CN117322140A - 陶瓷布线构件 - Google Patents

陶瓷布线构件 Download PDF

Info

Publication number
CN117322140A
CN117322140A CN202380011605.8A CN202380011605A CN117322140A CN 117322140 A CN117322140 A CN 117322140A CN 202380011605 A CN202380011605 A CN 202380011605A CN 117322140 A CN117322140 A CN 117322140A
Authority
CN
China
Prior art keywords
pair
internal
terminals
terminal
wiring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380011605.8A
Other languages
English (en)
Chinese (zh)
Inventor
西岛英孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of CN117322140A publication Critical patent/CN117322140A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
CN202380011605.8A 2022-04-28 2023-04-27 陶瓷布线构件 Pending CN117322140A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/019340 2022-04-28
JP2022019340 2022-04-28
PCT/JP2023/016613 WO2023210735A1 (ja) 2022-04-28 2023-04-27 セラミック配線部材

Publications (1)

Publication Number Publication Date
CN117322140A true CN117322140A (zh) 2023-12-29

Family

ID=88518797

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380011605.8A Pending CN117322140A (zh) 2022-04-28 2023-04-27 陶瓷布线构件

Country Status (4)

Country Link
JP (1) JP7557107B2 (enExample)
CN (1) CN117322140A (enExample)
TW (1) TWI852518B (enExample)
WO (1) WO2023210735A1 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766009A (ja) * 1993-08-30 1995-03-10 Mitsubishi Materials Corp サーミスタ素子及びその製造方法
JP2010035078A (ja) * 2008-07-31 2010-02-12 Kyocera Kinseki Corp 圧電発振器
JP2010073847A (ja) * 2008-09-18 2010-04-02 Sony Corp Ｐｔｃサーミスタ素子及びその製造方法、並びに２次電池セル及びその製造方法
JP5900582B1 (ja) * 2014-11-21 2016-04-06 株式会社大真空 圧電振動デバイス
CN105977373B (zh) * 2015-03-11 2020-06-05 株式会社大真空 压电器件

Also Published As

Publication number Publication date
WO2023210735A1 (ja) 2023-11-02
TW202408325A (zh) 2024-02-16
TWI852518B (zh) 2024-08-11
JP7557107B2 (ja) 2024-09-26
JPWO2023210735A1 (enExample) 2023-11-02

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