TW202306779A - 積層體及半導體裝置的製造方法 - Google Patents

積層體及半導體裝置的製造方法 Download PDF

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TW202306779A
TW202306779A TW111112118A TW111112118A TW202306779A TW 202306779 A TW202306779 A TW 202306779A TW 111112118 A TW111112118 A TW 111112118A TW 111112118 A TW111112118 A TW 111112118A TW 202306779 A TW202306779 A TW 202306779A
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resin film
substrate
resin
laminate
formula
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TW111112118A
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Chinese (zh)
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中嶋里沙乃
有本由香里
越野美加
荒木斉
富川真佐夫
藤原健典
青島健太
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日商東麗股份有限公司
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TW111112118A 2021-04-01 2022-03-30 積層體及半導體裝置的製造方法 TW202306779A (zh)

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EP (1) EP4316815A4 (https=)
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KR (1) KR20230167344A (https=)
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WO2024124535A1 (zh) 2022-12-16 2024-06-20 厦门市芯颖显示科技有限公司 转移载板、转移组件及微器件转移方法
CN121079761A (zh) * 2023-04-26 2025-12-05 东丽株式会社 层叠体、层叠体的制造方法、半导体装置的制造方法
JP7617347B1 (ja) * 2023-06-26 2025-01-17 積水化学工業株式会社 樹脂組成物及び接続構造体の製造方法

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