, when traveller 25 slides in the wave-shaped groove of guide way 26, zigzag cutting edge and film border position contact on cutter 24 and go out the incision on the film, when traveller 25 slides to the straight line type inslot of guide way 26, traveller 25's height rises, cutter 24's height rise this moment, the straight line type part and the film contact of cutter 24 cutting edge, thereby make the straight line type cutting edge on the cutter 24 cut the processing through the incision fast to the film, improve the convenience and the high efficiency that the film was tailor, the convenience is cut the film fast, reduce the cutting degree of difficulty.

As shown in fig. 5 to 7, as a preferred embodiment, two openings 27 are formed in the conveying chain plates 2 on the left and right sides of the suction cup 3, four openings 27 surround one suction cup 3, a plurality of bases 28 are arranged at the bottom of the conveying chain plate 2, and the bases 28 are located below the suction cup 3;

be provided with layer board 29 in the fixed bucket 1, layer board 29 is located the below of carrying link joint 2, the contact of the top of layer board 29 and the inboard base 28 bottom of fixed bucket 1, the bottom of layer board 29 is provided with a plurality of bows 30, the outer end of bows 30 is fixed on the outer wall of fixed bucket 1, sliding opening 31 has all been seted up to the left and right sides of layer board 29, it is provided with slider 32 to slide in sliding opening 31, slider 32 top is provided with movable plate 33, movable plate 33 is located the upside of layer board 29, movable plate 33 keeps away from the lateral wall middle part rotation of base 28 and installs two push pedals 34. A third leaf spring 35 is arranged on the outer wall of the push plate 34, the outer end of the third leaf spring 35 is fixed on the movable plate 33, the third leaf spring 35 pushes the side wall of the push plate 34 to be tightly attached to the side wall of the movable plate 33, the push plate 34 keeps a vertical state, and four right-angle stop levers 47 are arranged at the top of the supporting plate 29;

the bottom of the supporting plate 29 is provided with a first adjusting cylinder 36, the movable end of the first adjusting cylinder 36 is rotatably provided with two push-pull rods 37, the two push-pull rods 37 are inclined and opposite in inclination direction, and the outer ends of the two push-pull rods 37 are respectively and rotatably connected with the two sliding blocks 32.

In this embodiment, when the conveying chain plate 2 is conveyed, the conveying chain plate 2 drives the base 28 to move synchronously, when the base 28 moves to the working position, the base 28 passes through a gap between two right-angle stop rods 47 adjacent to each other in the transverse direction on the supporting plate 29 and slides to the top of the supporting plate 29, at this time, the supporting plate 29 lifts the base 28, so as to lift the conveying chain plate 2, the suction cup 3 and the wafer on the suction cup 3, the first adjusting cylinder 36 performs an extension motion, the first adjusting cylinder 36 pushes two push-pull rods 37 to tilt synchronously, the two push-pull rods 37 pull two sliding blocks 32 to approach synchronously, the two sliding blocks 32 drive two moving plates 33 to approach synchronously, the moving plates 33 drive their upper push plates 34 to move synchronously and vertically, the push plates 34 move into the openings 27 on the conveying chain plate 2, the four push plates 34 approach synchronously, the suction cup 3 stops sucking the wafer thereon, the four push plates 34 push the wafer to perform centering treatment, thereby pinpoint the wafer, the convenience is accurately laminated and is handled the wafer, after the wafer location is accomplished, sucking disc 3 adsorbs fixed processing to the wafer again, push pedal 34 contacts with right angle pin 47 this moment, push pedal 34 of the continuous moving state receives the sheltering from of right angle pin 47 and hinders, push pedal 34 stops moving, two movable plates 33 continue to be close to each other, movable plate 33 pulling push pedal 34 slope, push pedal 34 and wafer separation, third leaf spring 35 takes place elastic deformation, movable plate 33 passes gap and the lateral wall contact with base 28 between two adjacent right angle pins 47 of longitudinal direction, extrude fixed processing through two movable plates 33 to the left and right sides of base 28, thereby fix the processing in step to the wafer on base 28, sucking disc 3 and the sucking disc 3, effectively improve wafer laminating stability.

In this embodiment, the transport link joint 2 of moving state drives the wafer synchronous motion through its last sucking disc 3, and the wafer is in transport state this moment, and when the wafer moved and gets into in the fixed bucket 1, four push pedals 34 were fixed a position the processing to the wafer again, and the accurate location work is realized to the wafer this moment to avoid the wafer to accomplish the location work on sucking disc 3 at the beginning promptly when, the wafer takes place the skew in transportation process, accuracy when leading to the wafer to move the operating position that gets into in the fixed bucket 1 descends.

As shown in fig. 1, as a preference of the above embodiment, the pushing structure is further included, the pushing structure is used for pushing the arc-shaped squeezing plate 6 to move, the pushing structure includes a guide sleeve 38 and an arc-shaped plate 39, the guide sleeve 38 is fixed on the top of the fixed barrel 1, the upper side of the arc-shaped plate 39 is slidably inserted into the guide sleeve 38, a second adjusting cylinder 40 is installed on the top of the guide sleeve 38, the movable end of the second adjusting cylinder 40 is fixed on the arc-shaped plate 39, a plurality of third adjusting cylinders 41 are arranged on the lower side of the arc-shaped plate 39, a fixed plate 42 is fixed on the movable end of the lower side of the plurality of third adjusting cylinders 41, a second motor 43 is installed on the fixed plate 42, and the output end of the second motor 43 is connected with the arc-shaped squeezing plate 6.

In this embodiment, during initial state, arc stripper plate 6 is located the outside of fixed bucket 1, avoid arc stripper plate 6 to cause the influence to the moving state of clamping structure and film, when the film covers on the wafer, second adjust cylinder 40 stimulates bow-shaped plate 39 and slides towards uide bushing 38, bow-shaped plate 39 drives third adjust cylinder 41, fixed plate 42, second motor 43 and arc stripper plate 6 remove in fixed bucket 1 towards in step, when arc stripper plate 6 removed to the wafer top, third adjust cylinder 41 promotes fixed plate 42, second motor 43 and arc stripper plate 6 remove downwards and make arc stripper plate 6 bottom and the film surface contact on the wafer, second motor 43 drives arc stripper plate 6 and rotates and carry out rotatory extrusion tectorial membrane processing to the film.

As shown in fig. 1, as a preferred embodiment of the above embodiment, two driving wheels 44 are rotatably mounted at the bottom of the inner wall of the fixed barrel 1, the two driving wheels 44 are located between the two rotating rings 4, the two driving wheels 44 are in transmission connection with each other, the two driving wheels 44 are in transmission connection with the two rotating rings 4 respectively, a third motor 45 is mounted at the bottom of the fixed barrel 1, and an output end of the third motor 45 is in transmission connection with one driving wheel 44.

In this embodiment, the third motor 45 drives the two driving wheels 44 to rotate synchronously, and the rotation directions of the two driving wheels 44 are opposite, so that the two driving wheels 44 drive the two rotating rings 4 to rotate synchronously and in the same direction, thereby driving the equipment to operate.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A wafer surface film coating treatment device for processing an acceleration sensing chip is characterized by comprising a fixed barrel (1) and a conveying chain plate (2), wherein the conveying chain plate (2) penetrates through the middle of the fixed barrel (1), a plurality of suckers (3) are installed on the conveying chain plate (2), two rotating rings (4) are rotatably arranged on the inner wall of the fixed barrel (1), clamping structures are arranged on the left side and the right side of the inside of the fixed barrel (1), the clamping structures are fixed on the two rotating rings (4), and a material conveying opening (5) is formed in the outer wall of the fixed barrel (1);

the device also comprises an arc-shaped extrusion plate (6), and the film pulled to the upper surface of the wafer is extruded and applied on the wafer through the arc-shaped extrusion plate (6).

2. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 1, wherein the clamping structure comprises a moving seat (7), the moving seat (7) is fixed on two rotating rings (4), two supporting blocks (8) are arranged on the moving seat (7), outer plates (9) are arranged on the front side and the rear side of the moving seat (7), a vertical plate (10) is arranged on each outer plate (9), a limiting groove is formed in the side wall of each vertical plate (10) facing the moving seat (7), a right-angle sliding plate (11) is arranged in the limiting groove in a sliding manner, a compression bar (12) is rotatably arranged on each right-angle sliding plate (11), the rotary connection position of each compression bar (12) and each right-angle sliding plate (11) is located in the middle of the outer wall of each right-angle sliding plate (11), a first plate spring (13) is fixed on each compression bar (12), and the outer end of each first plate spring (13) is fixed at the outer end of each right-angle sliding plate (11), the outer end of the vertical plate (10) is rotatably provided with a first extrusion cylinder (14), and the movable end of the first extrusion cylinder (14) is rotatably arranged on the pressure lever (12).

3. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 2, wherein the outer wall of the support block (8) is a convex arc surface, the moving seat (7) is provided with two sliding grooves (15), the two sliding grooves (15) are inclined and have opposite inclination directions, the two support blocks (8) are respectively slidably mounted on the two sliding grooves (15), a second plate spring (16) is arranged in the sliding grooves (15), one end of the second plate spring (16) is fixed on the inner wall of the sliding groove (15), and the other end of the second plate spring (16) is fixed on the support block (8);

the pressing rod (12) is arranged to be an elastic telescopic rod, the fixed end of the pressing rod (12) is rotatably installed on the right-angle sliding plate (11), the movable end of the pressing rod (12) is far away from the right-angle sliding plate (11), the movable end of the pressing rod (12) faces the outer wall of the support block (8) and is arranged to be an inward concave arc surface, and a baffle plate (17) is fixed on the inner wall of the arc surface of the movable end of the pressing rod (12);

riser (10) with planking (9) sliding connection rotates on planking (9) and installs second extrusion cylinder (46), and the expansion end of second extrusion cylinder (46) rotates and installs on riser (10).

4. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 3, wherein a first motor (18) is mounted on a side wall of the movable base (7), the first motor (18) is located between the movable base (7) and the conveying chain plate (2), a lead screw (19) is arranged at an output end of the first motor (18), a threaded sleeve (20) is arranged at an outer end of the lead screw (19), the threaded sleeve (20) is rotatably connected with the lead screw (19), the threaded sleeve (20) is fixed on the movable base (7), a mounting plate (21) is mounted on the first motor (18) in a threaded sleeve manner, and the mounting plate (21) is slidably mounted on the side wall of the movable base (7);

sliding sleeve (22) are installed at mounting panel (21) top, it is provided with slide bar (23) to slide in sliding sleeve (22), slide bar (23) top stretches out to the sliding sleeve (22) outside, and cutter (24) are installed to slide bar (23) top slope, install traveller (25) on the lateral wall of slide bar (23), guide way (26) have been seted up on the lateral wall of removal seat (7), guide way (26) comprise wave-shaped groove and straight line type groove, and the wave-shaped groove is located the tip in straight line type groove, the outer end slip of traveller (25) inserts to the wave-shaped inslot.

5. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 4, wherein the wave-shaped groove on the guide groove (26) is located below the linear groove, the upper part of the cutting edge of the cutter (24) is arranged in a saw-tooth shape, and the lower part of the cutting edge of the cutter (24) is arranged in a linear shape.

6. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 5, wherein two openings (27) are formed on the conveying chain plates (2) on the left and right sides of the suction cup (3), four openings (27) surround one suction cup (3), a plurality of bases (28) are arranged at the bottom of each conveying chain plate (2), and the bases (28) are located below the suction cup (3);

the automatic conveying device is characterized in that a supporting plate (29) is arranged in the fixed barrel (1), the supporting plate (29) is located below the conveying chain plate (2), the top of the supporting plate (29) is in contact with the bottom of a base (28) on the inner side of the fixed barrel (1), a plurality of arc-shaped frames (30) are arranged at the bottom of the supporting plate (29), the outer ends of the arc-shaped frames (30) are fixed on the outer wall of the fixed barrel (1), sliding openings (31) are formed in the left side and the right side of the supporting plate (29), sliding blocks (32) are arranged in the sliding openings (31) in a sliding mode, a moving plate (33) is arranged at the top of each sliding block (32), the moving plate (33) is located on the upper side of the supporting plate (29), and two pushing plates (34) are rotatably mounted in the middle of the outer side wall of the moving plate (33) far away from the base (28);

a third plate spring (35) is mounted on the outer wall of the push plate (34), the outer end of the third plate spring (35) is fixed on the movable plate (33), the third plate spring (35) pushes the side wall of the push plate (34) to be tightly attached to the side wall of the movable plate (33), the push plate (34) keeps a vertical state, and four right-angle stop levers (47) are arranged at the top of the supporting plate (29);

the bottom of the supporting plate (29) is provided with a first adjusting cylinder (36), the movable end of the first adjusting cylinder (36) is rotatably provided with two push-pull rods (37), the two push-pull rods (37) are inclined and have opposite inclination directions, and the outer ends of the two push-pull rods (37) are respectively rotatably connected with the two sliding blocks (32).

7. The device for processing the surface coating film of the acceleration sensing chip of claim 6, it is characterized by also comprising a pushing structure which is used for pushing the arc-shaped extrusion plate (6) to move, the pushing structure comprises a guide sleeve (38) and an arc-shaped plate (39), the guide sleeve (38) is fixed to the top of the fixed barrel (1), the upper side of the arc-shaped plate (39) is slidably inserted into the guide sleeve (38), a second adjusting cylinder (40) is installed at the top of the guide sleeve (38), the movable end of the second adjusting cylinder (40) is fixed to the arc-shaped plate (39), a plurality of third adjusting cylinders (41) are arranged on the lower side of the arc-shaped plate (39), a fixing plate (42) is fixed to the movable end of the lower side of the third adjusting cylinders (41), a second motor (43) is installed on the fixing plate (42), and the output end of the second motor (43) is connected with the arc-shaped extrusion plate (6).

8. The device for processing the surface coating of the wafer processed by the acceleration sensing chip as claimed in claim 7, wherein two driving wheels (44) are rotatably mounted at the bottom of the inner wall of the fixed barrel (1), the two driving wheels (44) are located between the two rotating rings (4), the two driving wheels (44) are in transmission connection with each other, the two driving wheels (44) are respectively in transmission connection with the two rotating rings (4), the bottom of the fixed barrel (1) is provided with a third motor (45), and the output end of the third motor (45) is in transmission connection with one driving wheel (44).