CN113566537A - Drying system for semiconductor wafer and working method thereof - Google Patents

Drying system for semiconductor wafer and working method thereof Download PDF

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Publication number
CN113566537A
CN113566537A CN202111118361.2A CN202111118361A CN113566537A CN 113566537 A CN113566537 A CN 113566537A CN 202111118361 A CN202111118361 A CN 202111118361A CN 113566537 A CN113566537 A CN 113566537A
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CN
China
Prior art keywords
semiconductor wafer
feeding
disc
drying
material blocking
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Pending
Application number
CN202111118361.2A
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Chinese (zh)
Inventor
张祖华
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Changzhou Hengmai Drying Equipment Co ltd
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Changzhou Hengmai Drying Equipment Co ltd
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Application filed by Changzhou Hengmai Drying Equipment Co ltd filed Critical Changzhou Hengmai Drying Equipment Co ltd
Priority to CN202111118361.2A priority Critical patent/CN113566537A/en
Publication of CN113566537A publication Critical patent/CN113566537A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
    • F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
    • F26B11/181—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles the receptacle being a foraminous, perforated or open-structured drum or drum-like container, e.g. rotating around a substantially horizontal or vertical axis; the receptacle being multiple perforated drums, e.g. in superimposed arrangement
    • F26B11/184—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles the receptacle being a foraminous, perforated or open-structured drum or drum-like container, e.g. rotating around a substantially horizontal or vertical axis; the receptacle being multiple perforated drums, e.g. in superimposed arrangement provided with internal means for mixing, stirring or conveying the materials to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/04—Agitating, stirring, or scraping devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/14—Chambers, containers, receptacles of simple construction
    • F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

The invention belongs to the technical field of semiconductor drying equipment, and particularly relates to a drying system for a semiconductor wafer and a working method thereof, wherein the drying system for the semiconductor wafer comprises: the device comprises a feeding plate, a feeding disc device, a drying device, a material blocking device and a conveying device; wherein the feeding plate puts the semiconductor wafer into the feeding disc device; the feeding disc device drives the embedded semiconductor wafer to rotate to a corresponding position so as to fall onto the conveying device; the material blocking device blocks the semiconductor wafer exposed on the upper disc surface from rotating along with the feeding disc device, and the semiconductor wafer exposed on the upper disc surface is embedded into the rotating feeding disc device; the invention disperses the semiconductor wafer by arranging the feeding plate and the feeding disc device, and dries the semiconductor wafer by the drying device, thereby having good drying effect, simple structure and low manufacturing cost, dusting the semiconductor wafer by the stop device and drying the whole body of the semiconductor wafer by turning the semiconductor wafer continuously.

Description

Drying system for semiconductor wafer and working method thereof
Technical Field
The invention belongs to the technical field of semiconductor drying equipment, and particularly relates to a drying system for a semiconductor wafer and a working method of the drying system.
Background
The traditional drying equipment dries the semiconductor wafer through a long conveying line, so that the manufacturing cost is high and the drying effect on the semiconductor wafer is not ideal.
Therefore, it is desirable to develop a new drying system for semiconductor wafers and a method for operating the same to solve the above problems.
Disclosure of Invention
The invention aims to provide a drying system for a semiconductor wafer and a working method thereof.
In order to solve the above-mentioned technical problem, the present invention provides a drying system for a semiconductor wafer, comprising: the feeding plate, the feeding disc device, the drying device, the material blocking device and the conveying device are obliquely arranged; the feeding plate and the drying device are positioned above the feeding disc device, the material blocking device is arranged close to the upper disc surface of the feeding disc device, and the conveying device is positioned below the feeding disc device; the feeding plate is suitable for throwing the semiconductor wafers into the feeding disc device so that the corresponding semiconductor wafers are embedded into the rotating feeding disc device; the drying device is suitable for drying the semiconductor wafers on the feeding plate and the feeding disc device; the feeding disc device is suitable for driving the embedded semiconductor wafer to rotate to a corresponding position so as to fall onto the conveying device; the material blocking device is suitable for blocking the semiconductor wafer exposed on the upper disc surface from rotating along with the feeding disc device and embedding the semiconductor wafer exposed on the upper disc surface into the rotating feeding disc device; and the conveying device is suitable for conveying the fallen and dried semiconductor wafer to a packaging system.
Further, the feed disc device comprises: a rotating disc and a fixed disc which are arranged from top to bottom and are arranged on the frame; the lower part of the feeding plate is provided with a feeding hole, and the feeding hole is positioned above the lower part of the rotating disc; a plurality of embedding grooves are distributed on the rotating disc and used for embedding the semiconductor wafer; the upper portion of fixed disc is provided with at least one and embedded groove assorted blanking groove, promptly in the semiconductor wafer embedding rotating disc that the feed inlet was put in corresponds embedded groove on, works as when rotating disc drives the embedded groove that has embedded semiconductor wafer and changes to the corresponding blanking groove department of fixed disc, this embedded groove forms the blanking passageway with corresponding blanking groove, in order to be corresponding semiconductor wafer falls into conveyor.
Furthermore, corresponding baffles are arranged on the edge of the feeding plate and the circumference of the rotating disc so as to prevent the corresponding semiconductor wafer from falling out; the rotating disc is driven by a disc motor fixed on the frame.
Further, the drying device includes: the drying heating assembly and the drying fan are positioned above the feeding disc device; the drying and heating assembly is suitable for heating ambient air, and the drying fan is suitable for blowing the heated air to the feeding plate, the feeding disc device and the conveying device so as to form drying air flow to dry the corresponding semiconductor wafer.
Further, the dam device includes: the material blocking roller and the material blocking motor are arranged on the material blocking roller; the material blocking rollers and the material inlet are respectively positioned on two sides of the lower part of the rotating disc, and the material blocking rollers are attached to the disc surface of the rotating disc; the material blocking motor is installed on the frame, the movable part of the material blocking motor is connected with the material blocking roller, namely, the material blocking motor is suitable for driving the material blocking roller to rotate, so that the material blocking roller blocks the semiconductor wafer exposed on the disc surface of the rotating disc to rotate along with the rotating disc, and the semiconductor wafer exposed on the disc surface of the rotating disc is embedded into the corresponding embedded groove.
Further, when the feed inlet is positioned on the left side of the lower part of the rotating disc and the material blocking roller is positioned on the right side of the lower part of the rotating disc, the rotating disc rotates anticlockwise, and the material blocking motor drives the material blocking roller to rotate clockwise; when the material blocking roller is located on the left side of the lower portion of the rotating disc and the feed inlet is located on the right side of the lower portion of the rotating disc, the rotating disc rotates clockwise, and the material blocking motor drives the material blocking roller to rotate anticlockwise.
Furthermore, a vibration plate is connected to the feeding plate and arranged close to the material blocking roller, namely, when the material blocking motor is suitable for driving the material blocking roller to rotate, the vibration plate is suitable for vibrating the semiconductor wafer on the feeding plate, so that the semiconductor wafer falls onto the rotating disc from the feeding hole.
Furthermore, a lifting platform, a lifting motor and a dumping motor are arranged on the blocking side of the material blocking roller; the lifting platform is provided with a lifting conveyer belt and a drying plate, the lifting conveyer belt is driven by a lifting motor, and the movable part of the dumping motor is connected with the lifting platform; the semiconductor wafers stacked on the blocking side of the material blocking roller climb onto the drying plate through the lifting conveyer belt, and the drying device dries the semiconductor wafers on the lifting conveyer belt and the drying plate; the dumping motor is suitable for driving the lifting platform to overturn, so that the semiconductor wafer dried on the lifting conveyer belt and the drying plate is dumped into the lower part of the rotating disc.
Further, the conveying device includes: the conveying guide rail, the first material baffle, the first cylinder, the second material baffle and the second cylinder are obliquely arranged; the conveying guide rail is suitable for receiving the semiconductor wafer falling from the feeding disc device and conveying the semiconductor wafer along the conveying direction of the conveying guide rail; the first material baffle plate and the second material baffle plate are sequentially arranged on the conveying guide rail and are positioned in the conveying direction of the conveying guide rail; the first material baffle and the second material baffle are respectively connected with the movable part of the first air cylinder and the movable part of the second air cylinder, namely the first air cylinder drives the first material baffle to be opened so that the semiconductor wafer is conveyed to the second material baffle, and the second air cylinder drives the second material baffle to be opened so that the semiconductor wafer is conveyed to the packaging system.
In another aspect, the present invention provides a method for operating a drying system for semiconductor wafers, including: the feeding plate, the feeding disc device, the drying device, the material blocking device and the conveying device are obliquely arranged; putting the semiconductor wafer into a feeding disc device through a feeding plate so as to enable the corresponding semiconductor wafer to be embedded into the rotating feeding disc device; drying the semiconductor wafers on the feeding plate and the feeding disc device through a drying device; the embedded semiconductor wafer is driven to rotate to a corresponding position through the feeding disc device so as to fall onto the conveying device; the semiconductor wafer exposed on the upper disc surface is prevented by the material blocking device from rotating along with the feeding disc device, and the semiconductor wafer exposed on the upper disc surface is embedded into the rotating feeding disc device; and the conveying device is suitable for conveying the fallen and dried semiconductor wafer to the packaging system.
The invention has the advantages that the feeding plate and the feeding disc device are arranged to disperse the semiconductor wafers, and the drying device is used for drying, so that the drying effect is good, the structure is simple, the manufacturing cost is low, meanwhile, the stop device is used for preventing the semiconductor wafers exposed on the upper disc surface from rotating along with the feeding disc device, the dusting can be carried out on the semiconductor wafers, meanwhile, the semiconductor wafers are continuously turned over and dried, the drying effect is further improved, and finally, the falling dried semiconductor wafers are conveyed to subsequent equipment through the conveying device, and the integration of drying, polishing and conveying is realized.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a self-contained view of a drying system for semiconductor wafers of the present invention;
FIG. 2 is a side view of a drying system for semiconductor wafers of the present invention;
FIG. 3 is a partial view of a drying system for semiconductor wafers of the present invention;
FIG. 4 is a partial view of the feed disc assembly of the present invention;
FIG. 5 is a structural view of a drying apparatus of the present invention;
figure 6 is a block diagram of the lift platform of the present invention.
In the figure:
a feeding plate 1, a feeding hole 100 and a vibrating plate 110;
the device comprises a feeding disc device 2, a rotating disc 200, an embedded groove 201, a fixed disc 210 and a charging chute 211;
a drying device 3, a drying heating component 300 and a drying fan 310;
the material blocking device 4, the material blocking roller 400 and the material blocking motor 410;
the device comprises a conveying device 5, a conveying guide rail 500, a first material baffle 510, a first air cylinder 520, a second material baffle 530 and a second air cylinder 540;
a frame 6;
a baffle 7;
the device comprises a lifting platform 8, a lifting conveyer belt 800, a lifting motor 801 and a drying plate 810;
the dump motor 9.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In this embodiment, as shown in fig. 1 to 6, the embodiment provides a drying system for a semiconductor wafer, comprising: the device comprises a feeding plate 1, a feeding disc device 2, a drying device 3, a material blocking device 4 and a conveying device 5 which are obliquely arranged; the feeding plate 1 and the drying device 3 are positioned above the feeding disc device 2, the material blocking device 4 is arranged on the upper disc surface of the feeding disc device 2 in a sticking mode, and the conveying device 5 is positioned below the feeding disc device 2; the feeding plate 1 is suitable for throwing the semiconductor wafers into the feeding disc device 2 so that the corresponding semiconductor wafers are embedded into the rotating feeding disc device 2; the drying device 3 is suitable for drying the semiconductor wafers on the feeding plate 1 and the feeding disc device 2; the feeding disc device 2 is suitable for driving the embedded semiconductor wafer to rotate to a corresponding position so as to fall onto the conveying device 5; the material blocking device 4 is suitable for blocking the semiconductor wafer exposed on the upper disc surface from rotating along with the feeding disc device 2 and embedding the semiconductor wafer exposed on the upper disc surface into the rotating feeding disc device 2; and the conveying device 5 is adapted to convey the dropped dried semiconductor wafer to a packaging system.
Feed plate 1
The feeding plate 1 mainly plays a feeding role, the feeding plate 1 can put the semiconductor wafer into the feeding disc device 2, so that the semiconductor wafer is embedded into the rotating feeding disc device 2, and the semiconductor wafer slides along the feeding plate 1 under the action of gravity to fall into the feeding disc device 2 due to the fact that the feeding plate 1 is obliquely arranged.
Feeding disc device 2
Feeding disc device 2 mainly plays the stirring, the feeding effect, the semiconductor wafer rolls under feeding disc device 2's rotation effect, can make the whole body of semiconductor wafer dry, and feeding disc device 2 can also make the semiconductor wafer embedding, thereby the semiconductor wafer that drives the embedding rotates to relevant position in order to fall into conveyor 5 on, because feeding disc device 2 is the slope setting, simultaneously feeding plate 1 puts in the semiconductor wafer to feeding disc device 2's low department, feeding disc device 2 rotates the semiconductor wafer of low department to high department and carries out the feeding, and the semiconductor wafer is by low to high in-process at the action of gravity, roll under the rotation effect, it is dry, drying effect is improved.
Drying device 3
The drying device 3 mainly serves to dry the semiconductor wafers on the feeding plate 1, the feeding disk device 2, and the conveying device 5.
Stop device 4
The material blocking device 4 mainly plays a role in blocking, the material blocking device 4 is attached to the upper disc surface of the feeding disc device 2 to be arranged, the semiconductor wafer exposed on the upper disc surface can be prevented from rotating along with the feeding disc device 2, the semiconductor wafer exposed on the upper disc surface is embedded into the rotating feeding disc device 2, the semiconductor wafer can be continuously blocked and rolled, and is dried by the drying device 3, the whole body of the semiconductor wafer is dried, the drying effect is improved, and meanwhile, the material blocking device 4 can be used for dusting the semiconductor wafer in the contact process of the semiconductor wafer.
Conveying device 5
The conveying device 5 mainly plays a role of conveying materials, and the conveying device 5 can convey the fallen and dried semiconductor wafer to subsequent equipment for further processing.
In this embodiment, this embodiment is through setting up feeding plate 1, feeding disc device 2 disperses semiconductor wafer, and there is drying device 3 to dry, not only drying effect is good, and simple structure, the cost is low, it exposes the semiconductor wafer in last quotation to block simultaneously through dam device 4 and rotates along with feeding disc device 2, can whisk semiconductor wafer, make semiconductor wafer incessantly upset whole body dry simultaneously, drying effect has further been improved, carry the semiconductor wafer after the drying that falls to follow-up equipment through conveyor 5 at last, drying, polishing, transportation integration have been realized.
In this embodiment, the feed disc device 2 includes: a rotating disc 200 and a fixed disc 210 which are arranged from top to bottom and are arranged on the frame 6; the lower part of the feeding plate 1 is provided with a feeding hole 100, and the feeding hole 100 is positioned above the lower part of the rotating disc 200; a plurality of embedding grooves 201 are distributed on the rotating disc 200 for embedding the semiconductor wafer; the upper portion of fixed disc 210 is provided with at least one and embedded groove 201 assorted blanking groove 211, promptly the semiconductor wafer embedding that feed inlet 100 was put in rotates the corresponding embedded groove 201 on the disc 200 in, works as when the corresponding blanking groove 211 department of fixed disc 210 is rotated to embedded groove 201 that has embedded semiconductor wafer to rotating disc 200 drive, this embedded groove 201 forms the blanking passageway with corresponding blanking groove 211, in order to correspond semiconductor wafer falls into conveyor 5 on.
In the present embodiment, the feed plate 1 is disposed obliquely, and the lower portion of the feed plate 1 is defined as the lower portion of the feed plate 1.
In the present embodiment, the feeding disk device 2 is disposed obliquely, the lower portion of the fixed disk 210 is defined as the lower portion of the fixed disk 210, the upper portion of the fixed disk 210 is defined as the upper portion of the fixed disk 210, and since the rotating disk 200 is in rotation, the lower portion of the rotating disk 200 is still defined as the lower portion of the rotating disk 200, and the upper portion of the rotating disk 200 is defined as the upper portion of the rotating disk 200.
In this embodiment, the semiconductor wafer slides along the feed plate 1 under gravity and falls from the feed inlet 100 onto the rotating disk 200.
In this embodiment, the fixed disk 210 is fixed on the frame 6, the rotating disk 200 can rotate, and the semiconductor wafer is inserted into the corresponding insertion groove 201 of the rotating disk 200 and is not blocked by the material blocking device 4, so that when the insertion groove 201 is engaged with the corresponding blanking groove 211, the semiconductor wafer falls from the rotating disk 200 and the fixed disk 210 and falls on the conveying device 5 when the semiconductor wafer is inserted into the corresponding insertion groove 201 of the rotating disk 200 and rotates to the upper portion of the rotating disk 200.
In this embodiment, the edge of the feeding plate 1 and the circumference of the rotating disc 200 are provided with corresponding baffles 7 to prevent the corresponding semiconductor wafer from falling out; the rotary disk 200 is driven by a disk motor fixed to the frame 6.
In the present embodiment, the drying device 3 includes: a drying heating assembly 300 and a drying fan 310 located above the feeding disk device 2; the drying and heating assembly 300 is adapted to heat the ambient air, and the drying blower 310 is adapted to blow the heated air toward the feeding plate 1, the feeding disk device 2, and the conveying device 5 to form a drying air flow to dry the corresponding semiconductor wafer.
In the present embodiment, the drying and heating assembly 300 may be, but is not limited to, a heating wire, and the drying and heating assembly 300 and the drying fan 310 can dry the semiconductor wafer.
In this embodiment, the material blocking device 4 includes: a material blocking roller 400 and a material blocking motor 410; the material blocking rollers 400 and the feed inlet 100 are respectively positioned at two sides of the lower part of the rotating disc 200, and the material blocking rollers 400 are attached to the disc surface of the rotating disc 200; the material blocking motor 410 is installed on the frame 6, the movable part of the material blocking motor 410 is connected with the material blocking roller 400, namely, the material blocking motor 410 is suitable for driving the material blocking roller 400 to rotate, so that the material blocking roller 400 blocks the semiconductor wafer exposed on the disc surface of the rotating disc 200 to rotate along with the rotating disc 200, and the semiconductor wafer exposed on the disc surface of the rotating disc 200 is embedded into the corresponding embedded groove 201.
In the embodiment, the material blocking roller 400 can block the semiconductor wafer exposed on the surface of the rotating disc 200 from rotating along with the rotating disc 200, and simultaneously can enable the semiconductor wafer embedded in the corresponding embedded groove 201 on the rotating disc 200 to pass through, and the material blocking roller 400 can continuously block the semiconductor wafer and enable the semiconductor wafer to roll over, and simultaneously the material blocking roller 400 can dust the semiconductor wafer in the process of contacting with the semiconductor wafer.
In this embodiment, when the feed inlet 100 is located on the left side of the lower portion of the rotating disc 200 and the stop roller 400 is located on the right side of the lower portion of the rotating disc 200, the rotating disc 200 rotates counterclockwise, and the stop motor 410 drives the stop roller 400 to rotate clockwise; when the material blocking roller 400 is positioned at the left side of the lower part of the rotating disc 200 and the feed inlet 100 is positioned at the right side of the lower part of the rotating disc 200, the rotating disc 200 rotates clockwise, and the material blocking motor 410 drives the material blocking roller 400 to rotate anticlockwise.
In this embodiment, the rotating direction of the rotating disk 200 is different from that of the blocking roller 400, so that the blocking roller 400 can apply a resistance to the semiconductor wafer to block the semiconductor wafer, and meanwhile, the roller body of the blocking roller 400 is continuously contacted with the semiconductor wafer.
In this embodiment, the feeding plate 1 is connected with a vibrating plate 110, the vibrating plate 110 is disposed close to the stop roller 400, that is, when the stop motor 410 is adapted to drive the stop roller 400 to rotate, the vibrating plate 110 is adapted to vibrate the semiconductor wafer on the feeding plate 1, so that the semiconductor wafer falls from the feeding hole 100 onto the rotating disk 200.
In this embodiment, the vibrating plate 110 is used for conveying the semiconductor wafer, and when the material blocking motor 410 drives the material blocking roller 400 to rotate, the vibrating plate 110 is continuously flapped, so as to vibrate the semiconductor wafer on the feeding plate 1, so that the semiconductor wafer slides along the feeding plate 1 under the action of gravity and falls onto the rotating disc 200 through the feeding hole 100.
In this embodiment, the blocking side of the material blocking roller 400 is provided with a lifting platform 8, a lifting motor 801 and a dumping motor 9; the lifting platform 8 is provided with a lifting conveyer belt 800 and a drying plate 810, the lifting conveyer belt 800 is driven by a lifting motor 801, and the movable part of the dumping motor 9 is connected with the lifting platform 8; the semiconductor wafers stacked on the blocking side of the material blocking roller 400 climb onto a drying plate 810 through a lifting conveyer belt 800, and the drying device 3 dries the semiconductor wafers on the lifting conveyer belt 800 and the drying plate 810; the dumping motor 9 is adapted to drive the lifting platform 8 to turn over so that the semiconductor wafer dried on the lifting conveyer 800 and the drying plate 810 is dumped into the lower portion of the rotating disk 200.
In this embodiment, the semiconductor wafer blocking side accumulation of the material blocking roller 400 is driven by the lifting conveyer belt 800 to climb onto the drying plate 810, on one hand, the semiconductor wafer can be prevented from being blocked by the material blocking roller 400, on the other hand, the semiconductor wafer can be closer to the drying device 3, the drying effect is improved, meanwhile, when the semiconductor wafer is excessively accumulated on the drying plate 810, the lifting platform 8 is driven to overturn by the dumping motor 9, so that the semiconductor wafer dried on the lifting conveyer belt 800 and the drying plate 810 is poured into the lower portion of the rotating disc 200, and the dried semiconductor wafer can be embedded into the corresponding embedded groove 201.
In the present embodiment, the conveying device 5 includes: the conveying guide rail 500, the first material baffle 510, the first cylinder 520, the second material baffle 530 and the second cylinder 540 are obliquely arranged; the conveying guide rail 500 is adapted to receive the semiconductor wafer dropped from the feeding disc device 2 and convey the semiconductor wafer along the conveying direction of the conveying guide rail 500; the first striker plate 510 and the second striker plate 530 are sequentially arranged on the conveying guide rail 500, and the first striker plate 510 and the second striker plate 530 are located in the conveying direction of the conveying guide rail 500; the first material baffle 510 and the second material baffle 530 are respectively connected with the movable part of the first air cylinder 520 and the movable part of the second air cylinder 540, that is, the first air cylinder 520 drives the first material baffle 510 to open, so that the semiconductor wafer is conveyed to the second material baffle 530, and the second air cylinder 540 drives the second material baffle 530 to open, so that the semiconductor wafer is conveyed to the packaging system.
In this embodiment, because the conveying guide rail 500 is arranged obliquely, the semiconductor wafer slides along the conveying guide rail 500 under the action of gravity to be conveyed to subsequent equipment, and is blocked by the first striker plate 510 and the second striker plate 530, so that batch conveying can be realized, and the semiconductor wafer can be timely blocked at the corresponding striker plate when the semiconductor wafer is abnormal.
Example 2
The present invention provides, on the basis of embodiment 1, a method of operating a drying system for semiconductor wafers according to embodiment 1, including: the feeding plate 1, the feeding disc device 2, the drying device 3, the material blocking device 4 and the conveying device 5 are obliquely arranged; semiconductor wafers are put into a feeding disc device 2 through a feeding plate 1, so that the corresponding semiconductor wafers are embedded into the rotating feeding disc device 2; drying the semiconductor wafers on the feeding plate 1 and the feeding disc device 2 through a drying device 3; the embedded semiconductor wafer is driven to rotate to a corresponding position through the feeding disc device 2 so as to fall onto the conveying device 5; the semiconductor wafer exposed on the upper disc surface is prevented from rotating along with the feeding disc device 2 by the material blocking device 4, and the semiconductor wafer exposed on the upper disc surface is embedded into the rotating feeding disc device 2; and the dropped dried semiconductor wafer is adapted to be conveyed to a packaging system by a conveying device 5.
In this embodiment, the feed disc device 2 includes: a rotating disc 200 and a fixed disc 210 which are arranged from top to bottom and are arranged on the frame 6; the lower part of the feeding plate 1 is provided with a feeding hole 100, and the feeding hole 100 is positioned above the lower part of the rotating disc 200; a plurality of embedding grooves 201 are distributed on the rotating disc 200 for embedding the semiconductor wafer; the upper portion of fixed disc 210 is provided with at least one and embedded groove 201 assorted blanking groove 211, promptly the semiconductor wafer embedding that feed inlet 100 was put in rotates the corresponding embedded groove 201 on the disc 200 in, works as when the corresponding blanking groove 211 department of fixed disc 210 is rotated to embedded groove 201 that has embedded semiconductor wafer to rotating disc 200 drive, this embedded groove 201 forms the blanking passageway with corresponding blanking groove 211, in order to correspond semiconductor wafer falls into conveyor 5 on.
In this embodiment, the edge of the feeding plate 1 and the circumference of the rotating disc 200 are provided with corresponding baffles 7 to prevent the corresponding semiconductor wafer from falling out; the rotary disk 200 is driven by a disk motor fixed to the frame 6.
In the present embodiment, the drying device 3 includes: a drying heating assembly 300 and a drying fan 310 located above the feeding disk device 2; the drying and heating assembly 300 is adapted to heat the ambient air, and the drying blower 310 is adapted to blow the heated air toward the feeding plate 1, the feeding disk device 2, and the conveying device 5 to form a drying air flow to dry the corresponding semiconductor wafer.
In this embodiment, the material blocking device 4 includes: a material blocking roller 400 and a material blocking motor 410; the material blocking rollers 400 and the feed inlet 100 are respectively positioned at two sides of the lower part of the rotating disc 200, and the material blocking rollers 400 are attached to the disc surface of the rotating disc 200; the material blocking motor 410 is installed on the frame 6, the movable part of the material blocking motor 410 is connected with the material blocking roller 400, namely, the material blocking motor 410 is suitable for driving the material blocking roller 400 to rotate, so that the material blocking roller 400 blocks the semiconductor wafer exposed on the disc surface of the rotating disc 200 to rotate along with the rotating disc 200, and the semiconductor wafer exposed on the disc surface of the rotating disc 200 is embedded into the corresponding embedded groove 201.
In this embodiment, when the feed inlet 100 is located on the left side of the lower portion of the rotating disc 200 and the stop roller 400 is located on the right side of the lower portion of the rotating disc 200, the rotating disc 200 rotates counterclockwise, and the stop motor 410 drives the stop roller 400 to rotate clockwise; when the material blocking roller 400 is positioned at the left side of the lower part of the rotating disc 200 and the feed inlet 100 is positioned at the right side of the lower part of the rotating disc 200, the rotating disc 200 rotates clockwise, and the material blocking motor 410 drives the material blocking roller 400 to rotate anticlockwise.
In this embodiment, the feeding plate 1 is connected with a vibrating plate 110, the vibrating plate 110 is disposed close to the stop roller 400, that is, when the stop motor 410 is adapted to drive the stop roller 400 to rotate, the vibrating plate 110 is adapted to vibrate the semiconductor wafer on the feeding plate 1, so that the semiconductor wafer falls from the feeding hole 100 onto the rotating disk 200.
In this embodiment, the blocking side of the material blocking roller 400 is provided with a lifting platform 8, a lifting motor 801 and a dumping motor 9; the lifting platform 8 is provided with a lifting conveyer belt 800 and a drying plate 810, the lifting conveyer belt 800 is driven by a lifting motor 801, and the movable part of the dumping motor 9 is connected with the lifting platform 8; the semiconductor wafers stacked on the blocking side of the material blocking roller 400 climb onto a drying plate 810 through a lifting conveyer belt 800, and the drying device 3 dries the semiconductor wafers on the lifting conveyer belt 800 and the drying plate 810; the dumping motor 9 is adapted to drive the lifting platform 8 to turn over so that the semiconductor wafer dried on the lifting conveyer 800 and the drying plate 810 is dumped into the lower portion of the rotating disk 200.
In the present embodiment, the conveying device 5 includes: the conveying guide rail 500, the first material baffle 510, the first cylinder 520, the second material baffle 530 and the second cylinder 540 are obliquely arranged; the conveying guide rail 500 is adapted to receive the semiconductor wafer dropped from the feeding disc device 2 and convey the semiconductor wafer along the conveying direction of the conveying guide rail 500; the first striker plate 510 and the second striker plate 530 are sequentially arranged on the conveying guide rail 500, and the first striker plate 510 and the second striker plate 530 are located in the conveying direction of the conveying guide rail 500; the first material baffle 510 and the second material baffle 530 are respectively connected with the movable part of the first air cylinder 520 and the movable part of the second air cylinder 540, that is, the first air cylinder 520 drives the first material baffle 510 to open, so that the semiconductor wafer is conveyed to the second material baffle 530, and the second air cylinder 540 drives the second material baffle 530 to open, so that the semiconductor wafer is conveyed to the packaging system.
In conclusion, the semiconductor wafer is dispersed by arranging the feeding plate and the feeding disc device, and is dried by the drying device, so that the drying effect is good, the structure is simple, the manufacturing cost is low, meanwhile, the material blocking device blocks the semiconductor wafer exposed on the upper disc surface from rotating along with the feeding disc device, the dust can be brushed on the semiconductor wafer, meanwhile, the semiconductor wafer can be continuously turned over for drying the whole body, the drying effect is further improved, and finally, the fallen and dried semiconductor wafer is conveyed to subsequent equipment by the conveying device, and the drying, polishing and conveying integration is realized.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (10)

1. A drying system for a semiconductor wafer, comprising:
the feeding plate, the feeding disc device, the drying device, the material blocking device and the conveying device are obliquely arranged; wherein
The feeding plate and the drying device are positioned above the feeding disc device, the material blocking device is arranged close to the upper disc surface of the feeding disc device, and the conveying device is positioned below the feeding disc device;
the feeding plate is suitable for throwing the semiconductor wafers into the feeding disc device so that the corresponding semiconductor wafers are embedded into the rotating feeding disc device;
the drying device is suitable for drying the semiconductor wafers on the feeding plate and the feeding disc device;
the feeding disc device is suitable for driving the embedded semiconductor wafer to rotate to a corresponding position so as to fall onto the conveying device;
the material blocking device is suitable for blocking the semiconductor wafer exposed on the upper disc surface from rotating along with the feeding disc device and embedding the semiconductor wafer exposed on the upper disc surface into the rotating feeding disc device; and
the conveying device is suitable for conveying the fallen and dried semiconductor wafer to a packaging system.
2. A drying system for a semiconductor wafer as defined in claim 1,
the feeding disc device comprises: a rotating disc and a fixed disc which are arranged from top to bottom and are arranged on the frame;
the lower part of the feeding plate is provided with a feeding hole, and the feeding hole is positioned above the lower part of the rotating disc;
a plurality of embedding grooves are distributed on the rotating disc and used for embedding the semiconductor wafer;
the upper part of the fixed disc is provided with at least one charging chute matched with the embedded groove, namely
The semiconductor wafer that the feed inlet was put in imbeds in the corresponding embedded groove on the carousel, works as when the carousel drives the embedded groove that has inlayed semiconductor wafer and rotates the corresponding charging chute department to fixed disc, should imbed the groove and form the blanking passageway with corresponding charging chute, in order to correspond semiconductor wafer falls into conveyor.
3. A drying system for a semiconductor wafer as defined in claim 2,
corresponding baffles are arranged on the edge of the feeding plate and the circumference of the rotating disc to prevent the corresponding semiconductor wafer from falling out;
the rotating disc is driven by a disc motor fixed on the frame.
4. A drying system for a semiconductor wafer as defined in claim 1,
the drying device includes: the drying heating assembly and the drying fan are positioned above the feeding disc device;
the drying and heating assembly is suitable for heating ambient air, and the drying fan is suitable for blowing the heated air to the feeding plate, the feeding disc device and the conveying device so as to form drying air flow to dry the corresponding semiconductor wafer.
5. A drying system for a semiconductor wafer as defined in claim 2,
the stock stop includes: the material blocking roller and the material blocking motor are arranged on the material blocking roller;
the material blocking rollers and the material inlet are respectively positioned on two sides of the lower part of the rotating disc, and the material blocking rollers are attached to the disc surface of the rotating disc;
the material blocking motor is arranged on the frame, and the movable part of the material blocking motor is connected with the material blocking roller, namely
The material blocking motor is suitable for driving the material blocking roller to rotate so that the material blocking roller blocks the semiconductor wafer exposed on the disc surface of the rotating disc to rotate along with the rotating disc and enables the semiconductor wafer exposed on the disc surface of the rotating disc to be embedded into the corresponding embedded groove.
6. A drying system for a semiconductor wafer as defined in claim 5,
when the feed inlet is positioned on the left side of the lower part of the rotating disc and the material blocking roller is positioned on the right side of the lower part of the rotating disc, the rotating disc rotates anticlockwise, and the material blocking motor drives the material blocking roller to rotate clockwise;
when the material blocking roller is located on the left side of the lower portion of the rotating disc and the feed inlet is located on the right side of the lower portion of the rotating disc, the rotating disc rotates clockwise, and the material blocking motor drives the material blocking roller to rotate anticlockwise.
7. A drying system for a semiconductor wafer as defined in claim 5,
the feeding plate is connected with a vibrating plate which is arranged close to the material blocking roller, namely
When the material blocking motor is suitable for driving the material blocking roller to rotate, the vibrating plate is suitable for vibrating the semiconductor wafer on the feeding plate, so that the semiconductor wafer falls onto the rotating disc from the feeding hole.
8. A drying system for a semiconductor wafer as defined in claim 5,
a lifting platform, a lifting motor and a dumping motor are arranged on the blocking side of the blocking roller;
the lifting platform is provided with a lifting conveyer belt and a drying plate, the lifting conveyer belt is driven by a lifting motor, and the movable part of the dumping motor is connected with the lifting platform;
the semiconductor wafers stacked on the blocking side of the material blocking roller climb onto the drying plate through the lifting conveyer belt, and the drying device dries the semiconductor wafers on the lifting conveyer belt and the drying plate;
the dumping motor is suitable for driving the lifting platform to overturn, so that the semiconductor wafer dried on the lifting conveyer belt and the drying plate is dumped into the lower part of the rotating disc.
9. A drying system for a semiconductor wafer as defined in claim 1,
the conveying device comprises: the conveying guide rail, the first material baffle, the first cylinder, the second material baffle and the second cylinder are obliquely arranged;
the conveying guide rail is suitable for receiving the semiconductor wafer falling from the feeding disc device and conveying the semiconductor wafer along the conveying direction of the conveying guide rail;
the first material baffle plate and the second material baffle plate are sequentially arranged on the conveying guide rail and are positioned in the conveying direction of the conveying guide rail;
the first striker plate and the second striker plate are respectively connected with the movable part of the first cylinder and the movable part of the second cylinder, namely
The first air cylinder drives the first material baffle to be opened so that the semiconductor wafer is conveyed to the second material baffle, and the second air cylinder drives the second material baffle to be opened so that the semiconductor wafer is conveyed to the packaging system.
10. A method of operating a drying system for semiconductor wafers as claimed in any one of claims 1 to 9, comprising:
the feeding plate, the feeding disc device, the drying device, the material blocking device and the conveying device are obliquely arranged;
putting the semiconductor wafer into a feeding disc device through a feeding plate so as to enable the corresponding semiconductor wafer to be embedded into the rotating feeding disc device;
drying the semiconductor wafers on the feeding plate and the feeding disc device through a drying device;
the embedded semiconductor wafer is driven to rotate to a corresponding position through the feeding disc device so as to fall onto the conveying device;
the semiconductor wafer exposed on the upper disc surface is prevented by the material blocking device from rotating along with the feeding disc device, and the semiconductor wafer exposed on the upper disc surface is embedded into the rotating feeding disc device; and
the dropped dried semiconductor wafer is adapted to be transported to a packaging system by a transport device.
CN202111118361.2A 2021-09-24 2021-09-24 Drying system for semiconductor wafer and working method thereof Pending CN113566537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111118361.2A CN113566537A (en) 2021-09-24 2021-09-24 Drying system for semiconductor wafer and working method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111118361.2A CN113566537A (en) 2021-09-24 2021-09-24 Drying system for semiconductor wafer and working method thereof

Publications (1)

Publication Number Publication Date
CN113566537A true CN113566537A (en) 2021-10-29

Family

ID=78174232

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111118361.2A Pending CN113566537A (en) 2021-09-24 2021-09-24 Drying system for semiconductor wafer and working method thereof

Country Status (1)

Country Link
CN (1) CN113566537A (en)

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