CN116913819A - 一种半导体用切筋设备 - Google Patents
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Abstract
本发明涉及半导体加工设备技术领域,具体的公开了一种半导体用切筋设备,包括设备机台,设备机台顶部设有切筋模具,设备机台底部转动设有六边台,六边台的六个面均可拆卸固定有模具台,每个模具台的两侧均设有伸缩板,设备机台后侧底部设有与六边台匹配的壳体,壳体底部抽拉滑动设有收集盒,壳体设有与模具台对齐匹配的下料口,壳体顶部设有吹气下料机构,设备机台后侧设有与六边台匹配的边角料下料机构,设备机台前侧设有与六边台匹配的上料机构。本发明可实现切筋操作和下料操作的分开,能够使得完成切筋后的半导体零件的下料与之后新的切筋操作同步进行,避免占用切筋操作的时间,有效提高了工作效率。
Description
技术领域
本发明涉及半导体加工设备技术领域,尤其涉及一种半导体用切筋设备。
背景技术
半导体切筋是将原连接在一起的引线框架与半导体零件切断分离,以及将封装时溢出的多余塑胶去除,并将半导体引脚折弯成设计的形状,不能破坏半导体封装状态,避免引脚扭曲变形,之后将切割好的产品收集转运即可。
现有的半导体用切筋设备通过切筋模具和模具台实现切筋操作,即将引线框架放置到模具台上,通过切筋模具冲压来说实现切割动作,但是在切筋完成后,需要时间进行下料操作,影响连续加工的效率,存在占用切筋操作时间的问题,影响整体切筋的工作效率。
因此,为了解决此类问题,我们提出了一种半导体用切筋设备。
发明内容
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种半导体用切筋设备。
为了实现上述目的,本发明采用了如下技术方案:
一种半导体用切筋设备,包括设备机台,所述设备机台顶部设有切筋模具,设备机台底部转动设有六边台,六边台侧边设有转动驱动机构,六边台的六个面均可拆卸固定有模具台,六个模具台均能够与切筋模具对齐匹配,每个模具台的两侧均设有伸缩板,设备机台后侧底部设有与六边台匹配的壳体,壳体底部抽拉滑动设有收集盒,壳体设有与模具台对齐匹配的下料口,壳体顶部设有吹气下料机构;
所述设备机台后侧设有与六边台匹配的边角料下料机构,设备机台前侧设有与六边台匹配的上料机构。
优选的,所述设备机台顶部伸缩设有冲压台,切筋模具与冲压台底部可拆卸固定连接,设备机台中部两侧均固定有支撑台,六边台位于两个支撑台中间,两个支撑台与冲压台之间设有缓冲弹簧,缓冲弹簧内套设有光杆,光杆下端与支撑台固定连接,光杆上端滑动贯穿冲压台并与设备机台顶部固定连接。
优选的,所述转动驱动机构包括与设备机台固定连接的伺服电机,六边台同轴固定有第一转轴,且第一转轴两端与设备机台两侧转动连接,伺服电机一端固定有外壳,第一转轴贯穿外壳,第一转轴同轴固定有从动带轮,从动带轮位于外壳内部,伺服电机的输出轴同轴固定有主动带轮,主动带轮与从动带轮通过第一皮带传动连接。
优选的,所述伸缩板的长度与六边台的长度相同,六边台内部固定有与伸缩板匹配的第一电动伸缩杆,第一电动伸缩杆的伸缩端与伸缩板固定连接,伸缩板的伸缩方向与六边台的轴心对齐。
优选的,所述下料口呈倾斜设置,下料口上下端均设有与伸缩板匹配的缺口,且两个缺口边缘处均固定有倾斜挡条,六边台的两端与两个缺口边缘贴合匹配。
优选的,所述吹气下料机构包括与壳体顶部固定的吹气头,吹气头出风口的长度与六边台的长度相同,且出风口的两端与六边台两端对齐,吹气头倾斜朝向六边台。
优选的,所述边角料下料机构包括转动辊,转动辊同轴固定有第二转轴,第二转轴两端分别与设备机台两侧转动连接,第二转轴与第一转轴之间设有联动机构,转动辊上滑动设有两个环状块,环状块与转动辊通过紧固螺栓固定,环状块上等距环绕固定有三个伸缩气缸,位于转动辊两端的伸缩气缸两两对齐,伸缩气缸的伸缩端固定有气吸盘,壳体顶部设有与转动辊底部对应的下料输送带。
优选的,所述联动机构包括第一齿轮和第二齿轮,第一齿轮和第二齿轮啮合匹配,第一齿轮同轴固定在第二转轴上,设备机台侧边水平固定有支撑柱,支撑柱端面同轴转动设有第一带轮,第二齿轮与第一带轮同轴固定连接,第一转轴同轴固定有第二带轮,第一带轮与第二带轮通过第二皮带传动连接。
优选的,所述上料机构包括支撑架,支撑架上横向固定有第二电动伸缩杆,第二电动伸缩杆的伸缩端朝向设备机台并固定有移动板,移动板侧边上下滑动设有吸盘托板,吸盘托板呈水平设置且其底部设有若干上料气吸盘,移动板侧边竖直固定有第三电动伸缩杆,第三电动伸缩杆的伸缩端与吸盘托板固定连接。
优选的,所述支撑架下方设有上料输送带,上料输送带一端与吸盘托板下侧对齐。
与现有技术相比,本发明的有益效果是:
1:本发明中通过设置六边台、模具台、切筋模具、吹气下料机构以及边角料下料机构,有效实现连续加工的效果,六边台能够转动带动模具台移动,通过六边台的转动使得当前的切筋操作和上一个切筋后的下料操作同步进行,实现切筋操作和下料操作的分开,有效避免了占用切筋操作时间的问题,提高了工作效率。
2:本发明通过设置联动机构,从而实现六边台和边角料下料机构的联动,使得随着六边台的转动,边角料下料机构上吸附固定引线框架的气吸盘随之转动到下料输送带上侧,之后引线框架掉落至下料输送带上并移出,达到有效的联动效果,进一步提高工作效率。
附图说明
图1为本发明提出的一种半导体用切筋设备的第一轴测图;
图2为本发明提出的一种半导体用切筋设备的第二轴测图;
图3为本发明提出的一种半导体用切筋设备的设备机台的侧面剖视图;
图4为本发明提出的一种半导体用切筋设备的模具的壳体的内部结构示意图;
图5为本发明提出的一种半导体用切筋设备的外壳的内部结构示意图;
图6为本发明提出的一种半导体用切筋设备的联动机构的结构示意图;
图7为图6的局部放大图;
图8为本发明提出的一种半导体用切筋设备的上料机构的结构示意图。
图中:1、设备机台;2、切筋模具;3、六边台;4、模具台;5、伸缩板;6、壳体;7、收集盒;8、下料口;9、冲压台;10、支撑台;11、伺服电机;12、第一转轴;13、从动带轮;14、主动带轮;15、第一皮带;16、第一电动伸缩杆;17、倾斜挡条;18、吹气头;19、转动辊;20、第二转轴;21、外壳;22、环状块;23、伸缩气缸;24、气吸盘;25、第一齿轮;26、第二齿轮;27、支撑柱;28、第一带轮;29、第二带轮;30、第二皮带;31、下料输送带;32、支撑架;33、第二电动伸缩杆;34、移动板;35、吸盘托板;36、第三电动伸缩杆;37、上料输送带。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
参照图1-8,一种半导体用切筋设备,包括设备机台1,设备机台1呈到U字形,设备机台1顶部设有切筋模具2,设备机台1底部转动设有六边台3,六边台3侧边设有转动驱动机构,六边台3的六个面均可拆卸固定有模具台4,模具台4处于水平状态时,用于放置框架,框架内为封装后代切割引脚的半导体零件。六个模具台4均能够与切筋模具2对齐匹配,即六边台3转动可使得每个模具台4在转动到上方位置时,能够与切筋模具2上下平行对齐。单独的模具台4与切筋模具2对齐后,通过合并二者实现对处于之间的框架以及框架上的半导体进行引脚切割和挤压成型操作。每个模具台4的两侧均设有伸缩板5,设备机台1后侧底部设有与六边台3匹配的壳体6,壳体6底部抽拉滑动设有收集盒7,收集盒7用于收集切筋完成后的半导体零件,收集盒7能够抽出,实现对半导体零件的取出。壳体6设有与模具台4对齐匹配的下料口8,即六边台3转动调节能够使得模具台4与下料口8对齐。壳体6顶部设有吹气下料机构,吹气下料机构用于快速下料模具台4上切筋完成后的半导体零件;
设备机台1后侧设有与六边台3匹配的边角料下料机构,设备机台1前侧设有与六边台3匹配的上料机构。
作为本发明的一种技术优化方案,设备机台1顶部伸缩设有冲压台9,设备机台1顶部内部设有与冲压台9匹配的现有的往复活塞移动装置。切筋模具2与冲压台9底部可拆卸固定连接,切筋模具2能够进行更换。设备机台1中部两侧均固定有支撑台10,六边台3位于两个支撑台10中间,两个支撑台10与冲压台9之间设有缓冲弹簧,缓冲弹簧内套设有光杆,光杆下端与支撑台10固定连接,光杆上端滑动贯穿冲压台9并与设备机台1顶部固定连接。冲压台9启动用于带动切筋模具2下压,切筋模具2与下方的模具台4合并,对处于之间的引线框架上的半导体零件引脚切断并折弯成型,将引线框架和若干半导体零件分离,完成切筋操作。
作为本发明的一种技术优化方案,转动驱动机构包括与设备机台1固定连接的伺服电机11,伺服电机11能够进行精确的转动控制。六边台3同轴固定有第一转轴12,且第一转轴12两端与设备机台1两侧转动连接,第一转轴12起到稳定支撑的作用。伺服电机11一端固定有外壳21,第一转轴12贯穿外壳21,第一转轴12同轴固定有从动带轮13,从动带轮13位于外壳21内部,伺服电机11的输出轴同轴固定有主动带轮14,伺服电机11端面固定有减速齿轮箱,伺服电机11的输出轴为减速齿轮箱的输出轴。主动带轮14与从动带轮13通过第一皮带15传动连接。伺服电机11启动带动主动带轮14转动,主动带轮14通过第一皮带15带动从动带轮13转动,进而带动第一转轴12转动,第一转轴12转动带动六边台3转动。
作为本发明的一种技术优化方案,伸缩板5的长度与六边台3的长度相同,六边台3内部固定有与伸缩板5匹配的第一电动伸缩杆16,第一电动伸缩杆16的伸缩端与伸缩板5固定连接,伸缩板5的伸缩方向与六边台3的轴心对齐。第一电动伸缩杆16用于控制伸缩板5伸缩移动。第一电动伸缩杆16的电源线穿过第一转轴12内部,即第一转轴12中部设有通孔,电源线穿过第一转轴12内部并延伸至一端,并与现有的电源线旋转接头连接,因此六边台3的转动不会影响第一电动伸缩杆16的正常使用。
作为本发明的一种技术优化方案,下料口8呈倾斜设置,下料口8上下端均设有与伸缩板5匹配的缺口,且两个缺口边缘处均固定有倾斜挡条17,六边台3的两端与两个缺口边缘贴合匹配,在模具台4转动到与壳体6的下料口8对齐时,能够整体处于下料口8内,且两侧被封闭,同时两个伸缩板5封闭上下缺口,此时能够使得若干半导体不会掉落到壳体6外侧,确保半导体有效收集到收集盒7内。
作为本发明的一种技术优化方案,吹气下料机构包括与壳体6顶部固定的吹气头18,吹气头18出风口的长度与六边台3的长度相同,且出风口的两端与六边台3两端对齐,吹气头18倾斜朝向六边台3,吹气头18用于从模具台4上方倾斜向下吹气,确保若干半导体零件全部掉落到收集盒7内。
作为本发明的一种技术优化方案,边角料下料机构包括转动辊19,转动辊19同轴固定有第二转轴20,第二转轴20两端分别与设备机台1两侧转动连接,第二转轴20与第一转轴12之间设有联动机构,转动辊19上滑动设有两个环状块22,环状块22与转动辊19通过紧固螺栓固定,环状块22上等距环绕固定有三个伸缩气缸23,伸缩气缸23能够通过环状块22进行位置的调节。位于转动辊19两端的伸缩气缸23两两对齐,伸缩气缸23的伸缩端固定有气吸盘24。第二转轴20内部设有通孔,伸缩气缸23和气吸盘24的气管均通过第二转轴20内部,并与外部的对应的气管通过现有的旋转接头对接,因此转动辊19的转动不会影响伸缩气缸23和气吸盘24的操作。壳体6顶部设有与转动辊19底部对应的下料输送带31。转动辊19两端的伸缩气缸23伸长可带动对应的气吸盘24移动,气吸盘24可与切筋后的引线框架贴合并气吸固定,之后对应的伸缩气缸23收回,将引线框架与若干半导体零件分离。之后引线框架移动至下料输送带31上移出。
作为本发明的一种技术优化方案,联动机构包括第一齿轮25和第二齿轮26,第一齿轮25和第二齿轮26啮合匹配,第一齿轮25同轴固定在第二转轴20上,设备机台1侧边水平固定有支撑柱27,支撑柱27端面同轴转动设有第一带轮28,第二齿轮26与第一带轮28同轴固定连接,第一转轴12同轴固定有第二带轮29,第一带轮28与第二带轮29通过第二皮带30传动连接。第一转轴12转动带动六边台3转动,第一转轴12转动带动第二带轮29转动,第二带轮29转动通过第二皮带30带动第一带轮28转动,第一带轮28转动带动第二齿轮26转动,第二齿轮26转动带动第一齿轮25反转,第一齿轮25反转带动第二转轴20。
作为本发明的一种技术优化方案,上料机构包括支撑架32,支撑架32上横向固定有第二电动伸缩杆33,第二电动伸缩杆33的伸缩端朝向设备机台1并固定有移动板34,移动板34与支撑架32滑动匹配,移动板34上固定有现有的位置感应器。移动板34侧边上下滑动设有吸盘托板35,吸盘托板35呈水平设置且其底部设有若干上料气吸盘,移动板34侧边竖直固定有第三电动伸缩杆36,第三电动伸缩杆36的伸缩端与吸盘托板35固定连接。
作为本发明的一种技术优化方案,支撑架32下方设有上料输送带37,上料输送带37用于对待切筋的引线框架进行输送。上料输送带37一端与吸盘托板35下侧对齐,支撑架32下方设有现有的定位传感器,上料输送带37一端设有定位挡板,引线框架输送至正对吸盘托板35下侧位置后停止,能够精确的对齐吸盘托板35下侧。
本发明在使用时,六边台3通过转动将一个模具台4移动至与切筋模具2上下平行对齐的位置,此时将半导体零件和框架组合的引线框架放置到模具台4上,冲压台9启动带动切筋模具2下压,切筋模具2与下方的模具台4合并,对引线框架上的半导体零件引脚切断并折弯成型,将引线框架和若干半导体零件分离,同时将封装时溢出的多余塑胶去除。之后六边台3顺时针转动,使得该模具台4以及若干半导体零件移动到与边角料下料机构对齐的位置,此时转动辊19两端的伸缩气缸23伸长,带动气吸盘24移动,气吸盘24与切筋后的引线框架贴合并气吸固定,之后对应的伸缩气缸23收回,将引线框架与若干半导体零件分离。之后六边台3转动,使得该模具台4转动到与壳体6的下料口8对齐的方位,转动的同时该模具台4两边的伸缩板5伸长,即对应的第一电动伸缩杆16控制伸缩板5伸长,且在模具台4定位后,两个伸缩板5恰好封闭下料口8上下端的缺口,此时由于重力的原因,若干半导体零件掉落到壳体6底部的收集盒7内,并且吹气头18启动,对该模具台4从上方倾斜向下吹气,确保若干半导体零件全部掉落到收集盒7内,最终完成半导体零件的收集操作。整体机构能够实现连续加工的效果,六边台3每次转动一面,即可在处于顶部的模具台4上放置半导体零件和框架组合的引线框架,在切筋操作后,可继续进行六边台3的转动,并继续放置半导体零件和框架组合的引线框架,后续完成切筋后的半导体零件的下料与之后新的切筋操作同步进行,不会占用切筋操作的时间,有效提高了工作效率。
六边台3转动通过伺服电机11精确控制,即伺服电机11启动带动主动带轮14转动,主动带轮14通过第一皮带15带动从动带轮13转动,从动带轮13带动第一转轴12转动,第一转轴12转动带动六边台3转动。
同时在六边台3转动时,在联动机构的作用下,六边台3转动可带动转动辊19同步转动。即第一转轴12转动带动六边台3转动,第一转轴12转动带动第二带轮29转动,第二带轮29转动通过第二皮带30带动第一带轮28转动,第一带轮28转动带动第二齿轮26转动,第二齿轮26转动带动第一齿轮25反转,第一齿轮25反转带动第二转轴20。六边台3每转动一面,即模具台4对齐到边角料下料机构时,通过第二齿轮26和第一齿轮25的齿数的匹配,恰好使得两个伸缩气缸23与模具台4对齐,便于之后引线框架下料。同时随着六边台3的继续转动,吸附固定引线框架的气吸盘24随之转动到下料输送带31上侧,此时停止吸附,引线框架掉落至下料输送带31上并移出。
在吹气头18启动,对该模具台4从上方倾斜向下吹气,确保若干半导体零件全部掉落到收集盒7内部时,吹气头18吹气同时起到对模具台4散热的效果,且起到对模具台4的有效清洁,确保模具台4上不会存在碎屑残留,即吹去切割去除的多余塑胶,有效的提高了模具台4的使用寿命,并提高了良品率。
在将半导体零件和框架组合的引线框架放置到模具台4上时,可通过上料输送带37对待切筋的引线框架进行输送,输送至正对吸盘托板35下侧位置后停止,第三电动伸缩杆36启动带动吸盘托板35下降,吸盘托板35底部的若干上料气吸盘启动气吸固定引线框架,之后,第三电动伸缩杆36启动带动吸盘托板35上升,第二电动伸缩杆33启动带动移动板34和对应的吸盘托板35移动,吸盘托板35移动到对应的模具台4上侧,并与模具台4定位对齐,之后第三电动伸缩杆36启动带动吸盘托板35下降,将引线框架精准的放置到模具台4上侧,吸盘托板35底部的若干上料气吸盘停止气吸,之后吸盘托板35上升并整体缩回,完成上料操作。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种半导体用切筋设备,包括设备机台(1),其特征在于,所述设备机台(1)顶部设有切筋模具(2),设备机台(1)底部转动设有六边台(3),六边台(3)侧边设有转动驱动机构,六边台(3)的六个面均可拆卸固定有模具台(4),六个模具台(4)均能够与切筋模具(2)对齐匹配,每个模具台(4)的两侧均设有伸缩板(5),设备机台(1)后侧底部设有与六边台(3)匹配的壳体(6),壳体(6)底部抽拉滑动设有收集盒(7),壳体(6)设有与模具台(4)对齐匹配的下料口(8),壳体(6)顶部设有吹气下料机构;
所述设备机台(1)后侧设有与六边台(3)匹配的边角料下料机构,设备机台(1)前侧设有与六边台(3)匹配的上料机构。
2.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述设备机台(1)顶部伸缩设有冲压台(9),切筋模具(2)与冲压台(9)底部可拆卸固定连接,设备机台(1)中部两侧均固定有支撑台(10),六边台(3)位于两个支撑台(10)中间,两个支撑台(10)与冲压台(9)之间设有缓冲弹簧,缓冲弹簧内套设有光杆,光杆下端与支撑台(10)固定连接,光杆上端滑动贯穿冲压台(9)并与设备机台(1)顶部固定连接。
3.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述转动驱动机构包括与设备机台(1)固定连接的伺服电机(11),六边台(3)同轴固定有第一转轴(12),且第一转轴(12)两端与设备机台(1)两侧转动连接,伺服电机(11)一端固定有外壳(21),第一转轴(12)贯穿外壳(21),第一转轴(12)同轴固定有从动带轮(13),从动带轮(13)位于外壳(21)内部,伺服电机(11)的输出轴同轴固定有主动带轮(14),主动带轮(14)与从动带轮(13)通过第一皮带(15)传动连接。
4.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述伸缩板(5)的长度与六边台(3)的长度相同,六边台(3)内部固定有与伸缩板(5)匹配的第一电动伸缩杆(16),第一电动伸缩杆(16)的伸缩端与伸缩板(5)固定连接,伸缩板(5)的伸缩方向与六边台(3)的轴心对齐。
5.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述下料口(8)呈倾斜设置,下料口(8)上下端均设有与伸缩板(5)匹配的缺口,且两个缺口边缘处均固定有倾斜挡条(17),六边台(3)的两端与两个缺口边缘贴合匹配。
6.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述吹气下料机构包括与壳体(6)顶部固定的吹气头(18),吹气头(18)出风口的长度与六边台(3)的长度相同,且出风口的两端与六边台(3)两端对齐,吹气头(18)倾斜朝向六边台(3)。
7.根据权利要求3所述的一种半导体用切筋设备,其特征在于,所述边角料下料机构包括转动辊(19),转动辊(19)同轴固定有第二转轴(20),第二转轴(20)两端分别与设备机台(1)两侧转动连接,第二转轴(20)与第一转轴(12)之间设有联动机构,转动辊(19)上滑动设有两个环状块(22),环状块(22)与转动辊(19)通过紧固螺栓固定,环状块(22)上等距环绕固定有三个伸缩气缸(23),位于转动辊(19)两端的伸缩气缸(23)两两对齐,伸缩气缸(23)的伸缩端固定有气吸盘(24),壳体(6)顶部设有与转动辊(19)底部对应的下料输送带(31)。
8.根据权利要求7所述的一种半导体用切筋设备,其特征在于,所述联动机构包括第一齿轮(25)和第二齿轮(26),第一齿轮(25)和第二齿轮(26)啮合匹配,第一齿轮(25)同轴固定在第二转轴(20)上,设备机台(1)侧边水平固定有支撑柱(27),支撑柱(27)端面同轴转动设有第一带轮(28),第二齿轮(26)与第一带轮(28)同轴固定连接,第一转轴(12)同轴固定有第二带轮(29),第一带轮(28)与第二带轮(29)通过第二皮带(30)传动连接。
9.根据权利要求1所述的一种半导体用切筋设备,其特征在于,所述上料机构包括支撑架(32),支撑架(32)上横向固定有第二电动伸缩杆(33),第二电动伸缩杆(33)的伸缩端朝向设备机台(1)并固定有移动板(34),移动板(34)侧边上下滑动设有吸盘托板(35),吸盘托板(35)呈水平设置且其底部设有若干上料气吸盘,移动板(34)侧边竖直固定有第三电动伸缩杆(36),第三电动伸缩杆(36)的伸缩端与吸盘托板(35)固定连接。
10.根据权利要求10所述的一种半导体用切筋设备,其特征在于,所述支撑架(32)下方设有上料输送带(37),上料输送带(37)一端与吸盘托板(35)下侧对齐。
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CN117374007B (zh) * | 2023-12-04 | 2024-03-15 | 容泰半导体(江苏)有限公司 | 一种具有刀具切换功能的半导体切筋成型装置 |
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