CN116847981A - 层叠体及半导体装置的制造方法 - Google Patents

层叠体及半导体装置的制造方法 Download PDF

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Publication number
CN116847981A
CN116847981A CN202280012984.8A CN202280012984A CN116847981A CN 116847981 A CN116847981 A CN 116847981A CN 202280012984 A CN202280012984 A CN 202280012984A CN 116847981 A CN116847981 A CN 116847981A
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resin film
substrate
laminate
resin
semiconductor element
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Chinese (zh)
Inventor
中嶋里沙乃
有本由香里
越野美加
荒木斉
富川真佐夫
藤原健典
青岛健太
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Toray Industries Inc
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Toray Industries Inc
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CN202280012984.8A 2021-04-01 2022-03-23 层叠体及半导体装置的制造方法 Pending CN116847981A (zh)

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JP2021062609 2021-04-01
JP2021-062609 2021-04-01
PCT/JP2022/013453 WO2022210154A1 (ja) 2021-04-01 2022-03-23 積層体および半導体装置の製造方法

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US (1) US12534399B2 (https=)
EP (1) EP4316815A4 (https=)
JP (1) JP7790341B2 (https=)
KR (1) KR20230167344A (https=)
CN (1) CN116847981A (https=)
TW (1) TW202306779A (https=)
WO (1) WO2022210154A1 (https=)

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WO2024124535A1 (zh) 2022-12-16 2024-06-20 厦门市芯颖显示科技有限公司 转移载板、转移组件及微器件转移方法
CN121079761A (zh) * 2023-04-26 2025-12-05 东丽株式会社 层叠体、层叠体的制造方法、半导体装置的制造方法
JP7617347B1 (ja) * 2023-06-26 2025-01-17 積水化学工業株式会社 樹脂組成物及び接続構造体の製造方法

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