JPWO2022234690A1 - - Google Patents

Info

Publication number
JPWO2022234690A1
JPWO2022234690A1 JP2023518615A JP2023518615A JPWO2022234690A1 JP WO2022234690 A1 JPWO2022234690 A1 JP WO2022234690A1 JP 2023518615 A JP2023518615 A JP 2023518615A JP 2023518615 A JP2023518615 A JP 2023518615A JP WO2022234690 A1 JPWO2022234690 A1 JP WO2022234690A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023518615A
Other languages
Japanese (ja)
Other versions
JPWO2022234690A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022234690A1 publication Critical patent/JPWO2022234690A1/ja
Publication of JPWO2022234690A5 publication Critical patent/JPWO2022234690A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023518615A 2021-05-06 2021-12-28 Pending JPWO2022234690A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021078842 2021-05-06
PCT/JP2021/048954 WO2022234690A1 (ja) 2021-05-06 2021-12-28 鉛フリーソルダペースト

Publications (2)

Publication Number Publication Date
JPWO2022234690A1 true JPWO2022234690A1 (https=) 2022-11-10
JPWO2022234690A5 JPWO2022234690A5 (https=) 2024-02-09

Family

ID=83932082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023518615A Pending JPWO2022234690A1 (https=) 2021-05-06 2021-12-28

Country Status (5)

Country Link
US (1) US20240238915A1 (https=)
EP (1) EP4335941A4 (https=)
JP (1) JPWO2022234690A1 (https=)
CN (1) CN117279733A (https=)
WO (1) WO2022234690A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7620254B1 (ja) * 2024-07-11 2025-01-23 千住金属工業株式会社 フラックス及び接合体の製造方法
CN119501370B (zh) * 2025-01-07 2025-12-26 云南锡业新材料有限公司 一种零卤低空洞SnBi系助焊膏及其制备方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005528224A (ja) * 2002-05-30 2005-09-22 フライズ メタルズ インコーポレイテッド はんだ付け用ペースト及び融剤
CN101695794A (zh) * 2009-10-23 2010-04-21 东莞市特尔佳电子有限公司 一种无卤锡铋铜焊锡膏及其制备方法
CN102581523A (zh) * 2012-03-21 2012-07-18 瑞玛泰（北京）科技有限公司 无卤助焊膏及其制备方法
CN104858571A (zh) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 一种锡铋系无铅锡膏用无卤素助焊剂及其制备方法
JP2017064783A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 フラックス組成物およびソルダペースト
WO2018134673A1 (ja) * 2017-01-20 2018-07-26 レノボ・シンガポール・プライベート・リミテッド はんだ接合方法、およびはんだ継手
CN110303273A (zh) * 2019-06-26 2019-10-08 浙江强力控股有限公司 用于散热模组的无卤低温环保焊锡膏及其制备方法
JP2020025974A (ja) * 2018-08-10 2020-02-20 千住金属工業株式会社 フラックス及びはんだペースト
WO2020083529A1 (en) * 2018-10-24 2020-04-30 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications
CN111590241A (zh) * 2020-06-11 2020-08-28 中山翰华锡业有限公司 低温环保多元合金焊锡膏及其制备方法
WO2020209384A1 (ja) * 2019-04-11 2020-10-15 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
JP2021049534A (ja) * 2019-09-24 2021-04-01 千住金属工業株式会社 フラックスおよびソルダペースト

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
JP6458894B1 (ja) * 2018-04-26 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
CN112638574A (zh) * 2018-08-31 2021-04-09 铟泰公司 SnBi和SnIn焊锡合金
JP7089491B2 (ja) 2019-04-23 2022-06-22 株式会社タムラ製作所 フラックス組成物、ソルダペースト及び電子回路基板
KR102371432B1 (ko) * 2019-05-27 2022-03-07 센주긴조쿠고교 가부시키가이샤 납땜 합금, 솔더 페이스트, 납땜 볼, 솔더 프리폼, 납땜 조인트, 및 기판

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005528224A (ja) * 2002-05-30 2005-09-22 フライズ メタルズ インコーポレイテッド はんだ付け用ペースト及び融剤
CN101695794A (zh) * 2009-10-23 2010-04-21 东莞市特尔佳电子有限公司 一种无卤锡铋铜焊锡膏及其制备方法
CN102581523A (zh) * 2012-03-21 2012-07-18 瑞玛泰（北京）科技有限公司 无卤助焊膏及其制备方法
CN104858571A (zh) * 2015-06-10 2015-08-26 深圳市同方电子新材料有限公司 一种锡铋系无铅锡膏用无卤素助焊剂及其制备方法
JP2017064783A (ja) * 2015-09-30 2017-04-06 株式会社タムラ製作所 フラックス組成物およびソルダペースト
WO2018134673A1 (ja) * 2017-01-20 2018-07-26 レノボ・シンガポール・プライベート・リミテッド はんだ接合方法、およびはんだ継手
JP2020025974A (ja) * 2018-08-10 2020-02-20 千住金属工業株式会社 フラックス及びはんだペースト
WO2020083529A1 (en) * 2018-10-24 2020-04-30 Alpha Assembly Solutions Inc. Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications
WO2020209384A1 (ja) * 2019-04-11 2020-10-15 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
CN110303273A (zh) * 2019-06-26 2019-10-08 浙江强力控股有限公司 用于散热模组的无卤低温环保焊锡膏及其制备方法
JP2021049534A (ja) * 2019-09-24 2021-04-01 千住金属工業株式会社 フラックスおよびソルダペースト
CN111590241A (zh) * 2020-06-11 2020-08-28 中山翰华锡业有限公司 低温环保多元合金焊锡膏及其制备方法

Also Published As

Publication number Publication date
WO2022234690A1 (ja) 2022-11-10
EP4335941A4 (en) 2024-10-30
US20240238915A1 (en) 2024-07-18
CN117279733A (zh) 2023-12-22
EP4335941A1 (en) 2024-03-13

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