TWI912484B - 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件 - Google Patents

樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件

Info

Publication number
TWI912484B
TWI912484B TW111108894A TW111108894A TWI912484B TW I912484 B TWI912484 B TW I912484B TW 111108894 A TW111108894 A TW 111108894A TW 111108894 A TW111108894 A TW 111108894A TW I912484 B TWI912484 B TW I912484B
Authority
TW
Taiwan
Prior art keywords
group
groups
preferred
acid
formula
Prior art date
Application number
TW111108894A
Other languages
English (en)
Chinese (zh)
Other versions
TW202248293A (zh
Inventor
小川倫弘
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202248293A publication Critical patent/TW202248293A/zh
Application granted granted Critical
Publication of TWI912484B publication Critical patent/TWI912484B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW111108894A 2021-03-16 2022-03-11 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件 TWI912484B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021042487 2021-03-16
JP2021-042487 2021-03-16

Publications (2)

Publication Number Publication Date
TW202248293A TW202248293A (zh) 2022-12-16
TWI912484B true TWI912484B (zh) 2026-01-21

Family

ID=83320609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108894A TWI912484B (zh) 2021-03-16 2022-03-11 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件

Country Status (5)

Country Link
JP (1) JPWO2022196524A1 (https=)
KR (1) KR20230146065A (https=)
CN (1) CN117043273A (https=)
TW (1) TWI912484B (https=)
WO (1) WO2022196524A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
TW202045588A (zh) * 2019-03-15 2020-12-16 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚合物前驅物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
JPH10260531A (ja) * 1997-03-17 1998-09-29 Nippon Zeon Co Ltd ポリイミド系樹脂組成物
MY148226A (en) * 2006-11-15 2013-03-29 Sumitomo Bakelite Co Photosensitive resin composition, insulating film, protective film, and electronic equipment
JP5920345B2 (ja) * 2011-06-15 2016-05-18 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品
JP7351896B2 (ja) * 2019-02-22 2023-09-27 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱塩基発生剤
WO2020262227A1 (ja) * 2019-06-26 2020-12-30 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1124267A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたレリーフパターンの製造法
TW202045588A (zh) * 2019-03-15 2020-12-16 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及聚合物前驅物

Also Published As

Publication number Publication date
CN117043273A (zh) 2023-11-10
TW202248293A (zh) 2022-12-16
JPWO2022196524A1 (https=) 2022-09-22
KR20230146065A (ko) 2023-10-18
WO2022196524A1 (ja) 2022-09-22

Similar Documents

Publication Publication Date Title
TWI894339B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI888627B (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TWI890798B (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI890907B (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI890841B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
CN114981360B (zh) 固化性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件
TWI898039B (zh) 硬化物的製造方法、積層體的製造方法及半導體元件的製造方法
TW202219080A (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、半導體器件、聚醯亞胺前驅物及其製造方法
TW202311240A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、及半導體元件、以及化合物
TWI904246B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI896742B (zh) 感光性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件
TWI912365B (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI893199B (zh) 複合圖案的製造方法、樹脂組成物、積層體的製造方法及半導體裝置的製造方法
TWI882163B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202311304A (zh) 永久膜之製造方法、積層體之製造方法及裝置之製造方法以及永久膜
TW202234156A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及化合物
TW202136375A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TWI904243B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI894341B (zh) 硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TWI912484B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI917593B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置
TW202219118A (zh) 聚醯亞胺前驅物之製造方法及硬化性樹脂組成物之製造方法
TWI902904B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件
TWI920232B (zh) 永久膜之製造方法、積層體之製造方法及半導體裝置之製造方法
TWI914402B (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體元件