CN117110318A - Visual stable scanning imaging device for batch detection of packaged chips - Google Patents
Visual stable scanning imaging device for batch detection of packaged chips Download PDFInfo
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract
The invention discloses a visual stable scanning imaging device for batch detection of packaged chips, which comprises a base and a movable support mechanism arranged on the base, wherein an industrial camera is arranged on the movable support mechanism, a chip detection movable support is also arranged on the base, the chip detection movable support is provided with a chip suction mechanism, the chip suction mechanism comprises a cylinder frame, the cylinder frame is rotatably connected with the chip detection movable support, at least one group of sucker frames are arranged on the cylinder frame, the sucker frames are of hollow structures, a plurality of air nozzles are arranged on the sucker frames, suckers are arranged on the air nozzles, and an air pump interface is also arranged on the sucker frames and connected with an air source. The chip suction mechanism can rotate and is matched with the industrial camera multi-degree-of-freedom movable support device, so that the linear array scanning camera and the detected chip can form a required view angle which meets imaging, the imaging accuracy is ensured, and the detection efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of packaged chip defect detection, and relates to a visual stable scanning imaging device for packaged chip batch detection.
Background
Along with the rapid development of intelligent manufacturing technology, the realization of accurate defect detection of a packaged chip based on a visual imaging technology has become a hot spot for domestic and foreign research. In the packaging manufacture of conventional chips at home, a rapid and stable chip scanning device is a key for ensuring the efficiency of the chip scanning device, so that the visual stable scanning imaging device for batch detection of packaged chips has important practical application value.
The defect detection method is generally based on that the algorithm complexity and the calculation efficiency reach a good development level, however, the acquisition of the target image is a source and a guarantee. At present, chip scanning imaging is carried out in a manual operation mode, so that the chip scanning imaging is easily influenced by human factors, and the characteristic registration and the detection result are not accurate and consistent. In addition, the manual operation inevitably has problems of subjectivity, fatigue, etc., and increases the production cost and the complexity of human management.
Conventional automated equipment has limitations in packaged chip inspection. These devices typically detect only significant defects on the surface, while imaging and detection are difficult for small packaging defects or internal failures. Such limitations can lead to defective products not being found in time, with unnecessary cost loss and quality problems. Secondly, for the detection device of the traditional packaged chips, only one packaged chip or a small number of packaged chips can be detected at a time, the whole efficiency in the scanning process is low, and for the traditional detection equipment, a simple automatic device is adopted, so that the efficiency is low.
Disclosure of Invention
The invention aims to provide a visual stable scanning imaging device for batch detection of packaged chips, and designs a cylinder packaged chip batch detection suction device which can suck a plurality of chips at a time, and can realize that a cylinder rotates in a certain angle by internally arranging a servo driving motor in a system device, and the device is matched with an industrial camera multi-degree-of-freedom mobile bracket device, so that a linear array scanning camera and the detected packaged chips can form a view angle meeting the imaging requirement, the imaging accuracy is ensured, the quality of imaging pictures is ensured, the processing of subsequent images is facilitated, and the detection efficiency is greatly improved.
The technical solution for realizing the purpose of the invention is as follows:
the utility model provides a visual stabilization scanning image device towards encapsulation chip detects in batches, includes the base with set up in the movable support mechanism of base, be provided with industrial camera on the movable support mechanism, still be provided with the chip on the base and detect movable support, the chip detects movable support and is provided with chip suction mechanism, chip suction mechanism includes the cylinder frame, cylinder frame swivelling joint in the chip detects movable support, be provided with at least a set of sucking disc frame on the cylinder frame, the inside hollow structure that is of sucking disc frame, be provided with a plurality of air cock on the sucking disc frame, be provided with the sucking disc on the air cock, the sucking disc frame still is provided with the air pump interface, air pump interface connection air supply.
In the preferred technical scheme, the cylinder frame includes the installation pole, the installation pole both ends are provided with the mounting bracket, be provided with the recess on the mounting bracket, the recess is used for installing the sucking disc frame.
In the preferred technical scheme, the groove comprises a spherical groove, spherical movable pairs are arranged at two ends of the sucker frame, and the spherical groove and the spherical movable pairs are matched and movable.
In the preferred technical scheme, the recess still includes L type recess, L type recess with spherical recess intercommunication, L type recess is provided with T type and bolts and move removable valve.
In the preferred technical scheme, the middle part of the inner side of the mounting frame of the cylinder frame is provided with a central fixed driven wheel, the central fixed driven wheel is meshed with a driving wheel for transmission, the driving wheel is driven by a driving motor, one end of the sucker frame is provided with a rotating gear, and the rotating gear is meshed with the central fixed driven wheel for transmission.
In the preferred technical scheme, the movable support mechanism comprises movable supports, sliding rails are arranged between the movable supports, an X-axis pulley block, a Y-axis pulley block and a Z-axis pulley block are arranged on the sliding rails, the X-axis pulley block, the Y-axis pulley block and the Z-axis pulley block are driven by a motor, and an industrial camera is arranged on the Z-axis pulley block.
In the preferred technical scheme, the chip detection movable support comprises a support frame, wherein the support frame is used for installing a cylinder frame, a driving pulley block is arranged on the support frame, and the driving pulley block drives the cylinder frame to rotate.
In the preferred technical scheme, the support frame is installed in vertical movement mechanism, vertical movement mechanism includes guide rail, servo motor and hold-in range, the support frame is installed in the guide rail, moves in vertical direction through servo motor and hold-in range drive support frame.
In the preferred technical scheme, the base still has conveyer belt and chip to place fixed tray, be provided with the chip in the fixed tray of chip and place fixed draw-in groove, be provided with the sensor in the fixed draw-in groove of chip placement.
In the preferred technical scheme, chip placement fixed tray bottom is provided with the ball pair, the peripheral parcel of ball pair has the ball pair rubber tire, the ball pair rubber tire rotates in certain limit, be provided with two parallel tracks on the conveyer belt, the ball pair rubber tire sets up in the track.
Compared with the prior art, the invention has the remarkable advantages that:
the device can realize flexible movement and accurate positioning through the multi-degree-of-freedom moving bracket mechanism of the industrial camera. Compared with the traditional manual operation or simple fixed automatic equipment, the device provided by the invention combines the visual sensor with the industrial camera multi-degree-of-freedom movable bracket device, can freely adjust the position according to the production line requirement, and is suitable for chips with different sizes and positions. The flexibility greatly improves the adaptability and the production efficiency of the production line.
The device adopts the independently designed cylindrical packaged chip batch detection suction mechanism, can suck a plurality of chips once, allows the whole packaged chip suction mechanism to rotate by matching with an external servo-driven motor, and can rapidly and accurately perform linear array scanning imaging on the packaged chips by matching with a linear array scanning camera.
In addition, the device expands the application field of the laser sensor in a chip packaging production line. By combining the visual sensor and the industrial camera multi-degree-of-freedom movable bracket device, the device can intelligently sense the chip scanning effect on the sucker and adjust in real time, thereby improving the automation level and accuracy of the production line.
Drawings
FIG. 1 is a schematic three-dimensional structure of a preferred embodiment;
FIG. 2 is a schematic view of the structure of the test stand base and the conveyor belt according to the preferred embodiment;
FIG. 3 is a schematic view of the industrial camera and the moving frame mechanism according to the preferred embodiment;
FIG. 4 is a schematic diagram of a chip sucking mechanism according to the preferred embodiment;
FIG. 5 is a schematic view of a cylinder frame according to the preferred embodiment;
FIG. 6 is a schematic view of a T-bolt removable valve according to the preferred embodiment;
FIG. 7 is a schematic view of the structure of the chuck holder according to the preferred embodiment;
FIG. 8 is a schematic diagram of a chip test mobile stand according to the preferred embodiment;
FIG. 9 is a schematic diagram of a connection structure of a driving pulley block of a chip detection mobile bracket according to a preferred embodiment;
FIG. 10 is a schematic top view of a chip placement fixture tray according to the preferred embodiment;
fig. 11 is a partial enlarged view of the bottom of the chip placement fixture tray of the preferred embodiment.
Detailed Description
The principle of the invention is as follows: according to the invention, the industrial camera multi-degree-of-freedom movable support device is adopted to move the support mechanism, and the relative linear array scanning camera is matched, so that the linear array scanning camera can be accurately and stably adjusted in the up-down, left-right, front-back directions, clear and accurate detection images can be provided for subsequent image processing, and the detection efficiency of the whole packaged chip is improved from the source. Secondly, the device designs a cylinder chip sucking mechanism which can suck 4 multiplied by 5 chips at a time. Through built-in servo driving motor in the system device, can realize that the cylinder rotates in certain angle, cooperates industry camera multi freedom to remove support mechanism for linear array scanning camera can form the demand visual angle that accords with the formation of image with the encapsulation chip that is detected, guarantees the accuracy of formation of image.
Example 1:
as shown in fig. 1 and 4, the visual stable scanning imaging device for batch detection of packaged chips comprises a base 1 and a movable support mechanism 3 arranged on the base 1, wherein an industrial camera 4 is arranged on the movable support mechanism 3, a chip detection movable support 6 is further arranged on the base 1, a chip suction mechanism 5 is arranged on the chip detection movable support 6, the chip suction mechanism 5 comprises a column frame 5-0, the column frame 5-0 is rotatably connected to the chip detection movable support 6, at least one group of sucker frames 5-7 are arranged on the column frame 5-0, a hollow structure is arranged inside the sucker frames 5-7, a plurality of air nozzles 5-11 are arranged on the sucker frames 5-7, suckers 5-1 are arranged on the air nozzles 5-11, an air pump interface 5-2 is further arranged on the sucker frames 5-7, and the air pump interface 5-2 is connected with an air source.
The cylinder chip suction mechanism can suck 4 multiplied by 5 chips at a time, can realize that the cylinder rotates in a certain angle, and is matched with the multi-degree-of-freedom moving support mechanism of the industrial camera, so that the linear array scanning camera and the detected packaging chip can form a required view angle which meets the imaging, and the imaging accuracy is ensured.
In a preferred embodiment, as shown in fig. 1 and 2, the base 1 is further matched with a conveyor belt 8 and a chip placement fixing tray 7, and the chip placement fixing tray 7 is placed in a clamping groove of the conveyor belt 8 for batch inspection of packaged chips.
The conveyor belt 8 is parallel to the base 1, the conveyor belt 8 and the base 1 are not directly connected, and the conveyor belt is directly conveyed to the device of the invention by an external production line.
As shown in FIG. 2, the base 1 is a test bed base and comprises a rubber pulley 1-1 and an openable clamping plate 1-2. The rubber pulley 1-1 allows the base of the test bed to move flexibly, so that the transportation difficulty is reduced, and the installation cost of the device is reduced; the openable clamping plate 1-2 can be opened, and a part of space is reserved in advance in the test bed base and is used for placing equipment wires, power supplies, air compressors and other matched equipment, so that the space occupation rate of the device is greatly reduced.
Specifically, the test bench base upper portion is provided with triangle fixed plate 2, and triangle fixed plate 2 will remove support mechanism 3 and industry camera 4 and fix in one side of test bench base, and triangle fixed plate 2 will chip suction mechanism 5 and chip detection remove support 6 and fix in the opposite side of test bench base.
As shown in FIG. 3, the industrial camera 4 and the multi-degree-of-freedom movable support mechanism 3 comprise movable supports 3-5, sliding rails 3-2 are arranged between the movable supports 3-5, Y-axis pulley blocks 3-1 are arranged on the sliding rails 3-2, X-axis pulley blocks 3-3 are arranged on the sliding rails 3-2, and the industrial camera 4 is arranged on Z-axis pulley blocks 3-4,Z and 3-4. The industrial camera 4 is an industrial camera employing a line scan method, allowing conventional settings such as exposure time, sensitivity, image size resolution, and ROI setting to be manually adjusted. The X, Y and Z axis pulley blocks are respectively provided with a corresponding slide rail 3-2, are provided with a DC brushless motor driver for driving, adopt a PWM (pulse width modulation) control mode, allow the industrial camera 4 to stably move at any spatial position on the multi-degree-of-freedom movable support mechanism 3, have the advantages of high efficiency, low noise and high response speed, and greatly improve the scanning stability and accuracy of the industrial camera 4.
As shown in fig. 4 and 5, the column frame 5-0 includes a mounting rod 5-01, mounting frames 5-02 are provided at both ends of the mounting rod 5-01, grooves 5-8 are provided on the mounting frames 5-02, and the grooves 5-8 are used for mounting suction cup frames 5-7.
In a preferred embodiment, the groove 5-8 comprises a spherical groove 5-81, two ends of the sucker frame 5-7 are provided with spherical movable pairs 5-9, and the spherical groove 5-81 and the spherical movable pairs 5-9 are matched and movable. The grooves 5-8 further comprise L-shaped grooves 5-82, the L-shaped grooves 5-82 are communicated with the spherical grooves 5-81, and the L-shaped grooves 5-82 are provided with T-shaped bolt-action detachable valves 5-3.
Specifically, as shown in fig. 4, 5, 6 and 7, the chip sucking mechanism 5 comprises a sucking disc 5-1, an air pump interface 5-2, a T-shaped bolt-driven detachable valve 5-3, a direct current brushless motor 5-4, a motor driving wheel 5-5, a center fixed driven wheel 5-6, a sucking disc frame 5-7, a groove 5-8, a spherical movable pair 5-9 and a sucking disc frame rotating driven wheel 5-10. The whole device depends on a cylinder-like frame 5-0, grooves are formed in two ends of the cylinder-like frame 5-0, ball pairs at two ends of a sucker 5-1 are installed in the grooves at two ends of the cylinder, a T-shaped bolt-driven detachable valve 5-3 is installed on the grooves after the ball pairs are installed to fix a sucker frame 5-7, a center fixed driven wheel 5-6 penetrates through the center of the whole chip suction mechanism 5, a direct current brushless motor 5-4 is coaxially fixed with a motor driving wheel 5-5, the motor driving wheel 5-5 can rotate by 360 degrees, the center fixed driven wheel 5-6 is driven to rotate, the direct current brushless motor 5-4 is connected with the center fixed driven wheel 5-6 through a gear pair, the direct current brushless motor 5-4 is used for driving the motor driving wheel 5-5 to rotate to drive the center fixed driven wheel 5-6 to rotate around the center shaft, and then the sucker frame driven wheel 5-10 meshed with the center fixed driven wheel is driven to rotate, namely, the rotating gear is finally enabled to rotate in a certain angle.
The sucking disc 5-1 obtains suitable suction through being connected with the air pump interface 5-2 with air compressor, can smooth absorb the encapsulation chip, adopts this kind of soft and certain elastic material of rubber to the specialty of absorbing the object simultaneously, structurally, has adopted the ripple sucking disc, and this kind of sucking disc shock attenuation effect is better, adopts glue to seal firmly with the air pump mouth junction, and sucking disc 5-1 is soft rubber because the material of front end and encapsulation chip contact's position, can not damage the encapsulation chip easily, loss on the reduction in production that can be fine. The air pump interface 5-2 is connected with a hose of the air compressor to provide suction for the sucker 5-1, so that the sucker has the capability of sucking objects. The T-shaped bolt is used for moving the detachable valve 5-3, and the bolt is used for moving the detachable valve, so that when the sucker frame 5-7 is in fault or damaged, the detachable valve can be quickly detached and replaced, the production efficiency is greatly improved, and meanwhile, the problems of universalization and portability are greatly solved. The brushless DC motor 5-4 can enable the whole chip sucking mechanism 5 to rotate around the central shaft, and in a working state, the sucking disc frame 5-7 can be roughly aligned with the packaged chips in the tray on the conveyor belt. After the sucker frame 5-7 is roughly aligned, the driving wheel is driven by the direct current brushless motor 5-4 to drive the center fixed driven wheel 5-6, so that the sucker frame 5-7 can be accurately positioned, and the packaged chips on the tray on the conveyor belt 8 can be accurately aligned. Two spherical movable pairs 5-9 are arranged at two ends of the sucker frame 5-7, and spherical grooves 5-81 on the chip sucking mechanism 5 are matched with the spherical movable pairs, so that the sucker frame 5-7 can be allowed to rotate around the sucker frame 5-7 by 360 degrees, and the accurate positioning function of the sucker frame 5-7 can be realized.
As shown in fig. 8 and 9, the chip detection moving bracket 6 includes a supporting frame 6-2, the supporting frame 6-2 is used for installing a column frame 5-0, a driving pulley block 6-4 is arranged on the supporting frame 6-2, and the driving pulley block 6-4 drives the column frame 5-0 to rotate.
The support frame 6-2 is mounted on a vertical moving mechanism, the vertical moving mechanism comprises a guide rail 6-5, a servo motor 6-1 and a synchronous belt 6-3, the support frame 6-2 is mounted on the guide rail 6-5, and the support frame 6-2 is driven to move in the vertical direction through the servo motor 6-1 and the synchronous belt 6-3.
Specifically, as shown in fig. 8 and 9, the chip detection moving bracket 6 comprises a servo motor 6-1, a supporting frame 6-2, a synchronous belt 6-3 and a driving pulley block 6-4. The two servo motors 6-1 are matched with the synchronous belt 6-3, so that the chip suction mechanism 5 can stably move in the vertical direction, and the flexibility of the chip suction mechanism 5 is greatly improved. The supporting frame 6-2 is a fixed plate or a supporting frame which adopts a triangular pattern to meet the requirement of structural stability. The driving pulley block 6-4 is used for assisting the chip sucking mechanism 5 to roughly position the tray filled with the packaged chips, the driving pulley block 6-4 is driven by the direct current brushless motor 5-4, the driving pulley block 6-4 is connected by the synchronous belt, the synchronous belt is driven by the driving wheel to move, the driven wheel arranged on one side of the chip sucking mechanism 5 is driven to rotate, the whole chip sucking mechanism 5 is completed to rotate, finally, the whole device can be just above the chip placing fixed tray 7, and the interval of each sucking disc 5-1 is just equal to the interval between each clamping groove of the chip placing fixed tray 7, so that the chip sucking mechanism is assisted to roughly position the tray.
As shown in fig. 10 and 11, the chip placement fixing tray 7 includes a chip placement fixing clip groove 7-1, a laser sensor 7-2, a ball pair 7-3, and a ball pair rubber tire 7-4. The size of the chip placing and fixing clamping groove 7-1 is basically attached to the chip to be detected and packaged, so that the suction cups 5-1 which are orderly arranged on the suction cup frame 5-7 at the later stage can be conveniently and accurately sucked. The laser sensor 7-2 is disposed in the chip placement fixing slot 7-1 and is used for sensing the chip, and of course, the laser sensor can also be other types of sensors, such as an infrared sensor, etc., when the sucking disc 5-1 successfully sucks the packaged chip, and after detecting that the flow is normal, the next step is performed, that is, the industrial camera 4 performs linear array scanning detection on the packaged chip.
The ball pair 7-3 is matched with the ball pair rubber tire 7-4 and is arranged at the bottom of the chip placement fixing tray 7, the inner wall of the ball pair rubber tire 7-4 is wrapped with the ball pair 7-3, and the tire can rotate in the left and right 15-degree ranges on the premise that the tray is kept stable, so that the chip placement fixing tray 7 meets the condition that the conveyor belt 8 turns, and the chip placement fixing tray 7 can smoothly and smoothly turn because of the rotation of a certain angle, the condition that the conveyor belt is blocked due to the change of the direction of the conveyor belt in the transportation process is avoided, and the device can greatly improve the running smoothness and stability of the whole conveyor belt.
As shown in FIG. 1, two parallel boards with grooves are arranged on the surface of the conveyor belt 8, when the conveyor belt 8 starts to work, because the inner wall of the spherical pair rubber tire 7-4 and the spherical pair 7-3 in the chip placement fixing tray 7 are arranged in a wrapping manner, the chip placement fixing tray 7 cannot slide back and forth smoothly like a pulley, and the movement of the whole chip placement fixing tray 7 on the conveyor belt mainly depends on the friction force provided by the conveyor belt 8, so that the chip placement fixing tray 7 can stably advance on the chip placement fixing tray, and the running efficiency and the duration of the whole chip placement fixing tray are greatly improved.
The foregoing examples are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the foregoing examples, and any other changes, modifications, substitutions, combinations, and simplifications that do not depart from the spirit and principles of the present invention should be made therein and are intended to be equivalent substitutes within the scope of the present invention.
Claims (10)
1. The utility model provides a visual stabilization scanning image device towards encapsulation chip detects in batches, includes the base with set up in the movable support mechanism of base, be provided with industrial camera on the movable support mechanism, a serial communication port, still be provided with the chip on the base and detect movable support, the chip detects movable support and is provided with chip suction mechanism, chip suction mechanism includes the cylinder frame, cylinder frame swivelling joint in the chip detects movable support, be provided with at least a set of sucking disc frame on the cylinder frame, the inside hollow structure that is of sucking disc frame, be provided with a plurality of air nozzles on the sucking disc frame, be provided with the sucking disc on the air nozzle, the sucking disc frame still is provided with the air pump interface, air pump interface connection air supply.
2. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 1, wherein the column frame comprises a mounting rod, mounting frames are arranged at two ends of the mounting rod, and grooves are formed in the mounting frames and used for mounting the sucker frames.
3. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 2, wherein the grooves comprise spherical grooves, spherical movable pairs are arranged at two ends of the sucker frame, and the spherical grooves are matched with the spherical movable pairs to move.
4. The vision-stabilizing scanning imaging device for batch inspection of packaged chips of claim 3, wherein the groove further comprises an L-shaped groove, wherein the L-shaped groove is communicated with the spherical groove, and wherein the L-shaped groove is provided with a T-shaped latching detachable valve.
5. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 2, wherein a central fixed driven wheel is arranged in the middle of the inner side of the mounting frame of the cylinder frame, the central fixed driven wheel is in meshed transmission with a driving wheel, the driving wheel is driven by a driving motor, one end of the sucker frame is provided with a rotating gear, and the rotating gear is in meshed transmission with the central fixed driven wheel.
6. The vision-stabilizing scanning imaging device for batch detection of packaged chips according to claim 1, wherein the movable support mechanism comprises movable supports, sliding rails are arranged between the movable supports, an X-axis pulley block, a Y-axis pulley block and a Z-axis pulley block are arranged on the sliding rails, the X-axis pulley block, the Y-axis pulley block and the Z-axis pulley block are driven by a motor, and an industrial camera is arranged on the Z-axis pulley block.
7. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 1, wherein the chip inspection moving support comprises a support frame, the support frame is used for installing a column frame, and a driving pulley block is arranged on the support frame and drives the column frame to rotate.
8. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 7, wherein the support frame is mounted on a vertical moving mechanism, the vertical moving mechanism comprises a guide rail, a servo motor and a synchronous belt, and the support frame is mounted on the guide rail and is driven to move in the vertical direction by the servo motor and the synchronous belt.
9. The vision-stabilizing scanning imaging device for batch inspection of packaged chips according to claim 1, wherein the base is further provided with a conveyor belt and a chip placement fixing tray, a chip placement fixing clamping groove is formed in the chip placement fixing tray, and a sensor is arranged in the chip placement fixing clamping groove.
10. The visual stable scanning imaging device for batch detection of packaged chips according to claim 9, wherein a spherical pair is arranged at the bottom of the chip placement fixing tray, a spherical pair rubber tire is wrapped at the periphery of the spherical pair, the spherical pair rubber tire rotates in a certain range, two parallel tracks are arranged on the conveyor belt, and the spherical pair rubber tire is arranged in the tracks.
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CN115032198A (en) * | 2022-06-11 | 2022-09-09 | 广东邮电职业技术学院 | IC card chip visual detection mechanism |
CN115178476A (en) * | 2022-07-22 | 2022-10-14 | 上海梓一测控技术有限公司 | Be used for six outward appearance check out test set of high-speed high accuracy of chip |
CN218180709U (en) * | 2022-08-31 | 2022-12-30 | 湖南奥创普科技有限公司 | Appearance detection equipment for semiconductor chip |
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