CN117043273A - 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件 - Google Patents

树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件 Download PDF

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Publication number
CN117043273A
CN117043273A CN202280021576.9A CN202280021576A CN117043273A CN 117043273 A CN117043273 A CN 117043273A CN 202280021576 A CN202280021576 A CN 202280021576A CN 117043273 A CN117043273 A CN 117043273A
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China
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group
formula
resin
carbon atoms
acid
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CN202280021576.9A
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English (en)
Chinese (zh)
Inventor
小川伦弘
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Fujifilm Corp
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Fujifilm Corp
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Publication of CN117043273A publication Critical patent/CN117043273A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
CN202280021576.9A 2021-03-16 2022-03-10 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件 Pending CN117043273A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021042487 2021-03-16
JP2021-042487 2021-03-16
PCT/JP2022/010636 WO2022196524A1 (ja) 2021-03-16 2022-03-10 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Publications (1)

Publication Number Publication Date
CN117043273A true CN117043273A (zh) 2023-11-10

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ID=83320609

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CN202280021576.9A Pending CN117043273A (zh) 2021-03-16 2022-03-10 树脂组合物、固化物、层叠体、固化物的制造方法及半导体器件

Country Status (5)

Country Link
JP (1) JPWO2022196524A1 (https=)
KR (1) KR20230146065A (https=)
CN (1) CN117043273A (https=)
TW (1) TWI912484B (https=)
WO (1) WO2022196524A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106678A (ja) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
WO2008059808A1 (en) * 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment
CN103502889A (zh) * 2011-06-15 2014-01-08 日立化成杜邦微系统股份有限公司 感光性树脂组合物、使用了该树脂组合物的图案固化膜的制造方法以及电子部件
WO2020170997A1 (ja) * 2019-02-22 2020-08-27 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
WO2020189358A1 (ja) * 2019-03-15 2020-09-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体
WO2020262227A1 (ja) * 2019-06-26 2020-12-30 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106678A (ja) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
WO2008059808A1 (en) * 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment
CN103502889A (zh) * 2011-06-15 2014-01-08 日立化成杜邦微系统股份有限公司 感光性树脂组合物、使用了该树脂组合物的图案固化膜的制造方法以及电子部件
WO2020170997A1 (ja) * 2019-02-22 2020-08-27 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
WO2020189358A1 (ja) * 2019-03-15 2020-09-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体
WO2020262227A1 (ja) * 2019-06-26 2020-12-30 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Also Published As

Publication number Publication date
TWI912484B (zh) 2026-01-21
TW202248293A (zh) 2022-12-16
JPWO2022196524A1 (https=) 2022-09-22
KR20230146065A (ko) 2023-10-18
WO2022196524A1 (ja) 2022-09-22

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