JPWO2022196524A1 - - Google Patents

Info

Publication number
JPWO2022196524A1
JPWO2022196524A1 JP2023507047A JP2023507047A JPWO2022196524A1 JP WO2022196524 A1 JPWO2022196524 A1 JP WO2022196524A1 JP 2023507047 A JP2023507047 A JP 2023507047A JP 2023507047 A JP2023507047 A JP 2023507047A JP WO2022196524 A1 JPWO2022196524 A1 JP WO2022196524A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023507047A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022196524A1 publication Critical patent/JPWO2022196524A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP2023507047A 2021-03-16 2022-03-10 Pending JPWO2022196524A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021042487 2021-03-16
PCT/JP2022/010636 WO2022196524A1 (ja) 2021-03-16 2022-03-10 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Publications (1)

Publication Number Publication Date
JPWO2022196524A1 true JPWO2022196524A1 (https=) 2022-09-22

Family

ID=83320609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023507047A Pending JPWO2022196524A1 (https=) 2021-03-16 2022-03-10

Country Status (5)

Country Link
JP (1) JPWO2022196524A1 (https=)
KR (1) KR20230146065A (https=)
CN (1) CN117043273A (https=)
TW (1) TWI912484B (https=)
WO (1) WO2022196524A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106678A (ja) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
WO2008059808A1 (en) * 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment
WO2020189358A1 (ja) * 2019-03-15 2020-09-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920345B2 (ja) * 2011-06-15 2016-05-18 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP7351896B2 (ja) * 2019-02-22 2023-09-27 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
WO2020262227A1 (ja) * 2019-06-26 2020-12-30 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106678A (ja) * 1991-10-07 1994-04-19 Internatl Business Mach Corp <Ibm> 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
WO2008059808A1 (en) * 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment
WO2020189358A1 (ja) * 2019-03-15 2020-09-24 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、ポリマー前駆体

Also Published As

Publication number Publication date
TWI912484B (zh) 2026-01-21
CN117043273A (zh) 2023-11-10
TW202248293A (zh) 2022-12-16
KR20230146065A (ko) 2023-10-18
WO2022196524A1 (ja) 2022-09-22

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