CN113587617A - Conveying system for drying semiconductor wafer - Google Patents
Conveying system for drying semiconductor wafer Download PDFInfo
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- CN113587617A CN113587617A CN202111168478.1A CN202111168478A CN113587617A CN 113587617 A CN113587617 A CN 113587617A CN 202111168478 A CN202111168478 A CN 202111168478A CN 113587617 A CN113587617 A CN 113587617A
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- drying
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 139
- 238000001035 drying Methods 0.000 title claims abstract description 77
- 238000007599 discharging Methods 0.000 claims abstract description 123
- 238000007731 hot pressing Methods 0.000 claims abstract description 41
- 235000012431 wafers Nutrition 0.000 claims description 129
- 238000003825 pressing Methods 0.000 claims description 78
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000013519 translation Methods 0.000 claims description 12
- 230000000903 blocking effect Effects 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 8
- 239000003570 air Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/02—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in the whole or part of a circle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
- F26B23/04—Heating arrangements using electric heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The invention belongs to the technical field of semiconductor drying equipment, and particularly relates to a conveying system for drying a semiconductor wafer, which comprises: the device comprises a discharge rail, a discharge device, a hot pressing device and a discharge platform; one end of the discharging rail is suitable for receiving the falling semiconductor wafer, and the discharging device is positioned at the other end of the discharging rail; the hot pressing device is movably arranged above the discharging device and is suitable for being pressed down onto the discharging device so as to deform the discharging device to form a discharging channel, namely, the semiconductor wafer falls onto the discharging platform through the discharging channel; according to the invention, the discharging device is arranged at the discharging end of the discharging rail, so that ordered and batch discharging is realized, and meanwhile, the semiconductor wafer is dried again through the hot pressing device during discharging, so that water vapor is prevented from being accumulated and attached to the semiconductor wafer, the drying effect is improved, meanwhile, the structure is simple, the cost is low, the semiconductor wafer is collected at the discharging platform, and drying and discharging of the semiconductor wafer are realized.
Description
Technical Field
The invention belongs to the technical field of semiconductor drying equipment, and particularly relates to a conveying system for drying a semiconductor wafer.
Background
The traditional drying equipment discharges the semiconductor wafer through a long conveying line, so that the manufacturing cost is high and the problem of material blockage exists.
Meanwhile, as the transport line is lengthened, water vapor accumulation exists, and the water vapor is attached to the surface of the semiconductor wafer again, so that the drying effect is influenced.
Therefore, it is desirable to develop a new conveying system for drying semiconductor wafers to solve the above problems.
Disclosure of Invention
The invention aims to provide a conveying system for drying a semiconductor wafer.
In order to solve the above-mentioned technical problem, the present invention provides a conveying system for drying a semiconductor wafer, comprising: the device comprises a discharge rail, a discharge device, a hot pressing device and a discharge platform; one end of the discharging rail is suitable for receiving the falling semiconductor wafer, and the discharging device is positioned at the other end of the discharging rail; the hot pressing device is movably arranged above the discharging device and is suitable for being pressed down onto the discharging device, so that the discharging device deforms to form a discharging channel, and the semiconductor wafer falls onto the discharging platform through the discharging channel.
Further, the outfeed track comprises: the device comprises a discharge plate and two guide plates arranged on the discharge plate; the two guide plates are vertically arranged on the discharge plate in parallel to guide and convey the semiconductor wafer to the discharge device.
Further, the discharging device comprises: the lower pressing plate, the elastic piece and the fixing plate; a corresponding position on the discharging plate is provided with a lower pressing hole matched with the lower pressing plate; the fixed plate is fixedly connected below the discharge plate, the lower pressure plate is movably connected with the top surface of the fixed plate through an elastic piece, and the lower pressure plate is flush with the lower pressure hole; the hot pressing device is positioned above the lower pressing plate; the hot pressing device is suitable for pressing down and pushing the lower pressing plate to extrude the elastic piece, so that the lower pressing hole is opened to form a discharging channel, namely, the semiconductor wafer on the discharging plate falls onto the discharging platform from the discharging channel.
Further, the elastic member includes: at least one spring; the lower pressing plate is movably connected with the top surface of the fixing plate through a corresponding spring, and the initial position of the lower pressing plate is flush with the lower pressing hole.
Further, the discharging device also comprises: a discharging cylinder; the slope of ejection of compact cylinder sets up at the end of ejection of compact board, just the movable part of ejection of compact cylinder sets up towards the direction of pushing down of holding down plate, works as promptly the holding down plate is pushed down the back by hot press unit, the movable part of ejection of compact cylinder is suitable for the top surface that supports the holding down plate, and promotes the holding down plate takes place the slope, so that semiconductor wafer landing on the holding down plate is to ejection of compact platform on.
Furthermore, the movable part of the discharging cylinder is provided with a clamping plate, and the discharging cylinder is suitable for driving the clamping plate to clamp the edge of the lower pressing plate, so that the lower pressing plate is pushed to incline.
Furthermore, the top surface of the fixed plate is provided with at least one limiting column to limit the displacement of the elastic part.
Further, the hot press apparatus includes: the hot pressing plate, the heating assembly and the pressing cylinder are arranged on the upper surface of the heating assembly; the hot pressing plate is positioned above the lower pressing plate; the bottom surface of the hot pressing plate is provided with a drying groove, the heating assembly is suitable for heating the hot pressing plate, and the movable part of the pressing cylinder is connected with the top surface of the hot pressing plate, namely the pressing cylinder is suitable for driving the hot pressing plate to press downwards towards the pressing plate and covering the semiconductor wafer on the pressing plate in the drying groove so as to dry the semiconductor wafer in the drying groove; the pressing cylinder pushes the hot pressing plate to press downwards and drives the pressing plate to extrude the elastic piece, so that the pressing hole is opened to form a discharging channel.
Further, the hot press apparatus further includes: a translation cylinder; the movable part of translation cylinder connects the installation department that pushes down the cylinder, promptly the translation cylinder is suitable for the drive to push down the cylinder along the direction of delivery translation of ejection of compact board, in order to drive hot pressboard, heating element translation.
Further, the feeding end of the discharging rail is connected with the feeding rail; a feeding disc is arranged above the feeding rail, and the feeding disc forms a feeding channel through rotation, so that the semiconductor wafers in the feeding disc fall into the feeding rail through the feeding channel and are conveyed to the discharging rail; the feeding disc is also provided with a feeding roller, and the feeding roller is suitable for blocking the semiconductor wafer exposed on the feeding disc from rotating along with the feeding disc and enabling the semiconductor wafer exposed on the feeding disc to be embedded into the feeding disc and rotate until the feeding channel falls down; the lifting and drying device comprises a feeding roller, a lifting motor, a lifting conveyer belt, a drying plate, a lifting motor, a tilting motor and a drying plate, wherein the lifting platform is arranged on the blocking side of the feeding roller, the lifting conveyer belt is driven by the lifting motor, the movable part of the tilting motor is connected with the lifting platform, semiconductor wafers stacked on the blocking side of the feeding roller climb onto the drying plate through the lifting conveyer belt, and the tilting motor drives the lifting platform to turn over so that the semiconductor wafers on the lifting conveyer belt and the drying plate are poured into a feeding disc; and a drying fan is arranged above the feeding track, the feeding disc and the lifting platform and is suitable for drying the semiconductor wafers on the feeding track, the feeding disc and the lifting platform.
The semiconductor wafer drying device has the advantages that the discharging device is arranged at the discharging end of the discharging rail, ordered and batch discharging is achieved, meanwhile, the semiconductor wafer is dried again through the hot pressing device during discharging, water vapor is prevented from being accumulated and attached to the semiconductor wafer, the drying effect is improved, meanwhile, the structure is simple, the cost is low, the semiconductor wafer is collected at the discharging platform, drying and discharging of the semiconductor wafer are achieved, and the semiconductor wafer drying device is economical and practical.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a block diagram of a conveyor system for drying semiconductor wafers according to the present invention;
FIG. 2 is a block diagram of the outfeed track of the present invention;
FIG. 3 is a structural view of the discharging device of the present invention;
FIG. 4 is a block diagram of a hot press apparatus of the present invention;
FIG. 5 is a block diagram of a hot platen of the present invention;
FIG. 6 is a self-contained view of the semiconductor wafer drying conveyor system of the present invention;
FIG. 7 is a partial view of the conveyor system for drying semiconductor wafers of the present invention;
fig. 8 is a partial view of the feed disk of the present invention.
In the figure:
the discharging device comprises a discharging rail 1, a discharging plate 100, a lower pressing hole 101 and a guiding plate 110;
the device comprises a discharging device 2, a lower pressing plate 200, an elastic piece 210, a fixing plate 220, a discharging cylinder 230, a clamping plate 240 and a limiting column 250;
the hot-pressing device 3, a hot-pressing plate 300, a drying groove 301, a heating assembly 310, a downward-pressing cylinder 320 and a translation cylinder 330;
a discharge platform 4;
the feeding device comprises a feeding rail 5, a first material baffle 500, a second material baffle 510, a first air cylinder 520 and a second air cylinder 530;
the feeding disc 6, the upper rotating disc 600, the embedded groove 601, the lower fixed disc 610 and the charging chute 611;
a feeding roller 7 and a feeding motor 700;
lifting the platform 8;
a lift motor 9;
a dump motor 10;
a drying fan 11;
a feeding plate 12, a feeding hole 1200 and a vibrating plate 1210;
a baffle 13.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In the present embodiment, as shown in fig. 1 to 8, the present embodiment provides a conveying system for drying a semiconductor wafer, comprising: the device comprises a discharge rail 1, a discharge device 2, a hot-pressing device 3 and a discharge platform 4; one end of the discharging rail 1 is suitable for receiving the falling semiconductor wafer, and the discharging device 2 is positioned at the other end of the discharging rail 1; the hot pressing device 3 is movably arranged above the discharging device 2, and the hot pressing device 3 is suitable for being pressed down onto the discharging device 2, so that the discharging device 2 deforms to form a discharging channel, namely, the semiconductor wafer falls onto the discharging platform 4 through the discharging channel.
In the present embodiment, the discharge rail 1 functions to transport the semiconductor wafer.
In the present embodiment, the discharge device 2 functions to discharge the semiconductor wafer, so that the semiconductor wafer can be controllably discharged and the semiconductor wafer can be prevented from being clogged or stacked.
In this embodiment, hot press unit 3 can play the effect of dry semiconductor wafer, and hot press unit 3 can eliminate the steam that adheres to on semiconductor wafer as last drying equipment before the ejection of compact of semiconductor wafer, improves drying effect, can cooperate discharging device 2 to carry out the ejection of compact, simple structure to semiconductor wafer simultaneously.
In the present embodiment, the discharge platform 4 functions to collect the semiconductor wafers.
In this embodiment, this embodiment sets up discharging device 2 through the discharge end at ejection of compact track 1, realizes orderly, the batch ejection of compact, and is dry once more when the semiconductor wafer ejection of compact through hot press unit 3 simultaneously, avoids steam to pile up and adheres to on the semiconductor wafer, improves drying effect, and simple structure, with low costs collect the semiconductor wafer in ejection of compact platform 4 departments simultaneously, have realized dry, the ejection of compact, economy and practicality to the semiconductor wafer.
In this embodiment, the discharging rail 1 includes: a discharge plate 100 and two guide plates 110 disposed on the discharge plate 100; the two guide plates 110 are vertically arranged on the discharging plate 100 in parallel to guide and convey the semiconductor wafer to the discharging device 2.
In the present embodiment, by providing the two guide plates 110 on the discharging plate 100, the semiconductor wafer is transported between the two guide plates 110 and then transported to the discharging device 2.
In this embodiment, the discharging device 2 includes: a lower pressure plate 200, an elastic member 210, and a fixing plate 220; a lower pressing hole 101 matched with the lower pressing plate 200 is formed in the corresponding position on the discharging plate 100; the fixed plate 220 is fixedly connected below the discharging plate 100, the lower pressing plate 200 is movably connected with the top surface of the fixed plate 220 through an elastic part 210, and the lower pressing plate 200 is flush with the lower pressing hole 101; the hot-pressing device 3 is positioned above the lower pressing plate 200; the hot press apparatus 3 is adapted to press and push the lower press plate 200 to squeeze the elastic member 210, so that the lower press holes 101 are opened to form a discharge passage, i.e. the semiconductor wafer on the discharge plate 100 falls from the discharge passage onto the discharge platform 4.
In the present embodiment, the lower platen 200, the elastic member 210 and the fixing plate 220 cooperate to control the discharge amount and the discharge speed of the semiconductor wafer.
In this embodiment, the elastic member 210 includes: at least one spring; the lower press plate 200 is movably connected to the top surface of the fixing plate 220 by corresponding springs, and the initial position of the lower press plate 200 is flush with the lower press hole 101.
In the present embodiment, when the initial position of the lower press plate 200 is flush with the lower press hole 101, the discharging channel is closed; when the lower press plate 200 presses the spring to move downwards, the discharging channel is opened.
In this embodiment, the discharging device 2 further includes: a take-off cylinder 230; the discharging cylinder 230 is obliquely arranged at the tail end of the discharging plate 100, and the movable part of the discharging cylinder 230 is arranged towards the downward pressing direction of the lower pressing plate 200, namely, when the lower pressing plate 200 is pressed down by the hot pressing device 3, the movable part of the discharging cylinder 230 is suitable for abutting against the top surface of the lower pressing plate 200 and pushing the lower pressing plate 200 to be inclined, so that the semiconductor wafer on the lower pressing plate 200 slides to the discharging platform 4.
In this embodiment, the discharging cylinder 230 can assist the lower platen 200 to discharge, and the discharging cylinder 230 tilts the lower platen 200, so that the semiconductor wafer slides down from the lower platen 200 under the action of gravity to be conveyed to the discharging platform 4.
In this embodiment, the movable portion of the discharging cylinder 230 is provided with a clamping plate 240, and the discharging cylinder 230 is adapted to drive the clamping plate 240 to clamp the edge of the lower pressing plate 200, so as to push the lower pressing plate 200 to tilt.
In this embodiment, the clamping plate 240 may be U-shaped or two-finger clamping, so as to facilitate the pushing of the lower pressing plate 200 to incline.
In this embodiment, at least one position-limiting pillar 250 is disposed on the top surface of the fixing plate 220 to limit the displacement of the elastic member 210.
In the present embodiment, the lower pressure plate 200 is prevented from being excessively depressed by providing the stopper posts 250.
In the present embodiment, the hot press apparatus 3 includes: a hot press plate 300, a heating assembly 310 and a down-press cylinder 320; the hot pressing plate 300 is positioned above the lower pressing plate 200; the bottom surface of the hot pressing plate 300 is provided with a drying groove 301, the heating assembly 310 is suitable for heating the hot pressing plate 300, and the movable part of the pressing cylinder 320 is connected with the top surface of the hot pressing plate 300, i.e. the pressing cylinder 320 is suitable for driving the hot pressing plate 300 to press downwards towards the pressing plate 200, and covering the semiconductor wafer on the pressing plate 200 in the drying groove 301, so as to dry the semiconductor wafer in the drying groove 301; the pressing cylinder 320 pushes the hot pressing plate 300 to press downwards and drives the pressing plate 200 to extrude the elastic part 210, so that the pressing hole 101 is opened to form a discharging channel.
In this embodiment, the heating assembly 310 may be, but is not limited to, a heating plate, and the hot pressing plate 300 is driven to press downward by the pressing cylinder 320, on one hand, the drying groove 301 performs final drying on the semiconductor wafer before discharging, and on the other hand, the heating assembly can cooperate with the pressing plate 200 to discharge.
In this embodiment, the hot press apparatus 3 further includes: a translation cylinder 330; the movable part of the translation cylinder 330 is connected with the mounting part of the pressing cylinder 320, that is, the translation cylinder 330 is suitable for driving the pressing cylinder 320 to translate along the conveying direction of the discharging plate 100, so as to drive the hot-pressing plate 300 and the heating assembly 310 to translate.
In the present embodiment, the position of the hot press plate 300 can be adjusted by providing the translation cylinder 330, so that the hot press plate 300 faces the lower press plate 200.
In the embodiment, the feeding end of the discharging track 1 is connected with the feeding track 5; a feeding disc 6 is arranged above the feeding rail 5, and the feeding disc 6 forms a feeding channel through rotation, so that the semiconductor wafer in the feeding disc 6 falls into the feeding rail 5 through the feeding channel, and is conveyed to the discharging rail 1; the feeding disc 6 is also provided with a feeding roller 7, and the feeding roller 7 is suitable for blocking the semiconductor wafer exposed on the feeding disc 6 from rotating along with the feeding disc 6 and enabling the semiconductor wafer exposed on the feeding disc 6 to be embedded into the feeding disc 6 and rotate until a feeding channel falls; a lifting platform 8, a lifting motor 9 and a dumping motor 10 are arranged on the blocking side of the feeding roller 7, a lifting conveyer belt and a drying plate are arranged on the lifting platform 8, the lifting conveyer belt is driven by the lifting motor 9, the movable part of the dumping motor 10 is connected with the lifting platform 8, semiconductor wafers stacked on the blocking side of the feeding roller 7 climb onto the drying plate through the lifting conveyer belt, and the dumping motor 10 drives the lifting platform 8 to turn over so that the semiconductor wafers on the lifting conveyer belt and the drying plate are dumped into the feeding disc 6; the upper portions of the feeding track 5, the feeding disc 6 and the lifting platform 8 are provided with drying fans 11, and the drying fans 11 are suitable for drying the semiconductor wafers on the feeding track 5, the feeding disc 6 and the lifting platform 8.
In the present embodiment, a feeding plate 12 is disposed above the feeding disc 6, and is used for receiving semiconductor wafers; the feed disc 6 comprises: an upper rotating disk 600 and a lower fixing disk 610; an upper rotary plate 600 disposed below the feed plate 12 and having a plurality of insertion grooves 601 formed therein for receiving the semiconductor wafers dropped from the feed plate 12 and rotating to insert the semiconductor wafers into the insertion grooves 601; the lower fixed disk 610 is positioned below the upper rotating disk 600, at least one blanking groove 611 matched with the embedded groove 601 is arranged at the upper part of the lower fixed disk, and the upper rotating disk 600 drives the embedded groove 601 embedded with the semiconductor wafer to rotate to the blanking groove 611, so that the embedded groove 601 and the corresponding blanking groove 611 form a blanking channel; the feeding track 5 is positioned below the lower fixed disk 610 and is used for receiving the semiconductor wafers falling from the blanking channel and conveying the semiconductor wafers to the discharging track 1; the feeding roller 7 is attached to the upper rotary disk 600, and is used for blocking the semiconductor wafer exposed on the upper rotary disk 600 from rotating along with the upper rotary disk 600 and enabling the semiconductor wafer exposed on the upper rotary disk 600 to be embedded into each embedded groove 601.
In this embodiment, the upper rotary disk 600 is fixed to the frame, the upper rotary disk 600 can rotate, and the semiconductor wafer is inserted into the corresponding insertion groove 601 of the upper rotary disk 600 without being blocked by the feeding roller 7, so that the semiconductor wafer falls from the blanking passage and falls on the feeding rail 5 when the insertion groove 601 is engaged with the corresponding blanking groove 611 after rotating from the lower portion of the upper rotary disk 600 to the upper portion of the upper rotary disk 600.
In this embodiment, the feeding plate 12, the upper rotating disk 600, the lower fixed disk 610, the feeding track 5, the feeding roller 7 and the drying fan 11 are all obliquely arranged, and the feeding plate 12, the upper rotating disk 600, the lower fixed disk 610, the feeding track 5, the feeding roller 7 and the drying fan 11 are installed on the rack.
In the present embodiment, the feeding plate 12 is disposed obliquely, and the high position on the feeding plate 12 is defined as the upper part of the feeding plate 12, and the low position on the feeding plate 12 is defined as the lower part of the feeding plate 12.
In this embodiment, the upper rotating disk 600 is disposed obliquely, and since the upper rotating disk 600 is rotating, the lower portion of the upper rotating disk 600 is still defined as the lower portion of the upper rotating disk 600, and the upper portion of the upper rotating disk 600 is defined as the upper portion of the upper rotating disk 600; the lower fixed disk 610 is disposed slantly, a lower portion of the lower fixed disk 610 is defined as a lower portion of the lower fixed disk 610, and an upper portion of the lower fixed disk 610 is defined as an upper portion of the lower fixed disk 610.
In this embodiment, the lower portion of the feeding plate 12 is provided with a feeding hole 1200, and the feeding hole 1200 is located above the lower portion of the upper rotating disk 600; the semiconductor wafer slides along the feeding plate 12 under the action of gravity and falls from the feeding port 1200 onto the surface of the upper rotary disk 600.
In the embodiment, the edge of the feeding plate 12 and the circumference of the upper rotating disk 600 are provided with corresponding baffles 13 to block the semiconductor wafer from falling out.
In this embodiment, the upper rotary plate 600 is driven by a disc motor fixed to the frame.
In this embodiment, the drying fan 11 is further provided with a heating wire, the heating wire heats the ambient air, and the drying fan 11 blows the heated air to the feeding plate 12, the upper rotating disk 600, the lower fixed disk 610, the feeding track 5, and the feeding roller 7 to form a drying airflow to dry the semiconductor wafer.
In this embodiment, the feeding roller 7 is driven by a feeding motor 700, the feeding motor 700 is mounted on the frame, and the movable portion of the feeding motor 700 is connected to the feeding roller 7.
In the present embodiment, the feed rollers 7 can block the semiconductor wafers exposed on the surface of the upper rotary plate 600 from rotating with the upper rotary plate 600 while allowing the semiconductor wafers inserted into the corresponding insertion grooves 601 to pass therethrough, and the feed rollers 7 can continuously block and roll the semiconductor wafers while the feed rollers 7 can ash the semiconductor wafers during their contact with the semiconductor wafers.
In this embodiment, the feeding roller 7 and the feeding port 1200 are respectively located at two sides of the lower portion of the upper rotating disk 600, and the feeding roller 7 is attached to the disk surface of the upper rotating disk 600.
In the present embodiment, the feed motor 700 drives the feed roller 7 to rotate so as to block the semiconductor wafers exposed on the disk surface of the upper rotary disk 600 from rotating with the upper rotary disk 600 and to fit the semiconductor wafers exposed on the disk surface of the upper rotary disk 600 into the corresponding fitting grooves 601.
In this embodiment, the feed inlet 1200 is disposed on the left side of the lower portion of the upper rotating disk 600, and the feed roller 7 is disposed on the right side of the lower portion of the upper rotating disk 600, so that the upper rotating disk 600 rotates counterclockwise, and the feed motor 700 drives the feed roller 7 to rotate clockwise; the feed roller 7 is disposed on the left side of the lower portion of the upper rotary plate 600, and the feed port 1200 is disposed on the right side of the lower portion of the upper rotary plate 600, so that the upper rotary plate 600 rotates clockwise, and the feed motor 700 drives the feed roller 7 to rotate counterclockwise.
In this embodiment, the upper rotary plate 600 and the feed roller 7 rotate in different directions, so that the feed roller 7 can apply a resistance to the semiconductor wafer to block the semiconductor wafer, and simultaneously the roller body of the feed roller 7 is in continuous contact with the semiconductor wafer.
In this embodiment, a vibration plate 1210 is disposed on the feeding plate 12, the vibration plate 1210 is disposed close to the feeding roller 7, and the feeding motor 700 drives the stop roller to rotate, so that the vibration plate 1210 vibrates the semiconductor wafer on the feeding plate 12, and the semiconductor wafer falls from the feeding port 1200 to the upper rotating disc 600.
In this embodiment, the vibration plate 1210 plays a role of conveying the semiconductor wafer, and when the feeding motor 700 drives the feeding roller 7 to rotate, the vibration plate 1210 is continuously flapped, so as to vibrate the semiconductor wafer on the feeding plate 12, so that the semiconductor wafer slides along the feeding plate 12 under the action of gravity and falls on the disc surface of the upper rotating disc 600 through the feeding port 1200.
In this embodiment, the lifting conveyer belt can drive the side that blocks of feed roller 7 accumulational semiconductor wafer climbs to the drying plate on, can avoid semiconductor wafer to pile up in the side that blocks of feed roller 7 on the one hand, on the other hand can make semiconductor wafer closer to drying fan 11, improve drying effect, semiconductor wafer piles up through empting the upset of motor 10 drive lifting platform 8 on the drying plate simultaneously when too much, make the lifting conveyer belt, the dried semiconductor wafer on the drying plate pours the lower part of last rotary disk 600 into, can be with the corresponding embedded groove 601 of dried semiconductor wafer embedding.
In this embodiment, the feeding rail 5 is provided with a first striker plate 500 and a second striker plate 510; the first material baffle 500 and the second material baffle 510 are driven by a first air cylinder 520 and a second air cylinder 530, the feeding rail 5 is suitable for receiving the semiconductor wafer falling from the blanking channel, and the semiconductor wafer is conveyed along the conveying direction of the feeding rail 5; the first material baffle 500 and the second material baffle 510 are positioned in the material conveying direction of the feeding track 5; the first striker plate 500 and the second striker plate 510 are respectively connected to the movable portion of the first cylinder 520 and the movable portion of the second cylinder 530, that is, the first cylinder 520 drives the first striker plate 500 to open, so that the semiconductor wafer is conveyed to the second striker plate 510, and the second cylinder 530 drives the second striker plate 510 to open, so that the semiconductor wafer is conveyed to the discharge rail 1.
In this embodiment, because the feeding track 5 is the slope setting, thereby semiconductor wafer slides along feeding track 5 and carries to ejection of compact track 1 under the action of gravity to stop semiconductor wafer through first striker plate 500, second striker plate 510, can realize transporting in batches, and can in time stop semiconductor wafer in corresponding striker plate department when semiconductor wafer appears unusually.
In conclusion, the discharging device is arranged at the discharging end of the discharging track, so that ordered and batch discharging is realized, meanwhile, the semiconductor wafer is dried again through the hot pressing device during discharging, water vapor is prevented from being accumulated and attached to the semiconductor wafer, the drying effect is improved, meanwhile, the structure is simple, the cost is low, the semiconductor wafer is collected at the discharging platform, the semiconductor wafer is dried and discharged, and the device is economical and practical.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. A conveyor system for drying a semiconductor wafer, comprising:
the device comprises a discharge rail, a discharge device, a hot pressing device and a discharge platform; wherein
One end of the discharging rail is suitable for receiving the falling semiconductor wafer, and the discharging device is positioned at the other end of the discharging rail;
the hot pressing device is movably arranged above the discharging device and is suitable for being pressed down to the discharging device so as to deform the discharging device to form a discharging channel, namely
And the semiconductor wafer falls onto the discharging platform through the discharging channel.
2. A transport system for semiconductor wafer drying as claimed in claim 1,
the ejection of compact track includes: the device comprises a discharge plate and two guide plates arranged on the discharge plate;
the two guide plates are vertically arranged on the discharge plate in parallel to guide and convey the semiconductor wafer to the discharge device.
3. A transport system for semiconductor wafer drying as claimed in claim 2,
the discharging device comprises: the lower pressing plate, the elastic piece and the fixing plate;
a corresponding position on the discharging plate is provided with a lower pressing hole matched with the lower pressing plate;
the fixed plate is fixedly connected below the discharge plate, the lower pressure plate is movably connected with the top surface of the fixed plate through an elastic piece, and the lower pressure plate is flush with the lower pressure hole;
the hot pressing device is positioned above the lower pressing plate;
the hot-pressing device is suitable for pressing down and pushing the lower pressing plate to extrude the elastic piece so as to open the lower pressing hole to form a discharging channel, namely
And the semiconductor wafer on the discharging plate falls onto the discharging platform from the discharging channel.
4. A transport system for semiconductor wafer drying as claimed in claim 3,
the elastic member includes: at least one spring;
the lower pressing plate is movably connected with the top surface of the fixing plate through a corresponding spring, and the initial position of the lower pressing plate is flush with the lower pressing hole.
5. A transport system for semiconductor wafer drying as claimed in claim 3,
the discharging device further comprises: a discharging cylinder;
the discharging cylinder is obliquely arranged at the tail end of the discharging plate, and the movable part of the discharging cylinder is arranged towards the pressing direction of the pressing plate, namely
When the lower pressing plate is pressed down by the hot pressing device, the movable part of the discharging cylinder is suitable for abutting against the top surface of the lower pressing plate and pushing the lower pressing plate to incline, so that the semiconductor wafer on the lower pressing plate slides onto the discharging platform.
6. A transport system for semiconductor wafer drying as claimed in claim 5,
the movable part of the discharging cylinder is provided with a clamping plate, and the discharging cylinder is suitable for driving the clamping plate to clamp the edge of the lower pressing plate, so that the lower pressing plate is pushed to incline.
7. A transport system for semiconductor wafer drying as claimed in claim 3,
the top surface of the fixed plate is provided with at least one limiting column to limit the displacement of the elastic piece.
8. A transport system for semiconductor wafer drying as claimed in claim 3,
the hot press apparatus includes: the hot pressing plate, the heating assembly and the pressing cylinder are arranged on the upper surface of the heating assembly;
the hot pressing plate is positioned above the lower pressing plate;
the bottom surface of hot pressboard is provided with the stoving groove, heating element is suitable for and heats the hot pressboard, the movable part of push down the cylinder connects the top surface of hot pressboard, promptly
The downward pressing air cylinder is suitable for driving the hot pressing plate to press downward towards the downward pressing plate and covering the semiconductor wafer on the downward pressing plate in the drying groove so as to dry the semiconductor wafer in the drying groove;
the pressing cylinder pushes the hot pressing plate to press downwards and drives the pressing plate to extrude the elastic piece, so that the pressing hole is opened to form a discharging channel.
9. A transport system for semiconductor wafer drying as claimed in claim 8,
the hot press apparatus further comprises: a translation cylinder;
the movable part of the translational cylinder is connected with the mounting part of the pushing cylinder, i.e.
The translation cylinder is suitable for driving the pressing cylinder to translate along the conveying direction of the discharging plate so as to drive the hot pressing plate and the heating assembly to translate.
10. A transport system for semiconductor wafer drying as claimed in claim 1,
the feeding end of the discharging rail is connected with the feeding rail;
a feeding disc is arranged above the feeding rail, and the feeding disc forms a feeding channel through rotation, so that the semiconductor wafers in the feeding disc fall into the feeding rail through the feeding channel and are conveyed to the discharging rail;
the feeding disc is also provided with a feeding roller, and the feeding roller is suitable for blocking the semiconductor wafer exposed on the feeding disc from rotating along with the feeding disc and enabling the semiconductor wafer exposed on the feeding disc to be embedded into the feeding disc and rotate until the feeding channel falls down;
the lifting and drying device comprises a feeding roller, a lifting motor, a lifting conveyer belt, a drying plate, a lifting motor, a tilting motor and a drying plate, wherein the lifting platform is arranged on the blocking side of the feeding roller, the lifting conveyer belt is driven by the lifting motor, the movable part of the tilting motor is connected with the lifting platform, semiconductor wafers stacked on the blocking side of the feeding roller climb onto the drying plate through the lifting conveyer belt, and the tilting motor drives the lifting platform to turn over so that the semiconductor wafers on the lifting conveyer belt and the drying plate are poured into a feeding disc;
and a drying fan is arranged above the feeding track, the feeding disc and the lifting platform and is suitable for drying the semiconductor wafers on the feeding track, the feeding disc and the lifting platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111168478.1A CN113587617A (en) | 2021-10-08 | 2021-10-08 | Conveying system for drying semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111168478.1A CN113587617A (en) | 2021-10-08 | 2021-10-08 | Conveying system for drying semiconductor wafer |
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| Publication Number | Publication Date |
|---|---|
| CN113587617A true CN113587617A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111168478.1A Pending CN113587617A (en) | 2021-10-08 | 2021-10-08 | Conveying system for drying semiconductor wafer |
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| Country | Link |
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| CN (1) | CN113587617A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153751A (en) * | 2023-11-01 | 2023-12-01 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying channel without particulate pollution based on ultra-vacuum environment |
| CN117352440A (en) * | 2023-12-05 | 2024-01-05 | 青岛育豪微电子设备有限公司 | Semiconductor cooling device |
-
2021
- 2021-10-08 CN CN202111168478.1A patent/CN113587617A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153751A (en) * | 2023-11-01 | 2023-12-01 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying channel without particulate pollution based on ultra-vacuum environment |
| CN117153751B (en) * | 2023-11-01 | 2024-01-26 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying channel without particulate pollution based on ultra-vacuum environment |
| CN117352440A (en) * | 2023-12-05 | 2024-01-05 | 青岛育豪微电子设备有限公司 | Semiconductor cooling device |
| CN117352440B (en) * | 2023-12-05 | 2024-04-12 | 青岛育豪微电子设备有限公司 | Semiconductor cooling device |
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Application publication date: 20211102 |
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