KR20230167344A - 적층체 및 반도체 장치의 제조 방법 - Google Patents

적층체 및 반도체 장치의 제조 방법 Download PDF

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KR20230167344A
KR20230167344A KR1020237028983A KR20237028983A KR20230167344A KR 20230167344 A KR20230167344 A KR 20230167344A KR 1020237028983 A KR1020237028983 A KR 1020237028983A KR 20237028983 A KR20237028983 A KR 20237028983A KR 20230167344 A KR20230167344 A KR 20230167344A
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resin film
laminate
substrate
resin
less
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Korean (ko)
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리사노 나카지마
유카리 아리모토
미카 고시노
히토시 아라키
마사오 도미카와
다케노리 후지와라
겐타 아오시마
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도레이 카부시키가이샤
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    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/3405—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of organic materials
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  • Chemical & Material Sciences (AREA)
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KR1020237028983A 2021-04-01 2022-03-23 적층체 및 반도체 장치의 제조 방법 Pending KR20230167344A (ko)

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JPJP-P-2021-062609 2021-04-01
JP2021062609 2021-04-01
PCT/JP2022/013453 WO2022210154A1 (ja) 2021-04-01 2022-03-23 積層体および半導体装置の製造方法

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US (1) US12534399B2 (https=)
EP (1) EP4316815A4 (https=)
JP (1) JP7790341B2 (https=)
KR (1) KR20230167344A (https=)
CN (1) CN116847981A (https=)
TW (1) TW202306779A (https=)
WO (1) WO2022210154A1 (https=)

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JPWO2023032888A1 (https=) * 2021-09-01 2023-03-09
CN118511275A (zh) 2022-12-16 2024-08-16 厦门市芯颖显示科技有限公司 转移载板、转移组件及微器件转移方法
WO2024124535A1 (zh) 2022-12-16 2024-06-20 厦门市芯颖显示科技有限公司 转移载板、转移组件及微器件转移方法
CN121079761A (zh) * 2023-04-26 2025-12-05 东丽株式会社 层叠体、层叠体的制造方法、半导体装置的制造方法
JP7617347B1 (ja) * 2023-06-26 2025-01-17 積水化学工業株式会社 樹脂組成物及び接続構造体の製造方法

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JP2010251359A (ja) 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2014515883A (ja) 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
JP2017531915A (ja) 2014-09-25 2017-10-26 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ 複合マイクロアセンブリのストラテジおよびデバイス
JP2020129638A (ja) 2019-02-12 2020-08-27 信越化学工業株式会社 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法
JP2020188037A (ja) 2019-05-09 2020-11-19 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． ディスプレイ装置の製造方法、およびソース基板構造体

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