CN117043273A - Resin composition, cured product, laminate, method for producing cured product, and semiconductor device - Google Patents

Resin composition, cured product, laminate, method for producing cured product, and semiconductor device Download PDF

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Publication number
CN117043273A
CN117043273A CN202280021576.9A CN202280021576A CN117043273A CN 117043273 A CN117043273 A CN 117043273A CN 202280021576 A CN202280021576 A CN 202280021576A CN 117043273 A CN117043273 A CN 117043273A
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group
formula
resin
carbon atoms
acid
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小川伦弘
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Abstract

The present invention provides a resin composition, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, and a semiconductor device comprising the cured product or the laminate, wherein the resin composition comprises a cyclized resin or a resin as a precursor thereof, the resin comprises a nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms, and the ratio of the molar amount of the structure comprising the nitrogen-containing heterocyclic structure detached from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours to the total molar amount of the nitrogen-containing heterocyclic structure contained in the resin is 10% or less.

Description

Resin composition, cured product, laminate, method for producing cured product, and semiconductor device
Technical Field
The present invention relates to a resin composition, a cured product, a laminate, a method for producing a cured product, and a semiconductor device.
Background
Cyclized resins such as polyimide are excellent in heat resistance, insulation properties, and the like, and therefore can be used for various applications. The application is not particularly limited, and examples of the application include use of a material or a protective film as an insulating film or a sealing material when a semiconductor device for actual mounting is taken as an example. Further, the film can be used as a base film, a cover film, or the like of a flexible substrate.
For example, in the above-mentioned applications, a cyclized resin such as polyimide is used in the form of a resin composition containing at least one of cyclized resins such as polyimide and precursors of cyclized resins.
Such a resin composition is applied to a substrate to form a photosensitive film by coating or the like, and then exposed to light, developed, heated or the like as necessary, whereby a cured product can be formed on the substrate.
The precursor of the cyclized resin such as a polyimide precursor is cyclized by heating, for example, to form a cyclized resin such as polyimide in a cured product.
The resin composition can be applied by a known coating method or the like, and therefore, it can be said that the resin composition is excellent in manufacturing suitability, for example, the shape, size, application position and the like of the applied resin composition are highly free in design and the like when applied. In addition to the high performance of the cyclized resin such as polyimide, the expansion of the application of the resin composition in industry is expected from the viewpoint of excellent suitability for production as described above.
For example, patent document 1 discloses a photosensitive resin composition comprising an alkali-soluble resin and a photosensitive agent, wherein one end of the alkali-soluble resin is an organic group having an unsaturated group, and at least one of a side chain and the other end has a nitrogen-containing cyclic compound.
Technical literature of the prior art
Patent literature
Patent document 1: international publication No. 2008/059808
Disclosure of Invention
Technical problem to be solved by the invention
In a member (for example, a device using the cured product as an insulating film) including a cured product of a cyclized resin such as polyimide and a metal (for example, a metal layer) in contact with the cured product, it is required that peeling between the metal and the cured product is not easily generated even after a long period of time has elapsed.
The present invention provides a resin composition which can obtain a cured product which is not liable to be peeled off between a metal and the cured product even after a long time has elapsed, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, and a semiconductor device comprising the cured product or the laminate.
Means for solving the technical problems
Examples of representative embodiments of the present invention are shown below.
A resin composition comprising a cyclized resin or a resin as a precursor thereof,
the resin contains a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms,
the ratio of the molar amount of the structure containing the nitrogen-containing heterocyclic structure, which is detached from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours, to the total molar amount of the nitrogen-containing heterocyclic structure contained in the resin is 10% or less.
<2> the resin composition according to <1>, wherein,
the nitrogen-containing heterocyclic structure is present at the terminal of the resin.
<3> the resin composition according to <1> or <2>, wherein,
the resin contains a structure represented by the following formula (1-1) or formula (2-1),
[ chemical formula 1]
In the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
in the formula (2-1), L 2 Represents a single bond or does not containM+1 valent linking group of oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
<4> a resin composition comprising a cyclized resin or a resin as a precursor thereof,
the resin contains a structure represented by the following formula (1-1) or formula (2-1),
[ chemical formula 2]
In the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
In the formula (2-1), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
<5> the resin composition according to any one of <1> to <4>, wherein,
the content of the nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms is 0.001 to 10% by mass relative to the total solid content of the composition.
<6> the resin composition according to any one of <1> to <5>, wherein,
the nitrogen-containing heterocyclic structure contained in the resin contains an imidazole skeleton, a triazole skeleton or a tetrazole skeleton.
<7> the resin composition according to any one of <1> to <6>, wherein,
the weight average molecular weight of the resin is 1,500 to 70,000.
<8> the resin composition according to any one of <1> to <7>, which is used for forming an interlayer insulating film for a rewiring layer.
<9> a cured product obtained by curing the resin composition according to any one of <1> to <8 >.
<10> a laminate comprising 2 or more layers of the cured product of <9>, wherein any of the cured products comprises a metal layer between them.
<11> a method for producing a cured product comprising a film formation step of applying the resin composition according to any one of <1> to <8> to a substrate to form a film.
<12> the method for producing a cured product according to <11>, comprising an exposure step of exposing the film and a developing step of developing the film.
<13> the method for producing a cured product according to <11> or <12>, comprising a heating step of heating the film at 50 to 450 ℃.
<14> a semiconductor device comprising the cured product of <9> or the laminate of <10 >.
Effects of the invention
According to the present invention, there are provided a resin composition which can obtain a cured product which is less likely to peel between a metal and the cured product even after a long period of time has elapsed, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, and a semiconductor device comprising the cured product or the laminate.
Detailed Description
Hereinafter, a main embodiment of the present invention will be described. However, the present invention is not limited to the illustrated embodiments.
In the present specification, the numerical range indicated by the symbol "to" refers to a range in which numerical values before and after "to" are included as a lower limit value and an upper limit value, respectively.
In the present specification, the term "process" means not only an independent process but also a process which cannot be clearly distinguished from other processes as long as the intended function of the process can be achieved.
In the labeling of groups (radicals) in the present specification, the label which is not labeled with a substituted or unsubstituted includes a group (radical) having no substituent and also includes a group (radical) having a substituent. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present specification, unless otherwise specified, "exposure" includes not only exposure by light but also exposure by a particle beam such as an electron beam or an ion beam. Examples of the light used for exposure include an open line spectrum of a mercury lamp, an active ray such as extreme ultraviolet rays (EUV light), X-rays, and electron beams, and radiation, which are typified by excimer laser light.
In the present specification, "(meth) acrylate" means either or both of "acrylate" and "methacrylate", "(meth) acrylic" means either or both of "acrylic" and "methacrylic", and "(meth) acryl" means either or both of "acryl" and "methacryl".
In the present specification, me in the structural formula represents methyl, et represents ethyl, bu represents butyl, and Ph represents phenyl.
In the present specification, the total solid content refers to the total mass of all the components of the composition except the solvent. In the present specification, the solid content concentration is the mass percentage of the other components than the solvent with respect to the total mass of the composition.
In the present specification, unless otherwise specified, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are values measured by Gel Permeation Chromatography (GPC) and are defined as polystyrene equivalent values. In the present specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) can be obtained by using HLC-8220GPC (TOSOH CORPORAT [ ON ]), for example, as a column by connecting in series a protection column HZ-L, a TSKgel Super HZM-M, a TSKgel Super HZ4000, a TSKgel Super HZ3000, and a TSKgel Super HZ2000 (manufactured by TOSOH CORPORATION). The molecular weights of these were measured using THF (tetrahydrofuran) as the eluent, unless otherwise specified. However, when THF is unsuitable as an eluent, for example, when the solubility is low, NMP (N-methyl-2-pyrrolidone) can also be used. Further, unless otherwise specified, detection in GPC measurement is performed using a UV ray (ultraviolet ray) detector having a wavelength of 254 nm.
In the present specification, when the positional relationship of each layer constituting the laminate is described as "up" or "down", it is sufficient that another layer exists above or below the layer serving as the reference among the layers concerned. That is, the 3 rd layer or the 3 rd element may be further interposed between the layer to be the reference and the other layer, and the layer to be the reference and the other layer do not need to be in contact. If not specifically described, the direction in which the base material layers are laminated is referred to as "upper", or the direction from the base material toward the resin composition layer is referred to as "upper", and the opposite direction is referred to as "lower". In addition, these vertical settings are for convenience in the present specification, and in a practical embodiment, the "upper" direction in the present specification may be oriented differently from the vertical direction.
In the present specification, unless otherwise specified, each component contained in the composition may contain 2 or more compounds corresponding to the component. Unless otherwise specified, the content of each component in the composition means the total content of all the compounds corresponding to the component.
In the present specification, unless otherwise specified, the temperature was 23 ℃, the air pressure was 101, 325Pa (1 air pressure), and the relative humidity was 50% rh.
In the present specification, a combination of preferred embodiments is a more preferred embodiment.
(resin composition)
The resin composition according to claim 1 of the present invention comprises a cyclized resin or a resin as a precursor thereof, wherein the resin comprises a nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms, and the ratio of the molar amount of the structure comprising the nitrogen-containing heterocyclic structure to the total molar amount of the nitrogen-containing heterocyclic structures contained in the resin, which is released from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours, is 10% or less.
The resin composition according to the 2 nd aspect of the present invention comprises a cyclized resin or a resin as a precursor thereof, and the resin comprises a structure represented by the following formula (1-1) or formula (2-1).
[ chemical formula 3]
In the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
in the formula (2-1), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
Hereinafter, the term "resin composition" is simply referred to as including both the resin composition according to the 1 st aspect of the present invention and the resin composition according to the 2 nd aspect of the present invention.
The resin belonging to at least one of the cyclized resin or the resin as a precursor thereof according to the 1 st aspect or the cyclized resin or the resin as a precursor thereof according to the 2 nd aspect is also referred to as "specific resin".
The resin composition of the present invention is preferably used for forming a photosensitive film for exposure and development, and more preferably for forming a film for exposure and development using a developer containing an organic solvent.
The resin composition of the present invention can be used for, for example, forming an insulating film for a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like, and is more preferably used for forming an interlayer insulating film for a rewiring layer.
The resin composition of the present invention can be used for forming a positive-type photosensitive film for development, and can also be used for forming a negative-type photosensitive film for development.
In the present invention, negative development means development in which a non-exposed portion is removed by development during exposure and development, and positive development means development in which an exposed portion is removed by development.
As the exposure method, the developing solution, and the developing method, for example, the exposure method described in the exposure step described in the description of the method for producing a cured product, the developing solution described in the developing step, and the developing method described in the developing step can be used.
According to the resin composition of the present invention, a cured product which is less likely to peel between the metal and the cured product even after a long period of time has elapsed can be obtained.
The mechanism for obtaining the above effects is not clear, but is presumed as follows.
Conventionally, nitrogen-containing cyclic compounds such as tetrazole and aminotetrazole have been used for the cured product for the purpose of improving the adhesion to metals, but there is room for improvement from the viewpoint of the adhesion between metals and the cured product after a long period of time.
As a result of intensive studies, the present inventors have found that when a cyclized resin or a resin as a precursor thereof contains a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms and the resin is heated at 1 air pressure and 350 ℃ for 2 hours, the ratio of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which is detached from the resin is 10% or less, or when a cyclized resin or a resin as a precursor thereof is contained and the resin contains a structure represented by the formula (1-1) or the formula (1-2), peeling is less likely to occur between a metal and a cured product even after a long period of time.
The mechanism by which the above-described effects can be obtained is not clear, but it is considered that the cured product obtained by the resin containing a nitrogen-containing heterocyclic structure and not being detached by heating or containing a structure not easily decomposed by heat, that is, a structure represented by the formula (1-1) or the formula (1-2), also contains a nitrogen-containing heterocyclic structure in the resin.
It is presumed that, since the nitrogen-containing heterocyclic structure is excellent in adhesion to a substrate (particularly, a metal substrate), the adhesion of the resin in the cured product to the substrate becomes strong, and the adhesion of the obtained cured product to the substrate is also excellent.
Further, in the present invention in which the nitrogen-containing heterocyclic structure is contained in the resin, it is considered that the low-molecular component in the composition can be reduced as compared with the case where only the above-mentioned nitrogen-containing cyclic compound is used as the low-molecular component, and therefore the obtained cured product is also excellent in chemical resistance.
Further, it is presumed that the low molecular components in the composition can be reduced as described above, and thus the surface uniformity (i.e., surface smoothness) of the cured product surface of the obtained cured product is also excellent.
Here, regarding the resin having a nitrogen-containing cyclic compound in at least one of the side chain and the other end described in patent document 1, it is considered that the proportion of the molar amount of the structure including the nitrogen-containing heterocyclic structure which is detached from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours is significantly more than 10%.
When such a resin is used, it is considered that peeling is likely to occur between the metal and the cured product after a long period of time.
The components contained in the resin composition of the present invention will be described in detail below.
< specific resin >
The resin composition according to claim 1 of the present invention comprises a cyclized resin or a resin (specific resin) as a precursor thereof, wherein the resin comprises a nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms, and the ratio of the molar amount of the structure comprising the nitrogen-containing heterocyclic structure to the total molar amount of the nitrogen-containing heterocyclic structures contained in the resin, which is released from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours, is 10% or less.
[ Nitrogen-containing heterocyclic Structure ]
The nitrogen-containing heterocyclic ring structure in the specific resin is a heterocyclic ring containing 2 or more nitrogen atoms as ring-forming atoms.
The nitrogen-containing heterocyclic ring structure may be a single ring or a heterocyclic ring, and is preferably a single ring or a condensed ring, more preferably a single ring of 5-membered ring or 6-membered ring or a condensed ring of 5-membered ring, a condensed ring of 6-membered ring or a condensed ring of 5-membered ring and 6-membered ring, and more preferably a single ring of 5-membered ring or a condensed ring of 5-membered ring and 6-membered ring.
Wherein, when the nitrogen-containing heterocyclic ring structure is a heterocyclic ring, at least 2 nitrogen atoms are contained as ring-forming atoms in at least 1 single ring constituting the heterocyclic ring. That is, for example, the benzimidazole ring corresponds to the nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms in the present invention, but the 7-azaindole ring is not regarded as the nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms in the present invention.
In addition, the above-mentioned nitrogen-containing heterocyclic structure may have a plurality of nitrogen-containing heterocyclic structures containing 2 or more nitrogen atoms as ring-forming atoms in the heterocyclic structure, as in the purine ring structure.
The nitrogen-containing heterocyclic structure may contain a heteroatom other than a nitrogen atom as a ring-forming atom, but a method in which the nitrogen-containing heterocyclic structure does not contain a heteroatom other than a nitrogen atom as a ring-forming atom is also one of preferred embodiments of the present invention. Examples of the hetero atom other than the nitrogen atom include an oxygen atom and a sulfur atom.
The nitrogen-containing heterocyclic ring structure may be an aliphatic ring or an aromatic ring, but an aromatic ring is preferable.
Among them, the above-mentioned nitrogen-containing heterocycle preferably contains an imidazole skeleton, a triazole skeleton or a tetrazole skeleton, more preferably an imidazole ring, a triazole ring, a tetrazole ring or a condensed ring of these rings with other rings, further preferably a benzimidazole ring, a triazole ring, a benzotriazole ring, a tetrazole ring or a purine ring, from the viewpoint of adhesion after a long period of time.
The other ring is preferably an aromatic ring, more preferably a 5-or 6-membered ring, and still more preferably a benzene ring.
The nitrogen-containing heterocyclic structure is preferably present at the terminal of the specific resin, more preferably at the terminal of the main chain of the specific resin.
In the present invention, the main chain means a relatively longest bonding chain in a resin molecule.
It is preferable that at least 1 of the main chain terminals of the specific resin has the above-mentioned nitrogen-containing heterocyclic structure.
The specific resin in the resin composition according to the 1 st aspect of the present invention preferably includes a structure represented by the following formula (1-1) or formula (2-1).
The specific resin in the resin composition according to the 2 nd aspect of the present invention includes a structure represented by the following formula (1-1) or formula (2-1).
In particular, when the specific resin is any one of polyimide, a polyimide precursor, polyamideimide, or a polyamideimide precursor, the specific resin preferably includes a structure represented by the following formula (1-1).
When the specific resin is polybenzoxazole or a polybenzoxazole precursor, the resin preferably contains a structure represented by the following formula (2-1).
[ chemical formula 4]
In the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
in the formula (2-1), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
In the formula (1-1), L 1 Preferably a single bond or an n+1 valent hydrocarbon group or containing 1 or more selected from-O-, -C (=O) -, -NR within the hydrocarbon group N -S-and-S (=o) 2 -a group of at least 1 structure of (a).
R is as described above N Represents a hydrogen atom or a 1-valent substituent, preferably a hydrogen atom or a hydrocarbon group, more preferably a hydrogen atom, an alkyl group or an aromatic hydrocarbon group。
And L is 1 The mode of single bond is also one of the preferable modes of the present invention.
In the formula (1-1), R 1 The preferred mode of the (c) is the same as that of the above-mentioned nitrogen-containing heterocyclic structure.
In the formula (1-1), n is preferably an integer of 1 to 4, more preferably 1 or 2, and further preferably 1.
In formula (1-1), the bonding sites with other structures are represented. Here, a mode in which 2 are bonded to carbon atoms each bonded by covalent bonds to form an imide ring structure including an imide structure shown by formula (1-1) is also one of preferred modes of the present invention. The imide ring structure is preferably a 5-membered ring structure, for example.
In the formula (2-1), L v Preferably a single bond or an n+1 valent hydrocarbon group or containing 1 or more groups selected from-O-, -C (=O) -, -S-and-S (=O) in the interior of the hydrocarbon group 2 -a group of at least 1 structure of (a).
And L is 2 The mode of single bond is also one of the preferable modes of the present invention.
In the formula (2-1), R 2 The preferred mode of the (c) is the same as that of the above-mentioned nitrogen-containing heterocyclic structure.
In the formula (2-1), m is preferably an integer of 1 to 4, more preferably 1 or 2, and further preferably 1.
In formula (2-1), the bonding sites with other structures are represented. Here, a mode in which 2 are bonded to carbon atoms each bonded by covalent bonds to form a ring structure containing a nitrogen atom and an oxygen atom shown in formula (2-1) is also one of preferred modes of the present invention. As the ring structure, for example, an oxazole ring structure is preferable.
The specific resin preferably includes a structure represented by any one of the following formulas (1-2) to (1-3) as a structure including a structure represented by the formula (1-1).
[ chemical formula 5]
Of the formula (1-2) orIn the formula (1-3), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 The nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, and represents a bonding site with other structure.
In the formula (1-2) or the formula (1-3), L 1 、R 1 And n is independently L in formula (1-1) 1 、R 1 And n have the same meaning, and the preferred mode is the same.
The specific resin preferably includes a structure represented by any one of the following formulas (2-2) to (2-3) as a structure including a structure represented by the formula (2-1).
[ chemical formula 6]
In the formula (2-2) or the formula (2-3), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
In the formula (2-2) or the formula (2-3), L 2 、R 2 And m is independently L in the formula (2-1) 2 、R 2 And m have the same meaning, and the preferred mode is the same.
When the specific resin contains a structure represented by the above formula (1-1), the specific resin also preferably contains a structure represented by the following formula (1-4).
[ chemical formula 7]
In the formula (1-4), A 1 Represents an oxygen atom or-NH-, R 115 Represents a 4-valent organic group, R 114 Represents a hydrogen atom or a 1-valent organic group, L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a cyclic ring-forming member containing at least 2 nitrogen atomsThe nitrogen-containing heterocyclic structure of the sub-group, n represents an integer of 1 or more, and x represents a bonding site with other structure.
In the formula (1-4), A 1 、R 114 R is R 114 And A in the following formula (2) 1 、R 115 R is R 114 The meaning is the same, and the preferred mode is the same.
In the formula (1-4), L 1 、R 1 And n is the same as L in the above formula (1-1) 1 、R 1 And n have the same meaning, and the preferred mode is the same.
When the specific resin contains a structure represented by the following formula (1-4), the specific resin preferably contains a repeating unit represented by the following formula (2).
When the specific resin contains a repeating unit represented by the following formula (2), A in the formula (1-4) is also preferable 1 、R 115 R is R 114 A in any one of the repeating units represented by the formula (2) contained in the specific resin 1 、R 115 R is R 114 Is of the same structure.
When the specific resin contains a repeating unit represented by the following formula (2), it is also preferable that the R in the formula (1-4) is the same as the R in the formula (2) 111 Is bonded to the bonding site of the substrate.
When the specific resin contains a structure represented by the above formula (1-1), the specific resin preferably also contains a structure represented by the following formula (1-5).
[ chemical formula 8]
In the formula (1-5), R 132 Represents a 4-valent organic group, L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 The nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, and represents a bonding site with other structure.
In the formula (1-5), R 132 R is the same as R in the above formula (4) 132 The meaning is the same, and the preferred mode is the same.
In the formula (1-5), L 1 、R 1 And n is the same as L in the above formula (1-1) 1 、R 1 And n have the same meaning, and the preferred mode is the same.
When the specific resin contains a structure represented by the following formula (1-5), the specific resin preferably contains a repeating unit represented by the following formula (4).
When the specific resin contains a repeating unit represented by the following formula (4), R in the formula (1-5) is also preferable 132 R in any one of the repeating units represented by the formula (4) contained in the specific resin 132 Is of the same structure.
When the specific resin contains a repeating unit represented by the following formula (4), it is also preferable that the R in the formula (1-5) is the same as the R in the formula (4) 131 Is bonded to the bonding site of the substrate.
When the specific resin contains a structure represented by the above formula (2-1), the specific resin also preferably contains a structure represented by the following formula (2-4).
[ chemical formula 9]
In the formula (2-4), R 122 Represents a 4-valent organic group, R 124 Represents a hydrogen atom or a 1-valent organic group, L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
In the formula (2-4), R 122 R is R 124 R in the formula (3) 122 R is R 124 The meaning is the same, and the preferred mode is the same.
In the formula (2-4), L 2 、R 2 And m is the same as L in the above formula (2-1) 2 、R 2 And m have the same meaning, and the preferred mode is the same.
When the specific resin contains a structure represented by the following formula (2-4), the specific resin preferably contains a repeating unit represented by the following formula (3).
The specific resin comprises a resin represented by the following formula (3)R in the formula (2-4) is also preferred when repeating units of 122 R is R 124 R in any one of the repeating units represented by the formula (3) contained in the specific resin 122 R is R 124 Is of the same structure.
When the specific resin contains a repeating unit represented by the following formula (3), it is also preferable that the R in the formula (2-4) is the same as the R in the formula (3) 121 Is bonded to the bonding site of the substrate.
When the specific resin contains a structure represented by the above formula (2-1), the specific resin also preferably contains a structure represented by the following formula (2-5).
[ chemical formula 10]
In the formula (2-5), R 134 Represents a 4-valent organic group, L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
In the formula (2-5), R 134 R in the formula (X) 134 The meaning is the same, and the preferred mode is the same.
In the formula (2-5), L 2 、R 2 And m is the same as L in the above formula (1-1) 2 、R 2 And m have the same meaning, and the preferred mode is the same.
When the specific resin contains a structure represented by the formula (2-5), the specific resin preferably contains a repeating unit represented by the formula (X) described below.
When the specific resin contains a repeating unit represented by the following formula (X), R in the formula (2-5) is also preferable 134 R in any one of the repeating units represented by the formula (X) contained in the specific resin 134 Is of the same structure.
When the specific resin contains a repeating unit represented by the following formula (X), it is also preferable that the R in the formula (1-5) is the same as R in the formula (X) 133 Is bonded to the bonding site of the substrate.
Hereinafter, a specific example of a structure including a nitrogen-containing heterocyclic structure (the nitrogen-containing heterocyclic structure contains 2 or more nitrogen atoms as ring-forming atoms) included in the specific resin is shown, but the present invention is not limited thereto. In the following structures, the bonding sites with other structures are indicated.
[ chemical formula 11]
The content of the nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms (also referred to as "content a") is preferably 0.001 to 10% by mass, more preferably 0.01 to 8% by mass, and even more preferably 0.1 to 5% by mass, relative to the total solid content of the composition.
The content a includes not only the content of the nitrogen-containing heterocyclic structure contained in the specific resin, but also a content of a compound having a nitrogen-containing heterocyclic structure (for example, migration inhibitor described later) in addition to the specific resin.
That is, when the composition contains only a specific resin as the compound containing the nitrogen-containing heterocyclic structure, the content a is a value represented by the following formula.
Content a= (mass of specific resin contained×molecular weight of the above-mentioned heterocycle contained in the specific resin/molecular weight of the specific resin)/(total solid content) ×100
When the composition contains a specific resin and component 1 (for example, migration inhibitor described later) as the compound containing the nitrogen-containing heterocyclic structure, the content a is a value represented by the following formula.
Content a= { (mass of specific resin contained in the specific resin/molecular weight of the above-mentioned heterocycle contained in the specific resin) + (mass of component 1 contained in the specific resin/molecular weight of component 1) }/(total solid component) ×100
The content of the nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms is preferably 1 to 4 moles, more preferably 1 to 2 moles, based on 1 mole of the specific resin.
[ proportion of molar amount of the structure comprising the above-mentioned nitrogen-containing heterocyclic Structure to be separated ]
Here, the molar amount ratio of the structure including the nitrogen-containing heterocyclic structure that is separated from the resin when the resin is heated at 1 air pressure and 350 ℃ for 2 hours was determined as follows.
1 mol of the resin was placed in a sealed container, and after heating at 1 gas pressure and 350℃for 2 hours in the sealed container, the amount of the structure including the nitrogen-containing heterocyclic structure which was separated by HPLC (high performance liquid chromatography) was quantified.
Thereafter, the above ratio (%) was calculated according to the following formula.
Ratio (%) = (molar amount of structure including nitrogen-containing heterocyclic structure detached)/(molar amount of structure including the above nitrogen-containing heterocyclic structure contained in the resin)
The above ratio is 10% or less, preferably 8% or less, and more preferably 5% or less. The lower limit of the ratio is not particularly limited, and may be 0%.
The weight average molecular weight of the specific resin is preferably 1,500 to 70,000, more preferably 10,000 ～ 50,000.
The specific resin is a cyclized resin or a precursor thereof.
The cyclized resin is preferably a resin containing an imide ring structure or an oxazole ring structure in the main chain structure.
Examples of the cyclized resin include polyimide, polybenzoxazole, and polyamideimide.
The precursor of the cyclized resin is a resin whose chemical structure is changed by an external stimulus to form a cyclized resin, preferably a resin whose chemical structure is changed by heat to form a cyclized resin, and more preferably a resin whose chemical structure is changed by a heat-generated ring-closure reaction to form a ring structure.
Examples of the precursor of the cyclized resin include a polyimide precursor, a polybenzoxazole precursor, and a polyamideimide precursor.
That is, the resin composition of the present invention preferably contains at least 1 resin (specific resin) selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole precursor, polyamideimide and polyamideimide precursor as the specific resin.
The resin composition of the present invention preferably contains polyimide or a polyimide precursor as a specific resin.
The specific resin preferably has a polymerizable group, and more preferably contains a radical polymerizable group.
When the specific resin has a radical polymerizable group, the resin composition of the present invention preferably contains a radical polymerization initiator described later, more preferably contains a radical polymerization initiator described later and contains a radical crosslinking agent described later. The composition may further contain a sensitizer as required. For example, a negative photosensitive film is formed from such a resin composition of the present invention.
The specific resin may have a polar conversion group such as an acid-decomposable group.
When the specific resin has an acid-decomposable group, the resin composition of the present invention preferably contains a photoacid generator described later. For example, a positive photosensitive film or a negative photosensitive film as a chemically amplified film is formed from such a resin composition of the present invention.
[ polyimide precursor ]
The polyimide precursor used in the present invention is not particularly limited in kind and the like, but preferably contains a repeating unit represented by the following formula (2).
[ chemical formula 12]
In the formula (2), A 1 A is a 2 Each independently represents an oxygen atom or-NH-, R 111 Represents a 2-valent organic group, R 115 Represents a 4-valent organic group, R 113 R is R 114 Each independently represents a hydrogen atom or a 1-valent organic group.
A in formula (2) 1 A is a 2 Each independently represents an oxygen atom or-NH-, preferably an oxygen atom.
R in formula (2) 111 Represents a 2-valent organic group. Examples of the 2-valent organic group include a linear or branched aliphatic group, a cyclic aliphatic group, and a group containing an aromatic group, and a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a group composed of a combination of these groups is preferable, and a group containing an aromatic group having 6 to 20 carbon atoms is more preferable. The hydrocarbon group in the chain of the straight-chain or branched aliphatic group may be substituted with a heteroatom-containing group, and the hydrocarbon group of the ring-forming atoms of the cyclic aliphatic group and the aromatic group may be substituted with a heteroatom-containing group. As a preferred embodiment of the present invention, R can be exemplified 111 Is composed of-Ar-and-Ar-L-Ar-examples of the groups represented are those of the formula, particularly preferred are groups represented by-Ar-L-Ar-. Wherein Ar is an aromatic group, L is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO-, -S-, -SO 2 -or-NHCO-, or a group consisting of a combination of more than 2 of the above. The preferred ranges of these are as described above.
R 111 Preferably derived from diamines. Examples of the diamine used for producing the polyimide precursor include linear or branched aliphatic, cyclic aliphatic, and aromatic diamines. The diamine may be used in an amount of 1 or 2 or more.
Specifically, the diamine is preferably a diamine containing a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a group composed of a combination of these groups, and more preferably a diamine containing an aromatic group having 6 to 20 carbon atoms. The hydrocarbon group in the chain of the straight-chain or branched aliphatic group may be substituted with a heteroatom-containing group, and the hydrocarbon group of the ring-forming atoms of the cyclic aliphatic group and the aromatic group may be substituted with a heteroatom-containing group. Examples of the group containing an aromatic group include the following groups.
[ chemical formula 13]
/>
Wherein A represents a single bond or a 2-valent linking group, preferably a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, -O-, -C (=O) -, -S-, -SO 2 -, -NHCO-or a combination of these, more preferably a single bond or an alkylene group selected from the group consisting of C1-3 which may be substituted with a fluorine atom, -O-, -C (=O) -, -S-or-SO 2 -groups, further preferably-CH 2 -、-O-、-S-、-SO 2 -、-C(CF 3 ) 2 -or-C (CH) 3 ) 2 -。
Wherein, represents the bonding site with other structures.
Specific examples of the diamine include at least 1 diamine selected from the following: 1, 2-diaminoethane, 1, 2-diaminopropane, 1, 3-diaminopropane, 1, 4-diaminobutane or 1, 6-diaminohexane; 1, 2-or 1, 3-diaminocyclopentane, 1,2-, 1, 3-or 1, 4-diaminocyclohexane, 1,2, 1, 3-or 1, 4-bis (aminomethyl) cyclohexane, bis- (4-aminocyclohexyl) methane, bis- (3-aminocyclohexyl) methane, 4 '-diamino-3, 3' -dimethylcyclohexylmethane, isophorone diamine; m-phenylenediamine or p-phenylenediamine, diaminotoluene, 4' -or 3,3' -diaminobiphenyl, 4' -diaminodiphenyl ether, 3-diaminodiphenyl ether, 4' -or 3,3' -diaminodiphenylmethane, 4' -or 3,3' -diaminodiphenylsulfone, 4,4' -or 3,3' -diaminodiphenyl sulfide, 4' -or 3,3' -diaminobenzophenone, 3' -dimethyl-4, 4' -diaminobiphenyl, 2' -dimethyl-4, 4' -diaminobiphenyl, 3' -dimethoxy-4, 4' -diaminobiphenyl, and 2, 2-bis (4-aminophenyl) propane, 2-bis (4-aminophenyl) hexafluoropropane, 2-bis (3-hydroxy-4-aminophenyl) propane, 2-bis (3-hydroxy-4-aminophenyl) hexafluoropropane, 2-bis (3-amino-4-hydroxyphenyl) propane 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, bis (3-amino-4-hydroxyphenyl) sulfone, bis (4-amino-3-hydroxyphenyl) sulfone, 4' -diamino p-diphenyl, 4' -bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl ] sulfone, bis [4- (3-aminophenoxy) phenyl ] sulfone, bis [4- (2-aminophenoxy) phenyl ] sulfone, 1, 4-bis (4-aminophenoxy) benzene, 9, 10-bis (4-aminophenyl) anthracene, 3 '-dimethyl-4, 4' -diaminodiphenyl sulfone, 1, 3-bis (4-aminophenoxy) benzene, 1, 3-bis (3-aminophenoxy) benzene, 1, 3-bis (4-aminophenyl) benzene, 3 '-diethyl-4, 4' -diaminodiphenyl methane 3,3 '-dimethyl-4, 4' -diaminodiphenylmethane, 4 '-diaminooctafluorobiphenyl, 2-bis [4- (4-aminophenoxy) phenyl ] propane, 2-bis [4- (4-aminophenoxy) phenyl ] hexafluoropropane, 9-bis (4-aminophenyl) -10-hydroanthracene, 3',4,4 '-tetraminobiphenyl, 3',4 '-tetraminodiphenyl ether, 1, 4-diaminoanthraquinone, 1, 5-diaminoanthraquinone, 3-dihydroxy-4, 4' -diaminobiphenyl, 9 '-bis (4-aminophenyl) fluorene, 4' -dimethyl-3, 3 '-diaminodiphenyl sulfone, 3',5 '-tetramethyl-4, 4' -diaminodiphenyl methane, 2, 4-and 2, 5-diaminocumene, 2, 5-dimethyl-p-phenylenediamine, acetoguanamine, 2,3,5, 6-tetramethyl-p-phenylenediamine, 2,4, 6-trimethyl-m-phenylenediamine, bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, 2, 7-diaminofluorene, 2, 5-diaminopyridine, 1, 2-bis (4-aminophenyl) ethane, diaminobenzanilide, esters of diaminobenzoic acid, 1, 5-diaminonaphthalene, diaminobenzol, 1, 3-bis (4-aminophenyl) hexafluoropropane, 1, 4-bis (4-aminophenyl) octafluorobutane, 1, 5-bis (4-aminophenyl) decafluoropentane, 1, 7-bis (4-aminophenyl) tetradecanefluoroheptane, 2-bis [4- (3-aminophenyl) hexafiuorophenoxy ] propane, 2, 5-bis [ 2, 5-diaminophenoxy ] hexafluoropropane, 2, 4-bis [ 2, 3-aminophenyl ] hexafluoropropane For bis (4-amino-2-trifluoromethylphenoxy) benzene, 4' -bis (4-amino-2-trifluoromethylphenoxy) biphenyl, 4' -bis (4-amino-3-trifluoromethylphenoxy) biphenyl 4,4' -bis (4-amino-2-trifluoromethylphenoxy) diphenylsulfone, 4' -bis (3-amino-5-trifluoromethylphenoxy) diphenylsulfone, 2-bis [4- (4-amino-3-trifluoromethylphenoxy) phenyl ] hexafluoropropane, 3',5,5' -tetramethyl-4, 4' -diaminobiphenyl, 4' -diamino-2, 2' -bis (trifluoromethyl) biphenyl, 2', 5', 6' -hexafluoro-tolidine, and 4,4' -diaminotetrabiphenyl.
Further, diamines (DA-1) to (DA-18) described in paragraphs 0030 to 0031 of International publication No. 2017/038598 are also preferable.
Further, diamines having 2 or more alkylene glycol units in the main chain as described in paragraphs 0032 to 0034 of International publication No. 2017/038598 may be preferably used.
From the viewpoint of flexibility of the obtained organic film, R 111 Preferably represented by-Ar-L-Ar-. Wherein Ar is each independently an aromatic group, L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO-, -S-, -SO 2 -or-NHCO-, or a group consisting of a combination of more than 2 of the above. Ar is preferably a phenylene group which is preferably a phenylene group, L is preferably an aliphatic hydrocarbon group having 1 or 2 carbon atoms which may be substituted with a fluorine atom-O-, -CO-, -S-or-SO 2 -. The aliphatic hydrocarbon group herein is preferably an alkylene group.
Moreover, from the viewpoint of the i-ray transmittance, R 111 The 2-valent organic group represented by the following formula (51) or (61) is preferable. In particular, from the viewpoints of i-ray transmittance and availability, the 2-valent organic group represented by formula (61) is more preferable.
(51)
[ chemical formula 14]
In the formula (51), R 50 ～R 57 Each independently is a hydrogen atom, a fluorine atom or a 1-valent organic group, R 50 ～R 57 At least 1 of which is a fluorine atom, a methyl group or a trifluoromethyl group, each independently represents a bonding site to a nitrogen atom in formula (2).
As R 50 ～R 57 The 1-valent organic group of (1) may include a C1-10 (preferably C1-6) organic groupUnsubstituted alkyl groups, fluorinated alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms), and the like.
[ chemical formula 15]
In the formula (61), R 58 R is R 59 Each independently represents a fluorine atom, a methyl group or a trifluoromethyl group, and each independently represents a bonding site to a nitrogen atom in formula (2).
Examples of the diamine having the structure of formula (51) or (61) include 2,2 '-dimethylbenzidine, 2' -bis (trifluoromethyl) -4,4 '-diaminobiphenyl, 2' -bis (fluoro) -4,4 '-diaminobiphenyl, and 4,4' -diaminooctafluorobiphenyl. These may be used in 1 kind or in combination of 2 or more kinds.
R in formula (2) 115 Represents a 4-valent organic group. The 4-valent organic group is preferably a 4-valent organic group containing an aromatic ring, and more preferably a group represented by the following formula (5) or (6).
In the formula (5) or (6), each independently represents a bonding site to another structure.
[ chemical formula 16]
In the formula (5), R 112 Is a single bond or a 2-valent linking group, preferably a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom-O-, -CO-, -S-, -SO 2 -and-NHCO-, and combinations thereof, more preferably a single bond, selected from the group consisting of alkylene groups having 1 to 3 carbon atoms which may be substituted with fluorine atoms, -O-, -CO-, -S-, and-SO 2 The radicals in are further preferably selected from the group consisting of-CH 2 -、-C(CF 3 ) 2 -、-C(CH 3 ) 2 -, -O-, -CO-; -S-and-SO 2 -a valence 2 group in (a).
Specifically, R 115 The method is exemplified by the method comprising the step of reacting a tetracarboxylic acid with a solventTetracarboxylic acid residues remaining after removal of the anhydride groups by dianhydride, and the like. As equivalent to R 115 The polyimide precursor may contain only 1 tetracarboxylic dianhydride residue or may contain 2 or more types.
The tetracarboxylic dianhydride is preferably represented by the following formula (O).
[ chemical formula 17]
In the formula (O), R 115 Represents a 4-valent organic group. R is R 115 Is preferably within the range of R in formula (2) 115 The meaning is the same, and the preferred ranges are also the same.
Specific examples of tetracarboxylic dianhydrides include pyromellitic dianhydride (PMDA), 3',4' -biphenyl tetracarboxylic dianhydride, 3',4,4' -diphenyl sulfide tetracarboxylic dianhydride, 3',4' -diphenyl sulfone tetracarboxylic dianhydride, 3',4,4' -diphenyl sulfide tetracarboxylic dianhydride, 3',4,4' -diphenyl sulfone tetracarboxylic dianhydride, 3',4' -benzophenone tetracarboxylic dianhydride, 4' -oxydiphthalic dianhydride, 2,3,6, 7-naphthalene tetracarboxylic dianhydride, 1,4,5, 7-naphthalene tetracarboxylic dianhydride, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride 2, 2-bis (2, 3-dicarboxyphenyl) propane dianhydride, 2-bis (3, 4-dicarboxyphenyl) hexafluoropropane dianhydride, 1, 3-diphenylhexafluoropropane-3, 4-tetracarboxylic dianhydride, 1,4,5, 6-naphthalene tetracarboxylic dianhydride, 2',3,3' -diphenyltetracarboxylic dianhydride, 3,4,9, 10-perylene tetracarboxylic dianhydride, 1,2,4, 5-naphthalene tetracarboxylic dianhydride, 1,4,5, 8-naphthalene tetracarboxylic dianhydride, 1,8,9, 10-phenanthrene tetracarboxylic dianhydride, 1-bis (2, 3-dicarboxyphenyl) ethane dianhydride, 1, 1-bis (3, 4-dicarboxyphenyl) ethane dianhydride, 1,2,3, 4-benzene tetracarboxylic dianhydride, and alkyl groups having 1 to 6 carbon atoms and alkoxy derivatives having 1 to 6 carbon atoms.
As a preferable example, tetracarboxylic dianhydrides (DAA-1) to (DAA-5) described in paragraph 0038 of International publication No. 2017/038598 can be mentioned.
In the formula (2), R 111 R is R 115 At least one of them may further have an OH group. More specifically, as R 111 The residue of a bisaminophenol derivative may be mentioned.
R in formula (2) 113 R is R 114 Each independently represents a hydrogen atom or a 1-valent organic group. The 1-valent organic group preferably contains a linear or branched alkyl group, a cyclic alkyl group, an aromatic group, or a polyalkylene oxide group. Also, R is preferably 113 R is R 114 At least one of them contains a polymerizable group, and more preferably both contain a polymerizable group. Also preferred is R 113 R is R 114 At least one of which contains 2 or more polymerizable groups. The polymerizable group is a group that can undergo a crosslinking reaction by the action of heat, a radical, or the like, and is preferably a radical polymerizable group. Specific examples of the polymerizable group include a group having an ethylenically unsaturated bond, an alkoxymethyl group, a hydroxymethyl group, an acyloxymethyl group, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group, and an amino group. The radical polymerizable group of the polyimide precursor is preferably a group having an ethylenically unsaturated bond.
Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinylphenyl group or the like), (meth) acrylamide group, (meth) acryloyloxy group, a group represented by the following formula (III), and the like, and a group represented by the following formula (III) is preferable.
[ chemical formula 18]
In the formula (III), R 200 Represents a hydrogen atom, a methyl group, an ethyl group or a hydroxymethyl group, preferably a hydrogen atom or a methyl group.
In formula (III), the bonding sites to other structures are represented.
In the formula (III)，R 201 Represents an alkylene group having 2 to 12 carbon atoms, -CH 2 CH(OH)CH 2 -, cycloalkylene or polyalkylene oxide groups.
R 201 Preferable examples of (C) include an alkylene group such as an ethenyl group, an propenyl group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, an octamethylene group, or a dodecamethylene group, a 1, 2-butanediyl group, a 1, 3-butanediyl group, and-CH 2 CH(OH)CH 2 -, polyalkylene oxide, more preferably alkylene such as vinyl, propenyl, -CH 2 CH(OH)CH 2 -, cyclohexyl, polyalkylene oxide, and more preferably alkylene or polyalkylene oxide such as vinyl, propenyl, and the like.
In the present invention, the polyalkylene oxide group means a group to which 2 or more alkylene oxides are directly bonded. The alkylene groups in the plurality of alkylene groups contained in the polyalkylene oxide group may be the same or different, respectively.
When the polyalkylene oxide group contains a plurality of alkylene oxide groups having different alkylene groups, the arrangement of the alkylene oxide groups in the polyalkylene oxide group may be random, may have a block arrangement, or may have an arrangement having an alternating pattern.
The number of carbon atoms of the alkylene group (including the number of carbon atoms of the substituent when the alkylene group has a substituent) is preferably 2 or more, more preferably 2 to 10, still more preferably 2 to 6, still more preferably 2 to 5, still more preferably 2 to 4, particularly preferably 2 or 3, and most preferably 2.
The alkylene group may have a substituent. Preferred substituents include alkyl groups, aryl groups, halogen atoms, and the like.
The number of alkyleneoxy groups contained in the polyalkyleneoxy groups (the number of repeating polyalkyleneoxy groups) is preferably 2 to 20, more preferably 2 to 10, and still more preferably 2 to 6.
The polyalkylene oxide group is preferably a polyethylene oxide group, a polypropylene oxide group, a polytrimethylene oxide group, a polytetramethylene oxide group, or a group in which a plurality of ethylene oxide groups are bonded to a plurality of propylene oxide groups, more preferably a polyethylene oxide group or a polypropylene oxide group, and still more preferably a polyethylene oxide group, from the viewpoints of solvent solubility and solvent resistance. Among the above groups in which a plurality of ethyleneoxy groups and a plurality of propyleneoxy groups are bonded, ethyleneoxy groups and propyleneoxy groups may be arranged randomly, may be arranged in blocks, or may be arranged in an alternating pattern. Preferred modes of repeating the number of ethyleneoxy groups and the like in these groups are as described above.
In the formula (2), R is 113 In the case of hydrogen atoms or R 114 In the case of a hydrogen atom, the polyimide precursor may form a conjugate salt with a tertiary amine compound having an ethylenically unsaturated bond. Examples of such tertiary amine compounds having an ethylenically unsaturated bond include N, N-dimethylaminopropyl methacrylate.
In the formula (2), R 113 R is R 114 At least one of them may be a polar conversion group such as an acid-decomposable group. The acid-decomposable group is not particularly limited as long as it is decomposed by the action of an acid to generate an alkali-soluble group such as a phenolic hydroxyl group or a carboxyl group, but is preferably an acetal group, a ketal group, a silicon-based ether group, a tertiary alkyl ester group, or the like, and more preferably an acetal group or a ketal group from the viewpoint of sensitivity to exposure.
Specific examples of the acid-decomposable group include a t-butoxycarbonyl group, an isopropoxycarbonyl group, a tetrahydropyranyl group, a tetrahydrofuranyl group, an ethoxyethyl group, a methoxyethyl group, an ethoxymethyl group, a trimethylsilyl group, a t-butoxycarbonylmethyl group, and a trimethylsilylether group. Ethoxyethyl or tetrahydrofuranyl is preferred from the viewpoint of exposure sensitivity.
Furthermore, the polyimide precursor preferably has a fluorine atom in the structure. The fluorine atom content in the polyimide precursor is preferably 10 mass% or more, and preferably 20 mass% or less.
In addition, the polyimide precursor may be copolymerized with an aliphatic group having a siloxane structure for the purpose of improving adhesion to the substrate. Specifically, as the diamine, bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, and the like can be mentioned.
The repeating unit represented by the formula (2) is preferably a repeating unit represented by the formula (2-A). That is, at least 1 of the polyimide precursors used in the present invention is preferably a precursor having a repeating unit represented by the formula (2-a). The amplitude of the exposure latitude can be further increased by including the repeating unit represented by the formula (2-a) in the polyimide precursor.
(2-A)
[ chemical formula 19]
In the formula (2-A), A 1 A is a 2 Represents an oxygen atom, R 111 R is R 112 Each independently represents a 2-valent organic group, R 113 R is R 114 Each independently represents a hydrogen atom or a 1-valent organic group, R 113 R is R 114 At least one of them is a group containing a polymerizable group, and preferably both are groups containing a polymerizable group.
A 1 、A 2 、R 111 、R 113 R is R 114 Independently of A in formula (2) 1 、A 2 、R 111 、R 113 R is R 114 The meaning is the same, and the preferred ranges are also the same.
R 112 R in formula (5) 112 The meaning is the same, and the preferred ranges are also the same.
The polyimide precursor may contain 1 kind of repeating unit represented by the formula (2), or may contain 2 or more kinds. Further, a structural isomer of the repeating unit represented by formula (2) may be contained. Furthermore, it is apparent that the polyimide precursor may contain other kinds of repeating units in addition to the repeating unit of the above formula (2).
As an embodiment of the polyimide precursor in the present invention, the content of the repeating unit represented by the formula (2) is 50 mol% or more based on the total repeating unit. The total content is more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all the repeating units in the polyimide precursor other than the terminal may be the repeating unit represented by the formula (2).
The weight average molecular weight (Mw) of the polyimide precursor is preferably 1,500 ～ 100,000, more preferably 1,500 to 70,000, further preferably 5,000 to 70,000, particularly preferably 10,000 ～ 50,000, and most preferably 15,000 ～ 40,000. The number average molecular weight (Mn) is preferably 1,000 to 50,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, and particularly preferably 4,000 to 20,000.
The molecular weight of the polyimide precursor is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more. The upper limit of the molecular weight dispersity of the polyimide precursor is not particularly limited, and is, for example, preferably 7.0 or less, more preferably 6.5 or less, and further preferably 6.0 or less.
In the present specification, the dispersity of the molecular weight is a value calculated from the weight average molecular weight/number average molecular weight.
When the resin composition contains a plurality of polyimide precursors as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the dispersity of at least 1 polyimide precursor be within the above-mentioned ranges. Further, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated for the plurality of polyimide precursors as 1 resin are each within the above-mentioned ranges.
[ polyimide ]
The polyimide used in the present invention may be an alkali-soluble polyimide or a polyimide soluble in a developer mainly containing an organic solvent.
In the present specification, the alkali-soluble polyimide means a polyimide in which 0.1g or more of polyimide is dissolved in 100g of a 2.38 mass% aqueous tetramethylammonium solution at 23 ℃, and from the viewpoint of pattern formability, a polyimide in which 0.5g or more of polyimide is dissolved is preferable, and a polyimide in which 1.0g or more of polyimide is more preferable. The upper limit of the amount of dissolution is not particularly limited, but is preferably 100g or less.
Further, from the viewpoints of film strength and insulation properties of the obtained organic film, the polyimide is preferably a polyimide having a plurality of imide structures in the main chain.
In the present specification, "main chain" means a relatively longest bonding chain among molecules of a polymer compound constituting a resin, and "side chain" means a bonding chain other than the above.
Fluorine atom-
From the viewpoint of film strength of the obtained organic film, the polyimide also preferably has fluorine atoms.
For example, R in the repeating unit represented by the following formula (4) is preferably a fluorine atom 132 Or R in the repeating unit represented by the following formula (4) 131 R contained as a fluorinated alkyl group in the repeating unit represented by the following formula (4) is more preferable 132 Or R in the repeating unit represented by the following formula (4) 131 。
The amount of fluorine atoms is preferably 5 mass% or more and preferably 20 mass% or less relative to the total mass of the polyimide.
Silicon atom-
From the viewpoint of film strength of the obtained organic film, the polyimide also preferably has silicon atoms.
The silicon atom is preferably R contained in the repeating unit represented by the following formula (4) 131 More preferably, R is contained as an organomodified (poly) siloxane structure described later in the repeating unit represented by the following formula (4) 131 。
The side chain of the polyimide may contain the silicon atom or the organomodified (poly) siloxane structure, but is preferably contained in the main chain of the polyimide.
The amount of silicon atoms is preferably 1 mass% or more, more preferably 20 mass% or less, relative to the total mass of the polyimide.
Ethylenic unsaturation
From the viewpoint of the film strength of the obtained organic film, polyimide preferably has an ethylenically unsaturated bond.
The polyimide may have an ethylenically unsaturated bond at the terminal of the main chain, or may have an ethylenically unsaturated bond in a side chain, and preferably has an ethylenically unsaturated bond in a side chain.
The ethylenically unsaturated bond is preferably radically polymerizable.
The ethylenically unsaturated bond is preferably R contained in the repeating unit represented by the following formula (4) 132 Or R in the repeating unit represented by the following formula (4) 131 R contained in the repeating unit represented by the following formula (4) is more preferable as a group having an ethylenically unsaturated bond 132 Or R in the repeating unit represented by the following formula (4) 131 。
Wherein the ethylenically unsaturated bond is preferably R contained in the repeating unit represented by the following formula (4) 131 R contained in the repeating unit represented by the following formula (4) is more preferable as a group having an ethylenically unsaturated bond 131 。
Examples of the group having an ethylenically unsaturated bond include a group having a vinyl group which may be substituted by direct bonding to an aromatic ring, such as a vinyl group, an allyl group, and a vinylphenyl group, (meth) acrylamido group, (meth) acryloyloxy group, and a group represented by the following formula (IV).
[ chemical formula 20]
In the formula (IV), R 20 Represents a hydrogen atom, a methyl group, an ethyl group or a hydroxymethyl group, preferably a hydrogen atom or a methyl group.
In the formula (IV), R 21 Represents an alkylene group having 2 to 12 carbon atoms, -O-CH 2 CH(OH)CH 2 -, -C (=O) O-, -O (C=O) NH-, a (poly) alkyleneoxy group having 2 to 30 carbon atoms (alkylene group having 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, particularly preferably 2 or 3 carbon atoms, a repeating number of preferably 1 to 12, more preferably 1 to 6 carbon atoms, particularly preferably 1 to 3 carbon atoms) or a combination of 2 or more.
The alkylene group having 2 to 12 carbon atoms may be any of a linear, branched, cyclic, or a combination thereof.
The alkylene group having 2 to 12 carbon atoms is preferably an alkylene group having 2 to 8 carbon atoms, and more preferably an alkylene group having 2 to 4 carbon atoms.
Wherein R is 21 The group represented by any one of the following formulas (R1) to (R3) is preferable, and the group represented by the formula (R1) is more preferable.
[ chemical formula 21]
In the formulae (R1) to (R3), L represents a single bond, an alkylene group having 2 to 12 carbon atoms, a (poly) alkyleneoxy group having 2 to 30 carbon atoms, or a group obtained by bonding these groups together in an amount of 2 or more, X represents an oxygen atom or a sulfur atom, X represents a bonding site to another structure, and ∈ represents R in the formula (IV) 21 Bonding sites for the bonded oxygen atoms.
In the formulae (R1) to (R3), a preferable mode of the alkylene group having 2 to 12 carbon atoms or the (poly) alkyleneoxy group having 2 to 30 carbon atoms in L is the same as that of the above-mentioned R 21 The preferred mode of the alkylene group having 2 to 12 carbon atoms or the (poly) alkyleneoxy group having 2 to 30 carbon atoms is the same.
In the formula (R1), X is preferably an oxygen atom.
In the formulae (R1) to (R3), the meanings are the same as those in the formula (IV), and preferred modes are also the same.
The structure represented by the formula (R1) can be obtained, for example, by reacting a polyimide having a hydroxyl group such as a phenolic hydroxyl group with a compound having an isocyanate group and an ethylenically unsaturated bond (for example, 2-isocyanatoethyl methacrylate or the like).
The structure represented by the formula (R2) can be obtained, for example, by reacting a polyimide having a carboxyl group with a compound having a hydroxyl group and an ethylenic unsaturated bond (for example, 2-hydroxyethyl methacrylate or the like).
The structure represented by the formula (R3) can be obtained, for example, by reacting a polyimide having a hydroxyl group such as a phenolic hydroxyl group with a compound having a glycidyl group and an ethylenically unsaturated bond (for example, glycidyl methacrylate or the like).
In formula (IV), the bond site to other structure is preferably a bond site to the main chain of polyimide.
The amount of the ethylenic unsaturated bond is preferably 0.0001 to 0.1mol/g, more preferably 0.0005 to 0.05mol/g, relative to the total mass of the polyimide.
Polymerizable groups other than those having an ethylenically unsaturated bond
The polyimide may contain a polymerizable group other than the group having an ethylenically unsaturated bond.
Examples of the polymerizable group other than the group having an ethylenically unsaturated bond include a cyclic ether group such as an epoxy group and an oxetanyl group, an alkoxymethyl group such as a methoxymethyl group, and a hydroxymethyl group.
For example, the polymerizable group other than the group having an ethylenically unsaturated bond is preferably R contained in the repeating unit represented by the following formula (4) 131 。
The amount of the polymerizable group other than the group having an ethylenically unsaturated bond is preferably 0.0001 to 0.1mol/g, more preferably 0.001 to 0.05mol/g, relative to the total mass of the polyimide.
Polarity-switching group-
The polyimide may have a polar conversion group such as an acid-decomposable group. Acid-decomposable groups in polyimide and R of the above formula (2) 113 R is R 114 The acid decomposable groups described in the above are the same, and the preferable modes are also the same.
The polarity-converting group is, for example, R contained in the repeating unit represented by the following formula (4) 131 、R 132 The ends of polyimide, and the like.
Acid number-
When the polyimide is used for alkali development, the acid value of the polyimide is preferably 30mgKOH/g or more, more preferably 50mgKOH/g or more, and still more preferably 70mgKOH/g or more from the viewpoint of improving the developability.
The acid value is preferably 500mgKOH/g or less, more preferably 400mgKOH/g or less, and still more preferably 200mgKOH/g or less.
When polyimide is used for development (for example, the "solvent development" described later) using a developer mainly composed of an organic solvent, the acid value of polyimide is preferably 1 to 35mgKOH/g, more preferably 2 to 30mgKOH/g, and still more preferably 5 to 20mgKOH/g.
The acid value is measured by a known method, for example, by the method described in JIS K0070: the method in 1992.
The acid group contained in the polyimide is preferably an acid group having a pKa of 0 to 10, more preferably an acid group having a pKa of 3 to 8, from the viewpoint of both storage stability and developability.
pKa is a value whose equilibrium constant Ka is expressed by its negative common logarithmic pKa taking into account the dissociation reaction of hydrogen ions released by the acid. In the present specification, unless otherwise specified, pKa is set to a calculated value based on ACD/ChemSketch (registered trademark). Alternatively, reference may be made to the values described in the "reform 5 th edition chemical review base" by the japan chemical society.
In the case where the acid group is a polybasic acid such as phosphoric acid, the pKa is a first dissociation constant.
As such an acid group, the polyimide preferably contains at least 1 selected from a carboxyl group and a phenolic hydroxyl group, more preferably contains a phenolic hydroxyl group.
Phenolic hydroxyl radical-
From the viewpoint of making the development speed by the alkali developer appropriate, polyimide preferably has a phenolic hydroxyl group.
The polyimide may have a phenolic hydroxyl group at the terminal of the main chain or may have a phenolic hydroxyl group in a side chain.
The phenolic hydroxyl group is preferably R contained in the repeating unit represented by the following formula (4) 132 Or R in the repeating unit represented by the following formula (4) 131 。
The amount of the phenolic hydroxyl groups is preferably 0.1 to 30mol/g, more preferably 1 to 20mol/g, relative to the total mass of the polyimide.
The polyimide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure, and preferably contains a repeating unit represented by the following formula (4).
[ chemical formula 22]
In the formula (4), R 131 Represents a 2-valent organic group, R 132 Represents a 4-valent organic group.
When the polymerizable group is present, the polymerizable group may be located at R 131 R is R 132 At least one of the above may be located at the terminal of polyimide as shown in the following formula (4-1) or formula (4-2).
(4-1)
[ chemical formula 23]
In the formula (4-1), R 133 The other groups are as defined for formula (4) and are polymerizable groups.
(4-2)
[ chemical formula 24]
R 134 R is R 135 At least one of them is a polymerizable group, and if not, an organic group, and the other groups have the same meaning as in formula (4).
Examples of the polymerizable group include the group containing an ethylenically unsaturated bond and a crosslinkable group other than the group containing an ethylenically unsaturated bond.
R 131 Represents a 2-valent organic group. Examples of the 2-valent organic group include R in the formula (2) 111 The same groups, preferably the same ranges.
And as R 131 The diamine residue remaining after removal of the amino group of the diamine may be mentioned. Examples of the diamine include aliphatic, cyclic aliphatic and aromatic diamines. Specific examples thereof include R in formula (2) of polyimide precursor 111 Is an example of (a).
From the viewpoint of more effectively suppressing warpage upon calcinationConsider R 131 Diamine residues having at least 2 alkylene glycol units in the backbone are preferred. More preferably, either one or both of the ethylene glycol chain and the propylene glycol chain contain 2 or more diamines in total in one molecule, and still more preferably, the diamine contains no aromatic ring.
Examples of diamines containing 2 or more in total in one molecule of either or both of the ethylene glycol chain and the propylene glycol chain include JEFFAMINE (registered trademark) KH-511, ED-600, ED-900, ED-2003, EDR-148, EDR-176, D-200, D-400, D-2000, D-4000 (trade name, manufactured by Huntsman Corporation), 1- (2- (2- (2-aminopropoxy) ethoxy) propoxy) propan-2-amine, 1- (1- (2-aminopropoxy) propan-2-yl) oxy) propan-2-amine, and the like, but are not limited thereto.
R 132 Represents a 4-valent organic group. Examples of the 4-valent organic group include R in the formula (2) 115 The same groups, preferably the same ranges.
For example, as R 115 The 4 links of the exemplified 4-valent organic group are bonded to 4-C (=o) -moieties in the above formula (4) to form a condensed ring.
And R is 132 The tetracarboxylic acid residue remaining after the acid anhydride group is removed from the tetracarboxylic dianhydride may be mentioned. Specific examples thereof include R in formula (2) of polyimide precursor 115 Is an example of (a). From the viewpoint of the strength of the organic film, R 132 Preferably an aromatic diamine residue having 1 to 4 aromatic rings.
Also preferred is R 131 And R is 132 At least one of them has a 0H group. More specifically, as R 131 Examples of the compounds include 2, 2-bis (3-hydroxy-4-aminophenyl) propane, 2-bis (3-hydroxy-4-aminophenyl) hexafluoropropane, 2-bis (3-amino-4-hydroxyphenyl) propane, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, and the above-mentioned compounds (DA-1) to (DA-18) as R 132 The above-mentioned (DAA-1) to (DAA-5) are more preferable examples.
Furthermore, polyimide is also preferred to have fluorine atoms in the structure. The fluorine atom content in the polyimide precursor is preferably 10 mass% or more, and preferably 20 mass% or less.
In addition, polyimide may be copolymerized with an aliphatic group having a siloxane structure for the purpose of improving adhesion to a substrate. Specifically, examples of the diamine component include bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, and the like.
In order to improve the storage stability of the resin composition, the main chain end of the polyimide is preferably blocked with a blocking agent such as a monoamine, an acid anhydride, a monocarboxylic acid, a monoacyl chloride compound, or an active monoester compound. Among them, monoamines are more preferably used, and preferable examples of monoamines include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene, 1-hydroxy-6-aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-aminonaphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4-aminobenzenesulfonic acid, 3-amino-4, 6-dihydroxypyrimidine, 2-amino-phenol, 3-aminophenol, 4-aminophenol, and thiophenol. These may be used in an amount of 2 or more, and various terminal groups may be introduced by reacting various kinds of blocking agents.
Imidization ratio (ring closure ratio)
The imidization ratio (also referred to as "ring closure ratio") of the polyimide is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more from the viewpoints of film strength, insulation property, and the like of the obtained organic film.
The upper limit of the imidization ratio is not particularly limited, and may be 100% or less.
The imidization rate can be measured, for example, by the following method.
Measurement of infrared absorption spectrum of polyimideThe absorption peak derived from the imide structure, namely 1377cm, was obtained -1 A nearby peak intensity P1. Next, the polyimide was heat-treated at 350℃for 1 hour, and then the infrared absorption spectrum was measured again to obtain 1377cm -1 A nearby peak intensity P2. The imidization ratio of polyimide can be obtained by using the obtained peak intensities P1 and P2 according to the following formula.
Imidization ratio (%) = (peak intensity P1/peak intensity P2) ×100
The polyimide may have a polyimide composition comprising all 1R 131 Or R is 132 The repeating unit represented by the above formula (4) may have a structure comprising at least 2R 131 Or R is 132 The repeating unit represented by the above formula (4). The polyimide may contain a repeating unit represented by the above formula (4) or another kind of repeating unit. Examples of the other types of repeating units include repeating units represented by the above formula (2).
For example, polyimide can be synthesized as follows: the polyimide precursor is obtained by a method in which a tetracarboxylic dianhydride is reacted with a diamine (a part of which is substituted with a monoamine, i.e., a capping agent) at a low temperature, a method in which a tetracarboxylic dianhydride is reacted with a diamine (a part of which is substituted with an acid anhydride or a monoacylchloride compound or an active monoester compound, i.e., a capping agent) at a low temperature, a method in which a diester is obtained from a tetracarboxylic dianhydride and an alcohol and then reacted in the presence of a diamine (a part of which is substituted with a monoamine, i.e., a capping agent) and a condensing agent, a method in which the remaining dicarboxylic acid is subjected to an acyl chlorination with a diamine (a part of which is substituted with a monoamine, i.e., a capping agent) and then a method in which a part of the imide structure is introduced by a known imidization method or a method in which a part of the imide structure is stopped halfway is used, and a method in which a part of the imide structure is introduced by further mixing a fully imidized polymer and a polyimide precursor thereof. Further, other known polyimide synthesis methods can be applied.
The polyimide preferably has a weight average molecular weight (Mw) of 1,500 ～ 100,000, more preferably 1,500 to 70,000, still more preferably 5,000 to 70,000, particularly preferably 10,000 ～ 50,000, and most preferably 15,000 ～ 40,000. By setting the weight average molecular weight to 1,500 or more, the bending resistance of the cured film can be improved. In order to obtain an organic film excellent in mechanical properties (for example, elongation at break), the weight average molecular weight is particularly preferably 15,000 or more.
The number average molecular weight (Mn) of the polyimide is preferably 1,000 to 40,000, more preferably 2,000 to 40,000, still more preferably 3,000 to 30,000, and particularly preferably 4,000 to 20,000.
The molecular weight of the polyimide is preferably 1.5 or more, more preferably 1.8 or more, and even more preferably 2.0 or more. The upper limit of the molecular weight dispersity of the polyimide precursor is not particularly limited, and is, for example, preferably 7.0 or less, more preferably 6.5 or less, and further preferably 6.0 or less.
When the resin composition contains a plurality of polyimides as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity of at least 1 polyimide be in the above-mentioned range. Further, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated for the plurality of kinds of polyimide as 1 kind of resin are each within the above-mentioned ranges.
[ polybenzoxazole precursor ]
The polybenzoxazole precursor used in the present invention is not particularly limited in its structure, and preferably contains a repeating unit represented by the following formula (3).
[ chemical formula 25]
In the formula (3), R 121 Represents a 2-valent organic group, R 122 Represents a 4-valent organic group, R 123 R is R 124 Each independently represents a hydrogen atom or a 1-valent organic group.
In the formula (3), R 123 R is R 124 Respectively with R in the formula (2) 113 The meaning is the same, and the preferred ranges are also the same. That is to say,preferably at least one is a polymerizable group.
In the formula (3), R 121 Represents a 2-valent organic group. The 2-valent organic group is preferably a group containing at least one of an aliphatic group and an aromatic group. As the aliphatic group, a straight chain aliphatic group is preferable. R is R 121 Dicarboxylic acid residues are preferred. The dicarboxylic acid residues may be used in an amount of 1 or 2 or more.
The dicarboxylic acid residue is preferably an aliphatic group-containing dicarboxylic acid or an aromatic group-containing dicarboxylic acid residue, and more preferably an aromatic group-containing dicarboxylic acid residue.
The dicarboxylic acid containing an aliphatic group is preferably a dicarboxylic acid containing a linear or branched (preferably linear) aliphatic group, and more preferably a dicarboxylic acid composed of a linear or branched (preferably linear) aliphatic group and 2-COOH. The number of carbon atoms of the linear or branched (preferably linear) aliphatic group is preferably 2 to 30, more preferably 2 to 25, still more preferably 3 to 20, still more preferably 4 to 15, and particularly preferably 5 to 10. The straight chain aliphatic group is preferably an alkylene group.
As the dicarboxylic acid comprising a straight-chain aliphatic group, examples thereof include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methylsuccinic acid, 2-dimethylsuccinic acid, 2, 3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, and 2-methylglutaric acid, 3-methylglutaric acid, 2-dimethylglutaric acid, 3-dimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoro-adipic acid, 3-methyladipic acid, pimelic acid, 2, 6-tetramethylpimelic acid, suberic acid, dodecafluoro-suberic acid, azelaic acid sebacic acid, hexadecanedioic acid, 1, 9-azelaic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, eicosanedioic acid, heneicosanedioic acid, docosanedioic acid, ditridecanedioic acid, tetracosanedioic acid, pentacosanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, icosanedioic acid, triacontanedioic acid, tricosanedioic acid, diglycolic acid, dicarboxylic acids represented by the following formula, and the like.
[ chemical formula 26]
(wherein Z is a hydrocarbon group having 1 to 6 carbon atoms and n is an integer of 1 to 6.)
The dicarboxylic acid having an aromatic group is preferably a dicarboxylic acid having the following aromatic group, and more preferably a dicarboxylic acid consisting of only a group having the following aromatic group and 2-COOH.
[ chemical formula 27]
Wherein A represents a member selected from the group consisting of-CH 2 -、-O-、-S-、-SO 2 -、-CO-、-NHCO-、-C(CF 3 ) 2 -and-C (CH) 3 ) 2 The 2-valent groups in (a) represent, independently of each other, bonding sites to other structures.
Specific examples of the dicarboxylic acid containing an aromatic group include 4,4 '-carbonyldibenzoic acid, 4' -dicarboxydiphenyl ether, and terephthalic acid.
In the formula (3), R 122 Represents a 4-valent organic group. R in the above formula (2) is used as a 4-valent organic group 115 The meaning is the same, and the preferred ranges are also the same.
And R is 122 Preferable examples of the group derived from a bisaminophenol derivative include 3,3 '-diamino-4, 4' -dihydroxybiphenyl, 4 '-diamino-3, 3' -dihydroxybiphenyl, 3 '-diamino-4, 4' -dihydroxydiphenyl sulfone, 4 '-diamino-3, 3' -dihydroxydiphenyl sulfone, bis- (3-amino-4-hydroxyphenyl) methane, 2-bis (3-amino-4-hydroxyphenyl) propane, 2-bis- (3-amino-4-hydroxyphenyl) hexafluoropropane, and 2, 2-bis- (4-amino-3-hydroxyphenyl) hexa-ne Fluoropropane, bis- (4-amino-3-hydroxyphenyl) methane, 2-bis-mono (4-amino-3-hydroxyphenyl) propane, 4 '-diamino-3, 3' -dihydroxybenzophenone, 3 '-diamino-4, 4' -dihydroxybenzophenone, 4 '-diamino-3, 3' -dihydroxydiphenyl ether, 3 '-diamino-4, 4' -dihydroxydiphenyl ether, 1, 4-diamino-2, 5-dihydroxybenzene, 1, 3-diamino-2, 4-dihydroxybenzene, 1, 3-diamino-4, 6-dihydroxybenzene, and the like. These bisaminophenols may be used alone or in combination.
Among the bisaminophenol derivatives, those having the following aromatic groups are preferable.
[ chemical formula 28]
Wherein X is 1 Represents-o-, -S-, -C (CF) 3 ) 2 -、-CH 2 -、-SO 2 -, -NHCO-, and # each represent a bonding site to another structure. R represents a hydrogen atom or a 1-valent substituent, preferably a hydrogen atom or a hydrocarbon group, more preferably a hydrogen atom or an alkyl group. And R is 122 The structure represented by the above formula is also preferable. R is R 122 In the case of the structure represented by the above formula, a total of 4 are preferably any 2 of them are R in the formula (3) 122 The bonding site of the bonded nitrogen atom and the other 2 are R in the formula (3) 122 The bonding site of the bonded oxygen atom is more preferably 2 x is R in formula (3) 122 The bonding site of the bonded oxygen atom and 2# are R in formula (3) 122 The bonding site or 2 of the bonded nitrogen atoms is R in formula (3) 122 The bonding site of the bonded nitrogen atom and 2 # are R in formula (3) 122 The bonding site of the bonded oxygen atom is more preferably 2 x is R in formula (3) 122 The bonding site of the bonded oxygen atom and 2# are R in formula (3) 122 Bonding sites for the bonded nitrogen atoms.
The bisaminophenol derivative is also preferably a compound represented by the formula (A-s).
[ chemical formula 29]
In the formula (A-s), R 1 Is selected from hydrogen atom, alkylene, substituted alkylene, -O-, -S-, -SO 2 -, -CO-, -NHCO-; a single bond or an organic group in the following formula (A-sc). R is R 2 The hydrogen atom, alkyl group, alkoxy group, acyloxy group, and cyclic alkyl group may be the same or different. R is R 3 The hydrogen atom, the linear or branched alkyl group, the alkoxy group, the acyloxy group, or the cyclic alkyl group may be the same or different.
[ chemical formula 30]
(in the formula (A-sc): represents an aromatic ring bond with an aminophenol group of the bisaminophenol derivative represented by the formula (A-s))
In the above formula (A-s), it is considered that the amino group is located at the ortho position to the phenolic hydroxyl group, i.e., at R 3 The substituent is particularly preferable in that the distance between the carbonyl carbon of the amide bond and the hydroxyl group is further shortened, and the effect of improving the cyclization ratio at the time of curing at low temperature is further improved.
In the above formula (A-s), R 2 Is alkyl and R 3 In the case of an alkyl group, the effect of high transparency to i-rays and high cyclization ratio at the time of curing at low temperature is maintained, and thus is preferable.
In the above formula (A-s), R 1 Further preferred is an alkylene group or a substituted alkylene group. As R 1 Specific examples of the alkylene group and substituted alkylene group include straight-chain or branched alkyl groups having 1 to 8 carbon atoms, and more preferable ones are those having sufficient solubility in a solvent and being capable of obtaining a polybenzoxazole precursor excellent in balance while maintaining high transparency to i-rays and a high cyclization ratio at the time of curing at a low temperatureis-CH 2 -、-CH(CH 3 )-、-C(CH 3 ) 2 -。
Examples of the production method of the bisaminophenol derivative represented by the formula (A-s) include paragraphs 0085 to 0094 and example 1 (0189 to 0190) of Japanese unexamined patent publication No. 2013-256506, which are incorporated herein by reference.
Specific examples of the structure of the bisaminophenol derivative represented by the formula (A-s) include those described in paragraphs 0070 to 0080 of Japanese patent application laid-open No. 2013-256506, which are incorporated herein by reference. Of course, these are not limiting.
In addition to the repeating units of formula (3) above, the polybenzoxazole precursor may also contain other types of repeating units.
From the viewpoint of being able to suppress warpage accompanying closed-loop generation, the polybenzoxazole precursor preferably contains a diamine residue represented by the following formula (SL) as another kind of repeating unit.
[ chemical formula 31]
In the formula (SL), Z has a structure a and a structure b, R 1s Is hydrogen atom or hydrocarbon group with 1-10 carbon atoms, R 2s Is a hydrocarbon group of 1 to 10 carbon atoms, R 3s 、R 4s 、R 5s 、R 6s At least 1 of them is an aromatic group, and the remainder is a hydrogen atom or an organic group having 1 to 30 carbon atoms, and may be the same or different. The polymerization of the a and b structures may be block polymerization or random polymerization. Regarding the mole% of the Z moiety, the a structure is 5 to 95 mole%, the b structure is 95 to 5 mole%, and a+b is 100 mole%.
In the formula (SL), preferable Z is R in the b structure 5s R is R 6s Is phenyl. The molecular weight of the structure represented by the formula (SL) is preferably 400 to 4,000, more preferably 500 to 3,000. By setting the molecular weight to the above range, the polybenzoxazole precursor can be reduced more effectivelyThe elastic modulus of the body after dehydration and ring closure can be used to achieve both the effect of suppressing warpage and the effect of improving solvent solubility.
When the diamine residue represented by the formula (SL) is contained as another type of repeating unit, it is preferable that the diamine residue further contains a tetracarboxylic acid residue remaining after the acid anhydride group is removed from the tetracarboxylic acid dianhydride as a repeating unit. Examples of such tetracarboxylic acid residues include R in formula (2) 115 Is an example of (a).
For example, the weight average molecular weight (Mw) of the polybenzoxazole precursor is preferably 1,500 to 70,000, more preferably 18,000 ～ 30,000, further preferably 20,000 ～ 29,000, and particularly preferably 22,000 ～ 28,000. The number average molecular weight (Mn) is preferably 1,000 to 14,000, more preferably 7,200 to 14,000, still more preferably 8,000 to 12,000, and particularly preferably 9,200 to 11,200.
The dispersion degree of the molecular weight of the polybenzoxazole precursor is preferably 1.4 or more, more preferably 1.5 or more, and further preferably 1.6 or more. The upper limit of the molecular weight dispersity of the polybenzoxazole precursor is not particularly limited, and is, for example, preferably 2.6 or less, more preferably 2.5 or less, further preferably 2.4 or less, still more preferably 2.3 or less, and still more preferably 2.2 or less.
When the resin composition contains a plurality of polybenzoxazole precursors as a specific resin, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity of at least 1 polybenzoxazole precursor are within the above-mentioned ranges. It is also preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated for the plurality of polybenzoxazole precursors as 1 resin are each within the above ranges.
[ polybenzoxazole ]
The polybenzoxazole is not particularly limited as long as it is a polymer compound having a benzoxazole ring, but is preferably a compound represented by the following formula (X), more preferably a compound represented by the following formula (X) and having a polymerizable group. The polymerizable group is preferably a radical polymerizable group. Further, the compound may be a compound represented by the following formula (X) and having a polar conversion group such as an acid-decomposable group.
[ chemical formula 32]
In the formula (X), R 133 Represents a 2-valent organic group, R 134 Represents a 4-valent organic group.
When the polar group such as a polymerizable group or an acid-decomposable group is present, the polar group such as a polymerizable group or an acid-decomposable group may be present at R 133 R is R 134 At least one of the compounds may be located at the terminal of polybenzoxazole as shown by the following formula (X-1) or formula (X-2).
(X-1)
[ chemical formula 33]
In the formula (X-1), R 135 R is R 136 At least one of them is a polar conversion group such as a polymerizable group or an acid-decomposable group, and if it is not a polar conversion group such as a polymerizable group or an acid-decomposable group, it is an organic group, and the other groups have the same meaning as in formula (X).
(X-2)
[ chemical formula 34]
In the formula (X-2), R 137 The other groups are the same as those of the formula (X) except that the other groups are a polar conversion group such as a polymerizable group or an acid-decomposable group, and the other groups are substituents.
The polar conversion group such as a polymerizable group or an acid-decomposable group is the same as the polymerizable group described in the polymerizable group of the polyimide precursor.
R 133 Represents a 2-valent organic group. Examples of the 2-valent organic group include an aliphatic group and an aromatic group. Specific examples include the formula of polybenzoxazole precursor3) R in (a) 121 Is an example of (a). Further, the preferable examples and R 121 The same applies.
R 134 Represents a 4-valent organic group. Examples of the 4-valent organic group include R in formula (3) of the polybenzoxazole precursor 122 Is an example of (a). Further, the preferable examples and R 122 The same applies.
For example, as R 122 The 4 links of the exemplified 4-valent organic group are bonded to the nitrogen atom and the oxygen atom in the above formula (X) to form a condensed ring. For example, R 134 In the case of the following organic group, the following structure is formed. In the following structures, the bonding sites with nitrogen or oxygen atoms in formula (X) are represented, respectively.
[ chemical formula 35]
The oxazolization ratio of the polybenzoxazole is preferably 85% or more, more preferably 90% or more. The upper limit is not particularly limited and may be 100%. When the rate of the oxazolization is 85% or more, the film shrinkage due to the closed loop occurring when the film is oxazolized by heating is reduced, and thus the occurrence of warpage can be effectively suppressed.
For example, the above-mentioned oxazolification rate can be measured by the following method.
The infrared absorption spectrum of polybenzoxazole was measured to obtain 1650cm as an absorption peak of the amide structure derived from the precursor -1 A nearby peak intensity Q1. Next, the film is used at 1490cm -1 The absorption intensity of the aromatic ring observed nearby was normalized. After the polybenzoxazole precursor was heat-treated at 350℃for 1 hour, the infrared absorption spectrum was measured again to obtain 1650cm -1 The peak intensity Q2 in the vicinity and at 1490cm -1 The absorption intensity of the aromatic ring observed nearby was normalized. Using the normalized values of the obtained peak intensities Q1, Q2, the oxazolization ratio of the polybenzoxazole can be obtained according to the following formula.
Oxazolification rate (%) = (normalized value of peak intensity Q1/normalized value of peak intensity Q2) ×100
Polybenzoxazole can have a structure containing all 1R 131 Or R is 132 The repeating unit of the above formula (X) may have at least 2R's of different kinds 131 Or R is 132 The repeating unit of formula (X) above. The polybenzoxazole may contain a repeating unit of other types in addition to the repeating unit of the above formula (X).
For example, a bisaminophenol derivative is reacted with a compound comprising R 133 The polybenzoxazole precursor is obtained by reacting a dicarboxylic acid or a compound selected from the dicarboxylic acid dichloride, the dicarboxylic acid derivative, and the like of the above dicarboxylic acid, and then oxazolized by a known oxazolization reaction method.
In the case of dicarboxylic acid, an active ester-type dicarboxylic acid derivative obtained by reacting 1-hydroxy-1, 2, 3-benzotriazole or the like in advance may be used in order to improve the reaction yield or the like.
The weight average molecular weight (Mw) of the polybenzoxazole is preferably 1,500 to 70,000, more preferably 5,000 to 70,000, further preferably 8,000 to 50,000, particularly preferably 10,000 ～ 30,000. By setting the weight average molecular weight to 1,500 or more, the bending resistance of the cured film can be improved. In order to obtain an organic film excellent in mechanical characteristics, the weight average molecular weight is particularly preferably 20,000 or more. When the polybenzoxazole is contained in an amount of 2 or more, it is preferable that the weight average molecular weight of at least 1 polybenzoxazole is within the above range.
The number average molecular weight (Mn) of the polybenzoxazole is preferably 1,000 to 14,000, more preferably 7,200 to 14,000, further preferably 8,000 to 12,000, and particularly preferably 9,200 to 11,200.
The molecular weight of the polybenzoxazole has a dispersity of preferably 1.4 or more, more preferably 1.5 or more, and still more preferably 1.6 or more. The upper limit of the dispersity of the molecular weight of the polybenzoxazole is not particularly limited, and is, for example, preferably 2.6 or less, more preferably 2.5 or less, further preferably 2.4 or less, further preferably 2.3 or less, and further preferably 2.2 or less.
When the resin composition contains a plurality of polybenzoxazoles as a specific resin, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity of at least 1 polybenzoxazole be within the above-mentioned ranges. It is also preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated for the plurality of polybenzoxazoles as 1 resin are each within the above-mentioned ranges.
[ Polyamide imide precursor ]
The polyamideimide precursor preferably comprises a repeating unit represented by the following formula (PAI-2).
[ chemical formula 36]
In the formula (PAI-2), R 117 Represents a 3-valent organic group, R 111 Represents a 2-valent organic group, A 2 Represents an oxygen atom or-NH-, R 113 Represents a hydrogen atom or a 1-valent organic group.
In the formula (PAI-2), R 117 Examples of the group include a linear or branched aliphatic group, a cyclic aliphatic group, an aromatic group, a heteroaromatic group, and a group in which these groups are linked by a single bond or a linking group to 2 or more, preferably a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 6 to 20 carbon atoms, and a group in which these groups are combined by a single bond or a linking group to 2 or more, more preferably an aromatic group having 6 to 20 carbon atoms, or a group in which aromatic groups having 6 to 20 carbon atoms are combined by a single bond or a linking group to 2 or more.
As the above-mentioned linking group, preferably, -0-, -S-, -C (=O) -, -S (=O) 2 -, alkylene halide, arylene, or a linking group obtained by bonding 2 or more of these groups, more preferably-O-, -S-, alkylene halide, arylene, or a linking group obtained by bonding 2 or more of these.
The alkylene group is preferably an alkylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and still more preferably an alkylene group having 1 to 4 carbon atoms.
The halogenated alkylene group is preferably a halogenated alkylene group having 1 to 20 carbon atoms, more preferably a halogenated alkylene group having 1 to 10 carbon atoms, and still more preferably a halogenated alkylene group having 1 to 4 carbon atoms. The halogen atom in the halogenated alkylene group includes a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like, and a fluorine atom is preferable. The above-mentioned halogenated alkylene group may have a hydrogen atom or may be substituted with a halogen atom in all hydrogen atoms, and preferably all hydrogen atoms are substituted with halogen atoms. Examples of the preferred halogenated alkylene group include (bistrifluoromethyl) methylene.
The arylene group is preferably a phenylene group or a naphthylene group, more preferably a phenylene group, and still more preferably a 1, 3-phenylene group or a 1, 4-phenylene group.
And R is 117 Preferably from tricarboxylic acid compounds in which at least 1 carboxyl group can be halogenated. As the above halogenation, chlorination is preferable.
In the present invention, a compound having 3 carboxyl groups is referred to as a tricarboxylic acid compound.
2 carboxyl groups among 3 carboxyl groups of the above-mentioned tricarboxylic acid compound may be anhydrated.
Examples of the tricarboxylic acid compound which may be halogenated for producing the polyamideimide precursor include branched aliphatic, cyclic aliphatic, and aromatic tricarboxylic acid compounds.
Only 1 kind of these tricarboxylic acid compounds may be used, or 2 or more kinds may be used.
Specifically, as the tricarboxylic acid compound, a tricarboxylic acid compound containing a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or a group obtained by combining 2 or more of these groups by a single bond or a linking group is preferable, and a tricarboxylic acid compound containing an aromatic group having 6 to 20 carbon atoms or a group obtained by combining 2 or more of aromatic groups having 6 to 20 carbon atoms by a single bond or a linking group is more preferable.
Further, specific examples of the tricarboxylic acid compound include 1,2, 3-propane Tricarboxylic acid, 1,3, 5-pentanetricarboxylic acid, citric acid, trimellitic acid, 2,3, 6-naphthalene tricarboxylic acid, phthalic acid (or phthalic anhydride) and benzoic acid by single bond, -O-, -CH 2 -、-C(CH 3 ) 2 -、-C(CF 3 ) 2 -、-SO 2 Or a compound in which phenylene groups are bonded.
These compounds may be those obtained by anhydrating 2 carboxyl groups (for example, trimellitic anhydride), or those obtained by halogenating at least 1 carboxyl group (for example, trimellitic anhydride chloride).
In the formula (PAI-2), R 111 、A 2 、R 113 Respectively with R in the above formula (2) 111 、A 2 、R 113 The meaning is the same, and the preferred mode is the same.
The polyamideimide precursor may further comprise other repeating units.
Examples of the other repeating unit include a repeating unit represented by the above formula (2), a repeating unit represented by the following formula (PAI-1), and the like.
[ chemical formula 37]
In the formula (PAI-1), R 116 Represents a 2-valent organic group, R 111 Represents a 2-valent organic group.
In the formula (PAI-1), R 116 Examples of the group include a linear or branched aliphatic group, a cyclic aliphatic group, an aromatic group, a heteroaromatic group, and a group in which these groups are linked by a single bond or a linking group to 2 or more, preferably a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 6 to 20 carbon atoms, and a group in which these groups are combined by a single bond or a linking group to 2 or more, more preferably an aromatic group having 6 to 20 carbon atoms, or a group in which aromatic groups having 6 to 20 carbon atoms are combined by a single bond or a linking group to 2 or more.
As the above-mentioned connectionThe group (S) is (are) a radical, preferably-O-, -S-; -C (=o) -, -S (=o) 2 -, alkylene halide, arylene, or a linking group obtained by bonding 2 or more of these groups, more preferably-O-, -S-, alkylene halide, arylene, or a linking group obtained by bonding 2 or more of these.
The alkylene group is preferably an alkylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and still more preferably an alkylene group having 1 to 4 carbon atoms.
The halogenated alkylene group is preferably a halogenated alkylene group having 1 to 20 carbon atoms, more preferably a halogenated alkylene group having 1 to 10 carbon atoms, and still more preferably a halogenated alkylene group having 1 to 4 carbon atoms. The halogen atom in the halogenated alkylene group includes a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like, and a fluorine atom is preferable. The above-mentioned halogenated alkylene group may have a hydrogen atom or may be substituted with a halogen atom in all hydrogen atoms, and preferably all hydrogen atoms are substituted with halogen atoms. Examples of the preferred halogenated alkylene group include (bistrifluoromethyl) methylene.
The arylene group is preferably a phenylene group or a naphthylene group, more preferably a phenylene group, and still more preferably a 1, 3-phenylene group or a 1, 4-phenylene group.
Also, R is preferably 116 Derived from dicarboxylic acid compounds or dicarboxylic acid dihalide compounds.
In the present invention, a compound having 2 carboxyl groups is referred to as a dicarboxylic acid compound, and a compound having 2 halogenated carboxyl groups is referred to as a dicarboxylic acid dihalide compound.
The carboxyl groups in the dicarboxylic acid dihalide compound may be halogenated, for example, preferably chlorinated. That is, the dicarboxylic acid dihalide compound is preferably a dicarboxylic acid dichloride compound.
Examples of the dicarboxylic acid compound or dicarboxylic acid dihalide compound which may be halogenated for producing the polyamideimide precursor include linear or branched aliphatic, cyclic aliphatic or aromatic dicarboxylic acid compound or dicarboxylic acid dihalide compound, and the like.
These dicarboxylic acid compounds or dicarboxylic acid dihalide compounds may be used in an amount of 1 or 2 or more.
Specifically, the dicarboxylic acid compound or the dicarboxylic acid dihalide compound is preferably a dicarboxylic acid compound or a dicarboxylic acid dihalide compound containing a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or a group obtained by combining 2 or more of these groups by a single bond or a linking group, and more preferably an aromatic group having 6 to 20 carbon atoms or a group obtained by combining 2 or more aromatic groups having 6 to 20 carbon atoms by a single bond or a linking group.
Further, as a specific example of the dicarboxylic acid compound, examples thereof include malonic acid, dimethylmalonic acid, ethylmalonic acid, isopropylmalonic acid, di-n-butylmalonic acid, succinic acid, tetrafluorosuccinic acid, methylsuccinic acid, 2-dimethylsuccinic acid, 2, 3-dimethylsuccinic acid, dimethylmethylsuccinic acid, glutaric acid, hexafluoroglutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, and 2, 2-dimethylglutaric acid, 3-dimethylglutaric acid, 3-ethyl-3-methylglutaric acid, adipic acid, octafluoro adipic acid, 3-methyladipic acid, pimelic acid, 2, 6-tetramethylpimelic acid, suberic acid, dodecafluoro suberic acid, azelaic acid, sebacic acid, hexadecyl sebacic acid, 1, 9-azelaic acid, dodecanedioic acid tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanedioic acid, nonadecanedioic acid, icosanedioic acid, hencanedioic acid, docanedioic acid, ditridecanedioic acid, ditetradecanedioic acid, heptadecanedioic acid, octadecanedioic acid, icosanedioic acid, triacontanedioic acid, triamcinolone diacid, triacontanedioic acid, diglycolic acid, phthalic acid, isophthalic acid, terephthalic acid, 4' -biphenylcarboxylic acid, 4' -dicarboxyl diphenyl ether, benzophenone-4, 4' -dicarboxylic acid, and the like.
Specific examples of the dicarboxylic acid dihalide compound include compounds having a structure obtained by halogenating 2 carboxyl groups in the specific examples of the above dicarboxylic acid compound.
In the formula (PAI-1), R 111 R is the same as R in the above formula (2) 111 The meaning is the same, and the preferred mode is the same.
Furthermore, the polyamideimide precursor preferably also has a fluorine atom in the structure. The fluorine atom content in the polyamideimide precursor is preferably 10 mass% or more, and preferably 20 mass% or less.
In addition, the polyamideimide precursor may be copolymerized with an aliphatic group having a siloxane structure for the purpose of improving adhesion to a substrate. Specifically, as the diamine component, bis (3-aminopropyl) tetramethyldisiloxane, bis (p-aminophenyl) octamethylpentasiloxane, and the like can be used.
One embodiment of the polyamideimide precursor in the present invention includes a repeating unit represented by the formula (PAI-2), a repeating unit represented by the formula (PAI-1), and a repeating unit represented by the formula (2) in a total amount of 50 mol% or more based on the total repeating units. The total content is more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all the repeating units in the polyamideimide precursor other than the terminal may be any one of the repeating unit represented by the formula (PAI-2), the repeating unit represented by the formula (PAI-1) and the repeating unit represented by the formula (2).
The polyamideimide precursor may contain all of the repeating unit represented by the formula (PAI-2), the repeating unit represented by the formula (PAI-1) and the repeating unit represented by the formula (2), the repeating unit represented by the formula (PAI-2) and the repeating unit represented by the formula (PAI-1) but not the repeating unit represented by the formula (2), the repeating unit represented by the formula (PAI-2) and the repeating unit represented by the formula (2) but not the repeating unit represented by the formula (PA 1-1), the repeating unit represented by the formula (PA 1-2) but not the repeating unit represented by the formula (PAI-1) and the repeating unit represented by the formula (2).
In addition, another embodiment of the polyamideimide precursor in the present invention includes a structure in which the total content of the repeating unit represented by the formula (PAI-2) and the repeating unit represented by the formula (PAI-1) is 50 mol% or more of the total repeating units. The total content is more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all the repeating units in the polyamideimide precursor other than the terminal may be any of the repeating units represented by the formula (PAI-2) or the repeating units represented by the formula (PAI-1).
The weight average molecular weight (Mw) of the polyamideimide precursor is preferably 1,500 ～ 500,000, more preferably 1,500 ～ 100,000, further preferably 1,500 to 70,000, particularly preferably 5,000 to 70,000, and most preferably 10,000 ～ 50,000. The number average molecular weight (Mn) is preferably 800 to 250,000, more preferably 2,000 to 50,000, and still more preferably 4,000 to 25,000.
The molecular weight of the polyamideimide precursor has a dispersity of preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more. The upper limit of the molecular weight dispersivity of the polyamideimide precursor is not particularly limited, and is, for example, preferably 7.0 or less, more preferably 6.5 or less, and further preferably 6.0 or less.
When the resin composition contains a plurality of polyamide-imide precursors as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight, and the dispersity of at least 1 polyamide-imide precursor are within the above-mentioned ranges. Further, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated as 1 resin of the plurality of polyamide-imide precursors are each within the above-mentioned ranges.
[ Polyamide imide ]
The polyamideimide used in the present invention may be an alkali-soluble polyamideimide or a polyamideimide which is soluble in a developer containing an organic solvent as a main component.
In the present specification, the alkali-soluble polyamideimide means that 0.1g or more of polyamideimide is dissolved in 100g of a 2.38 mass% aqueous tetramethylammonium solution at 23 ℃, and from the viewpoint of pattern formation, 0.5g or more of polyamideimide is preferably dissolved, and 1.0g or more of polyamideimide is more preferably dissolved. The upper limit of the amount of dissolution is not particularly limited, but is preferably 100g or less.
In addition, from the viewpoints of film strength and insulation properties of the obtained organic film, the polyamideimide is preferably a polyamideimide having a plurality of amide bonds and a plurality of imide structures in the main chain.
Fluorine atom-
From the viewpoint of film strength of the obtained organic film, the polyamideimide preferably has fluorine atoms.
The fluorine atom is preferably R contained in the repeating unit represented by the following formula (PAI-3) 117 Or R is 111 R contained as a fluorinated alkyl group in a repeating unit represented by the following formula (PAI-3) is more preferable 117 Or R is 111 。
The amount of fluorine atoms is preferably 5 mass% or more and preferably 20 mass% or less relative to the total mass of the polyamideimide.
Ethylenic unsaturation
From the viewpoint of the film strength of the obtained organic film, the polyamideimide may have an ethylenically unsaturated bond.
The polyamideimide may have an ethylenically unsaturated bond at the terminal of the main chain or may have an ethylenically unsaturated bond in a side chain, and preferably has an ethylenically unsaturated bond in a side chain.
The ethylenically unsaturated bond is preferably radically polymerizable.
The ethylenically unsaturated bond is preferably R contained in the repeating unit represented by the following formula (PAI-3) 117 Or R is 111 R contained in the repeating unit represented by the following formula (PAI-3) is more preferable as a group having an ethylenically unsaturated bond 117 Or R is 111 。
The preferable mode of the group having an ethylenically unsaturated bond is the same as that of the group having an ethylenically unsaturated bond in the above polyimide.
The amount of the ethylenic unsaturated bond is preferably 0.0001 to 0.1mol/g, more preferably 0.001 to 0.05mol/g, relative to the total mass of the polyamideimide.
Polymerizable groups other than ethylenically unsaturated bonds
The polyamideimide may have a polymerizable group other than an ethylenically unsaturated bond.
Examples of the polymerizable group other than an ethylenic unsaturated bond in the polyamide imide include the same groups as those of the polymerizable group other than an ethylenic unsaturated bond in the polyimide.
For example, the polymerizable group other than an ethylenically unsaturated bond is preferably R contained in a repeating unit represented by the formula (PAI-3) described later 111 。
The amount of the polymerizable group other than the ethylenic unsaturated bond is preferably 0.05 to 10mol/g, more preferably 0.1 to 5mol/g, relative to the total mass of the polyamideimide.
Polarity-switching group-
The polyamideimide may have a polar conversion group such as an acid-decomposable group. Acid-decomposable groups in the polyamideimide and R of the above formula (2) 113 R is R 114 The acid decomposable groups described in the above are the same, and the preferable modes are also the same.
Acid number-
When the polyamideimide is used for alkali development, the acid value of the polyamideimide is preferably 30mgKOH/g or more, more preferably 50mgKOH/g or more, and still more preferably 70mgKOH/g or more from the viewpoint of improving the developability.
The acid value is preferably 500mgKOH/g or less, more preferably 400mgKOH/g or less, and still more preferably 200mgKOH/g or less.
When the polyamideimide is used for development (for example, the "solvent development" described later) using a developing solution containing an organic solvent as a main component, the acid value of the polyamideimide is preferably 2 to 35mgKOH/g, more preferably 3 to 30mgKOH/g, and still more preferably 5 to 20mgKOH/g.
The acid value is measured by a known method, for example, by the method described in JIS K0070: the method in 1992.
The acid groups contained in the polyamide-imide include the same groups as the acid groups contained in the polyimide, and the preferable embodiments are also the same.
Phenolic hydroxyl radical-
From the viewpoint of making the development speed by the alkali developer appropriate, the polyamideimide preferably has a phenolic hydroxyl group.
The polyamideimide may have a phenolic hydroxyl group at the terminal of the main chain or may have a phenolic hydroxyl group in a side chain.
The phenolic hydroxyl group is preferably contained in, for example, R in the repeating unit represented by the following formula (PAI-3) 117 Or R is 111 。
The amount of the phenolic hydroxyl groups is preferably 0.1 to 30mol/g, more preferably 1 to 20mol/g, relative to the total mass of the polyamideimide.
The polyamideimide used in the present invention is not particularly limited as long as it is a polymer compound having an imide structure and an amide bond, and preferably contains a repeating unit represented by the following formula (PAI-3).
[ chemical formula 38]
In the formula (PAI-3), R 111 R is R 117 Respectively with R in the formula (PAI-2) 111 R is R 117 The meaning is the same, and the preferred mode is the same.
When the polymerizable group is present, the polymerizable group may be located at R 111 R is R 117 At least one of them may be located at the terminal of the polyamideimide.
In order to improve the storage stability of the resin composition, it is preferable that the main chain end of the polyamide-imide is blocked with a blocking agent such as a monoamine, an acid anhydride, a monocarboxylic acid, a monoacyl chloride compound, or an active monoester compound. The preferable mode of the blocking agent is the same as that of the blocking agent in the polyimide described above.
Imidization ratio (ring closure ratio)
The imidization rate (also referred to as "ring closure rate") of the polyamideimide is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more from the viewpoints of film strength, insulation property, and the like of the obtained organic film.
The upper limit of the imidization ratio is not particularly limited, and may be 100% or less.
The imidization ratio can be measured by the same method as the ring closure ratio of the polyimide.
The polyamideimide may have a molecular structure consisting of all 1R 111 Or R is 117 The repeating unit represented by the above formula (PAI-3) may further have a structure comprising at least 2R 131 Or R is 132 The repeating unit represented by the above formula (PAI-3). The polyamideimide may contain a repeating unit represented by the above formula (PAI-3) and other types of repeating units. Examples of the other type of repeating unit include repeating units represented by the above formula (PAI-1) or formula (PAI-2).
The polyamideimide can be synthesized, for example, as follows: the polyamide-imide precursor is obtained by a known method, and is synthesized by a method of completely imidizing the polyamide-imide precursor by a known imidization method or a method of introducing a part of imide structure by stopping the imidization in the middle of the imidization, or a method of introducing a part of imide structure by further mixing a completely imidized polymer with the polyamide-imide precursor.
The weight average molecular weight (Mw) of the polyamideimide is preferably 1,500 to 70,000, more preferably 5,000 to 70,000, further preferably 8,000 to 50,000, particularly preferably 10,000 ～ 30,000. By setting the weight average molecular weight to 1,500 or more, the bending resistance of the cured film can be improved. In order to obtain an organic film excellent in mechanical characteristics, the weight average molecular weight is particularly preferably 20,000 or more.
The number average molecular weight (Mn) of the polyamideimide is preferably 800 to 250,000, more preferably 2,000 to 50,000, and even more preferably 4,000 to 25,000.
The molecular weight of the polyamideimide precursor has a dispersity of preferably 1.5 or more, more preferably 1.8 or more, and further preferably 2.0 or more. The upper limit of the molecular weight dispersity of the polyamideimide is not particularly limited, and is, for example, preferably 7.0 or less, more preferably 6.5 or less, and further preferably 6.0 or less.
When the resin composition contains a plurality of polyamide-imides as the specific resin, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity of at least 1 polyamide-imide are within the above-mentioned ranges. Further, it is preferable that the weight average molecular weight, the number average molecular weight and the dispersity calculated from the plurality of polyamide-imide as 1 resin are each within the above-mentioned ranges.
[ method for producing polyimide precursor and the like ]
For example, a polyimide precursor or the like can be obtained by the following method: a method of reacting a tetracarboxylic dianhydride with a diamine at a low temperature, a method of reacting a tetracarboxylic dianhydride with a diamine at a low temperature to obtain a polyamic acid and esterifying with a condensing agent or an alkylating agent, a method of reacting a tetracarboxylic dianhydride with an alcohol in the presence of a diamine and a condensing agent after obtaining a diester from a tetracarboxylic dianhydride and an alcohol, a method of halogenating the remaining dicarboxylic acid with a halogenating agent and reacting it with a diamine after obtaining a diester from a tetracarboxylic dianhydride and an alcohol, and the like. Among the above production methods, more preferred is a method in which a diester is obtained from a tetracarboxylic dianhydride and an alcohol, and then the remaining dicarboxylic acid is halogenated with a halogenating agent and reacted with a diamine.
Examples of the condensing agent include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1, 2-dihydroquinoline, 1-carbonyldioxy-di-1, 2, 3-benzotriazole, N' -disuccinimide carbonate, and trifluoroacetic anhydride.
Examples of the alkylating agent include N, N-dimethylformamide dimethyl acetal, N-dimethylformamide diethyl acetal, N-dialkylformamide dialkyl acetal, trimethyl orthoformate, triethyl orthoformate and the like.
Examples of the halogenating agent include thionyl chloride, oxalyl chloride, and phosphoryl chloride.
In the method for producing a polyimide precursor or the like, an organic solvent is preferably used in the reaction. The organic solvent may be 1 or 2 or more.
The organic solvent may be appropriately determined depending on the raw materials, and examples thereof include pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone, N-ethylpyrrolidone, ethyl propionate, dimethylacetamide, dimethylformamide, tetrahydrofuran, and γ -butyrolactone.
In the method for producing a polyimide precursor or the like, an alkali compound is preferably added at the time of the reaction. The number of the basic compounds may be 1 or 2 or more.
The basic compound can be appropriately determined depending on the starting materials, and triethylamine, diisopropylethylamine, pyridine, 1, 8-diazabicyclo [5.4.0] undec-7-ene, N-dimethyl-4-aminopyridine and the like can be exemplified.
Blocking agent-
In order to introduce a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms into a specific resin, for example, a capping agent can be used.
For example, a compound having a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms and a hydroxyl group, a thiol group or an amino group is used as a capping agent to cap carboxylic acid anhydrides and acid anhydride derivatives at the ends of the resin, whereby the structure represented by the above formula (1-1) or formula (2-1) can be introduced into the ends.
From the viewpoint of reducing the molar amount of the structure containing the nitrogen-containing heterocyclic structure that is detached from the resin upon the heating, a compound having a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms and an amino group is preferably used as such a capping agent.
In this case, it is preferable that the other blocking agent to be described later be used together, and it is not used, from the viewpoint of reducing the molar amount of the structure containing the nitrogen-containing heterocyclic structure which is separated from the resin.
Examples of the compound having a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms and an amino group include compounds represented by the following formula (T-1).
[ chemical formula 39]
In the formula (T-1), L 1 、R 1 And n is independently L in the above formula (1-1) 1 、R 1 And n have the same meaning, and the preferred mode is the same.
The nitrogen-containing heterocyclic structure may be introduced into the terminal of a specific resin by capping the amino group at the terminal of the resin with a compound having a nitrogen-containing heterocyclic structure having 2 or more nitrogen atoms as ring-forming atoms and a functional group capable of reacting with the amino group.
Other blocking agents
Examples of the blocking agent include the following compounds.
When the carboxylic acid anhydride and acid anhydride derivative remaining at the end of the resin are blocked, examples of the blocking agent include monoalcohols, phenols, thiols, thiophenols, monoamines, and the like, and from the viewpoints of reactivity and film stability, monoalcohols, phenols, and monoamines are more preferably used. Preferred examples of the monoalcohol include primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecanol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol, furfuryl alcohol, secondary alcohols such as isopropanol, 2-butanol, cyclohexanol, cyclopentanol, 1-methoxy-2-propanol, tertiary alcohols such as t-butanol, adamantanol, and the like. Preferred examples of the phenols include phenols such as phenol, methoxyphenol, methylphenol, naphthalene-1-ol, naphthalene-2-ol, and hydroxystyrene. Further, preferable examples of monoamines include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene, 1-hydroxy-6-aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1-carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-aminonaphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4-aminobenzenesulfonic acid, 3-amino-4, 6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-aminophenol, 3-aminophenol, thiophenol, and the like. These may be used in an amount of 2 or more, and various terminal groups may be introduced by reacting various kinds of blocking agents.
In addition, when the amino group at the end of the resin is blocked, a compound having a functional group reactive with the amino group can be used for blocking. As the preferable blocking agent for the amino group, carboxylic acid anhydride, carboxylic acid chloride, carboxylic acid bromide, sulfonic acid chloride, sulfonic acid anhydride, sulfonic acid carboxylic acid anhydride, and the like can be preferable, and carboxylic acid anhydride and carboxylic acid chloride are more preferable. Preferred examples of the carboxylic anhydride include acetic anhydride, propionic anhydride, oxalic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, and 5-norbornene-2, 3-dicarboxylic anhydride. Preferred compounds of carboxylic acid chlorides include acetyl chloride, acryloyl chloride, propionyl chloride, methacryloyl chloride, pivaloyl chloride, cyclohexanecarbonyl chloride, 2-ethylhexanoyl chloride, cinnamoyl chloride, 1-adamantanecarbonyl chloride, heptafluorobutyryl chloride, stearoyl chloride, benzoyl chloride, and the like.
Solid precipitation-
The production of the polyimide precursor and the like may include a solid precipitation step. Specifically, the water-absorbing by-product of the dehydration condensing agent coexisting in the reaction liquid is filtered as needed, and then the obtained polymer component is poured into a poor solvent such as water, aliphatic lower alcohol or a mixed liquid thereof, and the polymer component is precipitated, whereby the polymer component is precipitated as a solid and dried to obtain a polyimide precursor or the like. In order to improve the purification degree, operations such as redissolution, reprecipitation, precipitation, and drying may be repeated for the polyimide precursor or the like. The method may further comprise a step of removing ionic impurities using an ion exchange resin.
[ specific example ]
Specific examples of the specific resin include, but are not limited to, specific resins used in examples described below, and specific resins obtained by changing the terminal structure of these resins to the structure described above in specific examples including the nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms.
[ content ]
The content of the specific resin in the resin composition of the present invention is preferably 20 mass% or more, more preferably 30 mass% or more, still more preferably 40 mass% or more, and still more preferably 50 mass% or more, relative to the total solid content of the resin composition. The content of the resin in the resin composition of the present invention is preferably 99.5% by mass or less, more preferably 99% by mass or less, still more preferably 98% by mass or less, still more preferably 97% by mass or less, and still more preferably 95% by mass or less, based on the total solid content of the resin composition.
The resin composition of the present invention may contain only 1 specific resin or may contain 2 or more kinds. When the content is 2 or more, the total amount is preferably within the above range.
Furthermore, the resin composition of the present invention preferably further comprises at least 2 resins.
Specifically, the resin composition of the present invention may contain 2 or more types of specific resins and other resins described later in total, or may contain 2 or more types of specific resins, and preferably contains 2 or more types of specific resins.
When the resin composition of the present invention contains 2 or more specific resins, it is preferable that the resin composition contains a dianhydride-derived structure (R in the above formula (2)) 115 ) More than 2 kinds of polyimide precursors which are different from each other.
< other resins >
The resin composition of the present invention may contain the above specific resin and another resin (hereinafter, also simply referred to as "another resin") different from the specific resin.
Examples of the other resin include a polyimide precursor different from a specific resin, a polyimide different from a specific resin, a polybenzoxazole precursor different from a specific resin, a polybenzoxazole different from a specific resin, a polyamideimide precursor different from a specific resin, a polyamideimide different from a specific resin, a phenol resin, a polyamide, an epoxy resin, a polysiloxane, a resin containing a siloxane structure, (meth) acrylic resin, (meth) acrylamide resin, a urethane resin, a butyral resin, a styrene resin, a polyether resin, a polyester resin, and the like.
For example, by further adding a (meth) acrylic resin, a resin composition excellent in coatability can be obtained, and a pattern (cured product) excellent in solvent resistance can be obtained.
For example, by adding a (meth) acrylic resin having a weight average molecular weight of 20,000 or less and a high polymerizable group value (for example, a molar amount of polymerizable groups contained in 1g of resin is 1×10) to a resin composition instead of or in addition to a polymerizable compound described later, it is possible to improve the coatability of the resin composition, the solvent resistance of a pattern (cured product), and the like -3 Molar/g or more).
When the resin composition of the present invention contains another resin, the content of the other resin is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, still more preferably 1 mass% or more, still more preferably 2 mass% or more, still more preferably 5 mass% or more, and still more preferably 10 mass% or more, based on the total solid content of the resin composition.
The content of the other resin in the resin composition of the present invention is preferably 80 mass% or less, more preferably 75 mass% or less, still more preferably 70 mass% or less, still more preferably 60 mass% or less, and still more preferably 50 mass% or less, based on the total solid content of the resin composition.
In addition, as a preferable embodiment of the resin composition of the present invention, the content of other resins may be reduced. In the above aspect, the content of the other resin is preferably 20% by mass or less, more preferably 15% by mass or less, further preferably 10% by mass or less, further preferably 5% by mass or less, and further preferably 1% by mass or less, based on the total solid content of the resin composition. The lower limit of the content is not particularly limited, and may be 0 mass% or more.
The resin composition of the present invention may contain only 1 kind of other resin or may contain 2 or more kinds. When the content is 2 or more, the total amount is preferably within the above range.
< polymerizable Compound >
The resin composition of the present invention preferably contains a polymerizable compound.
Examples of the polymerizable compound include a free-radical crosslinking agent and other crosslinking agents.
[ free radical crosslinking agent ]
The resin composition of the present invention preferably contains a radical crosslinking agent.
The radical crosslinking agent is a compound having a radical polymerizable group. As the radical polymerizable group, a group containing an ethylenically unsaturated bond is preferable. Examples of the group containing an ethylenically unsaturated bond include groups having an ethylenically unsaturated bond such as a vinyl group, an allyl group, a vinylphenyl group, a (meth) acryloyl group, a maleimido group, and a (meth) acrylamido group.
Among them, the group containing an ethylenically unsaturated bond is preferably a (meth) acryloyl group, (meth) acrylamide group or vinylphenyl group, and more preferably a (meth) acryloyl group from the viewpoint of reactivity.
The radical crosslinking agent is preferably a compound having 1 or more ethylenically unsaturated bonds, more preferably a compound having 2 or more ethylenically unsaturated bonds. The radical crosslinking agent may have 3 or more ethylenically unsaturated bonds.
The compound having 2 or more ethylenically unsaturated bonds is preferably a compound having 2 to 15 ethylenically unsaturated bonds, more preferably a compound having 2 to 10 ethylenically unsaturated bonds, and still more preferably a compound having 2 to 6 ethylenically unsaturated bonds.
Further, from the viewpoint of film strength of the obtained pattern (cured product), the resin composition of the present invention preferably further comprises a compound having 2 ethylenically unsaturated bonds and the above-mentioned compound having 3 or more ethylenically unsaturated bonds.
The molecular weight of the radical crosslinking agent is preferably 2,000 or less, more preferably 1,500 or less, and further preferably 900 or less. The lower limit of the molecular weight of the radical crosslinking agent is preferably 100 or more.
Specific examples of the radical polymerizable compound include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.) or esters and amides thereof, and preferably esters of unsaturated carboxylic acids and polyhydric alcohol compounds and amides of unsaturated carboxylic acids and polyvalent amine compounds. Further, an addition reaction product of an unsaturated carboxylic acid ester or amide having a nucleophilic substituent such as a hydroxyl group, an amino group, a sulfanyl group, or the like with a monofunctional or polyfunctional isocyanate or epoxy, a dehydration condensation reaction product with a monofunctional or polyfunctional carboxylic acid, or the like can be preferably used. Further, addition reactants of unsaturated carboxylic acid esters or amides having electrophilic substituents such as isocyanate groups or epoxy groups and monofunctional or polyfunctional alcohols, amines and thiols are preferable, and substitution reactants of unsaturated carboxylic acid esters or amides having releasable substituents such as halogeno groups or tosyloxy groups and monofunctional or polyfunctional alcohols, amines and thiols are more preferable. Further, as another example, a compound group substituted with a vinyl benzene derivative such as unsaturated phosphonic acid or styrene, a vinyl ether, or an allyl ether may be used instead of the unsaturated carboxylic acid. For a specific example, reference is made to paragraphs 0113 to 0122 of Japanese patent application laid-open No. 2016-027357, which is incorporated herein by reference.
The radical crosslinking agent is preferably a compound having a boiling point of 100 ℃ or higher at normal pressure. Examples thereof include polyethylene glycol di (meth) acrylate, trimethylolethane tri (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hexanediol di (meth) acrylate, trimethylolpropane tri (acryloxypropyl) ether, tri (acryloxyethyl) isocyanurate, a compound obtained by adding ethylene oxide or propylene oxide to a polyfunctional alcohol and then subjecting the resultant to (meth) acrylation, and epoxy acrylates or the like as the reaction product of an epoxy resin and (meth) acrylic acid, as described in each of Japanese patent publication Nos. 48-041708, 50-006034, 51-037193, 48-064183, 49-043191 and 52-030490; and mixtures of these. Furthermore, the compounds described in paragraphs 0254 to 0257 of JP-A2008-292970 are also preferred. Further, a polyfunctional (meth) acrylate obtained by reacting a compound having a cyclic ether group and an ethylenically unsaturated bond such as glycidyl (meth) acrylate, and the like can also be mentioned.
Further, as a preferable radical crosslinking agent other than the above, a compound having a fluorene ring and having 2 or more groups having an ethylenically unsaturated bond, and a cardo (cardo) resin described in japanese patent application laid-open publication No. 2010-160418, japanese patent application laid-open publication No. 2010-129825, japanese patent application laid-open publication No. 4364216, and the like can also be used.
Further, examples of the unsaturated compounds include specific unsaturated compounds described in Japanese patent publication No. 46-043946, japanese patent publication No. 01-040337 and Japanese patent publication No. 01-040336, and vinyl phosphonic acid compounds described in Japanese patent publication No. 02-025493. Furthermore, a perfluoroalkyl group-containing compound described in Japanese patent application laid-open No. 61-022048 can also be used. Furthermore, the compounds described as photopolymerizable monomers and oligomers in "Journal of the Adhesion Society of Japan" vol.20, no.7,300 to 308 (1984) can also be used.
In addition to the above, the compounds described in paragraphs 0048 to 0051 of Japanese patent application laid-open No. 2015-034964 and the compounds described in paragraphs 0087 to 0131 of International publication No. 2015/199219, which are incorporated herein by reference, can be used.
Further, the compounds described in JP-A-10-062986 as the specific examples of the compounds represented by the formulas (1) and (2) can also be used as the radical crosslinking agent, and the compounds are obtained by adding ethylene oxide or propylene oxide to a polyfunctional alcohol and then (meth) acrylating the resultant mixture.
Furthermore, the compounds described in paragraphs 0104 to 0131 of Japanese patent application laid-open No. 2015-187211 can also be used as radical crosslinking agents, and these are incorporated herein.
The radical crosslinking agent is preferably dipentaerythritol triacrylate (commercially available as KAYARAD-330, (Nippon Kayaku co., ltd.)), dipentaerythritol tetraacrylate (commercially available as KAYARAD D-320, (Nippon Kayaku co., ltd.)), a-TMMT (Shin-Nakamura Chemical co., ltd.)), dipentaerythritol penta (commercially available as kayardd-310, (Nippon Kayaku co., ltd.)), dipentaerythritol hexa (commercially available as KAYARAD DPHA, (Nippon Kayaku co., ltd.)), a-DPH (Shin-Nakamura Chemical co., ltd.)), and a structure in which these (meth) acryloyl groups are bonded via ethylene glycol residues or propylene glycol residues. It is also possible to use these oligomer types.
As commercial products of the radical crosslinking agent, for example, there may be mentioned 4-functional acrylate SR-494 having 4 ethyleneoxy chains manufactured by Sartomer Company, tnc, 2-functional methacrylate Sartomer Company having 4 ethyleneoxy chains manufactured by Inc, SR-209, 231, 239, nippon Kayaku Co., ltd., 6-functional acrylate DPCA-60 having 6 pentyleneoxy chains manufactured by Inc., 3-functional acrylate TPA-330 having 3 isobutyleneoxy chains manufactured by Td., urethane oligomer UAS-10, UAB-140 (manufactured by NIPPON PAPER INDUSTRIES CO., LTD), NK ESTER NK M-40G, NK ESTER 4G, ESTER M-9300, NK ESTER A-9300, UA-7200 (Shin-Nakamura Chemical Co., ltd.), DPHA-40H (manufactured by Nippon Kayaku, ltd.), UA-306, UA-35 CO., LTD. Manufactured by UA-35, NK M.N ESTER M-40G, NK ESTER M-40G, NK ESTER M-40G, K.N.N.K., K. 6, and 3-6, and so on (manufactured by Mr. Co., LTD. Co., ltd.) and so on, such as PME.600, LTD.
As the radical crosslinking agent, urethane acrylates described in Japanese patent publication No. 48-041708, japanese patent application laid-open No. 51-037193, japanese patent application laid-open No. 02-032293, and Japanese patent application laid-open No. 02-016765, urethane compounds having an ethylene oxide skeleton described in Japanese patent publication No. 58-049860, japanese patent publication No. 56-017654, japanese patent publication No. 62-039417, and Japanese patent publication No. 62-039418 are also preferred. Further, as the radical crosslinking agent, a compound having an amino structure or a thioether structure in the molecule described in JP-A-63-277653, JP-A-63-260909 or JP-A-01-105238 can be used.
The radical crosslinking agent may be a radical crosslinking agent having an acid group such as a carboxyl group or a phosphate group. The radical crosslinking agent having an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, and more preferably a radical crosslinking agent in which a non-aromatic carboxylic acid anhydride is reacted with an unreacted hydroxyl group of an aliphatic polyhydroxy compound to have an acid group. Particularly preferred are the following compounds: in the radical crosslinking agent in which a non-aromatic carboxylic anhydride is reacted with an unreacted hydroxyl group of an aliphatic polyhydroxy compound to have an acid group, the aliphatic polyhydroxy compound is a compound of pentaerythritol or dipentaerythritol. Examples of the commercial products include TOAGOSEI CO., LTD. The polyacid modified acrylic oligomers M-510 and M-520.
The radical crosslinking agent having an acid group preferably has an acid value of 0.1 to 300mgKOH/g, particularly preferably 1 to 100mgKOH/g. The acid value of the radical crosslinking agent is within the above range, and therefore, the production process is excellent in handleability and further excellent in developability. Furthermore, the polymerizability was good. The acid value was determined in accordance with JIS K0070: 1992, the measurement was performed.
From the viewpoints of pattern resolution and film stretchability, the resin composition preferably uses 2-functional methacrylate or acrylate.
Specific examples of the compound include triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, PEG (polyethylene glycol) 200 diacrylate, PEG200 dimethacrylate, PEG600 diacrylate, PEG600 dimethacrylate, polytetraethylene glycol diacrylate, polytetraethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 3-methyl-1, 5-pentanediol diacrylate, 1, 6-hexanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, dimethylol-tricyclodecane dimethacrylate, bisphenol a EO (ethylene oxide) adduct diacrylate, bisphenol a EO adduct dimethacrylate, bisphenol a PO adduct diacrylate, bisphenol a PO adduct dimethacrylate, 2-hydroxy-3-acryloxypropyl methacrylate, isocyanuric acid diacrylate, isocyanuric acid modified dimethacrylate, other 2-functional methacrylates having urethane bonds, and other 2-functional methacrylates having urethane bonds. These may be used in combination of 2 or more kinds as required.
For example, PEG200 diacrylate refers to a polyethylene glycol diacrylate having a formula weight of about 200 in polyethylene glycol chains.
The resin composition of the present invention can preferably use a monofunctional radical crosslinking agent as a radical crosslinking agent from the viewpoint of suppressing warpage accompanying control of the elastic modulus of a pattern (cured product). As the monofunctional radical crosslinking agent, there may be preferably used (meth) acrylic acid derivatives such as N-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, carbitol (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, epoxypropyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, N-vinyl compounds such as N-vinylpyrrolidone and N-vinylcaprolactam, allyl glycidyl ether, and the like. As the monofunctional radical crosslinking agent, a compound having a boiling point of 100 ℃ or higher at normal pressure is also preferable in order to suppress volatilization before exposure.
Examples of the radical crosslinking agent having a function of 2 or more include allyl compounds such as diallyl phthalate and triallyl trimellitate.
When the radical crosslinking agent is contained, the content thereof is preferably more than 0% by mass and 60% by mass or less relative to the total solid content of the resin composition of the present invention. The lower limit is more preferably 5 mass% or more. The upper limit is more preferably 50 mass% or less, and still more preferably 30 mass% or less.
The radical crosslinking agent may be used alone or in combination of 1 or more than 2. When 2 or more kinds are used in combination, the total amount thereof is preferably within the above range.
[ other crosslinking Agents ]
The resin composition of the present invention preferably further comprises a crosslinking agent other than the radical crosslinking agent described above.
In the present invention, the other crosslinking agent is preferably a compound having a plurality of groups in the molecule which promote a reaction for forming covalent bonds with other compounds in the composition or reaction products thereof by the sensitization of the photoacid generator or photobase generator, more preferably a compound having a plurality of groups in the molecule which promote a reaction for forming covalent bonds with other compounds in the composition or reaction products thereof by the action of an acid or a base.
The acid or base is preferably an acid or base generated from a photoacid generator or a photobase generator in the exposure step.
As the other crosslinking agent, a compound having at least 1 group selected from the group consisting of an acyloxymethyl group, a hydroxymethyl group, and an alkoxymethyl group is preferable, and a compound having a structure in which at least 1 group selected from the group consisting of an acyloxymethyl group, a hydroxymethyl group, and an alkoxymethyl group is directly bonded to a nitrogen atom is more preferable.
Examples of the other crosslinking agent include compounds having the following structures: formaldehyde or formaldehyde and alcohol are reacted with an amino group-containing compound such as melamine, acetylene urea, alkylene urea, benzoguanamine, etc., to replace the hydrogen atom of the amino group with an acyloxymethyl group, a hydroxymethyl group or an alkoxymethyl group. The method for producing these compounds is not particularly limited as long as they are compounds having the same structure as the compounds produced by the above method. The oligomer may be one in which methylol groups of these compounds are self-condensed with each other.
As the above amino group-containing compound, a crosslinking agent using melamine is referred to as a melamine-based crosslinking agent, a crosslinking agent using acetylene urea, urea or alkylene urea is referred to as a urea-based crosslinking agent, a crosslinking agent using alkylene urea is referred to as an alkylene urea-based crosslinking agent, and a crosslinking agent using benzoguanamine is referred to as a benzoguanamine-based crosslinking agent.
Among these, the resin composition of the present invention preferably contains at least 1 compound selected from urea-based crosslinking agents and melamine-based crosslinking agents, and more preferably contains at least 1 compound selected from acetylene urea-based crosslinking agents and melamine-based crosslinking agents described later.
Examples of the compound containing at least 1 of an alkoxymethyl group and an acyloxymethyl group in the present invention include compounds in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic group, a nitrogen atom of the urea structure described below, or a triazine.
The alkoxymethyl group or acyloxymethyl group contained in the above-mentioned compound preferably has 2 to 5 carbon atoms, more preferably 2 or 3 carbon atoms, and still more preferably 2 carbon atoms.
The total number of alkoxymethyl groups and acyloxymethyl groups in the above-mentioned compound is preferably 1 to 10, more preferably 2 to 8, and particularly preferably 3 to 6.
The molecular weight of the above compound is preferably 1500 or less, and preferably 180 to 1200.
[ chemical formula 40]
R 100 Represents an alkyl group or an acyl group.
R 101 R is R 102 Each independently represents a 1-valent organic group, and may be bonded to each other to form a ring.
Examples of the compound in which the alkoxymethyl group or the acyloxymethyl group is directly substituted on the aromatic group include compounds represented by the following general formula.
[ chemical formula 41]
Wherein X represents a single bond or a 2-valent organic group, each R 104 Each independently represents an alkyl group or an acyl group, R 103 Represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, or a group which is decomposed by the action of an acid and generates an alkali-soluble group (e.g., a group which is detached by the action of an acid, a group which is formed by-C (R 4 ) 2 COOR 5 A group (R) 4 R independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms 5 Represents groups which are detached by the action of an acid. )).
R 105 Each independently represents an alkyl group or an alkenyl group, a, b and c are each independently 1 to 3, d is 0 to 4, e is 0 to 3, f is 0 to 3, a+d is 5 or less, b+e is 4 or less, and c+f is 4 or less.
Regarding the groups which decompose and generate alkali-soluble groups by the action of an acid, the groups which are detached by the action of an acid are represented by-C (R 4 ) 2 COOR 5 R in the radicals represented 5 For example, there can be mentioned-C (R 36 )(R 37 )(R 38 )、-C(R 36 )(R 37 )(OR 39 )、-C(R 01 )(R 02 )(0R 39 ) Etc.
Wherein R is 36 ～R 39 Each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group. R is R 36 And R is R 37 Can be bonded to each other to form a ring.
The alkyl group is preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 5 carbon atoms.
The alkyl group may be either a straight chain or a branched chain.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 12 carbon atoms, and more preferably a cycloalkyl group having 3 to 8 carbon atoms.
The cycloalkyl group may have a monocyclic structure or a polycyclic structure such as a condensed ring.
The aryl group is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, and more preferably a phenyl group.
The aralkyl group is preferably an aralkyl group having 7 to 20 carbon atoms, and more preferably an aralkyl group having 7 to 16 carbon atoms.
The aralkyl group refers to an aryl group substituted with an alkyl group, and the preferable modes of the alkyl group and the aryl group are the same as those of the alkyl group and the aryl group.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms, more preferably an alkenyl group having 3 to 16 carbon atoms.
Further, these groups may further have a known substituent within a range to obtain the effect of the present invention.
R 01 R is R 02 Each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.
The group which is decomposed by the action of an acid to form an alkali-soluble group or the group which is detached by the action of an acid is preferably a tertiary alkyl ester group, an acetal group, a cumyl ester group, an enol ester group or the like. Further preferred is a tertiary alkyl ester group and an acetal group.
Specific examples of the compound having an alkoxymethyl group include the following structures. Examples of the compound having an acyloxymethyl group include compounds in which an alkoxymethyl group of the following compound is changed to an acyloxymethyl group. Examples of the compound having an alkoxymethyl group or an acyloxymethyl group in the molecule include, but are not limited to, the following compounds.
[ chemical formula 42]
[ chemical formula 43]
The compound containing at least 1 of an alkoxymethyl group and an acyloxymethyl group may be commercially available, or may be synthesized by a known method.
From the viewpoint of heat resistance, a compound in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or a triazine ring is preferable.
Specific examples of the melamine-based crosslinking agent include hexamethoxymethyl melamine, hexaethoxymethyl melamine, hexapropoxymethyl melamine, and hexabutoxybutyl melamine.
Specific examples of urea-based crosslinking agents include acetylene urea-based crosslinking agents such as monomethylolated acetylene urea, dimethylolated acetylene urea, trimethylolated acetylene urea, tetramethylolated acetylene urea, monomethylolated acetylene urea, dimethoxymethylated acetylene urea, trimethoxymethylated acetylene urea, tetramethoxymethylated acetylene urea, monoethoxymethylacetylene urea, diethoxymethylacetylene urea, triethoxymethylacetylene urea, tetraethoxymethylated acetylene urea, monopropoxymethylacetylene urea, dipropoxymethylacetylene urea, tripropoxymethylacetylene urea, tetrapropoxymethylacetylene urea, monobutyloxymethylacetylene urea, dibutoxymethylated acetylene urea, tributoxymethylated acetylene urea or tetrabutoxymethylated acetylene urea;
Urea-based crosslinking agents such as dimethoxymethyl urea, diethoxymethyl urea, dipropoxymethyl urea and dibutoxymethyl urea,
Vinyl urea cross-linking agents such as mono-methylolated vinyl urea or di-methylolated vinyl urea, mono-methoxymethylated vinyl urea, di-methoxymethylated vinyl urea, mono-ethoxymethylated vinyl urea, di-ethoxymethylated vinyl urea, mono-propoxymethylated vinyl urea, di-propoxymethylated vinyl urea, mono-or di-butoxymethylated vinyl urea,
Propylene urea-based crosslinking agents such as monocrystaline propylene urea, dimethylol propylene urea, monomethoxy methylated propylene urea, dimethoxy methylated propylene urea, monomethoxy methylated propylene urea, diethoxy methylated propylene urea, monopropoxy methylated propylene urea, dipropoxy methylated propylene urea, monobutyl oxymetylated propylene urea or dibutoxy methylated propylene urea,
1, 3-bis (methoxymethyl) -4, 5-dihydroxy-2-imidazolidinone, 1, 3-bis (methoxymethyl) -4, 5-dimethoxy-2-imidazolidinone, and the like.
Specific examples of the benzoguanamine-based crosslinking agent include monomethylol benzoguanamine, dimethylol benzoguanamine, trimethylol benzoguanamine, tetramethylol benzoguanamine, monomethylol methylated benzoguanamine, dimethoxymethyl benzoguanamine, trimethoxy methylated benzoguanamine, tetramethoxymethyl benzoguanamine, monoethoxymethyl benzoguanamine, diethoxymethyl benzoguanamine, triethoxymethyl benzoguanamine, tetraethoxymethyl benzoguanamine, monopropoxymethyl benzoguanamine, dipropoxymethyl benzoguanamine, tripropoxymethyl benzoguanamine, tetrapropoxymethyl benzoguanamine, monobutyloxymethyl benzoguanamine, dibutoxymethyl benzoguanamine, tributoxymethyl benzoguanamine, tetrabutoxymethyl benzoguanamine, and tetrabutoxymethyl benzoguanamine.
As the compound having at least 1 group selected from the group consisting of hydroxymethyl and alkoxymethyl, a compound in which at least 1 group selected from the group consisting of hydroxymethyl and alkoxymethyl is directly bonded to an aromatic ring (preferably a benzene ring) can be preferably used.
Specific examples of such compounds include xylylene glycol, bis (hydroxymethyl) cresol, bis (hydroxymethyl) dimethoxybenzene, bis (hydroxymethyl) diphenyl ether, bis (hydroxymethyl) benzophenone, hydroxymethyl benzene hydroxymethyl benzoate, bis (hydroxymethyl) biphenyl, dimethyl bis (hydroxymethyl) biphenyl, bis (methoxymethyl) benzene, bis (methoxymethyl) cresol, bis (methoxymethyl) dimethoxybenzene, bis (methoxymethyl) diphenyl ether, bis (methoxymethyl) benzophenone, methoxymethyl benzene methoxymethylbenzoate, bis (methoxymethyl) biphenyl, dimethyl bis (methoxymethyl) biphenyl, 4',4 "-ethylenetris [2, 6-bis (methoxymethyl) phenol ], 5' - [2, 2-trifluoro-1- (trifluoromethyl) ethylene ] bis [ 2-hydroxy-1, 3-benzenedimethanol ], 3', 5' -tetrakis (methoxymethyl) -1,1 '-biphenyl-4, 4' -diol, and the like.
As other crosslinking agents, commercially available products may be used, and preferable commercially available products include 46DMOC, 46DMOEP (manufactured by ASAHI YUKIZAI CORPORATION above), DML-PC, DML-PEP, DML-OC, DML-OEP, DML-34X, DML-PTBP, DML-PCHP, DML-OCHP, DML-PFP, DML-PSBP, DML-POP, DML-MBOC, DML-MBPC, DML-MTrisPC, DML-BisOC-Z, DML-BisOCHP-Z, DML-BPC, DMLBisc-P, DMOM-PC, DMM-PTBP, DMM-MBPC, triML-P, triML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPE, TML-BPA, TML-AF, TML-BPAP, TMOM-BP, TMOM-BPE, TMOM-BPOM-TMOM, TMOM-BPOM-Z, DML-BPC, DMLBOC-P, DMOM-PC, DMM-PTBP, TML-PtP, TML-HPL-HPP, HMP, PHOM-TPP, PHP; LTD), NIKALAC (registered trademark, the same as described below) MX-290, NIKALAC MX-280, NIKALAC MX-270, NIKALAC MX-279, NIKALAC MW-100LM, N [ KALAC MX-750LM (SANWA CHEMICAL co., LTD, above), and the like.
Further, the resin composition of the present invention preferably further contains at least 1 compound selected from the group consisting of an epoxy compound, an oxetane compound and a benzoxazine compound as another crosslinking agent.
Epoxy compound (epoxy group-containing compound)
As the epoxy compound, a compound having 2 or more epoxy groups in one molecule is preferable. The epoxy group undergoes a crosslinking reaction at 200 ℃ or less and does not cause dehydration reaction due to crosslinking, and thus film shrinkage is less likely to occur. Therefore, by containing the epoxy compound, the low-temperature curing and warpage of the resin composition of the present invention can be effectively suppressed.
The epoxy compound preferably contains polyethylene oxide. Thereby, the elastic modulus is further reduced, and warpage can be suppressed. The polyethylene oxide means that the number of repeating units of the ethylene oxide is 2 or more, and the number of repeating units is preferably 2 to 15.
Examples of the epoxy compound include bisphenol a epoxy resins; bisphenol F type epoxy resin; alkylene glycol type epoxy resins such as propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, butylene glycol diglycidyl ether, hexylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, and the like, or polyhydric alcohol hydrocarbon type epoxy resins; polyalkylene glycol type epoxy resins such as polypropylene glycol diglycidyl ether; and epoxy group-containing silicones such as polymethylsiloxane (glycidoxypropyl) and the like, but are not limited thereto. Specifically, EPICLON (registered trademark) HP-4032, EPICLON (registered trademark) HP-7200, EPICLON (registered trademark) HP-820, EPICLON (registered trademark) HP-4700, EPICLON (registered trademark) HP-4770, EPICLON (registered trademark) EXA-830LVP, EPICLON (registered trademark) EXA-8183, EPICLON (registered trademark) EXA-8169, EPICLON (registered trademark) N-660, EPICLON-665-EXP-S, EPICLON (registered trademark) N-740 (the above are trade names, DIC Corporation), RIKARESIN (registered trademark) BEO-20E, RIKARESIN (registered trademark) BEO-60E, RIKARESIN (registered trademark) HBE-100, RIKARESIN (registered trademark) DME-100, RIKARESIN (registered trademark) L-200 (trade name, new Japan Chemmical Co., ltd.), EP-4003S, EP-4000S, EP-4088S, EP-3950S (trade name, ADEKA CORPORATION, CELLOXDE 2021P, CELLOXIDE (registered trademark) 2081, CELLOXDE 2000, EHPE3150, EPOLEAD (registered trademark) GT401, EPOLEAD (registered trademark) PB4700, EPOLEAD (registered trademark) PB3600 (trade name, daicel Corporation, NC-3000-L, NC-3000-H, NC-3000-FH-75M, NC-3100, CER-3000-L, NC-2000-L, XD-1000, NC-7000L, NC-7300L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S (trade name, nippon Kayaku Co., ltd.) and the like. Furthermore, the following compounds may also be preferably used.
[ chemical formula 44]
Wherein n is an integer of 1 to 5, and m is an integer of 1 to 20.
In the above structure, n is preferably 1 to 2 and m is preferably 3 to 7 from the viewpoint of improving both heat resistance and elongation.
Oxetane compounds (compounds having an oxetanyl group)
Examples of oxetane compounds include compounds having 2 or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyl oxetane, 1, 4-bis { [ (3-ethyl-3-oxetanyl) methoxy ] methyl } benzene, 3-ethyl-3- (2-ethylhexyl methyl) oxetane, and 1, 4-benzenedicarboxylic acid-bis [ (3-ethyl-3-oxetanyl) methyl ] ester. Specifically, TOAGOSEI CO. LTD. ARON OXETANE series (for example, OXT-121, OXT-221) may be preferably used, and these may be used alone or 2 or more may be mixed.
Benzoxazine compound (compound having benzoxazolyl group)
The benzoxazine compound is preferable because it does not undergo deaeration during curing due to a crosslinking reaction caused by a ring-opening addition reaction, and further, it reduces heat shrinkage to suppress warpage.
Preferable examples of the benzoxazine compound include P-d type benzoxazine, F-a type benzoxazine (trade name, manufactured by Shikoku Chemicals Corporation), benzoxazine adducts of polyhydroxystyrene resins, and phenol novolac type dihydrobenzoxazine compounds. These may be used alone, or 2 or more kinds may be mixed.
The content of the other crosslinking agent is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, still more preferably 0.5 to 15% by mass, and particularly preferably 1.0 to 10% by mass, based on the total solid content of the resin composition of the present invention. The other crosslinking agent may be contained only in 1 kind, or may be contained in 2 or more kinds. When the crosslinking agent contains 2 or more other crosslinking agents, the total thereof is preferably within the above range.
[ polymerization initiator ]
The resin composition of the present invention preferably contains a polymerization initiator capable of initiating polymerization by light and/or heat. Particularly preferably, a photopolymerization initiator is contained.
The photopolymerization initiator is preferably a photo radical polymerization initiator. The photo radical polymerization initiator is not particularly limited, and may be appropriately selected from known photo radical polymerization initiators. For example, a photoradical polymerization initiator having photosensitivity to light rays ranging from the ultraviolet region to the visible region is preferable. Furthermore, active agents that generate reactive radicals for some interaction with photosensitizers that are excited by light may be used.
The photo radical polymerization initiator preferably contains at least 1 of the monomers having a molar absorptivity of at least about 50 L.mol in the range of about 240 to 800nm (preferably 330 to 500 nm) -1 ·cm -1 Is a compound of (a). The molar absorptivity of the compound can be measured by a known method. For example, it is preferable to measure the concentration of the solvent at 0.01g/L by an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer, manufactured by Varian Co.) using ethyl acetate.
As the photo radical polymerization initiator, a known compound can be arbitrarily used. Examples thereof include halogenated hydrocarbon derivatives (for example, compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having a trihalomethyl group, and the like), acylphosphine compounds such as acylphosphine oxides, oxime compounds such as hexaarylbisimidazole, oxime derivatives, and the like, organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, ketoxime ethers, α -amino ketone compounds such as aminoacetophenone, α -hydroxy ketone compounds such as hydroxyacetophenone, azo compounds, azide compounds, metallocene compounds, organoboron compounds, and iron arene complexes. For details of these, reference is made to paragraphs 0165 to 0182 of Japanese unexamined patent publication (Kokai) No. 2016-027357 and paragraphs 0138 to 0151 of International publication (Kokai) No. 2015/199219, which are incorporated herein by reference. Examples of the initiator include a compound described in JP-A-2014-130173 at the stage 0065-0111, JP-A-6301489, MATERIAL STAGE-60 p, vol.19, no.3, 2019, a peroxide-based photopolymerization initiator described in International publication No. 2018/221177, a photopolymerization initiator described in International publication No. 2018/110179, a photopolymerization initiator described in JP-A-2019-043864, a photopolymerization initiator described in JP-A-2019-044030, and a peroxide-based initiator described in JP-A-2019-167313, which are incorporated herein by reference.
Examples of the ketone compound include compounds described in paragraph 0087 of Japanese patent application laid-open No. 2015-087611, incorporated herein. Among the commercial products, KAYACURE DETX-S (Nippon Kayaku co., ltd.) may also be preferably used.
In one embodiment of the present invention, as the photo radical polymerization initiator, a hydroxyacetophenone compound, an aminoacetophenone compound, and an acylphosphine compound can be preferably used. More specifically, for example, an aminoacetophenone initiator described in JP-A-10-291969 or an acylphosphine oxide initiator described in JP-A-4225898 can be used, and this content is incorporated in the present specification.
As the alpha-hydroxyketone initiator, omnirad 184, omnirad 1173, omnirad 2959, omnirad 127 (manufactured by IGMResins B.V. above), IRGACURE 184 (IRGACURE is a registered trademark), DAROCUR 1173, IRGACURE 500, IRGACURE-2959, IRGACURE127 (trade name: manufactured by BASF corporation) can be used.
As the α -aminoketone initiator, omnirad 907, omnirad369E, omnirad 379EG (manufactured by the above-mentioned IGM Resins B.V.), IRGACURE 907, IRGACURE 369 and IRGACURE 379 (trade names: all manufactured by BASF corporation) can be used.
As the aminoacetophenone initiator, a compound described in japanese patent application laid-open No. 2009-191179, which is incorporated herein by reference, can be used in which the maximum absorption wavelength is matched to a light source having a wavelength of 365nm or 405nm or the like.
Examples of the acylphosphine oxide initiator include 2,4, 6-trimethylbenzoyl-diphenyl-phosphine oxide and the like. As the catalyst, omnirad 819, omnirad TPO (manufactured by IGM Resins B.V. above), IRGACURE-819, IRGACURE-TPO (trade name: manufactured by BASF corporation) can be used.
Examples of the metallocene compound include IRGACURE-784, IRGACURE-784EG (all manufactured by BASF corporation), keycure VIS 813 (King Brother Chem Co., ltd.).
As the photo radical polymerization initiator, an oxime compound is more preferably exemplified. By using an oxime compound, the exposure latitude can be further effectively improved. The oxime compound is particularly preferable because it has a wide exposure latitude (exposure margin) and also functions as a photocuring accelerator.
Specific examples of the oxime compound include a compound described in japanese patent application laid-open No. 2001-233846, a compound described in japanese patent application laid-open No. 2000-080068, a compound described in japanese patent application laid-open No. 2006-342166, a compound described in j.c.s.perkin II (1979, pages 1653-1660), a compound described in j.c.s.perkin II (1979, pages 156-162), a compound described in Journal of Photopolymer Science and Technology (1995, pages 202-232), a compound described in japanese patent application laid-open No. 2000-066385, a compound described in japanese patent application laid-open No. 2004-534797, a compound described in japanese patent application laid-open No. 6065596, a compound described in international publication No. 2015/152153, a compound described in international publication No. 2017/051680, a compound described in japanese patent application laid-open No. 2017-865, a compound described in international publication No. 2015-1675, a compound described in international publication No. 2015-2015, a publication No. 1648, and the like.
Preferable oxime compounds include, for example, 3- (benzoyloxy (imino)) butan-2-one, 3- (acetoxy (imino)) butan-2-one, 3- (propionyloxy (imino)) butan-2-one, 2- (acetoxy (imino)) pentan-3-one, 2- (acetoxy (imino)) -1-phenylpropan-1-one, 2- (benzoyloxy (imino)) -1-phenylpropan-1-one, 3- ((4-toluenesulfonyloxy) (imino)) butan-2-one, and 2- (ethoxycarbonyloxy (imino)) -1-phenylpropan-1-one of the following structures. In the resin composition of the present invention, an oxime compound (oxime-based photo radical polymerization initiator) is particularly preferably used as a photo radical polymerization initiator. The oxime-type photo-radical polymerization initiator has a linking group > c=n-O-C (=o) -, in the molecule.
[ chemical formula 45]
Among the commercial products, IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE OXE 03, IRGACURE OXE 04 (manufactured by BASF corporation as described above), ADEKA OPTOMER N-1919 (manufactured by ADEKA CORPORATION), and photo radical polymerization initiator 2 described in Japanese patent application laid-open No. 2012-014052 may be preferably used. In addition, TR-PBG-304, TR-PBG-305 (Changzhou Tronly New Electronic Materials CO., LTD.), ADEKA ARKLS NCI-730, NCI-831, and ADEKA ARKLS NCI-930 (ADEKA CORPORATION). Further, DFI-091 (manufactured by Daito Chemix Corporation) and SpeedCure PDO (manufactured by SARTOMER ARKEMA) can be used. Furthermore, an oxime compound having the following structure can also be used.
[ chemical formula 46]
As the photo radical polymerization initiator, an oxime compound having a fluorene ring can also be used. Specific examples of the oxime compound having a fluorene ring include a compound described in japanese patent application laid-open No. 2014-137466 and a compound described in japanese patent No. 06636081, which are incorporated herein by reference.
As the photo radical polymerization initiator, an oxime compound having at least 1 benzene ring of carbazole ring as a skeleton of naphthalene ring can also be used. Specific examples of such oxime compounds include those described in international publication No. 2013/083505, which is incorporated herein by reference.
Oxime compounds having a fluorine atom can also be used. Specific examples of such oxime compounds include a compound described in JP 2010-26261028A, compounds 24, 36 to 40 described in paragraph 0345 of JP 2014-500852A, and compound (C-3) described in paragraph 0101 of JP 2013-164471A, which are incorporated in the present specification.
As the photopolymerization initiator, an oxime compound having a nitro group can be used. Oxime compounds having a nitro group are also preferably dimers. Specific examples of the oxime compound having a nitro group include compounds described in paragraphs 0031 to 0047 of Japanese patent application laid-open No. 2013-114249, 0008 to 0012 and 0070 to 0079 of Japanese patent application laid-open No. 2014-137466, and 0007 to 0025 of Japanese patent application laid-open No. 4223071, which are incorporated herein by reference. Further, as the oxime compound having a nitro group, ADEKA ARKLS NCI-831 (ADEKA CORPORATION).
As the photo radical polymerization initiator, an oxime compound having a benzofuran skeleton can also be used. Specific examples thereof include OE-01 to OE-75 described in International publication No. 2015/036910.
As the photo radical polymerization initiator, an oxime compound in which a substituent having a hydroxyl group is bonded to a carbazole skeleton can also be used. Examples of such photopolymerization initiators include compounds described in International publication No. 2019/088055, which is incorporated herein by reference.
As the photopolymerization initiator, an aromatic ring group Ar having an electron withdrawing group introduced into an aromatic ring can also be used OX1 Is also referred to as oxime compound OX below. Ar as the above aromatic ring group OX1 Examples of the electron-withdrawing group include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a cyano group, preferably an acyl group and a nitro group, more preferably an acyl group, and further preferably a benzoyl group, from the viewpoint of facilitating formation of a film excellent in light resistance. The benzoyl group may have a substituent. The substituent is preferably a halogen atom, cyano group, nitro group, hydroxyl group, alkyl group, alkoxy group, aryl group, aryloxy group, heterocyclic oxy group, alkenyl group, alkylthio group, arylthio group, acyl group or amino group, more preferably an alkyl group, alkoxy group, aryl group, aryloxy group, heterocyclic oxy group, alkylthio group, arylthio group or amino group, still more preferably an alkoxy group, alkylthio group or amino group.
The oxime compound OX is preferably at least 1 selected from the group consisting of a compound represented by the formula (OX 1) and a compound represented by the formula (OX 2), more preferably a compound represented by the formula (OX 2).
[ chemical formula 47]
Wherein R is X1 Represents alkyl, alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heterocyclyloxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, acyl, acyloxy, amino, phosphono, carbamoyl or sulfamoyl,
R X2 represents alkyl, alkenyl, alkoxy, aryl, aryloxy, heterocyclyl, heterocyclyloxy, alkylsulfanyl, arylsulfanyl, alkylsulfinyl, arylsulfinyl, alkylsulfonyl, arylsulfonyl, acyloxy or amino,
R X3 ～R X14 each independently represents a hydrogen atom or a substituent.
Wherein R is X10 ～R X14 At least one of which is an electron withdrawing group.
In the above formula, R is preferably X12 Is an electron withdrawing group and R X10 、R X11 、R X13 、R X14 Is a hydrogen atom.
Specific examples of the oxime compound OX include compounds described in paragraphs 0083 to 0105 of japanese patent No. 4600600, incorporated herein by reference.
Examples of the most preferable oxime compound include an oxime compound having a specific substituent shown in japanese patent application laid-open No. 2007-269779, an oxime compound having a thioaryl group shown in japanese patent application laid-open No. 2009-191061, and the like, which are incorporated herein by reference.
From the viewpoint of exposure sensitivity, the photo radical polymerization initiator is preferably a compound selected from the group consisting of trihalomethyltriazine compounds, benzyldimethyl ketal compounds, α -hydroxyketone compounds, α -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, onium salt compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and derivatives thereof, cyclopentadienyl-benzene-iron complexes and salts thereof, halomethyl oxadiazole compounds, 3-aryl-substituted coumarin compounds.
More preferred photo radical polymerization initiator is a trihalomethyltriazine compound, an α -amino ketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a triarylimidazole dimer, an onium salt compound, a benzophenone compound, an acetophenone compound, still more preferably at least 1 compound selected from the group consisting of trihalomethyltriazine compound, α -amino ketone compound, metallocene compound, oxime compound, triarylimidazole dimer, benzophenone compound, still more preferably a metallocene compound or oxime compound.
The photo radical polymerization initiator may be a benzophenone, an aromatic ketone such as N, N ' -tetramethyl-4, 4' -diaminobenzophenone (Michler's ketone), an aromatic ketone such as N, N ' -tetraalkyl-4, 4' -diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinophenone-1, a benzoin ether compound such as alkylanthraquinone, a benzoin alkyl ether, a benzoin compound such as benzoin, alkylbenzoin, a benzyl derivative such as benzyl dimethyl ketal, or the like. Furthermore, a compound represented by the following formula (I) can also be used.
[ chemical formula 48]
In the formula (I), R I00 Is an alkyl group having 1 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms interrupted by 1 or more oxygen atoms, an alkoxy group having 1 to 12 carbon atoms, a phenyl group, or an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, a halogen atom, a cyclopentyl group, a cyclohexyl group, an alkenyl group having 2 to 12 carbon atoms, a phenyl group or a biphenyl group substituted by at least 1 of an alkyl group having 2 to 18 carbon atoms and an alkyl group having 1 to 4 carbon atoms interrupted by 1 or more oxygen atoms, R I01 Is a group represented by formula (II) or is associated with R I00 The same radicals R I02 ～R I04 Each independently represents an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, or a halogen atom.
[ chemical formula 49]
Wherein R is I05 ～R I07 R is the same as the R of the formula (I) I02 ～R I04 The same applies.
The photo radical polymerization initiator may be any one of the compounds described in paragraphs 0048 to 0055 of International publication No. 2015/125469, incorporated herein by reference.
As the photo radical polymerization initiator, a 2-functional or 3-functional or more photo radical polymerization initiator can be used. By using such a photo radical polymerization initiator, 2 or more radicals are generated from one molecule of the photo radical polymerization initiator, and thus good sensitivity can be obtained. In addition, when a compound having an asymmetric structure is used, crystallinity is reduced, solubility in a solvent or the like is increased, and deposition is less likely to occur with the passage of time, whereby the stability of the resin composition with time can be improved. Specific examples of the 2-functional or 3-functional or more photo-radical polymerization initiator include the photoinitiators of oxime esters described in Japanese patent application publication No. 2010-527339, japanese patent application publication No. 2011-524436, the photoinitiators described in Japanese patent application publication No. 0020-0033, the photoinitiators described in Japanese patent application publication No. 2017-0412, the dimers of oxime compounds described in Japanese patent application publication No. 0039-0055, the compounds (E) and (G) described in Japanese patent application publication No. 2013-522445, the Cmpd 1-7 described in Japanese patent application publication No. 2016/034963, the photoinitiators of oxime esters described in Japanese patent application publication No. 2017-523465, the photoinitiators described in Japanese patent application publication No. 0020-0033, the photoinitiators described in Japanese patent application publication No. 2017-151342, the photoinitiators described in paragraphs 0017-0026, the photoinitiators described in Japanese patent application publication No. 6469669, and the like.
When the photopolymerization initiator is contained, the content thereof is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, still more preferably 0.5 to 15% by mass, and still more preferably 1.0 to 10% by mass, relative to the total solid content of the resin composition of the present invention. The photopolymerization initiator may be contained in an amount of 1 or 2 or more. When the photopolymerization initiator is contained in an amount of 2 or more, the total amount is preferably within the above range.
Further, since the photopolymerization initiator may also function as a thermal polymerization initiator, the crosslinking by the photopolymerization initiator may be further promoted by heating in an oven, a hot plate, or the like.
[ sensitizer ]
The resin composition may contain a sensitizer. The sensitizer absorbs a specific active radiation to be in an electron-excited state. The sensitizer in an electron excited state is brought into contact with a thermal radical polymerization initiator, a photo radical polymerization initiator or the like to cause an electron transfer, an energy transfer, heat generation or the like. Thus, the thermal radical polymerization initiator and the photo radical polymerization initiator cause chemical changes to decompose and generate radicals, acids or bases.
As the sensitizer that can be used, compounds such as benzophenone-based, milone-based, coumarin-based, pyrazole azo-based, aniline azo-based, triphenylmethane-based, anthraquinone-based, anthracene-based, anthrapyridone-based, benzylidene-based, oxonol-based, pyrazolotriazole azo-based, pyridone azo-based, cyanine-based, phenothiazine-based, pyrrolopyrazole azomethine-based, xanthene-based, phthalocyanine-based, benzopyran-based, indigo-based and the like can be used.
As the sensitizer, for example, examples thereof include midone, 4' -bis (diethylamino) benzophenone, 2, 5-bis (4 ' -diethylaminobenzylidene) cyclopentane, 2, 6-bis (4 ' -diethylaminobenzylidene) cyclohexanone, 2, 6-bis (4 ' -diethylaminobenzylidene) -4-methylcyclohexanone, 4' -bis (dimethylamino) chalcone, 4' -bis (diethylamino) chalcone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenyl biphenyl) -benzothiazole, 2- (p-dimethylaminophenyl vinylidene) benzothiazole, and 2- (p-dimethylaminophenylvinylene) isonaphthylthiazole, 1, 3-bis (4 ' -dimethylaminobenzylidene) acetone, 1, 3-bis (4 ' -diethylaminobenzylidene) acetone, 3' -carbonyl-bis (7-diethylaminocoumarin), 3-acetyl-7-dimethylaminocoumarin, 3-ethoxycarbonyl-7-dimethylaminocoumarin, 3-benzyloxycarbonyl-7-dimethylaminocoumarin, 3-methoxycarbonyl-7-diethylaminocoumarin, 3-ethoxycarbonyl-7-diethylaminocoumarin (7- (diethylamino) coumarin-3-carboxylic acid ethyl ester), and, N-phenyl-N ' -ethylethanolamine, N-phenyldiethanolamine, N-p-tolyldiethanolamine, N-phenylethanolamine, 4-morpholinylbenzophenone, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 2-mercaptobenzimidazole, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzothiazole, 2- (p-dimethylaminostyrene) benzoxazole, 2- (p-dimethylaminostyrene) benzothiazole, 2- (p-dimethylaminostyrene) naphthalene (1, 2-d) thiazole, 2- (p-dimethylaminobenzoyl) styrene, diphenylacetamide, benzanilide, N-methylacetanilide, 3',4' -dimethylacetanilide, and the like.
Furthermore, other sensitizing colorants can be used.
For details of the sensitizing dye, reference is made to paragraphs 0161 to 0163 of Japanese patent application laid-open No. 2016-027357, which is incorporated herein by reference.
When the resin composition contains a sensitizer, the content of the sensitizer is preferably 0.01 to 20% by mass, more preferably 0.1 to 15% by mass, and even more preferably 0.5 to 10% by mass, based on the total solid content of the resin composition. The sensitizer may be used alone in an amount of 1 or 2 or more.
[ chain transfer agent ]
The resin composition of the present invention may contain a chain transfer agent. Chain transfer agents are defined, for example, in pages 683-684 of the third edition of the Polymer dictionary (university of Polymer (The Society of Polymer Science, japan) eds., 2005). As the chain transfer agent, for example, a compound group having-S-, -SO2-S-, -N-O-, SH, PH, riH, and GeH in the molecule, for RAFT (Reversible Addition Fragmentation chain Transfer: reversible addition fragmentation chain transfer) polymerized dithiobenzoate, trithiocarbonate, dithiocarbamate, xanthate compounds, and the like having thiocarbonylthio groups. These supply hydrogen to the low activity radicals to generate radicals, or may generate radicals by deprotonation after oxidation. In particular, a thiol compound can be preferably used.
The chain transfer agent may be a compound described in paragraphs 0152 to 0153 of International publication No. 2015/199219, incorporated herein by reference.
When the resin composition of the present invention has a chain transfer agent, the content of the chain transfer agent is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the total solid content of the resin composition of the present invention. The chain transfer agent may be 1 or 2 or more. When the chain transfer agent is 2 or more, the total amount thereof is preferably within the above range.
[ photoacid generator ]
The resin composition of the present invention preferably contains a photoacid generator.
The photoacid generator is a compound that generates at least one of a bronsted acid and a lewis acid by irradiating light of 200nm to 900 nm. The light to be irradiated is preferably light having a wavelength of 300nm to 450nm, more preferably light having a wavelength of 330nm to 420 nm. When the photoacid generator is used alone or in combination with a sensitizer, it is preferable that the photoacid generator can generate an acid by sensitization.
Examples of the acid to be produced include hydrogen halide, carboxylic acid, sulfonic acid, sulfinic acid, thiosulfinic acid, phosphoric monoester, phosphoric diester, boron derivative, phosphorus derivative, antimony derivative, halogen peroxide, sulfonamide, and the like.
Examples of the photoacid generator used in the resin composition of the present invention include quinone diazide compounds, oxime sulfonate compounds, organic halogenated compounds, organic borate compounds, disulfone compounds, onium salt compounds, and the like.
From the viewpoints of sensitivity and storage stability, the organic halogen compound, oxime sulfonate compound, and onium salt compound are preferable, and from the viewpoints of mechanical properties of the formed film, oxime esters are preferable.
Examples of the quinone diazide compound include a compound in which a quinone diazide sulfonic acid is bonded to a 1-or polyhydric hydroxyl compound via an ester bond, a compound in which a quinone diazide sulfonic acid is bonded to a 1-or polyhydric amino compound via a sulfonamide, and a compound in which a quinone diazide sulfonic acid is bonded to a polyhydric polyamino compound via an ester bond and/or a sulfonamide. These polyols, polyamino compounds, polyhydroxy polyamino compounds need not have all functional groups replaced by quinone diazide, preferably more than 40 mole% of the total functional groups are replaced by quinone diazide on average. By containing such a quinone diazide compound, a resin composition which is sensitive to the i-ray (wavelength 365 nm), h-ray (wavelength 405 nm) and g-ray (wavelength 436 nm) of a mercury lamp which are general ultraviolet rays can be obtained.
As the hydroxyl compound, specifically, phenol, trihydroxybenzophenone, 4-methoxyphenol, isopropanol, octanol, t-butanol, cyclohexanol, naphthol, bis-Z, bisP-EZ, tekP-4HBPA, trisP-HAP, trisP-PA, trisP-SA, trisOCR-PA, bisOCHP-Z, bisP-MZ, bisP-PZ, bisP-IPZ, bisOCP-IPZ, bisP-CP, bisRS-2P, bisRS-3P, bisP-OCHP, methyl Tris-FR-CR, bisRS-26X, DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML-PC, DML-PTBP, DML-34-EP, DML-POP, dimethylol-BisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC, triML-35XL, TML-BP, TML-Q, TML-3, TML-BRL-UK, HMP-393-BPL, HMP-TPBP, PHBPL-TPBP and PHBPL-TPBP are mentioned, honshu Chemical Industry co., ltd.) BIR-OC, BIP-PC, BIR-PTBP, BIR-PCHP, BIP-BIOC-F, 4PC, BIR-BIPC-F, TEP-BIP-A, 46DMOC, 46DMOEP, TM-BIP-A (trade name, ASAHI YUKIZAI CORPORATION), 2, 6-dimethoxymethyl-4-tert-butylphenol, 2, 6-dimethoxymethyl-p-cresol, 2, 6-diacetoxymethyl-p-cresol, naphthol, tetrahydroxybenzophenone, methyl gallate, bisphenol A, bisphenol E, methylenebisphenol, bisP-AP (trade name, honshu Chemical Industry co., ltd.), novolak resin, etc., but are not limited thereto.
Specific examples of the amino compound include aniline, methylaniline, diethylamine, butylamine, 1, 4-phenylenediamine, 1, 3-phenylenediamine, 4 '-diaminodiphenyl ether, 4' -diaminodiphenylmethane, 4 '-diaminodiphenylsulfone, 4' -diaminodiphenylsulfide, and the like, but are not limited thereto.
Specific examples of the polyhydric polyamino compound include 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 3,3' -dihydroxybenzidine, but are not limited thereto.
Among them, as the quinone diazide compound, an ester containing a phenol compound and 4-naphthoquinone diazide sulfonyl is preferable. Thus, higher sensitivity and higher resolution at the time of i-ray exposure can be obtained.
The content of the quinone diazide compound used in the resin composition of the present invention is preferably 1 to 50 parts by mass, more preferably 10 to 40 parts by mass, relative to 100 parts by mass of the resin. By setting the content of the quinone diazide compound in this range, the contrast between the exposed portion and the unexposed portion can be obtained, and thus high sensitivity can be achieved, which is preferable. A sensitizer or the like may be further added as needed.
The photoacid generator is also preferably a compound containing an oxime sulfonate group (hereinafter, also simply referred to as "oxime sulfonate compound").
The oxime sulfonate compound is not particularly limited as long as it has an oxime sulfonate group, and is preferably an oxime sulfonate compound represented by the following formula (OS-1), the following formula (0S-103), the formula (OS-104) or the formula (OS-105).
[ chemical formula 50]
In the formula (OS-1), X 3 Represents an alkyl group, an alkoxy group or a halogen atom. X is X 3 When there are plural, they may be the same or different. Above X 3 The alkyl group and the alkoxy group in (a) may have a substituent. As the aboveX 3 The alkyl group in (a) is preferably a linear or branched alkyl group having 1 to 4 carbon atoms. As the above X 3 The alkoxy group in (a) is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms. As the above X 3 The halogen atom in (2) is preferably a chlorine atom or a fluorine atom.
In the formula (OS-1), m3 represents an integer of 0 to 3, preferably 0 or 1. When m3 is 2 or 3, a plurality of X 3 May be the same or different.
In the formula (0S-1), R 34 Represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, a halogenated alkoxy group having 1 to 5 carbon atoms, a phenyl group which may be substituted with W, a naphthyl group which may be substituted with W, or an anthryl group which may be substituted with W. W represents a halogen atom, a cyano group, a nitro group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, a halogenated alkoxy group having 1 to 5 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a halogenated aryl group having 6 to 20 carbon atoms.
In the formula (0S-1), m3 is 3, X 3 Is methyl, X 3 Is ortho to the substituted position, R 34 Particularly preferred are compounds having a linear alkyl group having 1 to 10 carbon atoms, a 7, 7-dimethyl-2-oxonorbornylmethyl group or a p-tolyl group.
Specific examples of the oxime sulfonate compound represented by the formula (OS-1) include the following compounds described in paragraphs 0064 to 0068 of JP 2011-209692 and paragraphs 0158 to 0167 of JP 2015-194674, which are incorporated herein by reference.
[ chemical formula 51]
In the formulae (OS-103) to (0S-105), R s1 Represents alkyl, aryl or heteroaryl, R s2 When a plurality of them exist, each independently represents a hydrogen atom, an alkyl group, an aryl group or a halogen atom, R s6 When there are a plurality, each independently represents a halogen atomSon, alkyl, alkoxy, sulfonic, sulfamoyl or alkoxysulfonyl, xs represents O or S, ns represents 1 or 2, ms represents an integer from 0 to 6.
In the formulae (0S-103) to (OS-105), R is s1 The alkyl group (preferably having 1 to 30 carbon atoms), the aryl group (preferably having 6 to 30 carbon atoms) or the heteroaryl group (preferably having 4 to 30 carbon atoms) may have a known substituent within a range that achieves the effect of the present invention.
In the formulae (OS-103) to (OS-105), R s2 Preferably a hydrogen atom, an alkyl group (preferably having 1 to 12 carbon atoms) or an aryl group (preferably having 6 to 30 carbon atoms), more preferably a hydrogen atom or an alkyl group. R is R s2 When there are 2 or more in the compound, 1 or 2 of them are preferably an alkyl group, an aryl group or a halogen atom, more preferably 1 is an alkyl group, an aryl group or a halogen atom, particularly preferably 1 is an alkyl group and the rest are hydrogen atoms. From R s2 The alkyl group or the aryl group represented may have a known substituent within a range that achieves the effect of the present invention.
In the formula (OS-103), the formula (OS-104) or the formula (OS-105), xs represents O or S, preferably O. In the above formulae (OS-103) to (OS-105), the ring containing Xs as a ring-forming atom is a 5-membered ring or a 6-membered ring.
In the formulae (OS-103) to (OS-105), ns represents 1 or 2, preferably ns is 1 when Xs is 0, and ns is 2 when Xs is S.
In the formulae (OS-103) to (OS-105), R is s6 The alkyl group (preferably having 1 to 30 carbon atoms) and the alkoxy group (preferably having 1 to 30 carbon atoms) may have a substituent.
In the formulae (OS-103) to (OS-105), ms represents an integer of 0 to 6, preferably an integer of 0 to 2, more preferably 0 or 1, and particularly preferably 0.
The compound represented by the above formula (OS-103) is particularly preferably a compound represented by the following formula (OS-106), formula (OS-110) or formula (OS-111), the compound represented by the above formula (OS-104) is particularly preferably a compound represented by the following formula (OS-107), and the compound represented by the above formula (OS-105) is particularly preferably a compound represented by the following formula (OS-108) or formula (OS-109).
[ chemical formula 52]
In the formulae (OS-106) to (OS-111), R t1 Represents alkyl, aryl or heteroaryl, R t7 Represents a hydrogen or bromine atom, R t8 Represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, a halogen atom, a chloromethyl group, a bromomethyl group, a bromoethyl group, a methoxymethyl group, a phenyl group or a chlorophenyl group, R t9 Represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group, R t2 Represents a hydrogen atom or a methyl group.
In the formulae (OS-106) to (OS-111), R t7 Represents a hydrogen atom or a bromine atom, preferably a hydrogen atom.
In the formulae (OS-106) to (OS-111), R t8 The alkyl group having 1 to 8 carbon atoms, halogen atom, chloromethyl group, bromomethyl group, bromoethyl group, methoxymethyl group, phenyl group or chlorophenyl group is preferably an alkyl group having 1 to 8 carbon atoms, halogen atom or phenyl group, more preferably an alkyl group having 1 to 8 carbon atoms, still more preferably an alkyl group having 1 to 6 carbon atoms, and particularly preferably methyl group.
In the formulae (OS-106) to (OS-111), R t9 Represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group, preferably a hydrogen atom.
R t2 Represents a hydrogen atom or a methyl group, preferably a hydrogen atom.
In the oxime sulfonate compound, the steric structure (E, Z) of the oxime may be any one or a mixture.
Specific examples of the oxime sulfonate compounds represented by the above formulas (OS-103) to (OS-105) include compounds described in paragraphs 0088 to 0095 of Japanese patent application laid-open No. 2011-209692 and paragraphs 0168 to 0194 of Japanese patent application laid-open No. 2015-194674, which are incorporated herein by reference.
As a preferred embodiment of the oxime sulfonate compound containing at least 1 oxime sulfonate group, there may be mentioned compounds represented by the following formulas (OS-101) and (OS-102).
[ chemical formula 53]
In the formula (OS-101) or (OS-102), R u9 Represents a hydrogen atom, an alkyl group, an alkenyl group, an alkoxy group, an alkoxycarbonyl group, an acyl group, a carbamoyl group, a sulfamoyl group, a sulfo group, a cyano group, an aryl group or a heteroaryl group. More preferably R u9 In the form of cyano or aryl, R is further preferred u9 Is cyano, phenyl or naphthyl.
In the formula (OS-101) or (OS-102), R u2a Represents an alkyl group or an aryl group.
In the formula (OS-101) or the formula (OS-102), xu represents-O-, -S-, -NH-, -NR u5 -、-CH 2 -、-CR u6 H-or CR u6 R u7 -，R u5 ～R u7 Each independently represents an alkyl group or an aryl group.
In the formula (OS-101) or (OS-102), R u1 ～R u4 Each independently represents a hydrogen atom, a halogen atom, an alkyl group, an alkenyl group, an alkoxy group, an amino group, an alkoxycarbonyl group, an alkylcarbonyl group, an arylcarbonyl group, an amide group, a sulfo group, a cyano group or an aryl group. R is R u1 ～R u4 Can be bonded to each other to form a ring. In this case, the ring may be condensed to form a condensed ring together with the benzene ring. As R u1 ～R u4 Preferably a hydrogen atom, a halogen atom or an alkyl group, and R is also preferred u1 ～R u4 A means for forming an aryl group by bonding at least 2 of them to each other. Among them, R is preferable u1 ～R u4 All are hydrogen atoms. The above substituents may each further have a substituent.
The compound represented by the above formula (OS-101) is more preferably a compound represented by the formula (OS-102).
In the oxime sulfonate compound, the steric structure (E, Z, etc.) of the oxime or benzothiazole ring may be any one or a mixture of them.
Specific examples of the compound represented by the formula (OS-101) include compounds described in paragraphs 0102 to 0106 of Japanese patent application laid-open No. 2011-209692 and paragraphs 0195 to 0207 of Japanese patent application laid-open No. 2015-194674, which are incorporated herein by reference.
Among the above compounds, the following b-9, b-16, b-31, b-33 are preferable.
[ chemical formula 54]
Examples of the commercial products include WPAG-336 (manufactured by FUJIFILM Wako Pure Chemical Corporation), WPAG-443 (manufactured by FUJIFILM Wako Pute Chemical Corporation), and MBZ-101 (manufactured by Midori Kagaku Co., ltd.).
Further, preferable examples thereof include compounds represented by the following structural formulae.
[ chemical formula 55]
Specific examples of the organic halogenated compound include those described in "Bull chem. Soc Japan"42, 2924 (1969), U.S. Pat. No. 3,905,815, japanese patent publication No. 46-4605, japanese patent application laid-open No. 48-36281, japanese patent application laid-open No. 55-32070, japanese patent application laid-open No. 60-239736, japanese patent application laid-open No. 61-169835, japanese patent application laid-open No. 61-169837, japanese patent application laid-open No. 62-58241, japanese patent application laid-open No. 62-212401, japanese patent application laid-open No. 63-70243, japanese patent application laid-open No. 63-298339, and M.P.Hutt "Jurnal of Heterocyclic Chemistry"1 (No. 3), (1970) and the like, which are incorporated herein by reference. In particular, as a preferable example, an oxazole compound substituted with a trihalomethyl group is given: s-triazine compounds.
More preferably, at least one mono-, di-or tri-halogen substituted methyl group-bonded to the s-triazine ring, specifically, for example, 2,4, 6-tris (monochloromethyl) -s-triazine, 2,4, 6-tris (dichloromethyl) -s-triazine, 2,4, 6-tris (trichloromethyl) -s-triazine, 2-methyl-4, 6-bis (trichloromethyl) -s-triazine, 2-n-butyl-4, 6-bis (trichloromethyl) -s-triazine, 2- (. Alpha.,. Beta. -trichloroethyl) -4, 6-bis (trichloromethyl) -s-triazine, 2-phenyl-4, 6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (3, 4-epoxyphenyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-chlorophenyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- [ 1- (p-methoxyphenyl) -2, 4-yl ] -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -s-methyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-isopropoxystyryl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (4-naphthyloxy-naphthalene) -4, 6-bis (trichloromethyl) -s-triazine, 2-phenylthio-4, 6-bis (trichloromethyl) -s-triazine, 2-benzylthio-4, 6-bis (trichloromethyl) -s-triazine, 2,4, 6-tris (dibromomethyl) -s-triazine, 2,4, 6-tris (tribromomethyl) -s-triazine, 2-methyl-4, 6-bis (tribromomethyl) -s-triazine, 2-methoxy-4, 6-bis (tribromomethyl) -s-triazine, and the like.
Examples of the organic borate compound include, for example, an organic borate described in Japanese patent application laid-open No. 62-143044, japanese patent application laid-open No. 62-150242, japanese patent application laid-open No. 9-188685, japanese patent application laid-open No. 9-188686, japanese patent application laid-open No. 9-188710, japanese patent application laid-open No. 2000-131837, japanese patent application laid-open No. 2002-107916, japanese patent application laid-open No. 2764769, japanese patent application laid-open No. 2002-116539, etc., an organic borate described in Kunz, martin "Rad Tech'98.Proceeding April 19-22, 1998, chicago" etc., an organic sulfonium complex or an organic boron sulfonium complex described in Japanese patent application laid-open No. 6-157623, japanese patent application laid-open No. 6-175564, japanese patent application laid-open No. 6-175561, an organic boron-iodine complex described in Japanese patent application laid-open No. 6-131837, an organic boron complex described in Japanese patent application laid-open No. 6-175553, japanese patent application laid-open No. 37, japanese patent application laid-open No. 6-open No. 37-37, and the like, and the transition metal complex described in Japanese patent application laid-open No. 6-open No. 37-7, japanese patent application laid-open No. 6-7, and the like.
Examples of the disulfone compound include those described in Japanese patent application laid-open No. 61-166544 and Japanese patent application laid-open No. 2001-132318, and diazodisulfone compounds.
Examples of the onium salt compound include diazonium salts described in S.I.Schlesinger, photogr.Sci.Eng.,18, 387 (1974), t.s.bal et al, polymer,21, 423 (1980), ammonium salts described in U.S. Pat. No. 4,069,055, japanese patent application publication No. 4-365049, etc., phosphonium salts described in U.S. Pat. No. 4,069,055, U.S. Pat. No. 4,069,056, european patent application publication No. 104,143, U.S. Pat. No. 339,049, U.S. Pat. No. 410,201, iodonium salts described in japanese patent application publication No. 2-150848, japanese patent application publication No. 2-296514, european patent application publication No. 370,693, european patent application publication No. 390,214, european patent application publication No. 233,567, european patent application No. 297,443, european patent application No. 297,442, U.S. 4,933,377, U.S. 161,811, U.S. Pat. No. 410,201, U.S. Pat. No. 339,049, U.S. 4,760,013, U.S. Pat. No. 4,734,444, U.S. Pat. 2,833,827, german patent application publication No. 5, german patent application publication No. 5,4882, and crv 37,37j, macromolecules,10 (6), 1307 (1977), J.V.Criverlo et al, J.Polymer Sci., polymer chem. Ed.,17, 1047 (1979), selenium salts, C.S. Wen et al, teh, proc.Conf.Rad.copper ASIA, p478Tokyo, oct (1988), onium salts such as arsenic salts, pyridinium salts, and the like, which are incorporated herein by reference.
As the onium salts, there may be mentioned onium salts represented by the following general formulae (RI-I) to (RI-III).
[ chemical formula 56]
Formula (RI-I)) Ar in (1) 11 An aryl group having 20 or less carbon atoms which may have 1 to 6 substituents is preferably an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, an alkynyl group having 2 to 12 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an aryloxy group having 1 to 12 carbon atoms, a halogen atom, an alkylamino group having 1 to 12 carbon atoms, a dialkylamino group having 2 to 12 carbon atoms, an alkylamido group having 1 to 12 carbon atoms or an aryl group having 6 to 20 carbon atoms of an alkylamido group, a carbonyl group, a carboxyl group, a cyano group, a sulfonyl group, a sulfanyl group having 1 to 12 carbon atoms or a sulfanyl group having 1 to 12 carbon atoms. Z is Z 11 The 1-valent anion, halogen ion, perchlorate ion, hexafluorophosphate ion, tetrafluoroborate ion, sulfonate ion, sulfinate ion, sulfate ion, and from the aspect of stability, preferred are perchlorate ion, hexafluorophosphate ion, tetrafluoroborate ion, sulfonate ion, sulfinate ion. In the formula (RI-II), ar 21 、Ar 22 The aryl group having 1 to 20 carbon atoms which may have 1 to 6 substituents is independently represented by an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, an alkynyl group having 2 to 12 carbon atoms, an aryl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an aryloxy group having 1 to 12 carbon atoms, a halogen atom, a monoalkylamino group having 1 to 12 carbon atoms, a dialkylamino group having 1 to 12 carbon atoms of an alkyl group, an alkylamido group having 1 to 12 carbon atoms of an alkyl group or an arylamido group, a carbonyl group, a carboxyl group, a cyano group, a sulfonyl group, a sulfanyl group having 1 to 12 carbon atoms. Z is Z 21 - The 1-valent anion is preferably a halogen ion, a perchlorate ion, a hexafluorophosphate ion, a tetrafluoroborate ion, a sulfonate ion, a sulfinate ion, a sulfate ion, or a sulfate ion, and from the viewpoints of stability and reactivity, a perchlorate ion, a hexafluorophosphate ion, a tetrafluoroborate ion, a sulfonate ion, a sulfinate ion, or a carboxylate ion is preferable. In the formula (RI-III), R 31 、R 32 、R 33 Each of which is a single pieceIndependently represents an aryl group having 6 to 20 carbon atoms which may have 1 to 6 substituents, or an alkyl group, an alkenyl group or an alkynyl group, and from the viewpoints of reactivity and stability, an aryl group is preferable. Preferred substituents include an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, an alkynyl group having 2 to 12 carbon atoms, an aryl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an aryloxy group having 1 to 12 carbon atoms, a halogen atom, a monoalkylamino group having 1 to 12 carbon atoms, a dialkylamino group having 1 to 12 carbon atoms independently of each other, an alkylamido group having 1 to 12 carbon atoms of an alkyl group, an arylamido group, a carbonyl group, a carboxyl group, a cyano group, a sulfonyl group, a sulfanyl group having 1 to 12 carbon atoms, and a thioaryl group having 1 to 12 carbon atoms. Z is Z 31 The 1-valent anion is preferably a halogen ion, a perchlorate ion, a hexafluorophosphate ion, a tetrafluoroborate ion, a sulfonate ion, a sulfinate ion, a sulfate ion, or a sulfate ion, and from the viewpoints of stability and reactivity, a perchlorate ion, a hexafluorophosphate ion, a tetrafluoroborate ion, a sulfonate ion, a sulfinate ion, or a carboxylate ion is preferable.
Specific examples of the preferred photoacid generator are as follows.
[ chemical formula 57]
[ chemical formula 58]
[ chemical formula 59]
[ chemical formula 60]
[ chemical formula 61]
The photoacid generator is preferably used in an amount of 0.1 to 20% by mass, more preferably 0.5 to 18% by mass, still more preferably 0.5 to 10% by mass, still more preferably 0.5 to 3% by mass, and still more preferably 0.5 to 1.2% by mass, based on the total solid content of the resin composition.
The photoacid generator may be used alone or in combination of 1 or more. When a plurality of these are combined, the total amount of these is preferably within the above range.
In order to impart photosensitivity to a desired light source, it is also preferable to use a sensitizer in combination.
< alkali Generator >
The resin composition of the present invention may contain a base generator. Herein, the base generator means a compound capable of generating a base by physical action or chemical action. Examples of the alkali generator which is preferable for the resin composition of the present invention include a thermal alkali generator and a photobase generator.
In particular, when the resin composition contains a precursor of the cyclized resin, the resin composition preferably contains a base generator. When the resin composition contains a thermal base generator, for example, cyclization reaction of the precursor can be accelerated by heating, and mechanical properties and chemical resistance of the cured product are improved, for example, performance as an interlayer insulating film for a rewiring layer included in a semiconductor package is improved.
The alkali generator may be an ionic alkali generator or a nonionic alkali generator. Examples of the base generated from the base generator include secondary amines and tertiary amines.
The alkali generator according to the present invention is not particularly limited, and a known alkali generator can be used. As the known base generating agent, for example, a carbamoyl oxime compound, a carbamoyl hydroxylamine compound, a carbamic acid compound, a carboxamide compound, an acetamide compound, a carbamic acid ester compound, a benzyl carbamic acid ester compound, a nitrobenzyl carbamic acid ester compound, a sulfonamide compound, an imidazole derivative compound, an amine imide compound, a pyridine derivative compound, an α -aminoacetophenone derivative compound, a quaternary ammonium salt derivative compound, a pyridinium salt, an α -lactone ring derivative compound, an amine imide compound, a phthalimide derivative compound, an acyloxyimino compound, or the like can be used.
Specific examples of the nonionic base generator include compounds represented by the formula (B1), the formula (B2), and the formula (B3).
[ chemical formula 62]
Rb in the formulae (B1) and (B2) 1 、Rb 2 Rb 3 Each independently is an organic group having no tertiary amine structure, a halogen atom, or a hydrogen atom. Wherein Rb 1 Rb 2 And not simultaneously become hydrogen atoms. Furthermore, rb 1 、Rb 2 Rb 3 None of them has a carboxyl group. In the present specification, the tertiary amine structure means a structure in which all of 3 bonds of a 3-valent nitrogen atom are covalently bonded to a hydrocarbon-based carbon atom. Therefore, when the bonded carbon atom is a carbonyl group-forming carbon atom, that is, an amide group is formed together with a nitrogen atom, the present invention is not limited thereto.
In the formulae (B1) and (B2), rb is preferably 1 、Rb 2 Rb 3 At least 1 of which comprises a cyclic structure, more preferably at least 2 of which comprises a cyclic structure. The cyclic structure may be any of a single ring and a condensed ring, and a condensed ring formed by condensing a single ring or 2 single rings is preferable. The monocyclic ring is preferably a 5-membered ring or a 6-membered ring, more preferably a 6-membered ring. The monocyclic ring is preferably a cyclohexane ring and a benzene ring, and more preferably a cyclohexane ring.
More specifically, rb 1 Rb 2 Preferably a hydrogen atom, an alkyl group (preferably having 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), Alkenyl (preferably 2 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), aryl (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10 carbon atoms), or aralkyl (preferably 7 to 25 carbon atoms, more preferably 7 to 19 carbon atoms, still more preferably 7 to 12 carbon atoms). These groups may have substituents within a range that exerts the effects of the present invention. Rb (Rb) 1 With Rb 2 Can be bonded to each other to form a ring. As the ring formed, a 4-to 7-membered nitrogen-containing heterocycle is preferable. In particular, rb 1 Rb 2 The alkyl group is preferably a linear, branched or cyclic alkyl group which may have a substituent (preferably a carbon atom number of 1 to 24, more preferably 2 to 18, still more preferably 3 to 12), more preferably a cycloalkyl group which may have a substituent (preferably a carbon atom number of 3 to 24, more preferably 3 to 18, still more preferably 3 to 12), and still more preferably a cyclohexyl group which may have a substituent.
As Rb 3 Examples thereof include an alkyl group (preferably having 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10 carbon atoms), an alkenyl group (preferably having 2 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, still more preferably 2 to 6 carbon atoms), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, still more preferably 7 to 12 carbon atoms), an aralkenyl group (preferably having 8 to 24 carbon atoms, more preferably 8 to 20 carbon atoms, still more preferably 8 to 16 carbon atoms), an alkoxy group (preferably having 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), an aryloxy group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 12) or an aralkoxy group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19, still more preferably 7 to 12). Among them, cycloalkyl groups (preferably having 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), aralkenyl groups, and aralkoxy groups are preferable. Rb (Rb) 3 Further, the substituent may be present within a range that exerts the effects of the present invention.
The compound represented by the formula (B1) is preferably a compound represented by the following formula (B1-1) or the following formula (B1-2).
[ chemical formula 63]
In the formula, rb 11 Rb 12 And Rb 31 Rb 32 Respectively with Rb in formula (B1) 1 Rb 2 The meaning is the same.
Rb 13 The substituent may be an alkyl group (preferably having 1 to 24 carbon atoms, more preferably having 2 to 18 carbon atoms, still more preferably having 3 to 12 carbon atoms), an alkenyl group (preferably having 2 to 24 carbon atoms, more preferably having 2 to 18 carbon atoms, still more preferably having 3 to 12 carbon atoms), an aryl group (preferably having 6 to 22 carbon atoms, more preferably having 6 to 18 carbon atoms, still more preferably having 6 to 12 carbon atoms), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably having 7 to 19 carbon atoms, still more preferably having 7 to 12 carbon atoms) within a range that exhibits the effect of the present invention. Wherein Rb 13 Aralkyl groups are preferred.
Rb 33 Rb 34 Each independently represents a hydrogen atom, an alkyl group (preferably having 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, still more preferably 1 to 3 carbon atoms), an alkenyl group (preferably having 2 to 12 carbon atoms, more preferably 2 to 8 carbon atoms, still more preferably 2 to 3 carbon atoms), an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, still more preferably 6 to 10 carbon atoms), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, still more preferably 7 to 11 carbon atoms), or a hydrogen atom.
Rb 35 The aromatic group is preferably an alkyl group (preferably having 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, still more preferably 3 to 8 carbon atoms), an alkenyl group (preferably having 2 to 12 carbon atoms, more preferably 2 to 10, still more preferably 3 to 8 carbon atoms), an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18, still more preferably 6 to 12 carbon atoms), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19, still more preferably 7 to 12 carbon atoms), or an aryl group.
The compound represented by the formula (B1-1) is also preferably a compound represented by the formula (B1-1 a).
[ chemical formula 64]
Rb 11 Rb 12 And Rb in formula (B1-1) 11 Rb 12 The meaning is the same.
Rb 15 Rb 16 Is hydrogen atom, alkyl group (preferably carbon number)1 to 12, more preferably 1 to 6, still more preferably 1 to 3), an alkenyl group (preferably having 2 to 12 carbon atoms, more preferably 2 to 6, still more preferably 2 to 3), an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18, still more preferably 6 to 10), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19, still more preferably 7 to 11), a hydrogen atom or a methyl group.
Rb 17 Among them, an alkyl group (preferably having 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, still more preferably 3 to 8 carbon atoms), an alkenyl group (preferably having 2 to 12 carbon atoms, more preferably 2 to 10, still more preferably 3 to 8 carbon atoms), an aryl group (preferably having 6 to 22 carbon atoms, more preferably 6 to 18, still more preferably 6 to 12 carbon atoms), an aralkyl group (preferably having 7 to 23 carbon atoms, more preferably 7 to 19, still more preferably 7 to 12 carbon atoms) is preferable.
[ chemical formula 65]
In the formula (B3), L is a 2-valent hydrocarbon group having a saturated hydrocarbon group on the path of a linking chain linking adjacent oxygen atoms and carbon atoms, and represents a hydrocarbon group having 3 or more atoms on the path of the linking chain. And R is N1 R is R N2 Each independently represents a 1-valent organic group.
In the present specification, the term "link chain" refers to a chain in which the connection objects are connected at the shortest (minimum atomic number) distance among atomic chains on a path connecting 2 atoms or groups of atoms. For example, in a compound represented by the following formula, L is composed of styrene and has a vinyl group as a saturated hydrocarbon group, the linking chain is composed of 4 carbon atoms, and the number of atoms on the path of the linking chain (i.e., the number of atoms constituting the linking chain, hereinafter also referred to as "linking chain length" or "linking chain length") is 4.
[ chemical formula 66]
The number of carbon atoms in L of the formula (B3) (including carbon atoms other than the carbon atoms in the connecting chain) is preferably 3 to 24. The upper limit is more preferably 12 or less, still more preferably 10 or less, and particularly preferably 8 or less. The lower limit is more preferably 4 or more. The upper limit of the chain length of L is preferably 12 or less, more preferably 8 or less, further preferably 6 or less, and particularly preferably 5 or less, from the viewpoint of rapidly proceeding the intramolecular cyclization reaction. In particular, the chain length of the linkage of L is preferably 4 or 5, and most preferably 4. Specific examples of preferred compounds of the base generator include, for example, compounds described in paragraphs 0102 to 0168 of International publication No. 2020/066416 and compounds described in paragraphs 0143 to 0177 of International publication No. 2018/038002.
The base generator preferably further comprises a compound represented by the following formula (N1).
[ chemical formula 67]
In the formula (N1), R N1 R is R N2 Each independently represents a 1-valent organic group, R C1 Represents a hydrogen atom or a protecting group, and L represents a 2-valent linking group.
L is a 2-valent linking group, preferably a 2-valent organic group. The chain length of the linking group is preferably 1 or more, more preferably 2 or more. The upper limit is preferably 12 or less, more preferably 8 or less, and even more preferably 5 or less. The chain length refers to the number of atoms present in the atomic arrangement that forms the shortest path between 2 carbonyl groups in the formula.
In the formula (N1), R N1 R is R N2 Each independently represents a 1-valent organic group (preferably, a carbon number of 1 to 24, more preferably, a carbon number of 2 to 18, still more preferably, a carbon number of 3 to 12), preferably a hydrocarbon group (preferably, a carbon number of 1 to 24, more preferably, a carbon number of 1 to 12, still more preferably, a carbon number of 1 to 10), specifically, an aliphatic hydrocarbon group (preferably, a carbon number of 1 to 24, more preferably, a carbon number of 1 to 12, still more preferably, a carbon number of 1 to 10) or an aromatic hydrocarbon group (preferably, a carbon number of 6 to 22, more preferably, a carbon number of 6 to 18, still more preferably, a carbon number of 6 to 10), and an aliphatic hydrocarbon group is preferable. As R N1 R is R N2 If an aliphatic hydrocarbon group is used, the alkali generated is preferably highly basic. The aliphatic hydrocarbon group and the aromatic hydrocarbon group may have a substituent, and the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have an oxygen atom in the substituent in the aliphatic hydrocarbon chain or in the aromatic ring. In particular, an aliphatic hydrocarbon group having an oxygen atom in a hydrocarbon chain can be exemplified.
As a constituent R N1 R is R N2 Examples of the aliphatic hydrocarbon group(s) include a linear or branched alkyl group, a cyclic alkyl group, a group related to a combination of a linear alkyl group and a cyclic alkyl group, and an alkyl group having an oxygen atom in the chain. The linear or branched chain alkyl group preferably has 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms. Examples of the linear or branched chain alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, isopropyl, isobutyl, sec-butyl, tert-butyl, isopentyl, neopentyl, tert-pentyl, isohexyl and the like.
The cyclic alkyl group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms. Examples of the cyclic alkyl group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, and cyclooctyl.
The group involved in the combination of the chain alkyl group and the cyclic alkyl group preferably has 4 to 24 carbon atoms, more preferably 4 to 18 carbon atoms, and still more preferably 4 to 12 carbon atoms. Examples of the group involved in the combination of the chain alkyl group and the cyclic alkyl group include cyclohexylmethyl group, cyclohexylethyl group, cyclohexylpropyl group, methylcyclohexylmethyl group, ethylcyclohexylethyl group, and the like.
The alkyl group having an oxygen atom in the chain preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 4 carbon atoms. The alkyl group having an oxygen atom in the chain may be linear or cyclic, or may be linear or branched.
Wherein R is from the viewpoint of increasing the boiling point of a base formed by decomposition to be described later N1 R is R N2 Preferably an alkyl group having 5 to 12 carbon atoms. Among them, in a formulation in which adhesion to a metal (e.g., copper) layer is important, a group having a cyclic alkyl group and an alkyl group having 1 to 8 carbon atoms are preferable。
R N1 R is R N2 Can be connected with each other to form a ring structure. When the cyclic structure is formed, an oxygen atom or the like may be present in the chain. And R is N1 R is R N2 The cyclic structure may be a single ring or a condensed ring, and is preferably a single ring. The cyclic structure to be formed is preferably a 5-or 6-membered ring containing a nitrogen atom in the formula (N1), and examples thereof include a pyrrole ring, an imidazole ring, a pyrazole ring, a pyrroline ring, a pyrrolidine ring, an imidazolidine ring, a pyrazolidine ring, a piperidine ring, a piperazine ring, and a morpholine ring, and examples thereof include a pyrroline ring, a pyrrolidine ring, a piperidine ring, a piperazine ring, and a morpholine ring.
R C1 Represents a hydrogen atom or a protecting group, preferably a hydrogen atom.
The protecting group is preferably a protecting group which is decomposed by the action of an acid or a base, and a protecting group which is decomposed by an acid is preferable.
Specific examples of the protecting group include a chain or cyclic alkyl group or a chain or cyclic alkyl group having an oxygen atom in the chain. Examples of the chain or cyclic alkyl group include methyl, ethyl, isopropyl, t-butyl, and cyclohexyl. The chain alkyl group having an oxygen atom in the chain includes, specifically, an alkoxyalkyl group, and more specifically, a methoxymethyl group (MOM), an ethoxyethyl group (EE), and the like. Examples of the cyclic alkyl group having an oxygen atom in the chain include an epoxy group, an epoxypropyl group, an oxetanyl group, a tetrahydrofuranyl group, and a Tetrahydropyran (THP) group.
The 2-valent linking group constituting L is not particularly limited, and is preferably a hydrocarbon group, more preferably an aliphatic hydrocarbon group. The hydrocarbon group may have a substituent, and may have a kind of atom other than a carbon atom in the hydrocarbon chain. More specifically, the group is preferably a 2-valent hydrocarbon linking group which may have an oxygen atom in the chain, more preferably a 2-valent aliphatic hydrocarbon group which may have an oxygen atom in the chain, a 2-valent aromatic hydrocarbon group, or a group related to a combination of a 2-valent aliphatic hydrocarbon group which may have an oxygen atom in the chain and a 2-valent aromatic hydrocarbon group, and still more preferably a 2-valent aliphatic hydrocarbon group which may have an oxygen atom in the chain. These groups preferably do not have an oxygen atom.
The 2-valent hydrocarbon linking group preferably has 1 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, and still more preferably 2 to 6 carbon atoms. The 2-valent aliphatic hydrocarbon group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 4 carbon atoms. The 2-valent aromatic hydrocarbon group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and still more preferably 6 to 10 carbon atoms. The group (for example, an arylene alkyl group) involved in the combination of the 2-valent aliphatic hydrocarbon group and the 2-valent aromatic hydrocarbon group preferably has 7 to 22 carbon atoms, more preferably 7 to 18 carbon atoms, and still more preferably 7 to 10 carbon atoms.
The linking group L is preferably a linear or branched chain alkylene group, a cyclic alkylene group, a group related to a combination of a chain alkylene group and a cyclic alkylene group, an alkylene group having an oxygen atom in the chain, a linear or branched chain alkenylene group, a cyclic alkenylene group, an arylene group, or an arylene alkylene group.
The linear or branched chain alkylene group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 4 carbon atoms.
The cyclic alkylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms.
The group involved in the combination of the chain alkylene group and the cyclic alkylene group preferably has 4 to 24 carbon atoms, more preferably 4 to 12 carbon atoms, and still more preferably 4 to 6 carbon atoms.
The alkylene group having an oxygen atom in the chain may be linear or cyclic, or may be linear or branched. The alkylene group having an oxygen atom in the chain has preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, still more preferably 1 to 3 carbon atoms.
The linear or branched alkenyl group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 3 carbon atoms. The number of linear or branched alkenyl groups is preferably 1 to 10, more preferably 1 to 6, still more preferably 1 to 3, c=c bonds.
The cyclic alkenylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms. The number of c=c bonds in the cyclic alkenylene group is preferably 1 to 6, more preferably 1 to 4, and still more preferably 1 to 2.
The arylene group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and still more preferably 6 to 10 carbon atoms.
The arylene alkylene group preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, still more preferably 7 to 11 carbon atoms.
Among them, preferred are chain alkylene groups, cyclic alkylene groups, alkylene groups having an oxygen atom in the chain, chain alkenylene groups, arylene groups, and arylene alkylene groups, and more preferred are 1, 2-vinyl groups, propane diyl groups (particularly 1, 3-propane diyl groups), cyclohexane diyl groups (particularly 1, 2-cyclohexane diyl groups), vinylidene groups (particularly cis-vinylidene groups), phenylene groups (1, 2-phenylene groups), phenylene methylene groups (particularly 1, 2-phenylene methylene groups), and ethyleneoxy vinyl groups (particularly 1, 2-ethyleneoxy-1, 2-vinyl groups).
The following examples are given as examples of the alkali generator, but the present invention should not be construed as being limited thereto.
[ chemical formula 68]
The molecular weight of the nonionic base generator is preferably 800 or less, more preferably 600 or less, and further preferably 500 or less. The lower limit is preferably 100 or more, more preferably 200 or more, and still more preferably 300 or more.
Specific examples of preferred compounds of the ionic base generator include compounds described in paragraphs 0148 to 0163 of International publication No. 2018/038002.
Specific examples of the ammonium salt include the following compounds, but the present invention is not limited thereto.
[ chemical formula 69]
Specific examples of the imide salt include the following compounds, but the present invention is not limited thereto.
[ chemical formula 70]
When the resin composition of the present invention contains the alkali generator, the content of the alkali generator is preferably 0.1 to 50 parts by mass relative to 100 parts by mass of the resin in the resin composition of the present invention. The lower limit is more preferably 0.3 parts by mass or more, and still more preferably 0.5 parts by mass or more. The upper limit is more preferably 30 parts by mass or less, still more preferably 20 parts by mass or less, still more preferably 10 parts by mass or less, and may be 5 parts by mass or less, or may be 4 parts by mass or less.
The alkali generator can be used in an amount of 1 or 2 or more. When 2 or more kinds are used, the total amount is preferably within the above range.
< solvent >
The resin composition of the present invention preferably contains a solvent.
The solvent may be any known solvent. The solvent is preferably an organic solvent. Examples of the organic solvent include esters, ethers, ketones, cyclic hydrocarbons, sulfoxides, amides, ureas, alcohols, and the like.
Examples of the esters include ethyl acetate, n-butyl acetate, isobutyl acetate, hexyl acetate, pentyl formate, isopentyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ -butyrolactone, ε -caprolactone, 6-valerolactone, alkyl alkoxyacetate (e.g., methyl alkoxyacetate, ethyl alkoxyacetate, butyl alkoxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.), alkyl 3-alkoxypropionate (e.g., methyl 3-alkoxypropionate, ethyl 3-alkoxypropionate, etc. (e.g., methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, etc.), alkyl 2-alkoxypropionate (e.g., methyl 2-alkoxypropionate, ethyl 2-alkoxypropionate, propyl 2-alkoxypropionate, etc. (e.g., methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-ethoxypropionate, ethyl 2-alkoxy-2-methyl propionate, and ethyl 2-alkoxypropionate, etc.), methyl 2-alkoxypropionate, methyl 2-ethoxypropionate, etc.), methyl 2-ethoxypropionate, etc. (e.g., methyl 2-ethoxypropionate, etc.), ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutyrate, ethyl caproate, ethyl heptanoate, dimethyl malonate, diethyl malonate, and the like.
As the ethers, for example, ethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol ethyl methyl ether, propylene glycol monopropyl ether acetate, dipropylene glycol dimethyl ether, and the like can be preferably used.
Examples of ketones include methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-methylcyclohexanone, l-glucosone (levoglucosenone), and dihydro-l-glucosone.
Examples of the cyclic hydrocarbon include aromatic hydrocarbons such as toluene, xylene and anisole, and cyclic terpenes such as limonene.
As the sulfoxide, dimethyl sulfoxide is preferable, for example.
As the amides, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-dimethylacetamide, N-dimethylformamide, N-dimethylisobutyramide, 3-methoxy-N, N-dimethylpropionamide, 3-butoxy-N, N-dimethylpropionamide, N-formylmorpholine, N-acetylmorpholine and the like can be preferably used.
Preferred examples of the urea include N, N, N ', N' -tetramethylurea and 1, 3-dimethyl-2-imidazolidinone.
Examples of the alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 1-pentanol, 1-hexanol, benzyl alcohol, ethylene glycol monomethyl ether, 1-methoxy-2-propanol, 2-ethoxyethanol, diethylene glycol monoethyl ether, diethylene glycol monohexyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, polyethylene glycol monomethyl ether, polypropylene glycol, tetraethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, ethylene glycol monophenyl ether, methyl benzyl alcohol, n-amyl alcohol, methyl amyl alcohol, and diacetone alcohol.
From the viewpoint of improving the properties of the coated surface, the solvent is preferably mixed with 2 or more types.
In the present invention, it is preferable that the solvent be 1 or a mixed solvent of 2 or more solvents selected from methyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, γ -butyrolactone, dimethyl sulfoxide, ethyl carbitol acetate, butyl carbitol acetate, N-methyl-2-pyrrolidone, propylene glycol methyl ether acetate, levoglucosone, and dihydro-levoglucosone. Particularly preferred are dimethyl sulfoxide and gamma-butyrolactone in combination, or N-methyl-2-pyrrolidone and ethyl lactate in combination.
The solvent content is preferably 5 to 80% by mass, more preferably 5 to 75% by mass, still more preferably 10 to 70% by mass, and still more preferably 20 to 70% by mass of the total solid content concentration of the resin composition of the present invention from the viewpoint of coatability. The solvent content is adjusted according to the thickness and coating method required by the coating film.
The resin composition of the present invention may contain only 1 solvent, or may contain 2 or more solvents. When the solvent is contained in an amount of 2 or more, the total amount thereof is preferably within the above range.
< Metal adhesion improver >
The resin composition of the present invention preferably contains a metal adhesion improver for improving adhesion to a metal material used for an electrode, wiring, or the like. Examples of the metal adhesion improver include a silane coupling agent having an alkoxy silicon group, an aluminum-based adhesion promoter, a titanium-based adhesion promoter, a compound having a sulfonamide structure, a compound having a thiourea structure, a phosphoric acid derivative compound, a β -keto ester compound, an amino compound, and the like.
[ silane coupling agent ]
Examples of the silane coupling agent include a compound described in paragraph 0167 of Japanese patent application laid-open No. 2015/199219, a compound described in paragraphs 0062 to 0073 of Japanese patent application laid-open No. 2014-191002, a compound described in paragraphs 0063 to 0071 of International patent application laid-open No. 2011/080992, a compound described in paragraphs 0060 to 0061 of Japanese patent application laid-open No. 2014-191252, a compound described in paragraphs 0045 to 0052 of Japanese patent application laid-open No. 2014/097594, a compound described in paragraphs 2017 to 0078 of Japanese patent application laid-open No. 2018-173573, and the like. Further, as described in paragraphs 0050 to 0058 of JP 2011-128358, it is also preferable to use 2 or more different silane coupling agents. Furthermore, the following compounds are also preferably used as the silane coupling agent. In the following formula, me represents methyl group, and Et represents ethyl group.
[ chemical formula 71]
Examples of the other silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, 3-epoxypropoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1, 3-dimethyl-butylidenediamine), N-phenyl-3-aminopropyltrimethoxysilane, triethoxypropyl-3-methoxypropyl-isocyanurate, 3-methoxypropylpropyltrimethoxysilane, 3-mercaptopropyl-isocyanurate, and mercaptopropyl-silane, 3-trimethoxysilylpropyl succinic anhydride. These can be used singly or in combination of 1 or more than 2.
[ aluminum series adhesive auxiliary agent ]
Examples of the aluminum-based adhesive auxiliary agent include aluminum tris (ethylacetoacetate), aluminum tris (acetylacetonate), aluminum ethylacetoacetate diisopropyl ester, and the like.
Further, as other metal adhesion improvers, compounds described in paragraphs 0046 to 0049 of JP-A2014-186186 and thioether compounds described in paragraphs 0032 to 0043 of JP-A2013-072935 can be used, and these are incorporated herein.
The content of the metal adhesion improver is preferably in the range of 0.01 to 30 parts by mass, more preferably in the range of 0.1 to 10 parts by mass, and even more preferably in the range of 0.5 to 5 parts by mass, relative to 100 parts by mass of the specific resin. When the lower limit value is not less than the upper limit value, the adhesion between the pattern and the metal layer is improved, and when the upper limit value is not more than the upper limit value, the heat resistance and mechanical properties of the pattern are improved. The metal adhesion improver may be 1 or 2 or more. When 2 or more kinds are used, the total thereof is preferably within the above range.
< migration inhibitor >
The resin composition of the present invention may further comprise a migration inhibitor.
Compounds belonging to the above specific resins are not considered migration inhibitors.
By including the migration inhibitor, transfer of metal ions originating from the metal layer (metal wiring) into the film can be effectively suppressed.
The migration inhibitor is not particularly limited, and examples thereof include compounds having a heterocycle (pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isoxazole ring, isothiazole ring, tetrazole ring, pyridine ring, pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring, morpholine ring, 2H-pyran ring, 6H-pyran ring, triazine ring), compounds having thiourea and sulfanyl groups, hindered phenol compounds, salicylic acid derivative compounds, and hydrazide derivative compounds. In particular, triazole compounds such as 1,2, 4-triazole, benzotriazole, 3-amino-1, 2, 4-triazole, and 3, 5-diamino-1, 2, 4-triazole, and tetrazole compounds such as 1H-tetrazole, 5-phenyltetrazole, and 5-amino-1H-tetrazole can be preferably used.
Alternatively, an ion scavenger that traps anions such as halogen ions can also be used.
As other migration inhibitors, rust inhibitors described in paragraph 0094 of japanese patent application laid-open publication No. 2013-015701, compounds described in paragraphs 0073-0076 of japanese patent application laid-open publication No. 2009-283711, compounds described in paragraph 0052 of japanese patent application laid-open publication No. 2011-059656, compounds described in paragraphs 0114, 0116 and 0118 of japanese patent application laid-open publication No. 2012-194520, compounds described in paragraph 0166 of international publication No. 2015/199219, and the like can be used, and these are incorporated into the present specification.
Further, as migration inhibitors, the following nitrogen-containing compounds may be contained: the same compound contains a nitrogen-containing heterocyclic ring and an amino group, wherein 1 of the hydrogen atoms of the amino group may be substituted, and at least one of the nitrogen atoms as a ring-forming atom of the nitrogen-containing heterocyclic ring is directly bonded to a carbonyl group, a sulfonyl group or a thiocarbonyl group.
Of the above nitrogen-containing compounds, at least 1 of the nitrogen atoms as ring-forming atoms is preferably directly bonded to a carbonyl group.
By containing such a compound, adhesion of the metal to the cured film after a long time can sometimes be further improved.
Specific examples of migration inhibitors include the following compounds.
[ chemical formula 72]
When the resin composition of the present invention has a migration inhibitor, the content of the migration inhibitor is preferably 0.01 to 5.0 mass%, more preferably 0.05 to 2.0 mass%, and even more preferably 0.1 to 1.0 mass% relative to the total solid content of the resin composition of the present invention.
The migration inhibitor may be 1 or 2 or more. When the migration inhibitor is 2 or more, the total thereof is preferably within the above range.
< polymerization inhibitor >
The resin composition of the present invention preferably contains a polymerization inhibitor. Examples of the polymerization inhibitor include phenol compounds, quinone compounds, amino compounds, N-oxygen radical compounds, nitro compounds, nitroso compounds, heteroaromatic compounds, and metal compounds.
As specific compounds of the polymerization inhibitor, p-hydroquinone, o-methoxyphenol, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol (pyrogallol), p-t-butylcatechol, 1, 4-benzoquinone, diphenyl-p-benzoquinone, 4 '-thiobis (3-methyl-6-t-butylphenol), 2' -methylenebis (4-methyl-6-t-butylphenol), N-nitrosophenylhydroxylamine cerium salt, N-nitroso-N-phenylhydroxylamine aluminum salt, N-nitrosodiphenylamine, N-phenylnaphthylamine, ethylenediamine tetraacetic acid, 1, 2-cyclohexanediamine tetraacetic acid, glycol ether diamine tetraacetic acid, 2, 6-di-t-butyl-4-methylphenol, 5-nitroso-8-hydroxyquinoline, 1-nitroso-2-naphthol, 2-nitroso-1-naphthol, 2-nitroso-5- (N-ethyl-N-sulfopropylamino) phenol, N-nitroso-N- (1-naphthalene) hydroxylamine ammonium salt, bis (4-hydroxy-3, 5-t-butyl-4-methylphenol, 5-nitroso-5-hydroxy-3, 3-hydroxy-benzyl-4, 3H-tri-4, 3H-hydroxybenzyl ketone, 3, 5H-tri-4-hydroxy-3H-3, 5-t-butyl-4-hydroxy-methyl-4, 2, 6-tetramethylpiperidine 1-oxyl, 2, 6-tetramethylpiperidine 1-oxyl, phenothiazine, phenazine, 1-diphenyl-2-picrylhydrazine, copper (II) dibutyldithiocarbamate, nitrobenzene, N-nitroso-N-phenylhydroxylamine aluminum salt, N-nitroso-N-phenylhydroxylamine ammonium salt, and the like. Further, a polymerization inhibitor described in paragraph 0060 of Japanese patent application laid-open No. 2015-127817 and a compound described in paragraphs 0031 to 0046 of International publication No. 2015/125469, which are incorporated herein by reference, can also be used.
When the resin composition of the present invention has a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 20% by mass, more preferably 0.02 to 15% by mass, and even more preferably 0.05 to 10% by mass, based on the total solid content of the resin composition of the present invention.
The polymerization inhibitor may be 1 or 2 or more. When the polymerization inhibitor is 2 or more, the total amount thereof is preferably within the above range.
< acid scavenger >
In order to reduce the change in the performance with time after exposure to heat, the resin composition of the present invention preferably contains an acid scavenger. The acid scavenger is a compound that can scavenge the acid generated by the presence in the system, and is preferably a compound having low acidity and high pKa. The acid scavenger is preferably a compound having an amino group, preferably a primary amine, a secondary amine, a tertiary amine, an ammonium salt, a tertiary amide, or the like, preferably a primary amine, a secondary amine, a tertiary amine, an ammonium salt, more preferably a secondary amine, a tertiary amine, or an ammonium salt.
The acid scavenger may preferably be a compound having an imidazole structure, a diazabicyclo structure, an onium structure, a trialkylamine structure, an aniline structure or a pyridine structure, an alkylamine derivative having a hydroxyl group and/or an ether bond, an aniline derivative having a hydroxyl group and/or an ether bond, or the like. When having an onium structure, the acid scavenger is preferably a salt having a cation selected from ammonium, diazonium, iodine, sulfonium, phosphonium, pyridinium, and the like, and an anion having an acidity lower than that of the acid generated by the acid generator.
Examples of the acid scavenger having an imidazole structure include imidazole, 2,4, 5-triphenylimidazole, benzimidazole, and 2-phenylbenzimidazole. Examples of the acid scavenger having a diazabicyclo structure include 1, 4-diazabicyclo [2, 2] octane, 1, 5-diazabicyclo [4,3,0] non-5-ene, and 1, 8-diazabicyclo [5,4,0] undec-7-ene. Examples of the acid scavenger having an onium structure include tetrabutylammonium hydroxide, triarylsulfonium hydroxide, benzoylmethyl sulfonium hydroxide, and sulfonium hydroxide having a 2-oxoalkyl group, specifically triphenylsulfonium hydroxide, tris (tert-butylphenyl) sulfonium hydroxide, bis (tert-butylphenyl) iodonium hydroxide, benzoylmethylthionium hydroxide, and 2-oxopropyl-thiophenium hydroxide. Examples of the acid scavenger having a trialkylamine structure include tri (n-butyl) amine and tri (n-octyl) amine. Examples of the acid scavenger having an aniline structure include 2, 6-diisopropylaniline, N-dimethylaniline, N-dibutylaniline, N-dihexylaniline, and the like. Examples of the acid scavenger having a pyridine structure include pyridine and 4-methylpyridine. Examples of the alkylamine derivative having a hydroxyl group and/or an ether bond include ethanolamine, diethanolamine, triethanolamine, N-phenyldiethanolamine, and tris (methoxyethoxyethyl) amine. Examples of the aniline derivative having a hydroxyl group and/or an ether bond include N, N-bis (hydroxyethyl) aniline and the like.
Specific examples of the preferable acid scavenger include ethanolamine, diethanolamine, triethanolamine, ethylamine, diethylamine, triethylamine, hexylamine, dodecylamine, cyclohexylamine, cyclohexyldimethylamine, aniline, N-methylaniline, N-dimethylaniline, diphenylamine, pyridine, butylamine, isobutylamine, dibutylamine, tributylamine, dicyclohexylamine, DBU (diazabicycloundecene), DABCO (1, 4-diazabicyclo [2.2.2] octane), N-diisopropylethylamine, tetramethylammonium hydroxide, ethylenediamine, 1, 5-diaminopentane, N-methylhexylamine, N-methyldicyclohexylamine, trioctylamine, N-ethylethylenediamine, N, N-diethyl ethylenediamine, N, N, N ', N' -tetrabutyl-1, 6-hexamethylenediamine, spermidine, diaminocyclohexyl, bis (2-methoxyethyl) amine, piperidine, methylpiperidine, piperazine, tropane (tropane), N-phenylbenzylamine, 1, 2-diphenylethane, 2-aminoethanol, toluidine, aminophenol, hexylaniline, phenylenediamine, phenylethylamine, dibenzylamine, pyrrole, N-methylpyrrole, guanidine, aminopyrrolidine, pyrazole, pyrazoline, aminomorpholine, aminoalkylmorpholine and the like.
These acid scavengers may be used alone or in combination of 1 or more than 2.
The composition of the present invention may or may not contain an acid scavenger, but when contained, the content of the acid scavenger is usually 0.001 to 10% by mass, preferably 0.01 to 5% by mass, based on the total solid content of the composition.
The ratio of the acid generator to the acid scavenger is preferably acid generator/acid scavenger (molar ratio) =2.5 to 300. That is, the molar ratio is preferably 2.5 or more in terms of sensitivity and resolution, and is preferably 300 or less in terms of suppressing the problem that the relief pattern becomes thicker with time during the period from the post-exposure heat treatment to the resolution degradation. The acid generator/acid scavenger (molar ratio) is more preferably 5.0 to 200, still more preferably 7.0 to 150.
< other additives >
The resin composition of the present invention can be blended with various additives such as surfactants, higher fatty acid derivatives, thermal polymerization initiators, inorganic particles, ultraviolet absorbers, organic titanium compounds, antioxidants, anticoagulants, phenolic compounds, other high molecular compounds, plasticizers, other assistants (e.g., defoamers, flame retardants, etc.) and the like as necessary within the range to obtain the effects of the present invention. By properly containing these components, properties such as film physical properties can be adjusted. For these components, for example, reference can be made to the descriptions of paragraphs 0183 and later of Japanese patent application laid-open No. 2012-003225 (paragraph 0237 of the specification of corresponding U.S. patent application publication No. 2013/0034812), and the descriptions of paragraphs 0101 to 0104 and 0107 to 0109 of Japanese patent application laid-open No. 2008-250074, and the like, which are incorporated herein by reference. When these additives are blended, the total blending amount is preferably 3% by mass or less of the solid content of the resin composition of the present invention.
[ surfactant ]
As the surfactant, various surfactants such as a fluorine-based surfactant, a silicone-based surfactant, and a hydrocarbon-based surfactant can be used. The surfactant may be a nonionic surfactant, a cationic surfactant, or an anionic surfactant.
By adding the surfactant to the resin composition of the present invention, the liquid properties (particularly fluidity) when the resin composition is prepared into a coating liquid can be further improved, and the uniformity of the coating thickness and the liquid saving property can be further improved. That is, when a film is formed using a coating liquid to which a surfactant-containing composition is applied, the interfacial tension between the surface to be coated and the coating liquid decreases, so that the wettability to the surface to be coated is improved, and the coatability to the surface to be coated is improved. Therefore, a film having a uniform thickness with small thickness unevenness can be further preferably formed.
Examples of the fluorine-based surfactant include MEGAFACEF171, MEGAFACEF172, MEGAFACE F173, MEGAFACE F176, MEGAFACE F177, MEGAFACE F141, MEGAFACE F142, MEGAFACE F143, MEGAFACE F144, MEGAFACE R30, MEGAFACE F437, MEGAFACE F475, MEGAFACE F479, MEGAFACE F482, MEGAFACE F554, MEGAFACE F780, RS-72-K (manufactured by DIC Corporation above), fluoro FC430, fluoro FC431, fluoro FC171, novee FC4430, novec FC4432 (manufactured by 3M Japan Limited above), surflon S-382, surflon SC-101, surflon SC-103, surflon SC-104, surflon SC-105, surflon SC1068, surflon SC-381, surflon SC-383, surflon S393, surfKH-40 (manufactured by LTCO above), liquid FC 636, PF 20, and the other types of PF 20, and the like (manufactured by NOPF 656, PF 20). The fluorine-based surfactant may be any of the compounds described in paragraphs 0015 to 0158 of Japanese patent application laid-open No. 2015-117327 and the compounds described in paragraphs 0117 to 0132 of Japanese patent application laid-open No. 2011-132503, which are incorporated herein by reference. As the fluorine-based surfactant, a block polymer can be used, and specific examples thereof include compounds described in japanese patent application laid-open publication No. 2011-89090, which are incorporated herein.
The fluorine-containing polymer compound containing a repeating unit derived from a (meth) acrylate compound having a fluorine atom and a repeating unit derived from a (meth) acrylate compound having 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy group or propyleneoxy group) can also be preferably used, and the following compounds can be exemplified as the fluorine-containing surfactant that can be used in the present invention.
[ chemical formula 73]
The weight average molecular weight of the above compound is preferably 3,000 to 50,000, more preferably 5,000 to 30,000.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in a side chain can also be used. Specific examples thereof include compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A2010-164965, incorporated by reference herein. Examples of commercial products include MEGAFACE RS-101, RS-102, and RS-718K manufactured by DIC corporation.
The fluorine content of the fluorine-based surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. The fluorine-containing surfactant having a fluorine content within this range is effective in uniformity of thickness of the coating film and liquid saving property, and has good solubility in the composition.
Examples of silicone surfactants include Toray Silicones DC3PA, toray Silicones SH7PA, toray Silicone DC PA, toray Silicone SH PA, toray Silicone SH PA, toray Silicone SH29PA, toray Silicone SH PA, toray Silicone SH8400 (manufactured by Td. Above Dow Corning Toray Co.), TSF-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (manufactured by Momentive Performance Materials Inc. above), KP341, KF6001, KF6002 (manufactured by Shin-Etsu Chemical Co., ltd. Above), BYK307, BYK323, BYK330 (manufactured by BYK Chemie GmbH) and the like.
Examples of the hydrocarbon surfactant include PIONIN A-76, NEWKALGEN FS-3PG, PIONIN B-709, PIONIN B-811-N, PIONIN D-1004, PIONIN D-3104, PIONIN D-3605, PIONIN D-6112, PIONIN D-2104-D, PIONIN D-212, PIONIN D-931, PIONIN D-941, PIONIN D-951, PIONIN E-5310, PIONIN P-1050-B, PIONIN P-1028-P, PIONIN P-4050-T (the above is TAKEMOTO OIL FAT CO., LTD).
Examples of the nonionic surfactant include glycerin, trimethylol propane, trimethylol ethane, and ethoxylates and propoxylates thereof (for example, glycerin propoxylate, glycerin ethoxylate, and the like), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, and sorbitan fatty acid esters. Examples of the commercial products include PLURONI C (registered trademark) L10, L31, L61, L62, 10R5, 17R2, 25R2 (manufactured by BASF corporation), tetronic 304, 701, 704, 901, 904, 150R1 (manufactured by BASF corporation), solsperse 20000 (manufactured by Lubrizol Japan Ltd.), NCW-101, NCW-1001, NCW-1002 (manufactured by FUJIFILM Wako Pure Chemical Corporation), PIONIN D-6112, D-6112-W, D-6315 (manufactured by TAKEMOTO OIL & FAT CO., LTD), OLFIN E1010, surfynol 104, 400, 440 (manufactured by Nissin ChemicalIndustry CO., ltd.), and the like.
Specific examples of the cationic surfactant include organosiloxane polymers KP341 (Shin-Etsu Chemical co., ltd., (meth) acrylic (co) polymers polyflowno.75, no.77, no.90, no.95 (Kyoeisha Chemical co., ltd.,) and W001 (Yusho co., ltd.)) and the like.
Specific examples of the anionic surfactant include W004, W005, WO17 (yushoco., ltd.), and saldet BL (manufactured by SANYO KASEI co.ltd.).
The surfactant may be used in an amount of 1 or 2 or more.
The content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on the total solid content of the composition.
[ higher fatty acid derivative ]
In order to prevent polymerization inhibition by oxygen, a higher fatty acid derivative such as behenic acid or behenamide may be added to the resin composition of the present invention so as to be biased to the surface of the resin composition of the present invention during drying after coating.
The higher fatty acid derivative may be a compound described in paragraph 0155 of International publication No. 2015/199219, which is incorporated herein by reference.
When the resin composition of the present invention contains a higher fatty acid derivative, the content of the higher fatty acid derivative is preferably 0.1 to 10% by mass relative to the total solid content of the resin composition of the present invention. The number of higher fatty acid derivatives may be 1 or 2 or more. When the number of higher fatty acid derivatives is 2 or more, the total thereof is preferably within the above range.
[ thermal polymerization initiator ]
The resin composition of the present invention may contain a thermal polymerization initiator, and in particular, may contain a thermal radical polymerization initiator. The thermal radical polymerization initiator is a compound that generates radicals by thermal energy and causes or promotes polymerization of a compound having polymerizability. The addition of the thermal radical polymerization initiator can further promote the polymerization reaction of the resin and the polymerizable compound, and thus can further improve the solvent resistance. The photopolymerization initiator may also have a function of initiating polymerization by heat, and may be added as a thermal polymerization initiator.
Specific examples of the thermal radical polymerization initiator include compounds described in paragraphs 0074 to 0118 of Japanese patent application laid-open No. 2008-063254, the contents of which are incorporated herein by reference.
When the thermal polymerization initiator is contained, the content thereof is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and even more preferably 0.5 to 15% by mass, relative to the total solid content of the resin composition of the present invention. The thermal polymerization initiator may be contained in an amount of 1 or 2 or more. When the thermal polymerization initiator is contained in an amount of 2 or more, the total amount is preferably within the above range.
[ inorganic particles ]
The resin composition of the present invention may contain inorganic particles. Specifically, the inorganic particles may include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, glass, and the like.
The average particle diameter of the inorganic particles is preferably 0.01 to 2.0. Mu.m, more preferably 0.02 to 1.5. Mu.m, still more preferably 0.03 to 1.0. Mu.m, particularly preferably 0.04 to 0.5. Mu.m.
The average particle diameter of the inorganic particles is a primary particle diameter and is a volume average particle diameter. The volume average particle diameter can be measured by a dynamic light scattering method of Nanotrac WAVE II EX-150 (NIKKISO co., ltd.).
If the above measurement is difficult, the measurement can be performed by a centrifugal sedimentation light transmission method, an X-ray transmission method, or a laser diffraction/scattering method.
[ ultraviolet absorber ]
The compositions of the present invention may comprise an ultraviolet absorber. As the ultraviolet absorber, salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, triazine-based, and other ultraviolet absorbers can be used.
Examples of the salicylate-based ultraviolet light absorber include phenyl salicylate, p-octylphenyl salicylate, and p-tert-butylphenyl salicylate, and examples of the benzophenone-based ultraviolet light absorber include 2,2' -dihydroxy-4-methoxybenzophenone, 2' -dihydroxy-4, 4' -dimethoxybenzophenone, 2', 4' -tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2, 4-dihydroxybenzophenone, and 2-hydroxy-4-octoxybenzophenone. Examples of the benzotriazole-based ultraviolet absorber include 2- (2 '-hydroxy-3', 5 '-di-t-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 '-t-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3' -t-amyl-5 '-isobutylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 '-isobutyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-3' -isobutyl-5 '-propylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 ',5' -di-t-butylphenyl) benzotriazole, 2- (2 '-hydroxy-5' -methylphenyl) benzotriazole, and 2- [2 '-hydroxy-5' - (1, 3-tetramethyl) phenyl ] benzotriazole.
Examples of the substituted acrylonitrile ultraviolet absorber include ethyl 2-cyano-3, 3-diphenylacrylate and 2-ethylhexyl 2-cyano-3, 3-diphenylacrylate. Further, examples of the triazine-based ultraviolet light absorber include mono (hydroxyphenyl) triazine compounds such as 2- [4- [ (2-hydroxy-3-dodecyloxypropyl) oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine, 2- [4- [ (2-hydroxy-3-tridecyloxypropyl) oxy ] -2-hydroxyphenyl ] -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine, and 2- (2, 4-dihydroxyphenyl) -4, 6-bis (2, 4-dimethylphenyl) -1,3, 5-triazine; bis (hydroxyphenyl) triazine compounds such as 2, 4-bis (2-hydroxy-4-propoxyphenyl) -6- (2, 4-dimethylphenyl) -1,3, 5-triazine, 2, 4-bis (2-hydroxy-3-methyl-4-propoxyphenyl) -6- (4-methylphenyl) -1,3, 5-triazine, and 2, 4-bis (2-hydroxy-3-methyl-4-hexyloxyphenyl) -6- (2, 4-dimethylphenyl) -1,3, 5-triazine; tris (hydroxyphenyl) triazine compounds such as 2, 4-bis (2-hydroxy-4-butoxyphenyl) -6- (2, 4-dibutoxyphenyl) -1,3, 5-triazine, 2,4, 6-tris (2-hydroxy-4-octyloxyphenyl) -1,3, 5-triazine, and 2,4, 6-tris [ 2-hydroxy-4- (3-butoxy-2-hydroxypropoxy) phenyl ] -1,3, 5-triazine.
In the present invention, 1 kind of the above-mentioned various ultraviolet absorbers may be used alone, or 2 or more kinds may be used in combination.
The composition of the present invention may or may not contain an ultraviolet absorber, but when contained, the content of the ultraviolet absorber is preferably 0.001 mass% or more and 1 mass% or less, more preferably 0.01 mass% or more and 0.1 mass% or less, relative to the total solid content mass of the composition of the present invention.
[ organic titanium Compound ]
The resin composition of the present embodiment may contain an organic titanium compound. By containing the organic titanium compound in the resin composition, a resin layer excellent in chemical resistance can be formed even when cured at a low temperature.
Examples of the usable organic titanium compound include compounds in which an organic group is bonded to a titanium atom via a covalent bond or an ionic bond.
Specific examples of the organic titanium compound are shown in the following I) to VII).
I) Chelating titanium compound: among them, a chelate titanium compound having 2 or more alkoxy groups is more preferable in view of excellent storage stability of the resin composition and obtaining a good cured pattern. Specific examples are titanium bis (triethanolamine) diisopropoxide, titanium bis (n-butoxy) bis (2, 4-glutarate) diisopropoxide bis (2, 4-glutarate) titanium, titanium diisopropoxide bis (tetramethylheptanedioate) titanium, titanium diisopropoxide bis (ethylacetoacetate), and the like.
II) a titanium tetraalkoxide compound: examples of the titanium include tetra (n-butoxy) titanium, tetraethoxy titanium, tetra (2-ethylhexyl) titanium, tetraisobutoxy titanium, tetraisopropoxy titanium, tetramethoxy titanium, tetramethoxypropoxy titanium, tetramethylphenoxy titanium, tetra (n-nonoxy) titanium, tetra (n-propoxy) titanium, tetrastearoxy titanium, and tetra [ bis {2,2- (allyloxymethyl) propoxy } ] titanium.
III) titanocene compound: for example, pentamethylcyclopentadienyl trimethoxytitanium, bis (. Eta.5-2, 4-cyclopenta-1-yl) bis (2, 6-difluorophenyl) titanium, bis (. Eta.5-2, 4-cyclopenta-1-yl) bis (2, 6-difluoro-3- (1H-pyrrol-1-yl) phenyl) titanium, and the like.
IV) monoalkoxytitanium compounds: for example, titanium isopropoxide, such as dioctyl phosphate, and titanium isopropoxide, such as dodecylbenzenesulfonate.
V) titanium oxide compound: examples of the compound include titanium oxide bis (glutarate), titanium oxide bis (tetramethylpimelate), and titanium oxide phthalocyanine.
VI) titanium tetra acetylacetonate compound: for example, titanium tetraacetylacetonate.
VII) titanate coupling agent: for example, isopropyl tridecyl benzenesulfonyl titanate, etc.
Among them, at least 1 compound selected from the group consisting of the above-mentioned I) chelate titanium compound, II) tetraalkoxy titanium compound and III) titanocene compound is preferable from the viewpoint of exhibiting more excellent chemical resistance. In particular, diisopropoxybis (ethylacetoacetate) titanium, tetra (n-butoxy) titanium and bis (. Eta.5-2, 4-cyclopenta-n-1-yl) bis (2, 6-difluoro-3- (1H-pyrrol-1-yl) phenyl) titanium are preferred.
When the organic titanium compound is blended, the blending amount thereof is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 2 parts by mass, per 100 parts by mass of the specific resin. When the blending amount is 0.05 parts by mass or more, the obtained cured pattern more effectively exhibits good heat resistance and chemical resistance, while when 10 parts by mass or less, the composition is more excellent in storage stability.
[ antioxidant ]
The composition of the present invention may comprise an antioxidant. By containing an antioxidant as an additive, the tensile properties of the cured film and the adhesion to a metal material can be improved. Examples of the antioxidant include phenol compounds, phosphite compounds, and thioether compounds. As the phenol compound, any phenol compound known as a phenol antioxidant can be used. As the preferable phenol compound, a hindered phenol compound is exemplified. Compounds having a substituent at a position adjacent to the phenolic hydroxyl group (ortho position) are preferred. The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. Furthermore, the antioxidant is preferably a compound having a phenol group and a phosphite group in the same molecule. Further, the antioxidant can also preferably be a phosphorus-based antioxidant. Examples of phosphorus antioxidants include tris [2- [ [2,4,8, 10-tetrakis (1, 1-dimethylethyl) dibenzo [ d, f ] [1,3,2] dioxaphosphen-hepta-6-yl ] oxy ] ethyl ] amine, tris [2- [ (4, 6,9, 11-tetra-t-butyldibenzo [ d, f ] [1,3,2] dioxaphosphen-2-yl) oxy ] ethyl ] amine, and ethyl bis (2, 4-di-t-butyl-6-methylphenyl) phosphite. Examples of the commercially available antioxidants include ADEKA STAB AO-20, ADEKA STAB AO-30, ADEKA STAB AO-40, ADEKA STABAO-50, ADEKA STAB AO-50F, ADEKA STAB AO-60G, ADEKA STAB AO-80, ADEKA STAB AO-330 (manufactured by ADEKA CORPORATION). The antioxidant may be a compound described in paragraphs 0023 to 0048 of Japanese patent No. 6268967, incorporated herein by reference. Furthermore, the compositions of the present invention may contain latent antioxidants as desired. As potential antioxidants, the following compounds may be mentioned: the site functioning as an antioxidant is protected by a protecting group and the protecting group is detached by heating at 100 to 250 ℃ or heating at 80 to 200 ℃ in the presence of an acid/base catalyst, thereby functioning as an antioxidant. Examples of the potential antioxidant include compounds described in International publication No. 2014/021023, international publication No. 2017/030005, and Japanese patent application laid-open No. 2017-008219, which are incorporated herein by reference. Examples of commercial products of the latent antioxidant include ADEKA ARKLS GPA-5001 (manufactured by ADEKA CORPORATION).
Examples of preferred antioxidants include 2, 2-thiobis (4-methyl-6-t-butylphenol), 2, 6-di-t-butylphenol, and compounds represented by formula (3).
[ chemical formula 74]
In the general formula (3), R 5 Represents a hydrogen atom or an alkyl group having 2 or more carbon atoms (preferably 2 to 10 carbon atoms), R 6 An alkylene group having 2 or more carbon atoms (preferably 2 to 10 carbon atoms). R is R 7 Represents a 1-to 4-valent organic group containing at least one of an alkylene group having 2 or more carbon atoms (preferably 2 to 10 carbon atoms), an oxygen atom, and a nitrogen atom. k represents an integer of 1 to 4.
The compound represented by formula (3) inhibits oxidative degradation of the aliphatic group and the phenolic hydroxyl group of the resin. Further, by the rust prevention effect on the metal material, oxidation of the metal can be suppressed.
In order to be able to act on both the resin and the metal material, k is more preferably an integer of 2 to 4. As R 7 Examples of the alkyl group include alkyl group, cycloalkyl group, alkoxy group, alkyl ether group, alkyl silicon group, alkoxy silicon group, aryl ether group, carboxyl group, carbonyl group, allyl group, vinyl group, heterocyclic group, -O-group, and,The compound obtained by combining these may further have a substituent, such as-NH-, -NHNH-. Among them, alkyl ether and-NH-are preferable from the viewpoints of solubility in a developer and metal adhesion, and-NH-is more preferable from the viewpoints of interaction with a resin and metal adhesion due to formation of a metal complex.
Examples of the compound represented by the general formula (3) include, but are not limited to, the following structures.
[ chemical formula 75]
[ chemical formula 76]
[ chemical formula 77]
[ chemical formula 78]
The amount of the antioxidant to be added is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the specific resin. By setting the addition amount to 0.1 part by mass or more, the effects of improving the tensile characteristics and the adhesion to the metal material are easily obtained even under a high-temperature and high-humidity environment, and by setting the addition amount to 10 parts by mass or less, for example, the sensitivity of the resin composition is improved by interaction with the photosensitive agent. The antioxidant may be used in an amount of 1 or 2 or more. When 2 or more kinds are used, the total amount of these is preferably within the above range.
[ anti-coagulant ]
The resin composition of the present embodiment may contain an anti-coagulant as necessary. Examples of the anti-caking agent include sodium polyacrylate.
In the present invention, 1 anticoagulant may be used alone, or 2 or more anticoagulants may be used in combination.
The composition of the present invention may or may not contain an anticoagulant, but when contained, the content of the anticoagulant is preferably 0.01 mass% or more and 10 mass% or less, more preferably 0.02 mass% or more and 5 mass% or less, relative to the total solid content mass of the composition of the present invention.
[ phenol Compounds ]
The resin composition of the present embodiment may contain a phenolic compound as needed. Examples of the phenolic compound include Bis-Z, bisP-EZ, tekP-4HBPA, trisP-HAP, trisP-PA, bisOCHP-Z, bisP-MZ, bisP-PZ, bisP-IPZ, bisOCP-IPZ, bisP-CP, bisRS-2P, bisRS-3P, bisP-OCHP, methyl Tris-FR-CR, bisRS-26X (trade name, honshu Chemical Industry Co., ltd.), BIP-PC, BIR-PTBP, BIR-BIPC-F (trade name, ASAHI YUKIZAI CORPORAT [ ON ]).
In the present invention, 1 kind of phenol compound may be used alone, or 2 or more kinds may be used in combination.
The composition of the present invention may or may not contain a phenolic compound, but when contained, the content of the phenolic compound is preferably 0.01% by mass or more and 30% by mass or less, more preferably 0.02% by mass or more and 20% by mass or less, relative to the total solid content mass of the composition of the present invention.
[ other Polymer Compounds ]
Examples of the other polymer compound include a silicone resin, a (meth) acrylic polymer obtained by copolymerizing (meth) acrylic acid, a novolak resin, a resol resin, a polyhydroxystyrene resin, and a copolymer of these. The other polymer compound may be modified body having a crosslinking group such as a hydroxymethyl group, an alkoxymethyl group, or an epoxy group introduced therein.
In the present invention, 1 or 2 or more other polymer compounds may be used alone or in combination.
The composition of the present invention may or may not contain other polymer compounds, but when contained, the content of other polymer compounds is preferably 0.01 mass% or more and 30 mass% or less, more preferably 0.02 mass% or more and 20 mass% or less, relative to the total solid content mass of the composition of the present invention.
< Properties of resin composition >
The viscosity of the resin composition of the present invention can be adjusted by the solid content concentration of the resin composition. From the viewpoint of the coating film thickness, it is preferably 1,000mm 2 /s～12,000mm 2 S, more preferably 2,000mm 2 /s～10,000mm 2 S, more preferably 2, 500mm 2 /s～8,000mm 2 And/s. In the above range, a coating film having high uniformity is easily obtained. For example 1,000mm 2 At a ratio of not less than/s, the film thickness required as an insulating film for rewiring can be easily applied to 12,000mm 2 When the ratio is not more than/s, a coating film excellent in the coating surface shape can be obtained.
< restriction of substances contained in resin composition >
The water content of the resin composition of the present invention is preferably less than 2.0 mass%, more preferably less than 1.5 mass%, and even more preferably less than 1.0 mass%. When the content is less than 2.0%, the storage stability of the resin composition is improved.
Examples of the method for maintaining the water content include adjusting the humidity under the storage conditions and reducing the porosity of the storage container during storage.
From the viewpoint of insulation properties, the metal content of the resin composition of the present invention is preferably less than 5 mass ppm (parts per million (parts per million)), more preferably less than 1 mass ppm, and even more preferably less than 0.5 mass ppm. Examples of the metal include sodium, potassium, magnesium, calcium, iron, copper, chromium, nickel, and the like, except for metals contained as a complex of an organic compound and a metal. When a plurality of metals are contained, the total of these metals is preferably within the above range.
Further, as a method for reducing metal impurities unexpectedly contained in the resin composition of the present invention, the following methods can be mentioned: the raw material having a small metal content is selected as the raw material constituting the resin composition of the present invention, and the raw material constituting the resin composition of the present invention is filtered by a filter, and the inside of the apparatus is lined with polytetrafluoroethylene or the like to carry out distillation or the like under a condition that contamination is suppressed as much as possible.
In view of the use of the resin composition of the present invention as a semiconductor material, the content of halogen atoms is preferably less than 500 mass ppm, more preferably less than 300 mass ppm, and even more preferably less than 200 mass ppm from the viewpoint of wiring corrosiveness. Wherein the amount present in the state of halogen ions is preferably less than 5 mass ppm, more preferably less than 1 mass ppm, further preferably less than 0.5 mass ppm. Examples of the halogen atom include a chlorine atom and a bromine atom. The total of the chlorine atom and the bromine atom, or the chlorine ion and the bromine ion is preferably within the above range.
As a method for adjusting the content of halogen atoms, ion exchange treatment and the like are preferable.
As the container for containing the resin composition of the present invention, a conventionally known container can be used. In addition, as the storage container, a multilayer bottle having 6 kinds of 6 layers of resins constituting the inner wall of the container and a bottle having 6 kinds of resins and 7 layers of resins are preferably used for the purpose of suppressing the mixing of impurities into the raw material or the resin composition of the present invention. Examples of such a container include those described in Japanese patent application laid-open No. 2015-123351.
< cured product of resin composition >
By curing the resin composition of the present invention, a cured product of the resin composition can be obtained,
the cured product of the present invention is a cured product obtained by curing the resin composition of the present invention.
The curing of the resin composition is preferably performed by heating, more preferably at a heating temperature in the range of 120 to 400 ℃, still more preferably in the range of 140 to 380 ℃, and particularly preferably in the range of 170 to 350 ℃. The form of the cured product of the resin composition is not particularly limited, and may be selected from films, rods, spheres, pellets, and the like according to the application. In the present invention, the cured product is preferably in the form of a film. The shape of the cured product can be selected by patterning the resin composition according to the use of the resin composition, such as forming a protective film on a wall surface, forming a through hole for conduction, adjusting impedance, electrostatic capacitance, or internal stress, and imparting a heat dissipation function. The film thickness of the cured product (film made of the cured product) is preferably 0.5 μm or more and 150 μm or less.
The shrinkage of the resin composition of the present invention upon curing is preferably 50% or less, more preferably 45% or less, and still more preferably 40% or less. The shrinkage ratio herein refers to the percentage of the volume change of the resin composition before and after curing, and can be calculated from the following formula.
Shrinkage [% ] =100- (volume after curing ≡volume before curing) ×100
< Property of cured product of resin composition >
The imidization reaction rate of the cured product of the resin composition of the present invention is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. At 70% or more, a cured product having excellent mechanical properties may be obtained.
The elongation at break of the cured product of the resin composition of the present invention is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more.
The glass transition temperature (Tg) of the cured product of the resin composition of the present invention is preferably 180 ℃ or higher, more preferably 210 ℃ or higher, and still more preferably 230 ℃ or higher.
< preparation of resin composition >
The resin composition of the present invention can be prepared by mixing the above-described components. The mixing method is not particularly limited, and can be performed by a conventionally known method.
The mixing may be performed by stirring with a stirring blade, by a ball mill, by rotating the tank itself, or the like.
The temperature during mixing is preferably 10 to 30 ℃, more preferably 15 to 25 ℃.
In order to remove foreign matters such as dust and particles in the resin composition of the present invention, it is preferable to filter the resin composition by using a filter. The filter pore size is, for example, 5 μm or less, preferably 1 μm or less, more preferably 0.5 μm or less, and even more preferably 0.1 μm or less. The filter is made of polytetrafluoroethylene, preferably polyethylene or nylon. When the filter is made of polyethylene, HDPE (high density polyethylene) is more preferable. The filter may be a filter previously washed with an organic solvent. In the filter filtration step, a plurality of filters may be connected in series or in parallel. When a plurality of filters are used, filters having different pore diameters or different materials may be used in combination. Examples of the connection method include the following: HDPE filters with a pore size of 1 μm were used as the first stage, HDPE filters with a pore size of 0.2 μm were used as the second stage, and the two were connected in series. Moreover, various materials may be filtered multiple times. When the filtration is performed a plurality of times, the filtration may be a cyclic filtration. Moreover, pressure filtration may be performed. When the pressure filtration is performed, for example, the pressure applied is 0.01MPa or more and 1.0MPa or less, preferably 0.03MPa or more and 0.9MPa or less, more preferably 0.05MPa or more and 0.7MPa or less, and still more preferably 0.05MPa or more and 0.5MPa or less.
In addition to filtration using a filter, impurity removal treatment may be performed using an adsorbent. It is also possible to combine filter filtration and impurity removal treatment using an adsorbent material. As the adsorbent, a known adsorbent can be used. Examples thereof include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon.
After filtration with the filter, the resin composition filled in the bottle may be further subjected to a step of deaeration by placing the resin composition under reduced pressure.
(method for producing cured product)
The method for producing a cured product of the present invention preferably includes a film formation step of applying a resin composition to a substrate to form a film.
The method for producing a cured product of the present invention further preferably includes the film formation step, an exposure step of selectively exposing the film formed in the film formation step, and a development step of developing the film exposed in the exposure step with a developer to form a pattern.
The method for producing a cured product according to the present invention preferably includes at least one of the film forming step, the exposing step, the developing step, and a heating step of heating the pattern obtained in the developing step and a post-developing exposing step of exposing the pattern obtained in the developing step.
The production method of the present invention preferably further includes the step of forming the film and the step of heating the film.
The details of each step will be described below.
< film Forming Process >
The resin composition of the present invention can be used in a film forming step for forming a film on a substrate.
The method for producing a cured product of the present invention preferably includes a film formation step of applying a resin composition to a substrate to form a film.
[ substrate ]
The type of the substrate may be appropriately determined according to the application, and examples thereof include substrates for semiconductor production such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, metal substrates such as quartz, glass, optical films, ceramic materials, vapor deposition films, magnetic films, reflective films, ni, cu, cr, fe (for example, any of substrates formed of metal and substrates formed with a metal layer by plating, vapor deposition, and the like), papers, SOG (Spin On Glass), TFT (thin film transistor) array substrates, mold substrates, electrode plates of Plasma Display Panels (PDP), and the like, without particular limitation. In the present invention, a substrate for semiconductor production is particularly preferable, and a silicon substrate, a Cu substrate, and a mold substrate are more preferable.
Further, the surface of these substrates may be provided with an adhesion layer, an oxide layer, or the like formed of Hexamethyldisilazane (HMDS), or the like.
The shape of the base material is not particularly limited, and may be circular or rectangular.
The size of the base material is, for example, 100 to 450mm, preferably 200 to 450mm in diameter in the case of a circular shape. In the case of rectangular shapes, the length of the short side is, for example, 100 to 1000mm, preferably 200 to 700mm.
As the base material, for example, a plate-like base material (substrate) is preferably used.
When a resin composition is applied to the surface of a resin layer (for example, a layer made of a cured product) or the surface of a metal layer to form a film, the resin layer or the metal layer serves as a base material.
As a method for applying the resin composition of the present invention to a substrate, coating is preferable.
Examples of the application method include dip coating, air knife coating, curtain coating, bar coating, gravure coating, extrusion coating, spray coating, spin coating, slit coating, and inkjet coating. The spin coating method, the slit coating method, the spray coating method, or the inkjet method is more preferable from the viewpoint of film thickness uniformity, and the spin coating method and the slit coating method are preferable from the viewpoint of film thickness uniformity and productivity. By adjusting the solid content concentration of the resin composition and the coating conditions according to the method, a film having a desired thickness can be obtained. In addition, a coating method can be appropriately selected according to the shape of the substrate, and spin coating, spray coating, ink jet method, or the like is preferable in the case of a round substrate such as a wafer, and slit coating, spray coating, ink jet method, or the like is preferable in the case of a rectangular substrate. In the case of spin coating, for example, a spin speed of 500 to 3,500rpm can be applied for about 10 seconds to 3 minutes.
Further, a method of transferring a coating film formed by previously applying the above-described applying method to a temporary support onto a substrate can also be applied.
As the transfer method, the production method described in paragraphs 0023, 0036 to 0051 of Japanese patent application laid-open No. 2006-023696 or 0096 to 0108 of Japanese patent application laid-open No. 2006-047592 can be used in the present invention.
Further, a step of removing an excess film at the end of the base material may be performed. Examples of such a process include Edge Bead Rinse (EBR) and back surface rinse.
Furthermore, the following pre-wetting process may be employed: before the resin composition is applied to the substrate, various solvents are applied to the substrate to improve wettability of the substrate, and then the resin composition is applied.
< drying Process >
The film may be subjected to a step of drying the formed film (layer) after the film forming step (layer forming step) to remove the solvent.
That is, the method for producing a cured product of the present invention may include a drying step of drying the film formed in the film forming step.
The drying step is preferably performed after the film formation step and before the exposure step.
The drying temperature of the film in the drying step is preferably 50 to 150 ℃, more preferably 70 to 130 ℃, and even more preferably 90 to 110 ℃. Further, drying may be performed by decompression. The drying time may be exemplified by 30 seconds to 20 minutes, preferably 1 minute to 10 minutes, and more preferably 2 minutes to 7 minutes.
< Exposure procedure >
The film may be subjected to an exposure step of selectively exposing the film.
That is, the method for producing a cured product of the present invention may include an exposure step of selectively exposing the film formed in the film forming step.
Selective exposure refers to exposing a portion of the film. Further, by selective exposure, an exposed region (exposed portion) and an unexposed region (non-exposed portion) are formed on the film.
The exposure amount is not particularly limited as long as the resin composition of the present invention can be cured, and is preferably 50 to 10,000mJ/cm in terms of exposure energy at 365nm, for example 2 More preferably 200 to 8,000mJ/om 2 。
The exposure wavelength can be appropriately determined in the range of 190 to 1,000nm, preferably 240 to 550nm.
As the exposure wavelength, there can be mentioned (1) semiconductor lasers (wavelengths 830nm, 532nm, 488nm, 405nm, 375nm, 355nm, etc.) in relation to the light source (2) a metal halide lamp, (3) a high-pressure mercury lamp, g-rays (wavelength 436 nm), h-rays (wavelength 405 nm), i-rays (wavelength 365 nm), broadband (3 wavelengths of g, h, i-rays), (4) an excimer laser, a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), F 2 Excimer laser (wavelength 157 nm), (5) extreme ultraviolet; EUV (wavelength 13.6 nm), (6) electron beam, (7) second harmonic 532nm, third harmonic 355nm of YAG laser, etc. With respect to the resin composition of the present invention, particularly, high-pressure mercury lamp exposure is preferable, and among them, i-ray exposure is preferable. Thus, particularly high exposure sensitivity can be obtained.
The method of exposure is not particularly limited as long as at least a part of the film made of the resin composition of the present invention is exposed, and examples thereof include exposure using a photomask, exposure by a laser direct imaging method, and the like.
< post-exposure heating Process >
The film may be subjected to a post-exposure heating step (post-exposure heating step).
That is, the method for producing a cured product of the present invention may include a post-exposure heating step of heating the film exposed in the exposure step.
The post-exposure heating step may be performed after the exposure step and before the development step.
The heating temperature in the post-exposure heating step is preferably 50 to 140 ℃, more preferably 60 to 120 ℃.
The heating time in the post-exposure heating step is preferably 30 seconds to 300 minutes, more preferably 1 minute to 10 minutes.
The heating rate in the post-exposure heating step is preferably 1 to 12 ℃/min, more preferably 2 to 10 ℃/min, and even more preferably 3 to 10 ℃/min, from the temperature at the start of heating to the maximum heating temperature.
The temperature rise rate may be changed as appropriate during the heating process.
The heating method in the post-exposure heating step is not particularly limited, and a known heating plate, oven, infrared heater, or the like can be used.
In addition, heating is preferably performed in a low oxygen concentration atmosphere by passing an inert gas such as nitrogen, helium, or argon.
< developing Process >
The film after exposure can be used in a development step of developing with a developer to form a pattern.
That is, the method for producing a cured product of the present invention may include a developing step of developing the film exposed in the exposing step with a developer to form a pattern. By performing development, one of the exposed portion and the non-exposed portion of the film is removed, forming a pattern.
Here, the development of the non-exposed portion of the film removed by the development step is referred to as negative development, and the development of the exposed portion of the film removed by the development step is referred to as positive development.
[ developer solution ]
As the developer used in the developing step, an aqueous alkali solution or a developer containing an organic solvent is exemplified.
When the developer is an aqueous alkali solution, examples of the basic compound that can be contained in the aqueous alkali solution include inorganic bases, primary amines, secondary amines, tertiary amines, and quaternary ammonium salts, preferably TMAH (tetramethylammonium hydroxide), potassium hydroxide, sodium carbonate, sodium hydroxide, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, di-n-butylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetrapentylammonium hydroxide, tetrahexylammonium hydroxide, tetraoctylammonium hydroxide, ethyltrimethylammonium hydroxide, butyltrimethylammonium hydroxide, methylttripentylammonium hydroxide, dibutyldipentylammonium hydroxide, dimethyl bis (2-hydroxyethyl) ammonium hydroxide, trimethylphenylammonium hydroxide, trimethylbenzylammonium hydroxide, triethylbenzylammonium hydroxide, pyrrole, and piperidine, and more preferably TMAH. For example, when TMAH is used, the content of the alkaline compound in the developer is preferably 0.01 to 10 mass%, more preferably 0.1 to 5 mass%, and even more preferably 0.3 to 3 mass% based on the total amount of the developer.
When the developer contains an organic solvent, examples of the esters include ethyl acetate, n-butyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ -butyrolactone, epsilon-caprolactone, delta-valerolactone, and alkyl alkoxyacetate (for example: methyl alkoxyacetate, ethyl alkoxyacetate, butyl alkoxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.), alkyl 3-alkoxypropionate (e.g., methyl 3-alkoxypropionate, ethyl 3-alkoxypropionate, etc. (e.g., methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.), alkyl 2-alkoxypropionate (e.g., methyl 2-alkoxypropionate, ethyl 2-alkoxypropionate, propyl 2-alkoxypropionate, etc. (e.g., methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate)), methyl 2-alkoxy-2-methylpropionate, and ethyl 2-alkoxy-2-methylpropionate (e.g., methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.), ethyl 2-alkoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutyrate, ethyl 2-oxobutyrate, and the like, and as ethers, for example, diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene Glycol Monomethyl Ether (PGME), propylene Glycol Monomethyl Ether Acetate (PGMEA), propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and the like, and as ketones, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, and the like, and as cyclic hydrocarbons, for example, aromatic hydrocarbons such as toluene, xylene, anisole, and the like, and as sulfoxides, dimethyl sulfoxide, and as alcohols, methanol, ethanol, isopropanol, diethylene glycol, methyl butanol, N-butyl glycol, methyl pyrrolidone, N-methyl pyrrolidone, and the like, and as methyl amides, and the like, and as ketones, and as preferred examples.
When the developer contains an organic solvent, 1 or 2 or more organic solvents can be used in combination. In the present invention, in particular, a developer containing at least 1 selected from cyclopentanone, γ -butyrolactone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and cyclohexanone is preferable, a developer containing at least 1 selected from cyclopentanone, γ -butyrolactone, and dimethyl sulfoxide is more preferable, and a developer containing cyclopentanone is most preferable.
When the developing solution contains an organic solvent, the content of the organic solvent is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and particularly preferably 90% by mass or more, relative to the total mass of the developing solution. The content may be 100% by mass.
The developer may further contain other components.
Examples of the other components include a known surfactant and a known defoaming agent.
[ method for supplying developer ]
The method of supplying the developer is not particularly limited as long as the desired pattern can be formed, and there are the following methods: a method of immersing a substrate on which a film is formed in a developer, spin-coating immersion development in which a film formed on a substrate is supplied with a developer by a nozzle, or a method of continuously supplying a developer. The type of the nozzle is not particularly limited, and examples thereof include a direct current nozzle, a shower nozzle, a spray nozzle, and the like.
The method of supplying the developer by the direct-current nozzle or the method of continuously supplying the developer by the spray nozzle is preferable from the viewpoints of the permeability of the developer, the removability of the non-image portion, and the efficiency in production, and the method of supplying the developer by the spray nozzle is more preferable from the viewpoints of the permeability of the developer to the image portion.
Further, the following steps may be adopted: after continuously supplying the developing solution with the direct current nozzle, the substrate is rotated to remove the developing solution from the substrate, after spin-drying, again continuously supplying with the direct current nozzle, the substrate is rotated to remove the developing solution from the substrate, and this process may be repeated a plurality of times.
As a method for supplying the developer in the developing step, a step of continuously supplying the developer to the substrate, a step of holding the developer on the substrate in a substantially stationary state, a step of vibrating the developer on the substrate by ultrasonic waves or the like, a step of combining these, and the like can be employed.
The development time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes. The temperature of the developing solution at the time of development is not particularly limited, and may be preferably 10 to 45 ℃, more preferably 18 to 30 ℃.
In the developing step, the pattern may be further cleaned (rinsed) with a rinse solution after the treatment with the developer. Further, a method of supplying a rinse solution or the like before the developer in contact with the pattern is not completely dried may be employed.
[ flushing liquid ]
When the developer is an aqueous alkali solution, water can be used as the rinse liquid, for example. When the developer is a developer containing an organic solvent, for example, a solvent different from the solvent contained in the developer (for example, water or an organic solvent different from the organic solvent contained in the developer) can be used as the rinse liquid.
When the rinse liquid contains an organic solvent, examples of the organic solvent include ethyl acetate, n-butyl acetate, pentyl formate, isopentyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ -butyrolactone, ε -caprolactone, δ -valerolactone, alkyl alkoxyacetate (e.g., methyl alkoxyacetate, ethyl alkoxyacetate, butyl alkoxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.), alkyl 3-alkoxypropionate (e.g., methyl 3-alkoxypropionate, ethyl 3-alkoxypropionate, etc.), alkyl 2-alkoxypropionate (e.g., methyl 2-alkoxypropionate, ethyl 2-alkoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, methyl 2-ethoxypropionate, methyl 2-alkoxymethyl 2-alkoxypropionate, methyl 2-alkoxymethyl 2-ethoxypropionate, methyl 2-ethoxymethyl 2-alkoxymethyl 2-ethoxypropionate, etc.), and the like (e.g., methyl 2-ethoxypropionate, methyl 2-ethoxymethyl 2-alkoxypropionate, etc.), and the like, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutyrate, ethyl 2-oxobutyrate, and the like, and as ethers, for example, diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene Glycol Monomethyl Ether (PGME), propylene Glycol Monomethyl Ether Acetate (PGMEA), propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and the like, and as ketones, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, and the like, and as cyclic hydrocarbons, for example, aromatic hydrocarbons such as toluene, xylene, anisole, and the like, and as sulfoxides, dimethyl sulfoxide, and as alcohols, methanol, ethanol, isopropanol, diethylene glycol, methyl butanol, N-butyl glycol, methyl pyrrolidone, N-methyl pyrrolidone, and the like, and as methyl amides, and the like, and as ketones, and as preferred examples.
When the rinse liquid contains an organic solvent, the organic solvent may be used in an amount of 1 or 2 or more kinds thereof may be used in combination. In the present invention, particularly preferred are cyclopentanone, γ -butyrolactone, dimethyl sulfoxide, N-methylpyrrolidone, cyclohexanone, PGMEA, and PGME, more preferred are cyclopentanone, γ -butyrolactone, dimethyl sulfoxide, PGMEA, and PGME, and still more preferred are cyclohexanone and PGMEA.
When the rinse liquid contains an organic solvent, it is preferable that 50 mass% or more of the rinse liquid is an organic solvent, more preferably 70 mass% or more is an organic solvent, and still more preferably 90 mass% or more is an organic solvent. Further, the rinse solution may be 100 mass% organic solvent.
The rinse solution may further comprise other ingredients.
Examples of the other components include a known surfactant and a known defoaming agent.
[ method for supplying rinse solution ]
The method of supplying the rinse liquid is not particularly limited as long as the desired pattern can be formed, and there are the following methods: a method of immersing a substrate in a rinse solution, spin-coating immersion development on a substrate, a method of supplying a rinse solution to a substrate with a shower head, a method of continuously supplying a developer solution to a substrate by a direct-current nozzle or the like.
From the viewpoints of the permeability of the rinse liquid, the removability of the non-image portion, and the efficiency in production, a method of supplying the rinse liquid by using a spray nozzle, a direct-current nozzle, a spray nozzle, or the like is preferable, and a method of continuously supplying the rinse liquid by using a spray nozzle is more preferable from the viewpoint of the permeability of the rinse liquid to the image portion. The type of the nozzle is not particularly limited, and examples thereof include a direct current nozzle, a shower nozzle, a spray nozzle, and the like.
That is, the rinsing step is preferably a step of supplying or continuously supplying a rinsing liquid to the exposed film by a direct-current nozzle, and more preferably a step of supplying a rinsing liquid by a spray nozzle.
As a method for supplying the rinse liquid in the rinsing step, a step of continuously supplying the rinse liquid to the substrate, a step of holding the rinse liquid on the substrate in a substantially stationary state, a step of vibrating the rinse liquid on the substrate by ultrasonic waves or the like, a step of combining these, and the like can be used.
The rinsing time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes. The temperature of the rinse liquid at the time of rinsing is not particularly limited, and may be preferably 10 to 45 ℃, and more preferably 18 to 30 ℃.
< heating Process >
The pattern obtained by the development step (the pattern after the rinsing step in the case of performing the rinsing step) may be subjected to a heating step of heating the pattern obtained by the development.
That is, the method for producing a cured product of the present invention may include a heating step of heating the pattern obtained by the developing step.
The method for producing a cured product of the present invention may further include a heating step of heating a pattern obtained by another method without performing the development step or a film obtained by the film forming step.
In the heating step, the resin such as polyimide precursor is cyclized to form the resin such as polyimide.
Further, crosslinking of unreacted crosslinkable groups in the specific resin or the crosslinking agent other than the specific resin is also performed.
The heating temperature (maximum heating temperature) in the heating step is preferably 50 to 450 ℃, more preferably 150 to 350 ℃, still more preferably 150 to 250 ℃, still more preferably 160 to 250 ℃, and particularly preferably 160 to 230 ℃.
The heating step is preferably the following step: the cyclization reaction of the polyimide precursor is promoted in the pattern by the action of a base or the like generated from the base generator by heating.
The heating in the heating step is preferably performed at a heating rate of 1 to 12 ℃/min from the temperature at the start of heating to the maximum heating temperature. The temperature rise rate is more preferably 2 to 10℃per minute, and still more preferably 3 to 10℃per minute. The temperature rise rate is set to 1 ℃/min or more, whereby excessive volatilization of the acid or solvent can be prevented while ensuring productivity, and the residual stress of the cured product can be relaxed by setting the temperature rise rate to 12 ℃/min or less.
In the case of an oven capable of rapid heating, the heating is preferably performed at a temperature rising rate of 1 to 8 ℃/sec, more preferably 2 to 7 ℃/sec, and still more preferably 3 to 6 ℃/sec, from the temperature at the start of heating to the highest heating temperature.
The temperature at the start of heating is preferably 20 to 150 ℃, more preferably 20 to 130 ℃, still more preferably 25 to 120 ℃. The temperature at the start of heating means the temperature at the start of the step of heating to the highest heating temperature. For example, when the resin composition of the present invention is applied to a substrate and then dried, the temperature of the film (layer) after drying is preferably increased from a temperature lower by 30 to 200 ℃ than the boiling point of the solvent contained in the resin composition of the present invention.
The heating time (heating time at the highest heating temperature) is preferably 5 to 360 minutes, more preferably 10 to 300 minutes, still more preferably 15 to 240 minutes.
In particular, when forming a multilayer laminate, the heating temperature is preferably 30 ℃ or higher, more preferably 80 ℃ or higher, still more preferably 100 ℃ or higher, and particularly preferably 120 ℃ or higher, from the viewpoint of interlayer adhesiveness.
The upper limit of the temperature is preferably 350℃or lower, more preferably 250℃or lower, and still more preferably 240℃or lower.
The heating may be performed in stages. As an example, the following procedure may be performed: heating from 25 ℃ to 120 ℃ at 3 ℃/min and holding at 120 ℃ for 60 minutes, heating from 120 ℃ to 180 ℃ at 2 ℃/min and holding at 180 ℃ for 120 minutes. Further, as described in U.S. Pat. No. 9159547, it is also preferable to perform the treatment while irradiating ultraviolet rays. Such a pretreatment step can improve the film characteristics. The pretreatment step may be performed in a short time of about 10 seconds to 2 hours, and more preferably 15 seconds to 30 minutes. The pretreatment may be performed in 2 stages or more, for example, the pretreatment in the 1 st stage may be performed at 100 to 150 ℃ and the pretreatment in the 2 nd stage may be performed at 150 to 200 ℃.
Further, the cooling may be performed after the heating, and the cooling rate at this time is preferably 1 to 5 ℃/min.
In the heating step, it is preferable to perform the heating step under a reduced pressure in which an inert gas such as nitrogen, helium, or argon is circulated, for example, in order to prevent decomposition of the specific resin. The oxygen concentration is preferably 50ppm (volume ratio) or less, more preferably 20ppm (volume ratio) or less.
The heating method in the heating step is not particularly limited, and examples thereof include a heating plate, an infrared oven, an electrothermal oven, a hot air oven, an infrared oven, and the like.
< post-development exposure Process >
The pattern obtained by the development step (the pattern after the rinsing step in the case of performing the rinsing step) may be subjected to a post-development exposure step of exposing the pattern after the development step instead of or in addition to the heating step.
That is, the method for producing a cured product of the present invention may include a post-development exposure step of exposing the pattern obtained by the development step. The method for producing a cured product of the present invention may include a heating step and a post-development exposure step, or may include any one of a heating step and a post-development exposure step.
In the post-development exposure step, for example, a reaction of promoting cyclization of a polyimide precursor or the like by sensitization of a photoacid generator, a reaction of promoting detachment of an acid-decomposable group by sensitization of a photoacid generator, and the like can be promoted.
In the post-development exposure step, at least a part of the pattern obtained in the development step may be exposed, and preferably all of the pattern is exposed.
The exposure amount in the post-development exposure step is preferably 50 to 20,000mJ/cm as calculated by the exposure energy conversion at a wavelength at which the photosensitive compound has sensitivity 2 More preferably 100 to 15,000mJ/cm 2 。
The post-development exposure step can be performed using, for example, the light source in the exposure step, and preferably using broadband light.
< Metal layer Forming Process >
The pattern obtained by the development step (preferably, at least one of the heating step and the post-development exposure step) may be subjected to a metal layer forming step of forming a metal layer on the pattern.
That is, the method for producing a cured product of the present invention preferably includes a metal layer forming step of forming a metal layer on the pattern obtained by the developing step (preferably, at least one of a heating step and a post-developing exposure step is performed).
The metal layer is not particularly limited, and conventional metal species can be used, and examples thereof include copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, tin, silver, and alloys containing these metals, more preferably copper and aluminum, and still more preferably copper.
The method for forming the metal layer is not particularly limited, and a conventional method can be applied. For example, the methods described in Japanese patent application laid-open No. 2007-157879, japanese patent application laid-open No. 2001-521288, japanese patent application laid-open No. 2004-214501, japanese patent application laid-open No. 2004-101850, U.S. Pat. No. 7888181B2, and U.S. Pat. No. 9177926B2 can be used. For example, photolithography, PVD (physical deposition), CVD (chemical vapor deposition), lift off (lift off), electroplating, electroless plating, etching, printing, a method of combining these, and the like can be considered. More specifically, a patterning method combining sputtering, photolithography, and etching, and a patterning method combining photolithography and electroplating are exemplified. A preferred embodiment of plating includes plating using a copper sulfate plating solution or a copper cyanide plating solution.
The thickness of the metal layer is preferably 0.01 to 50 μm, more preferably 1 to 10 μm, in terms of the thickest part.
< use >
Examples of the field to which the method for producing a cured product of the present invention or the cured product of the present invention can be applied include an insulating film of a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, and the like. In addition, there are a sealing film, a substrate material (a base film or a cover film of a flexible printed circuit board, an interlayer insulating film), a case where a pattern is formed on an insulating film for practical mounting such as the above-mentioned one by etching, and the like. For these uses, for example, reference can be made to Science & Technology co., ltd, "high functionalization of polyimide and application Technology of application", release of polyimide material base and development "11 th 2011", release of polyimide material base and application "NTS, 8 th 2010, etc., of the kaki ben yan min/prison, CMC technical library.
The method for producing a cured product of the present invention and the cured product of the present invention can also be used for producing a plate surface such as an offset plate surface or a screen plate surface, use of a molded part in etching, protective paint for electronics, particularly microelectronics, production of a dielectric layer, and the like.
(laminate and method for producing laminate)
The laminate of the present invention is a structure having a plurality of layers made of the cured product of the present invention.
The laminate of the present invention may be a laminate comprising 2 or more layers of cured products, or may be a laminate comprising 3 or more layers.
Of the layers of the cured product of 2 or more layers contained in the laminate, at least 1 layer is a layer of the cured product of the present invention, and from the viewpoint of suppressing shrinkage of the cured product, deformation of the cured product accompanying the shrinkage, and the like, it is also preferable that all of the layers of the cured product contained in the laminate are layers of the cured product of the present invention.
That is, the method for producing a laminate of the present invention preferably includes the method for producing a cured product of the present invention, and more preferably includes the step of repeating the method for producing a laminate of the present invention a plurality of times.
The laminate of the present invention includes 2 or more layers of the cured product, and preferably includes a metal layer between any of the layers of the cured product. The metal layer is preferably formed by the metal layer forming step.
That is, the method for producing a laminate of the present invention preferably further includes a metal layer forming step of forming a metal layer on a layer made of a cured product between the methods for producing a cured product carried out a plurality of times. The metal layer forming step is preferably performed as described above.
As the laminate, for example, a laminate having a layer structure in which at least 3 layers of a layer composed of a first cured product, a metal layer, and a layer composed of a second cured product are laminated in this order is preferable.
Preferably, the layer composed of the first cured product and the layer composed of the second cured product are both layers composed of the cured product of the present invention. The resin composition of the present invention for forming the layer composed of the first cured product and the resin composition of the present invention for forming the layer composed of the second cured product may be the same composition or may be different compositions. The metal layer in the laminate of the present invention can be preferably used as a metal wiring such as a rewiring layer.
< lamination Process >
The method for producing a laminate of the present invention preferably includes a lamination step.
The lamination step is a series of steps including at least one of (a) a film formation step (layer formation step), (b) an exposure step, (c) a development step, (d) a heating step, and a post-development exposure step, in this order again, on the surface of the pattern (resin layer) or the metal layer. The film forming step (a) and at least one of the heating step and the post-development exposure step may be repeated. Further, the method may include (e) a metal layer forming step after at least one of the heating step and the post-development exposure step. The lamination step may obviously further include the above-described drying step or the like as appropriate.
When the lamination step is further performed after the lamination step, a surface activation treatment step may be further performed after the exposure step, after the heating step, or after the metal layer formation step. As the surface activation treatment, plasma treatment is exemplified. Details of the surface activation treatment will be described later.
The lamination step is preferably performed 2 to 20 times, more preferably 2 to 9 times.
For example, the resin layer is preferably 2 or more and 20 or less layers, more preferably 2 or more and 9 or less layers, such as resin layer/metal layer/resin layer/metal layer.
The composition, shape, film thickness, etc. of the layers may be the same or different.
In the present invention, in particular, it is preferable that the metal layer is provided and then the cured product (resin layer) of the resin composition of the present invention is further formed so as to cover the metal layer. Specifically, the method includes a method in which (a) the film forming step, (b) the exposure step, (c) the developing step, (d) at least one of the heating step and the post-developing exposure step, and (e) the metal layer forming step are repeated in this order, or a method in which (a) the film forming step, (d) at least one of the heating step and the post-developing exposure step, and (e) the metal layer forming step are repeated in this order. The resin composition layer (resin layer) and the metal layer of the present invention can be alternately laminated by alternately performing the lamination step of laminating the resin composition layer (resin layer) and the metal layer formation step of the present invention.
(surface activation treatment Process)
The method for producing a laminate of the present invention preferably includes a surface activation treatment step of surface-activating at least a part of the metal layer and the resin composition layer.
The surface activation treatment step is usually performed after the metal layer formation step, but the metal layer formation step may be performed after the surface activation treatment step is performed on the resin composition layer after the development step (preferably after at least one of the heating step and the post-development exposure step).
The surface activation treatment may be performed only on at least a part of the metal layer, may be performed only on at least a part of the resin composition layer after exposure, and may be performed on at least a part of both the metal layer and the resin composition layer after exposure. The surface activation treatment is preferably performed on at least a part of the metal layer, and more preferably, a part or the whole of the region of the metal layer where the resin composition layer is formed is surface-activated. In this way, by performing the surface activation treatment on the surface of the metal layer, the adhesion to the resin composition layer (film) provided on the surface thereof can be improved.
It is also preferable that a part or the whole of the resin composition layer (resin layer) after exposure is subjected to a surface activation treatment. In this way, by performing the surface activation treatment on the surface of the resin composition layer, the adhesion to the metal layer or the resin layer provided on the surface subjected to the surface activation treatment can be improved. Particularly, in the case of performing negative development or the like, when the resin composition layer is cured, the resin composition layer is less likely to be damaged by surface treatment, and adhesion is easily improved.
As the surface activation treatment, specifically, it can be selected from the following: plasma treatment, corona discharge treatment, CF-based treatment of various source gases (oxygen, hydrogen, argon, nitrogen/hydrogen mixed gas, argon/oxygen mixed gas, etc.) 4 /O 2 、NF 3 /O 2 、SF 6 、NF 3 、NF 3 /O 2 The etching treatment of (a) the surface treatment by an Ultraviolet (UV) ozone method, the treatment of immersing in an aqueous hydrochloric acid solution to remove an oxide film and then immersing in an organic surface treating agent containing a compound having at least 1 of an amino group and a thiol group, and the mechanical roughening treatment using a brush, preferably a plasma treatment, particularly preferably an oxygen plasma treatment using oxygen as a source gas. In the case of corona discharge treatment, the energy is preferably 500 to 200,000J/m 2 More preferably 1000 to 100,000J/m 2 Most preferably from 10,000 to 50,000J/m 2 。
(semiconductor device and method for manufacturing the same)
The present invention also discloses a semiconductor device comprising the cured product of the present invention or the laminate of the present invention.
The present invention also discloses a method for manufacturing a semiconductor device including the method for manufacturing a cured product of the present invention or the method for manufacturing a laminate of the present invention. As a specific example of a semiconductor device in which the resin composition of the present invention is used for forming an interlayer insulating film for a re-wiring layer, reference is made to the descriptions in paragraphs 0213 to 0218 and the description in fig. 1 of japanese patent application laid-open publication 2016-027357, which are incorporated herein by reference.
Examples
The present invention will be described in further detail with reference to examples. The materials, amounts used, ratios, treatment contents, treatment order, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Accordingly, the scope of the present invention is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are mass references.
Synthesis example 1
[ Synthesis of polyimide precursor (terminal tetrazole) from pyromellitic dianhydride, 4-diaminodiphenyl ether and 2-hydroxyethyl methacrylate ]
14.06g (64.5 mmol) of pyromellitic dianhydride (dried at 140℃for 12 hours), 16.8g (129 mmol) of 2-hydroxyethyl methacrylate, 0.05g of hydroquinone, 20.4g of pyridine (258 mmol) and 100g of diethylene glycol dimethyl ether (base-glyme) were mixed and stirred at 60℃for 10 hours. Further, 0.84g (6.45 mmol) of 2-hydroxyethyl methacrylate was added thereto and stirred for 2 hours to prepare a diester of pyromellitic acid and 2-hydroxyethyl methacrylate. Next, the reaction mixture was cooled to-10℃and 16.12g (135.5 mmol) of SOCl was added over 10 minutes while maintaining the temperature at-10.+ -. 4 ℃ 2 . At the time of adding SOCl 2 During this time, the viscosity increases. After dilution with 50mL of N-methylpyrrolidone, the reaction mixture was stirred at room temperature for 2 hours. Next, a solution obtained by dissolving 11.08g (58.7 mmol) of 4,4' -diaminodiphenyl ether in 100mL of N-methylpyrrolidone was added dropwise to the reaction mixture at-5 to 0℃over 20 minutes. Next, after the reaction mixture was reacted at 0℃for 1 hour, 10.97g (129.0 mmol) of 5-aminotetrazole was added and stirred at room temperature for 1 night. Next, the polyimide precursor was precipitated in 5 liters of water, and the water-polyimide precursor mixture was stirred at 5,000rpm (revolutions per minute: revolutions per minute) for 15 minutes. The polyimide precursor was filtered off, stirred in 4 liters of water for another 30 minutes, and filtered again. Next, the obtained polyimide precursor was dried at 45 ℃ for 3 days under reduced pressure, thereby obtaining a polyimide precursor a-1. The polyimide precursor A-1 had a weight average molecular weight of 18,000. The obtained polyimide precursor A-1 contains a repeating unit represented by the following formula (A-1) and a terminal represented by the formula (a-1). The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 2.3%.
[ chemical formula 79]
Synthesis example 1
[ Synthesis of polyimide precursor (without terminal tetrazole) from pyromellitic dianhydride, 4-diaminodiphenyl ether and 2-hydroxyethyl methacrylate ]
A polyimide precursor CA-1 was obtained in the same manner as in Synthesis example 1, except that 5-aminotetrazole was changed to ethanol in Synthesis example 1. The polyimide precursor had a weight average molecular weight of 19,000.
Synthesis example 2
[ Synthesis of polyimide precursor (terminal tetrazole, A-2) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
20.0g (64.5 mmol) of 4,4' -oxydiphthalic anhydride (dried at 140℃for 12 hours), 16.8g (129 mmol) of 2-hydroxyethyl methacrylate, 0.05g of hydroquinone, 20.4g of pyridine (258 mmol) and 100g of diethylene glycol dimethyl ether are mixed and stirred at 60℃for 10 hours. Further, 0.84g (6.45 mmol) of 2-hydroxyethyl methacrylate was added thereto and stirred for 2 hours to prepare a diester of 4,4' -oxydiphthalic acid and 2-hydroxyethyl methacrylate. Then, by SOCl 2 After the obtained diester was chlorinated, the same procedure as in Synthesis example 1 was followed by converting 4,4' -diaminodiphenyl ether into a polyimide precursor, and quenching with 10.97g (129.0 mmol) of 5-aminotetrazole, to obtain a polyimide precursor in the same manner as in Synthesis example 1. The polyimide precursor had a weight average molecular weight of 18,000. The obtained polyimide precursor A-2 contains a repeating unit represented by the following formula (A-2) and a terminal represented by the formula (a-2). The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 3.5%.
[ chemical formula 80]
Synthesis example 2
[ Synthesis of polyimide precursor (non-terminal tetrazole, CA-2) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor CA-2 was obtained in the same manner as in Synthesis example 2, except that 5-aminotetrazole was changed to ethanol in Synthesis example 2. The polyimide precursor had a weight average molecular weight of 18,000.
< synthetic example 3>
[ Synthesis of polyimide precursor (terminal tetrazole, molecular weight 1500, A-3) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor A-3 was obtained in the same manner as in Synthesis example 2, except that the amount of 4,4' -oxydianiline was changed from 58.7 mmol (11.75 g) to 32.2 mmol (6.45 g) in Synthesis example 2. The polyimide precursor had a weight average molecular weight of 1, 500. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 8.5%.
< synthetic example 4>
[ Synthesis of polyimide precursor (terminal adenine, A-4) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor A-4 was obtained in the same manner as in Synthesis example 2, except that 5-aminotetrazole was changed to adenine in Synthesis example 2. The polyimide precursor had a weight average molecular weight of 18,000. The proportion of the molar amount of the structure including the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 4.0%.
Synthesis example 5
[ Synthesis of polyimide precursor (terminal triazole, A-5) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor A-5 was obtained in the same manner as in Synthesis example 2, except that in Synthesis example 2, 5-aminotetrazole was changed to 3-amino-1, 2, 4-triazole. The polyimide precursor had a weight average molecular weight of 18,000. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure and 350℃for 2 hours was 1.5%.
< synthetic example 6>
[ Synthesis of polyimide precursor (terminal triazole, A-6) ] from 3,3', 4' -biphenyltetracarboxylic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
20.0g (64.5 mmol) of 3,3', 4' -biphenyltetracarboxylic anhydride (dried at 140℃for 12 hours), 16.8g (129 mmol) of 2-hydroxyethyl methacrylate, 0.05g of hydroquinone, 20.4g (258 mmol) of pyridine and 100g of diethylene glycol dimethyl ether were mixed (water content 88 ppm) and stirred at 60℃for 10 hours. Further, 0.84g (6.45 mmol) of 2-hydroxyethyl methacrylate was added thereto and stirred for 2 hours to prepare a diester of 3,3', 4' -biphenyltetracarboxylic acid and 2-hydroxyethyl methacrylate. Then, by SOCl 2 After the obtained diester was chlorinated, 10.84g (129.0 mmol) of 3-amino-1, 2, 4-triazole was added to the polyimide precursor by converting it to 4,4' -diaminodiphenyl ether in the same manner as in Synthesis example 1, and the mixture was stirred at room temperature for 1 night. Thereafter, a polyimide precursor A-6 was obtained in the same manner as in Synthesis example 1. The polyimide precursor A-6 had a weight average molecular weight of 20,000. The obtained polyimide precursor A-6 contains a repeating unit represented by the following formula (A-6) and a terminal represented by the formula (a-6). The proportion of the molar amount of the structure including the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 2.0%.
[ chemical formula 81]
< synthetic example 7>
[ Synthesis of polyimide precursor (terminal tetrazole, A-7) ] from 3,3', 4' -biphenyltetracarboxylic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor A-7 was obtained in the same manner as in Synthesis example 6, except that 3-amino-1, 2, 4-triazole was changed to 5-aminotetrazole in Synthesis example 6. The polyimide precursor had a weight average molecular weight of 18,000. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 3.3%.
< synthetic example 3' >
[ Synthesis of polyimide precursor (terminal pyridine, CA-3) ] from 4,4 '-oxydiphthalic anhydride, 4' -diaminodiphenyl ether and 2-hydroxyethyl methacrylate
A polyimide precursor CA-3 was obtained in the same manner as in Synthesis example 2, except that in Synthesis example 2, 5-aminotetrazole was changed to 2-aminopyridine. The polyimide precursor had a weight average molecular weight of 18,0000.
Synthesis example 8
In a flask equipped with a condenser and a stirrer, 22.2g (50 mmol) of 4,4' - (hexafluoroisopropylidene) diphthalic anhydride (Tokyo Chemical Industry co., ltd.) and 0.02g of 2, 6-tetramethylpiperidine 1-oxyl (Tokyo Chemical Industry co., ltd.) were dissolved in 100.0g of N-methylpyrrolidone (NMP) while removing water. Subsequently, 11.9g (45 mmol) of diamine (AA-1) described below was added, followed by stirring at 25℃for 3 hours, 8.51g (100 mmol) of 5-aminotetrazole was added, and further stirring at 45℃for 3 hours was performed. Subsequently, 15.8g (200 mmol) of pyridine, 12.8g (125 mmol) of acetic anhydride and 50g of N-methylpyrrolidone (NMP) were added, and the mixture was stirred at 80℃for 3 hours, and 50g of N-methylpyrrolidone (NMP) was added thereto for dilution.
The reaction solution was precipitated in 1 liter of methanol and stirred at 3000rpm for 15 minutes. The resin was removed by filtration, stirred in 1 liter of methanol for a further 30 minutes and filtered again. The obtained resin was dried at 40℃under reduced pressure for 1 day to obtain polyimide PBI-1.PBI-1 has a molecular weight mw=19,000.
The structure of polyimide PBI-1 comprises a repeating unit represented by the following formula (PBI-1) and a terminal represented by the formula (PBI-1). The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure and 350℃for 2 hours was 1.1%.
[ chemical formula 82]
< synthesis example AA-1: synthesis of diamine AA-1
In a flask equipped with a condenser and a stirrer, 26.0g (0.2 mol) of 2-hydroxyethyl methacrylate (FUJIFILM Wako Pute Chemical Corporation system) and 17.4g (0.22 mol) of dehydrated pyridine (FUJIFILM Wako Pure Chemical Corporation system) were dissolved in 78g of ethyl acetate, and the mixture was cooled to 5℃or lower. Next, 48.4g (0.21 mol) of 3, 5-dinitrobenzoyl chloride (Tokyo Chemical Industry co., ltd.) was dissolved in 145g of ethyl acetate, and the solution was added dropwise to the flask over 1 hour using a dropping funnel. After the completion of the dropwise addition, the mixture was stirred at 10℃or lower for 30 minutes, heated to 25℃and stirred for 3 hours. Then, the reaction solution was diluted with 600mL of ethyl acetate (CH 3 COOEt), transferred to a separating funnel, and washed with 300mL of water, 300mL of saturated sodium bicarbonate water, 300mL of diluted hydrochloric acid, and 300mL of saturated brine in this order. After washing in separate liquid, 30g of magnesium sulfate was dried, concentrated by an evaporator and dried in vacuum to obtain 61.0g of dinitro (A-1).
In a flask equipped with a condenser and a stirrer, 27.9g (500 mmol) of reduced iron (manufactured by FUJIFILM Wako Pure Chemical Corporation), 5.9g (110 mmol) of ammonium chloride (manufactured by FUJIFILM Wako Pure Chemical Corporation), 3.0g (50 mmol) of acetic acid (manufactured by FUJIFILM Wako Pure Chemical Corporation), and 0.03g of 2, 6-tetramethylpiperidine 1-oxyl (manufactured by Tokyo Chemical Industry co., ltd.) were weighed, and 200mL of isopropyl alcohol (IPA) and 30mL of pure water were added and stirred.
Then, 16.2g of the dinitro (A-1) was added thereto over 1 hour and stirred for 30 minutes. Then, the outside temperature was raised to 85℃and stirred for 2 hours, cooled to 25℃or lower, and then filtered using Celite (registered trademark). The filtrate was concentrated by rotary evaporator and dissolved in 800mL of ethyl acetate. This was transferred to a separating funnel, washed 2 times with 300mL of saturated sodium bicarbonate water, and washed sequentially with 300mL of water and 300mL of saturated brine. After washing by liquid separation, drying was performed with 30g of magnesium sulfate, and then concentration and vacuum drying were performed using an evaporator, 11.0g of diamine (AA-1) was obtained.
[ chemical formula 83]
< synthetic example 9>
Polyimide PBI-2 was obtained in the same manner as in synthesis example 8, except that 5-aminotetrazole was changed to adenine in synthesis example 8. The molecular weight Mw of PBI-2=20,000. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 4.8%.
< synthetic example 10>
Polyimide PBI-3 was obtained in the same manner as in synthesis example 8, except that 5-aminotetrazole was changed to 3-amino-1, 2, 4-triazole in synthesis example 8. The molecular weight Mw of PBI-3=20,000. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 2.5%.
Synthesis example 11
A polyimide precursor A-11 was obtained in the same manner as in Synthesis example 2, except that 5-aminotetrazole was changed to an amine represented by the following formula (Aa-1) in Synthesis example 2. The polyimide precursor had a weight average molecular weight of 18,500. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 4.2%.
[ chemical formula 84]
< synthesis example Aa-1: synthesis of amine represented by the formula (Aa-1)
In a three-necked flask, 7.5g (49 mmol) of 6-chloropurine, 150mL of 1-butanol and 25mL of water were mixed. To the flask, 32.5mL of ethylenediamine was added dropwise with stirring at room temperature over 1 hour with a dropping funnel while blowing nitrogen. After the completion of the dropwise addition, the reaction was continued at 80℃for 3 hours. After the completion of the reaction, the mixture was concentrated by a rotary evaporator. The obtained solid was washed with diisopropyl ether/methanol=150 mL/50mmL of a mixed solvent to obtain 8.7g of a white powder.
Synthesis example 12
23.48g of 4,4' -Oxybisphthalic Dianhydride (ODPA) and 22.27g of diphthalic dianhydride (BPDA) were placed in a separation flask, 39.69g of 2-hydroxyethyl methacrylate (HEMA) and 136.83g of tetrahydrofuran were added and stirred at room temperature (25 ℃ C.), and 24.66g of pyridine was added while stirring, thereby obtaining a reaction mixture. After the completion of the heat generation by the reaction, the reaction mixture was naturally cooled to room temperature and left for 16 hours.
Then, a solution of 62.46g of Dicyclohexylcarbodiimide (DCC) dissolved in 61.57g of tetrahydrofuran was added to the reaction mixture over 40 minutes while stirring under ice-cooling, followed by addition over 60 minutes while stirring of a suspension of 27.42g of 4,4' -diaminodiphenyl ether (DADPE) suspended in 119.73g of tetrahydrofuran. After stirring for 2 hours at room temperature, 32.72g of 3-amino-1, 2, 4-triazole was added and stirred for 1 hour, followed by 136.83g of tetrahydrofuran. The precipitate formed in the reaction mixture was removed by filtration, whereby a reaction solution was obtained.
The obtained reaction solution was added to 716.21g of ethanol, whereby a precipitate composed of a crude polymer was formed. The crude polymer thus obtained was collected by filtration and dissolved in 403.49g of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was added dropwise to 8470.26g of water to precipitate a polymer, and after the obtained precipitate was collected by filtration, vacuum drying was performed to obtain 70.2g of resin A-12 in the form of powder. The molecular weight of the resin 1 was measured by gel permeation chromatography (standard polystyrene conversion), and the weight average molecular weight (Mw) was 19, 500. The structure of the resin A-12 includes a repeating unit represented by the following formula (A-12) and any one of the structures represented by the formulas (a-12-1) and (a-12-2). The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 2.8%.
[ chemical formula 85]
< synthetic example 13>
The reaction was carried out according to the method of j.org.chem., vol.36, no.20, 1971 using 2-hydroxymethyl-2-methyl-1, 3-propanediol, whereby 2- (aminomethyl) -2-methylpropan-1, 3-diamine was obtained.
From the obtained 2- (aminomethyl) -2-methylpropane-1, 3-diamine and 3-chloro-1, 2, 4-triazole, a compound represented by the following formula (Aa-2) was synthesized.
A polyimide precursor A-13 was obtained in the same manner as in Synthesis example 2, except that in Synthesis example 2, 5-aminotetrazole was changed to a compound represented by the following formula (Aa-2). The polyimide precursor had a weight average molecular weight of 20, 500. The proportion of the molar amount of the structure containing the nitrogen-containing heterocyclic structure which was released from the resin when heated at 1 air pressure at 350℃for 2 hours was 5.7%.
[ chemical formula 86]
Synthesis example 14
28.0g (76.4 mmol) of 2,2' -bis (3-amino-4-hydroxyphenyl) hexafluoropropane was dissolved in 200g of N-methylpyrrolidone with stirring. Then, 12.1g (153 mmol) of pyridine was added thereto, and a solution obtained by dissolving 23.7g (80.2 mmol) of 4,4' -oxybenzoyl chloride in 75g of N-methylpyrrolidone was added dropwise over 1 hour while maintaining the temperature at-10 to 0 ℃. After stirring for 30 minutes, 1.08g (12.7 mmol) of 5-aminotetrazole was added and stirred for a further 60 minutes. Next, the polybenzoxazole precursor resin was precipitated in 6 liters of water and the water-polybenzoxazole precursor resin mixture was stirred at 500rpm for 15 minutes. The polybenzoxazole precursor resin was filtered off, stirred in 6 liters of water for another 30 minutes, and filtered again. Next, the obtained polybenzoxazole precursor resin was dried at 45 ℃ under reduced pressure for 3 days to obtain a polybenzoxazole precursor PBO-1. The weight average molecular weight mw=22500 of the polybenzoxazole precursor PBO-1.
The structure of the polybenzoxazole precursor PBO-1 includes a repeating unit represented by the following formula (PBO-1) and a structure represented by the formula (PBO-1).
[ chemical formula 87]
< examples and comparative examples >
In each example, the components described in the following table were mixed, respectively, to thereby obtain each resin composition. In each comparative example, the ingredients described in the following table were mixed, and each comparative composition was obtained.
Specifically, the content of each component other than the solvents described in the table is set to the amount (parts by mass) described in the column "parts by mass" of each column in the table.
The content of the solvent was set to a value in which the solid content concentration of the composition became "solid content concentration (mass%) in the table, and the ratio (mass ratio) of the solvent to the total mass, i.e., the content of each solvent, was set to a ratio described in the column of" ratio "in the table.
The obtained resin composition and comparative composition were subjected to pressure filtration using a polytetrafluoroethylene filter having a pore width of 0.8. Mu.m.
The "-" in the table indicates that the composition does not contain the corresponding component.
In the table, the column of the "parts by mass of a heterocycle in a solid content" indicates "the content (mass%) of a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms relative to the total solid content of the composition".
TABLE 1
TABLE 2
TABLE 3
The details of the components described in the table are as follows.
[ resin ]
A-1 to A-7, A-11 to A-13: a-1 to A-7 synthesized in the above synthesis examples. A-1 to A-7 and A-11 to A-13 are resins belonging to specific resins.
PBI-1 to PBI-3: PBI-1 to PBI-3 synthesized in the above synthesis example. PBI-1 to PBI-3 are all resins belonging to a specific resin.
PBO-1: PBO-1 synthesized in the above synthesis example. PBO-1 is a resin belonging to a specific resin.
CA-1 to CA-3: CA-1 to CA-3 synthesized in the above synthesis examples. CA-1 to CA-3 are all resins not belonging to a specific resin.
[ monomer (radically polymerizable Compound) ]
D-1: A-DPH (Shin-Nakamura Chemical Co., ltd.)
D-2: SR-209 (a compound of the following structure manufactured by Sartomer Company, inc.)
D-3: A-TMMT (Shin-Nakamura Chemical Co., ltd.)
[ chemical formula 88]
[ polymerization initiator (radical polymerization initiator) ]
C-1: IRGACURE OXE 01 (manufactured by BASF corporation)
C-2: IRGACURE OXE 02 (manufactured by BASF corporation)
C-3: IRGACURE 369 (BASF corporation)
C-4: compounds of the structure
[ chemical formula 89]
[ thermal alkali generators ]
B-1 to B-5: compounds represented by the following formulas (B-1) to (B-5)
[ chemical formula 90]
[ polymerization inhibitor ]
E-1: 2-nitroso-1-naphthol (Tokyo Chemical Industry Co., ltd.)
E-2: p-benzoquinone (Tokyo Chemical Industry Co., ltd.)
E-3: p-methoxyphenol (Tokyo Chemical Industry Co., ltd.)
[ migration inhibitor ]
F-1 to F-5: compounds of the structure
[ chemical formula 91]
Synthesis example F-4: synthesis of F-4
15g (0.18 mol) of 3-amino-1, 2, 4-triazole, 36.06g (0.36 mol) of triethylamine and 225mL of methylene chloride were mixed in a three-necked flask. 20.51g (0.20 mol) of chlorinated methacryloyl groups were added dropwise to the flask over 1 hour with stirring at 0 ℃. After the completion of the dropwise addition, the reaction was continued at room temperature for 4 hours. After the completion of the reaction, 200mL of water was mixed and subjected to a liquid separation operation, whereby an organic layer was extracted. The same operation was repeated 3 times. After drying over sodium sulfate, concentration was performed using a rotary evaporator. After concentration, 27.5g of white powder was obtained by recrystallization operation.
Synthesis example F-5: synthesis of Compound F-5
A white powder was obtained in the same manner as in Synthesis example F-4, except that the chlorinated methacryloyl group used in Synthesis example F-4 was changed to isobutyryl chloride.
[ silane coupling agent (Metal adhesion improver) ]
G-1 to G-4: a compound of the structure. In the following structural formula, et represents ethyl.
[ chemical formula 92]
/>
[ solvent ]
NMP: n-methyl-2-pyrrolidone
EL: lactic acid ethyl ester
GBL: gamma-butyrolactone
DMSO: dimethyl sulfoxide
[ other additives ]
I-1: a compound represented by the following formula (I-1)
I-2: n-phenyldiethanolamine
[ chemical formula 93]
< evaluation >
[ evaluation of Metal adhesion ]
The resin compositions and the comparative compositions prepared in examples and comparative examples were applied to copper substrates in layers by spin coating to form resin composition layers and comparative composition layers, respectively. The obtained copper substrate on which the resin composition layer or the comparative composition layer was formed was dried on a hot plate at 100℃for 5 minutes, whereby a curable resin composition layer or a comparative composition layer having a uniform thickness as described in the column "film thickness (μm)" was formed on the copper substrate. Using a stepper (Nikon NSR 2005i 9C), a mask having a square non-mask portion with a square shape of 100 μm was used, and the mask was irradiated with i-rays at 500mJ/cm 2 The resin composition layer or the comparative composition layer on the copper substrate was exposed to light, followed by development with cyclopentanone for 60 seconds and rinsing with PGMEA for 30 seconds, thereby obtaining a square-shaped resin layer of 100 μm square. Further, the resin layer (pattern) was formed by heating the resin layer under a nitrogen atmosphere at a temperature indicated in the column of "curing temperature (c)" in the table for a time indicated in the column of "curing time (min)" in the table by a hot plate.
Shear force was measured on a square resin layer of 100 μm square on a copper substrate using an adhesion tester (CondorSigma, manufactured by XYZTEC Co.) at 25℃under an environment of 65% Relative Humidity (RH). It can be said that the larger the shearing force is, the more excellent the metal adhesion (copper adhesion) of the cured product is. In all examples and comparative examples, the shearing force exceeded 30gf.
[ evaluation of adhesion after HTS (High Temperature Storage-test: high temperature preservation test) ]
The shear force was measured by the same evaluation method as that in the evaluation of the metal adhesion, except that the resin layer and the copper substrate were heated for a period of time indicated in the column of "curing time (min)" in the table at the temperature indicated in the column of "curing temperature (c)", and then subjected to the 1000-hour passage in the constant temperature bath at 175 ℃. The evaluation was performed according to the following evaluation criteria. The evaluation results are shown in the table in column "post HTS adhesion". It can be said that the larger the shearing force is, the more excellent the metal adhesion (copper adhesion) of the cured product is. Further, since the post-HTS adhesion is excellent, it can be said that peeling is less likely to occur between the cured product and the metal even after a long period of time has elapsed.
Evaluation criterion-
A: the shearing force exceeds 30gf.
B: the shearing force exceeds 25gf and is less than 30gf.
C: the shearing force exceeds 20gf and is less than 25 gf.
D: the shearing force is 20gf or less.
Further, 1gf was 0.00980665N.
[ evaluation of pore volume after HTS ]
By the same method as the evaluation method in the evaluation of the metal adhesion, a square resin layer having a square shape of 100 μm was formed on the copper substrate.
The porosity between the copper substrate and the resin layer was evaluated by heating the resin layer and the copper substrate at the temperature indicated in the column "curing temperature (c)" in the table for the time indicated in the column "curing time (min)" in the table, then allowing the resin layer and the copper substrate to pass through a constant temperature bath at 175 ℃ for 1000 hours, and then performing cross-sectional SEM (scanning electron microscope) measurement. The void area ratio was calculated by the following formula.
Void area (%) = (area of void portion observed by SEM measurement)/(total cross-sectional area of resin layer) ×100
Based on the obtained value of the porosity, evaluation was performed according to the following evaluation criteria. The evaluation results are shown in the column "post-HTS pore volume" of the table.
The smaller the void area ratio, the more excellent the reliability of the cured product after HTS, and the less likely voids are generated between the metal layer and the cured product even after a long period of time.
Evaluation criterion-
A: the porosity is 0.5% or less.
B: the pore area ratio exceeds 0.5% and is less than 1.5%.
C: the pore area ratio exceeds 1.5% and is less than 3%.
D: the void area ratio exceeds 3%.
[ evaluation of drug resistance ]
In each of examples and comparative examples, a uniform resin composition layer or a comparative composition layer having a thickness of 20 μm was formed on a copper substrate by the same method as in the above adhesion evaluation.
Using a stepper (Nikon NSR 2005 i9C), the beam was irradiated at 500mJ/cm 2 After the resin composition layer or the comparative composition layer on the copper substrate was subjected to surface-mount exposure, the temperature was raised at a temperature rise rate of 5 ℃/min under a nitrogen atmosphere, and the time of "curing time (min)" in the table was heated by a heating plate at the temperature indicated in the column of "curing temperature" (c) ", thereby obtaining a cured product.
In the evaluation of the chemical resistance, development was omitted for simplicity.
The obtained cured product was immersed in the following chemical solution under the following conditions, and the dissolution rate was calculated.
Liquid medicine: dimethyl sulfoxide (DMSO) with 25 mass% aqueous tetramethylammonium hydroxide (TMAH) 90:10 (mass ratio) of the mixture
Evaluation conditions: the cured product was immersed in the liquid medicine at 75℃for 15 minutes, and the film thicknesses before and after immersion were compared to calculate the dissolution rate (nm/min). For film thickness measurement, film thickness measurement was performed on the coated surface 10 by an ellipsometer (KT-22 manufactured by Foothill corporation) to obtain an arithmetic average value thereof.
The evaluation was performed according to the following evaluation criteria. The evaluation results are shown in the column "chemical resistance" of the table. It can be said that the smaller the value of the dissolution rate, the more excellent the chemical resistance of the cured product.
Evaluation criterion-
A: the dissolution rate is less than 250 nm/min.
B: the dissolution rate is 250 nm/min or more and less than 500 nm/min.
C: the dissolution rate is 500 nm/min or more.
< example 101>
A resin composition was prepared in the same manner as in example 1 except that the blending amount of the resin A-1 was changed from 80 parts by mass to 86.7 parts by mass in example 1, except that the thermal base generator B-1, the polymerization initiator C-1, the polymerization inhibitor E-2 and the silane coupling agent G-1.
The adhesion after HTS and the pore volume after HTS were evaluated by the same method as in example 1 using the above resin composition, and as a result, the same results as in example 1 were obtained in all evaluation items.
< example 102>
In example 10, a curable resin composition was prepared by changing the resin to a resin containing a repeating unit represented by the following formula P-1 and a structure represented by the following formula (P-1), and changing the thermal base generator B-1 to the following photobase generator B-7. Using the obtained curable resin composition, evaluation of adhesion after HTS, evaluation of pore volume after HTS, and evaluation of chemical resistance were performed.
The adhesion after HTS and the void amount after HTS were evaluated in the same manner as in example 10 except that the photomask was changed to a photomask having a square mask portion with a square shape of 100 μm square, and the pattern was rinsed with pure water by developing for 30 seconds using a 2.38 mass% tetramethylammonium hydroxide aqueous solution.
The evaluation of chemical resistance was performed in the same manner as in example 10, except that the entire surface exposure was not performed.
In the positive form, the results of post-HTS adhesion, post-HTS void volume, and chemical resistance were also the same as in example 10.
The results of the evaluation in the evaluation of the post-HTS adhesion, post-HTS pore volume and chemical resistance were the same as those of each of the evaluation in example 10.
[ chemical formula 94]
/>
Example 103 ]
An evaluation of adhesion after HTS, an evaluation of void amount after HTS, and an evaluation of chemical resistance were performed under the same conditions as in example l except that the heating means for heating in the table "curing time (min)" was changed from a heating plate to an infrared lamp heating device (advan RIKO, inc. Manufactured by RTP-6) at the temperature described in the column "curing temperature (°c)".
The same results as in example 1 were obtained for the evaluation of adhesion after HTS, the evaluation of pore volume after HTS, and the chemical resistance.
From the above results, it was found that the cured product of the resin composition of the present invention was excellent in post-HTS adhesion.
The comparative compositions in comparative examples 1 and 2 did not contain a specific resin. In this manner, the cured product obtained was found to have poor post-HTS adhesion.
< example 201>
The resin composition used in example 1 was applied to the copper thin layer surface of the resin substrate having a copper thin layer formed thereon in a layer form by spin coating, and dried at 100℃for 5 minutes to form a photosensitive film having a film thickness of 20. Mu.m, and then exposed to light by a stepper (manufactured by Nikon Corporation, NSR1505 i 6). Exposure was performed at 365nm via a mask (binary mask with a pattern of 1:1 lines and spaces) and a Line width of 10 μm. After the above heating, the layer was developed with cyclohexanone for 2 minutes and rinsed with PGMEA for 30 seconds, thereby obtaining a pattern of the layer.
Then, the temperature was raised at a temperature raising rate of 10 ℃/min under a nitrogen atmosphere, and after reaching 180 ℃, the interlayer insulating film for a rewiring layer was formed by maintaining at 180 ℃ for 120 minutes. The interlayer insulating film for a rewiring layer is excellent in insulation properties.
Further, as a result of manufacturing a semiconductor device using these interlayer insulating films for a rewiring layer, normal operation was confirmed.

Claims (14)

1. A resin composition comprising a cyclized resin or a resin as a precursor thereof,
the resin comprises a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms,
the ratio of the molar amount of the structure including the nitrogen-containing heterocyclic structure that is detached from the resin to the total molar amount of the nitrogen-containing heterocyclic structure included in the resin is 10% or less when the resin is heated at 1 air pressure at 350 ℃ for 2 hours.
2. The resin composition according to claim 1, wherein,
the nitrogen-containing heterocyclic structure is present at the end of the resin.
3. The resin composition according to claim 1 or 2, wherein,
the resin comprises a structure represented by the following formula (1-1) or formula (2-1),
in the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
in the formula (2-1), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
4. A resin composition comprising a cyclized resin or a resin as a precursor thereof,
the resin comprises a structure represented by the following formula (1-1) or formula (2-1),
in the formula (1-1), L 1 Represents a single bond or an n+1 valent linking group not comprising an imide ring structure, R 1 Represents a nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, n represents an integer of 1 or more, represents a bonding site with other structure,
in the formula (2-1), L 2 Represents a single bond or an m+1 valent linking group not comprising an oxazole ring structure, R 2 A nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms, m represents an integer of 1 or more, and x represents a bonding site to another structure.
5. The resin composition according to any one of claim 1 to 4, wherein,
the content of the nitrogen-containing heterocyclic structure containing 2 or more nitrogen atoms as ring-forming atoms is 0.001 to 10% by mass relative to the total solid content of the composition.
6. The resin composition according to any one of claims 1 to 5, wherein,
The nitrogen-containing heterocyclic structure contained in the resin contains an imidazole skeleton, a triazole skeleton or a tetrazole skeleton.
7. The resin composition according to any one of claims 1 to 6, wherein,
the weight average molecular weight of the resin is 1500-70000.
8. The resin composition according to any one of claims 1 to 7, which is used for forming an interlayer insulating film for a rewiring layer.
9. A cured product obtained by curing the resin composition according to any one of claims 1 to 8.
10. A laminate comprising 2 or more layers of the cured product according to claim 9, wherein any of the cured products comprises a metal layer between each other.
11. A method for producing a cured product, comprising a film forming step of applying the resin composition according to any one of claims 1 to 8 to a substrate to form a film.
12. The method for producing a cured product according to claim 11, comprising an exposure step of exposing the film and a development step of developing the film.
13. The method for producing a cured product according to claim 11 or 12, comprising a heating step of heating the film at 50 to 450 ℃.
14. A semiconductor device comprising the cured product of claim 9 or the laminate of claim 10.
CN202280021576.9A 2021-03-16 2022-03-10 Resin composition, cured product, laminate, method for producing cured product, and semiconductor device Pending CN117043273A (en)

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