CN117279733A - 无铅焊膏 - Google Patents

无铅焊膏 Download PDF

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Publication number
CN117279733A
CN117279733A CN202180097873.7A CN202180097873A CN117279733A CN 117279733 A CN117279733 A CN 117279733A CN 202180097873 A CN202180097873 A CN 202180097873A CN 117279733 A CN117279733 A CN 117279733A
Authority
CN
China
Prior art keywords
mass
solder
lead
flux
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180097873.7A
Other languages
English (en)
Chinese (zh)
Inventor
西村哲郎
中村贤次
增田纯也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Original Assignee
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd filed Critical Nihon Superior Sha Co Ltd
Publication of CN117279733A publication Critical patent/CN117279733A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202180097873.7A 2021-05-06 2021-12-28 无铅焊膏 Pending CN117279733A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-078842 2021-05-06
JP2021078842 2021-05-06
PCT/JP2021/048954 WO2022234690A1 (ja) 2021-05-06 2021-12-28 鉛フリーソルダペースト

Publications (1)

Publication Number Publication Date
CN117279733A true CN117279733A (zh) 2023-12-22

Family

ID=83932082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180097873.7A Pending CN117279733A (zh) 2021-05-06 2021-12-28 无铅焊膏

Country Status (5)

Country Link
US (1) US20240238915A1 (https=)
EP (1) EP4335941A4 (https=)
JP (1) JPWO2022234690A1 (https=)
CN (1) CN117279733A (https=)
WO (1) WO2022234690A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121315519A (zh) * 2024-07-11 2026-01-13 千住金属工业株式会社 助焊剂及接合体

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119501370B (zh) * 2025-01-07 2025-12-26 云南锡业新材料有限公司 一种零卤低空洞SnBi系助焊膏及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1671506A (zh) * 2002-05-30 2005-09-21 弗莱氏金属公司 纤焊膏焊剂体系
CN104858571A (zh) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 一种锡铋系无铅锡膏用无卤素助焊剂及其制备方法
CN110303273A (zh) * 2019-06-26 2019-10-08 浙江强力控股有限公司 用于散热模组的无卤低温环保焊锡膏及其制备方法
US20200047291A1 (en) * 2018-08-10 2020-02-13 Senju Metal Industry Co., Ltd. Flux and Solder Paste
JP6751248B1 (ja) * 2019-09-24 2020-09-02 千住金属工業株式会社 フラックスおよびソルダペースト
TW202106887A (zh) * 2019-05-27 2021-02-16 日商千住金屬工業股份有限公司 焊料合金、焊膏、焊球、焊料預形體、焊料接頭及基板
CN112513300A (zh) * 2019-04-11 2021-03-16 日本斯倍利亚社股份有限公司 无铅焊料合金和焊料接合部

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Publication number Priority date Publication date Assignee Title
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
CN101695794B (zh) * 2009-10-23 2011-09-07 东莞市特尔佳电子有限公司 一种无卤锡铋铜焊锡膏及其制备方法
CN102581523B (zh) * 2012-03-21 2015-06-17 北京鹏瑞中联科技有限公司 无卤助焊膏
JP6444953B2 (ja) * 2015-09-30 2018-12-26 株式会社タムラ製作所 フラックス組成物およびソルダペースト
CN109661726A (zh) * 2017-01-20 2019-04-19 联想（新加坡）私人有限公司 钎焊接合方法和钎焊接头
JP6458894B1 (ja) * 2018-04-26 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
CN112638574A (zh) * 2018-08-31 2021-04-09 铟泰公司 SnBi和SnIn焊锡合金
JP2022502265A (ja) * 2018-10-24 2022-01-11 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. ポリマー基板、プリント回路板及び他の接合用途のための低温はんだ付け溶液
JP7089491B2 (ja) 2019-04-23 2022-06-22 株式会社タムラ製作所 フラックス組成物、ソルダペースト及び電子回路基板
CN111590241A (zh) * 2020-06-11 2020-08-28 中山翰华锡业有限公司 低温环保多元合金焊锡膏及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1671506A (zh) * 2002-05-30 2005-09-21 弗莱氏金属公司 纤焊膏焊剂体系
CN104858571A (zh) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 一种锡铋系无铅锡膏用无卤素助焊剂及其制备方法
US20200047291A1 (en) * 2018-08-10 2020-02-13 Senju Metal Industry Co., Ltd. Flux and Solder Paste
CN112513300A (zh) * 2019-04-11 2021-03-16 日本斯倍利亚社股份有限公司 无铅焊料合金和焊料接合部
TW202106887A (zh) * 2019-05-27 2021-02-16 日商千住金屬工業股份有限公司 焊料合金、焊膏、焊球、焊料預形體、焊料接頭及基板
CN110303273A (zh) * 2019-06-26 2019-10-08 浙江强力控股有限公司 用于散热模组的无卤低温环保焊锡膏及其制备方法
JP6751248B1 (ja) * 2019-09-24 2020-09-02 千住金属工業株式会社 フラックスおよびソルダペースト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121315519A (zh) * 2024-07-11 2026-01-13 千住金属工业株式会社 助焊剂及接合体

Also Published As

Publication number Publication date
WO2022234690A1 (ja) 2022-11-10
EP4335941A4 (en) 2024-10-30
US20240238915A1 (en) 2024-07-18
JPWO2022234690A1 (https=) 2022-11-10
EP4335941A1 (en) 2024-03-13

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