JP7557107B2 - セラミック配線部材 - Google Patents

セラミック配線部材 Download PDF

Info

Publication number
JP7557107B2
JP7557107B2 JP2024518021A JP2024518021A JP7557107B2 JP 7557107 B2 JP7557107 B2 JP 7557107B2 JP 2024518021 A JP2024518021 A JP 2024518021A JP 2024518021 A JP2024518021 A JP 2024518021A JP 7557107 B2 JP7557107 B2 JP 7557107B2
Authority
JP
Japan
Prior art keywords
pair
internal
terminals
terminal
wiring member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024518021A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023210735A5 (enExample
JPWO2023210735A1 (enExample
Inventor
英孝 西島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of JPWO2023210735A1 publication Critical patent/JPWO2023210735A1/ja
Publication of JPWO2023210735A5 publication Critical patent/JPWO2023210735A5/ja
Application granted granted Critical
Publication of JP7557107B2 publication Critical patent/JP7557107B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2024518021A 2022-04-28 2023-04-27 セラミック配線部材 Active JP7557107B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/019340 2022-04-28
JP2022019340 2022-04-28
PCT/JP2023/016613 WO2023210735A1 (ja) 2022-04-28 2023-04-27 セラミック配線部材

Publications (3)

Publication Number Publication Date
JPWO2023210735A1 JPWO2023210735A1 (enExample) 2023-11-02
JPWO2023210735A5 JPWO2023210735A5 (enExample) 2024-05-22
JP7557107B2 true JP7557107B2 (ja) 2024-09-26

Family

ID=88518797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024518021A Active JP7557107B2 (ja) 2022-04-28 2023-04-27 セラミック配線部材

Country Status (4)

Country Link
JP (1) JP7557107B2 (enExample)
CN (1) CN117322140A (enExample)
TW (1) TWI852518B (enExample)
WO (1) WO2023210735A1 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010035078A (ja) 2008-07-31 2010-02-12 Kyocera Kinseki Corp 圧電発振器
JP2010073847A (ja) 2008-09-18 2010-04-02 Sony Corp Ptcサーミスタ素子及びその製造方法、並びに2次電池セル及びその製造方法
WO2016080075A1 (ja) 2014-11-21 2016-05-26 株式会社大真空 圧電振動デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766009A (ja) * 1993-08-30 1995-03-10 Mitsubishi Materials Corp サーミスタ素子及びその製造方法
CN105977373B (zh) * 2015-03-11 2020-06-05 株式会社大真空 压电器件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010035078A (ja) 2008-07-31 2010-02-12 Kyocera Kinseki Corp 圧電発振器
JP2010073847A (ja) 2008-09-18 2010-04-02 Sony Corp Ptcサーミスタ素子及びその製造方法、並びに2次電池セル及びその製造方法
WO2016080075A1 (ja) 2014-11-21 2016-05-26 株式会社大真空 圧電振動デバイス

Also Published As

Publication number Publication date
TW202408325A (zh) 2024-02-16
WO2023210735A1 (ja) 2023-11-02
JPWO2023210735A1 (enExample) 2023-11-02
CN117322140A (zh) 2023-12-29
TWI852518B (zh) 2024-08-11

Similar Documents

Publication Publication Date Title
TWI466437B (zh) Piezoelectric vibrator
JP4636018B2 (ja) 圧電振動素子用パッケージ及び圧電振動子
JP5900582B1 (ja) 圧電振動デバイス
JP2008182767A (ja) 水晶発振器
US20070176518A1 (en) Surface mount type crystal device
TWI822418B (zh) 搭載熱敏電阻的壓電振動裝置
JP7557107B2 (ja) セラミック配線部材
CN102148611A (zh) 压电振动器及使用该压电振动器的振荡器
JP4439291B2 (ja) 圧電振動子収納用パッケージおよび圧電装置
EP1309031B1 (en) Nonreciprocal circuit device and communication apparatus
JP2005020546A (ja) 表面実装型水晶発振器
JP7703972B2 (ja) 温度センサ付き水晶振動デバイス
JP5252992B2 (ja) 水晶発振器用パッケージおよび水晶発振器
JP6573515B2 (ja) セラミック基板
CN112956015B (zh) 电子部件收纳用封装件以及电子装置
JP2013110214A (ja) 電子部品収納用パッケージ
JP7615294B2 (ja) セラミック配線部材
JP6813682B2 (ja) 電子部品収納用パッケージ、電子装置および電子モジュール
JP4688673B2 (ja) 電子部品搭載用絶縁基体および電子装置
CN217363407U (zh) 混合集成放大电路及包括其的加速度计
JP2010129564A (ja) 電子部品パッケージ、及び圧電振動子
JP2011223425A (ja) 電子部品素子収納用パッケージ
JP2004297209A (ja) 表面実装型圧電発振器
JP2005244146A (ja) 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造
JP4582889B2 (ja) 圧力検出装置用パッケージ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231130

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240912

R150 Certificate of patent or registration of utility model

Ref document number: 7557107

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150