KR20230146065A - 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스 - Google Patents

수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스 Download PDF

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Publication number
KR20230146065A
KR20230146065A KR1020237031393A KR20237031393A KR20230146065A KR 20230146065 A KR20230146065 A KR 20230146065A KR 1020237031393 A KR1020237031393 A KR 1020237031393A KR 20237031393 A KR20237031393 A KR 20237031393A KR 20230146065 A KR20230146065 A KR 20230146065A
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KR
South Korea
Prior art keywords
group
formula
preferable
resin
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020237031393A
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English (en)
Korean (ko)
Inventor
미치히로 오가와
Original Assignee
후지필름 가부시키가이샤
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Publication of KR20230146065A publication Critical patent/KR20230146065A/ko
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
KR1020237031393A 2021-03-16 2022-03-10 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스 Ceased KR20230146065A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021042487 2021-03-16
JPJP-P-2021-042487 2021-03-16
PCT/JP2022/010636 WO2022196524A1 (ja) 2021-03-16 2022-03-10 樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス

Publications (1)

Publication Number Publication Date
KR20230146065A true KR20230146065A (ko) 2023-10-18

Family

ID=83320609

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237031393A Ceased KR20230146065A (ko) 2021-03-16 2022-03-10 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스

Country Status (5)

Country Link
JP (1) JPWO2022196524A1 (https=)
KR (1) KR20230146065A (https=)
CN (1) CN117043273A (https=)
TW (1) TWI912484B (https=)
WO (1) WO2022196524A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059808A1 (en) 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
JP3877093B2 (ja) * 1997-07-04 2007-02-07 日立化成工業株式会社 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
JP5920345B2 (ja) * 2011-06-15 2016-05-18 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP7351896B2 (ja) * 2019-02-22 2023-09-27 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
KR102647598B1 (ko) * 2019-03-15 2024-03-14 후지필름 가부시키가이샤 경화성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 반도체 디바이스, 및, 폴리머 전구체
WO2020262227A1 (ja) * 2019-06-26 2020-12-30 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059808A1 (en) 2006-11-15 2008-05-22 Sumitomo Bakelite Company Limited Photosensitive resin composition, insulating film, protective film, and electronic equipment

Also Published As

Publication number Publication date
TWI912484B (zh) 2026-01-21
CN117043273A (zh) 2023-11-10
TW202248293A (zh) 2022-12-16
JPWO2022196524A1 (https=) 2022-09-22
WO2022196524A1 (ja) 2022-09-22

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